HK1039916B - 無鉛焊料 - Google Patents

無鉛焊料

Info

Publication number
HK1039916B
HK1039916B HK02101537.6A HK02101537A HK1039916B HK 1039916 B HK1039916 B HK 1039916B HK 02101537 A HK02101537 A HK 02101537A HK 1039916 B HK1039916 B HK 1039916B
Authority
HK
Hong Kong
Prior art keywords
lead
free solders
solders
free
Prior art date
Application number
HK02101537.6A
Other languages
English (en)
Other versions
HK1039916A1 (en
Inventor
J‧S‧黃
Z‧郭
Original Assignee
新加坡朝日化學品及焊料工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/417,169 external-priority patent/US6176947B1/en
Application filed by 新加坡朝日化學品及焊料工業股份有限公司 filed Critical 新加坡朝日化學品及焊料工業股份有限公司
Publication of HK1039916A1 publication Critical patent/HK1039916A1/xx
Publication of HK1039916B publication Critical patent/HK1039916B/zh

Links

HK02101537.6A 1999-10-12 2002-02-27 無鉛焊料 HK1039916B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/417,169 US6176947B1 (en) 1998-12-31 1999-10-12 Lead-free solders

Publications (2)

Publication Number Publication Date
HK1039916A1 HK1039916A1 (en) 2002-05-17
HK1039916B true HK1039916B (zh) 2005-10-14

Family

ID=23652856

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02101537.6A HK1039916B (zh) 1999-10-12 2002-02-27 無鉛焊料

Country Status (4)

Country Link
CN (1) CN1208168C (zh)
HK (1) HK1039916B (zh)
SG (1) SG98429A1 (zh)
TW (1) TW528638B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040187976A1 (en) 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
TWI242866B (en) 2003-08-21 2005-11-01 Siliconware Precision Industries Co Ltd Process of forming lead-free bumps on electronic component
CN100351035C (zh) * 2005-10-28 2007-11-28 亚通电子有限公司 无铅焊料
CN101357423B (zh) * 2005-12-16 2011-03-09 浙江亚通焊材有限公司 无铅锡焊料
CN1803381A (zh) * 2006-01-11 2006-07-19 黄守友 无铅焊料及其制备方法
US8598464B2 (en) 2009-04-20 2013-12-03 Panasonic Corporation Soldering material and electronic component assembly
CN103146955B (zh) * 2013-03-22 2015-01-07 天津百瑞杰焊接材料有限公司 198℃保险丝熔断芯的无铅低温合金及其制备方法
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
CN103341699A (zh) * 2013-07-04 2013-10-09 浙江亚通焊材有限公司 一种取代锡铅钎料的Sn-In-Ag无铅钎料
JP6135885B2 (ja) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
US11577343B2 (en) * 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
CN107990708B (zh) * 2017-11-28 2020-09-29 乐山新天源太阳能科技有限公司 硅片烧结炉内烘干区的传送装置
JP6936926B1 (ja) 2021-03-10 2021-09-22 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手
CN113070606A (zh) * 2021-04-15 2021-07-06 云南锡业锡材有限公司 一种Sn-Ag-Cu高性能无铅焊料及其制备方法
CN115476069A (zh) * 2022-10-28 2022-12-16 云南锡业集团（控股）有限责任公司研发中心 低Ag高热稳定性和高韧性的五元或六元无铅锡基焊料
CN117139917B (zh) * 2023-10-31 2024-03-08 苏州塞一澳电气有限公司 一种汽车玻璃用无铅焊料及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JPH10193171A (ja) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd 半田付け物品
JP3736819B2 (ja) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 無鉛はんだ合金
JPH10314980A (ja) * 1997-05-14 1998-12-02 Sony Corp はんだ材料
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy

Also Published As

Publication number Publication date
HK1039916A1 (en) 2002-05-17
SG98429A1 (en) 2003-09-19
CN1314229A (zh) 2001-09-26
CN1208168C (zh) 2005-06-29
TW528638B (en) 2003-04-21

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