WO2007079671A1 - Brasure sans plomb et son procede de preparation - Google Patents

Brasure sans plomb et son procede de preparation Download PDF

Info

Publication number
WO2007079671A1
WO2007079671A1 PCT/CN2007/000033 CN2007000033W WO2007079671A1 WO 2007079671 A1 WO2007079671 A1 WO 2007079671A1 CN 2007000033 W CN2007000033 W CN 2007000033W WO 2007079671 A1 WO2007079671 A1 WO 2007079671A1
Authority
WO
WIPO (PCT)
Prior art keywords
tin
lead
solder
free solder
copper
Prior art date
Application number
PCT/CN2007/000033
Other languages
English (en)
Chinese (zh)
Inventor
Shouyou Huang
Original Assignee
Thousand Island Metal Foil Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thousand Island Metal Foil Co., Ltd filed Critical Thousand Island Metal Foil Co., Ltd
Publication of WO2007079671A1 publication Critical patent/WO2007079671A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the invention relates to a splicing material, in particular to a lead-free solder and a preparation method thereof.
  • the above-mentioned lead-free tin solder has the disadvantages of high melting point, low wettability, some coarse crystals, and many components. The process is complex and costly.
  • An object of the present invention is to provide a lead-free solder having a low melting point, good wettability, and low cost in order to overcome the disadvantages and deficiencies of the prior art described above, thereby providing a high-quality solder material for processing and manufacturing electronic products.
  • the lead-free solder of the present invention and a preparation method thereof, the composition weight percentage of the solder is:
  • composition weight percentage of lead-free solder is:
  • the raw material used in the method has high purity and low metal loss during the process
  • the metallurgy is more uniform and finer, which improves the wettability, elongation and welding performance;
  • This product has good welding performance for wire and transformer, and it is easy to produce good affinity with the substrate (solid material).
  • the solder joint is bright, full and without welding phenomenon.
  • the pure tin is melted and heated to 480 °C - 520 °C, then the SnCu, SnAg, SnNi intermediate alloy is melted and stirred. Minutes, after the slag is removed, the tin ingot or tin bar, solder bar, etc. required for extrusion are cast.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Cette invention concerne une brasure sans plomb et son procédé de préparation. La brasure comprend: 0,1 à 4,0 % en poids de Cu; 0,001 à 0,5 % en poids de Ni; 0,1 à 6,0 % en poids d'Ag; 0,0001 à 0,1 % en poids de P ou de Ga et un Sn d'équilibrage. Selon l'invention, des matières premières de grande pureté sont utilisées dans la préparation de la brasure avec, comme résultat, une perte de métal réduite, une structure métallurgique beaucoup plus homogène et un grain affiné. La mouillabilité de la brasure et la performance de soudure sont également améliorées. La brasure de l'invention est utilisée, de préférence, pour le soudage de fils ou d'une pièce de raccordement.
PCT/CN2007/000033 2006-01-11 2007-01-08 Brasure sans plomb et son procede de preparation WO2007079671A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200610032870.2 2006-01-11
CN 200610032870 CN1803381A (zh) 2006-01-11 2006-01-11 无铅焊料及其制备方法

Publications (1)

Publication Number Publication Date
WO2007079671A1 true WO2007079671A1 (fr) 2007-07-19

Family

ID=36865596

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2007/000033 WO2007079671A1 (fr) 2006-01-11 2007-01-08 Brasure sans plomb et son procede de preparation

Country Status (2)

Country Link
CN (1) CN1803381A (fr)
WO (1) WO2007079671A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3385027A1 (fr) * 2013-10-31 2018-10-10 Alpha Metals, Inc. Alliages de brasure sans plomb et sans argent
CN112643240A (zh) * 2020-12-10 2021-04-13 东莞市清大菁玉科技有限公司 一种应用于高频数据线线焊接的新型低温高导电率钎料及其制备方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101374630B (zh) * 2006-01-16 2012-01-04 日立金属株式会社 焊料合金、焊球及使用了它们的焊料接合部
CN101513697B (zh) * 2009-04-09 2012-09-05 宏桥纳米科技（深圳）有限公司 一种锡基无铅焊料及其制备方法
CN102476249A (zh) * 2010-11-25 2012-05-30 中国科学院金属研究所 一种耐大气腐蚀的Sn-Ag-Cu焊料
CN102248319A (zh) * 2011-06-30 2011-11-23 哈尔滨工业大学 一种低银Sn-Ag-Cu系无铅钎料
CN104526190A (zh) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 一种新型锡条的制作方法
CN105397328A (zh) * 2015-12-15 2016-03-16 瑞声光电科技(常州)有限公司 Sn-Cu系无铅钎料及其制备方法
CN109483081A (zh) * 2018-12-03 2019-03-19 先导薄膜材料（广东）有限公司 金属靶材绑定焊料及其制备方法
CN112342417B (zh) * 2020-11-17 2022-03-15 昆明理工大学 一种锡基焊料及其制备方法
CN114182119A (zh) * 2021-12-10 2022-03-15 云南锡业矿冶检测中心有限公司 一种锡合金标准样品的制备方法
CN114367760B (zh) * 2022-02-21 2023-08-18 中山翰华锡业有限公司 一种高可靠性的无卤无铅焊锡膏及其制备方法
CN115156755A (zh) * 2022-08-12 2022-10-11 云南锡业集团（控股）有限责任公司研发中心 一种含Bi、Ni、Ga的Sn-Ag-Cu无铅钎料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195592A (zh) * 1997-02-15 1998-10-14 三星电子株式会社 焊料用无铅合金
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
CN1314229A (zh) * 1999-10-12 2001-09-26 高科技集团公司 无铅焊料
CN1329964A (zh) * 2000-06-30 2002-01-09 日本铝钎料株式会社 无铅焊锡合金
KR20050030237A (ko) * 2004-11-13 2005-03-29 삼성전자주식회사 무연 솔더 합금

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195592A (zh) * 1997-02-15 1998-10-14 三星电子株式会社 焊料用无铅合金
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
CN1314229A (zh) * 1999-10-12 2001-09-26 高科技集团公司 无铅焊料
CN1329964A (zh) * 2000-06-30 2002-01-09 日本铝钎料株式会社 无铅焊锡合金
KR20050030237A (ko) * 2004-11-13 2005-03-29 삼성전자주식회사 무연 솔더 합금

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3385027A1 (fr) * 2013-10-31 2018-10-10 Alpha Metals, Inc. Alliages de brasure sans plomb et sans argent
CN112643240A (zh) * 2020-12-10 2021-04-13 东莞市清大菁玉科技有限公司 一种应用于高频数据线线焊接的新型低温高导电率钎料及其制备方法

Also Published As

Publication number Publication date
CN1803381A (zh) 2006-07-19

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