CN1305398A - 用于喷射液滴的装置和方法 - Google Patents
用于喷射液滴的装置和方法 Download PDFInfo
- Publication number
- CN1305398A CN1305398A CN99807276A CN99807276A CN1305398A CN 1305398 A CN1305398 A CN 1305398A CN 99807276 A CN99807276 A CN 99807276A CN 99807276 A CN99807276 A CN 99807276A CN 1305398 A CN1305398 A CN 1305398A
- Authority
- CN
- China
- Prior art keywords
- medium
- feed screw
- duct
- rotary type
- type feed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
Claims (28)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9802079-5 | 1998-06-11 | ||
SE98020795 | 1998-06-11 | ||
SE9802079A SE513527C2 (sv) | 1998-06-11 | 1998-06-11 | Anordning och förfarande för utskjutning av små droppar |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1305398A true CN1305398A (zh) | 2001-07-25 |
CN1104965C CN1104965C (zh) | 2003-04-09 |
Family
ID=20411664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99807276A Expired - Lifetime CN1104965C (zh) | 1998-06-11 | 1999-06-08 | 用于喷射液滴的装置和方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US6450416B1 (zh) |
EP (1) | EP1083998B1 (zh) |
JP (1) | JP4498606B2 (zh) |
KR (1) | KR100601459B1 (zh) |
CN (1) | CN1104965C (zh) |
AT (1) | ATE235968T1 (zh) |
AU (1) | AU4669699A (zh) |
DE (1) | DE69906519T2 (zh) |
SE (1) | SE513527C2 (zh) |
WO (1) | WO1999064167A1 (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100439820C (zh) * | 2003-07-14 | 2008-12-03 | 诺信公司 | 用于分配不连续量的粘性物质的装置和方法 |
CN100441070C (zh) * | 2002-07-18 | 2008-12-03 | 麦德塔自动化股份有限公司 | 喷射装置和应用该喷射装置的方法 |
CN104684656A (zh) * | 2012-09-27 | 2015-06-03 | 微密斯点胶技术有限公司 | 配量系统、配量方法和制造方法 |
CN105050731A (zh) * | 2013-03-15 | 2015-11-11 | 微密斯点胶技术有限公司 | 计量阀和计量方法 |
CN105189004A (zh) * | 2013-03-13 | 2015-12-23 | 麦克罗尼克迈达塔有限责任公司 | 将粘性介质喷射在工件上的方法 |
CN106536110A (zh) * | 2014-07-15 | 2017-03-22 | 派克泰克封装技术有限公司 | 用于单独施加连接材料沉积物的装置 |
CN109437075A (zh) * | 2018-11-27 | 2019-03-08 | 西南科技大学 | 高粘度膏状物的挤注装置 |
CN111482329A (zh) * | 2019-01-25 | 2020-08-04 | 本田技研工业株式会社 | 喷嘴距离确认装置和喷嘴距离确认方法 |
CN114929400A (zh) * | 2020-01-28 | 2022-08-19 | 迈康尼股份公司 | 具有供应导管致动器的喷射装置 |
CN114945429A (zh) * | 2020-01-28 | 2022-08-26 | 迈康尼股份公司 | 具有柔性喷嘴的喷射装置 |
TWI783948B (zh) * | 2016-09-20 | 2022-11-21 | 日商武藏工業股份有限公司 | 液體材料吐出裝置 |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE9901253D0 (sv) | 1999-04-08 | 1999-04-08 | Mydata Automation Ab | Dispensing assembly |
JP2002021715A (ja) * | 2000-07-10 | 2002-01-23 | Matsushita Electric Ind Co Ltd | 流体供給装置及び流体供給方法 |
SE518640C2 (sv) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
SE518642C2 (sv) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel |
SE0003647D0 (sv) | 2000-10-09 | 2000-10-09 | Mydata Automation Ab | Method, apparatus and use |
SE0101503D0 (sv) | 2001-04-27 | 2001-04-27 | Mydata Automation Ab | Method device and use of the device |
KR100726770B1 (ko) * | 2001-07-05 | 2007-06-11 | 삼성테크윈 주식회사 | 티비지에이 반도체 패키지의 제조장치와 이의 제조방법 |
SE0103737D0 (sv) | 2001-11-12 | 2001-11-12 | Mydata Automation Ab | Device for jetting droplets of a particle filled viscous medium |
KR100413111B1 (ko) * | 2001-11-15 | 2003-12-31 | 주식회사 프로텍 | 고속정량토출 제어용 헤드의 돗팅방법 |
SE0104210D0 (sv) * | 2001-12-14 | 2001-12-14 | Mydata Automation Ab | Viscous medium feeder |
JP4032729B2 (ja) * | 2001-12-19 | 2008-01-16 | 松下電器産業株式会社 | 流体塗布方法 |
US6983867B1 (en) * | 2002-04-29 | 2006-01-10 | Dl Technology Llc | Fluid dispense pump with drip prevention mechanism and method for controlling same |
JP2004283714A (ja) * | 2003-03-20 | 2004-10-14 | Fujitsu Display Technologies Corp | 液剤吐出ディスペンサ |
JP4183577B2 (ja) * | 2003-07-25 | 2008-11-19 | 武蔵エンジニアリング株式会社 | 液滴調整方法及び液滴吐出方法並びにその装置 |
EP1701231A1 (en) | 2005-03-08 | 2006-09-13 | Mydata Automation AB | Method of calibration |
US20070146442A1 (en) * | 2005-11-14 | 2007-06-28 | Mydata Automation Ab | System, assembly and method for jetting viscous medium onto a substrate |
US7980197B2 (en) * | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
US8707559B1 (en) | 2007-02-20 | 2014-04-29 | Dl Technology, Llc | Material dispense tips and methods for manufacturing the same |
DE202009004251U1 (de) | 2008-04-28 | 2009-06-10 | Hormec Technic Sa | Dosierungsvorrichtung |
US8864055B2 (en) | 2009-05-01 | 2014-10-21 | Dl Technology, Llc | Material dispense tips and methods for forming the same |
US8757511B2 (en) | 2010-01-11 | 2014-06-24 | AdvanJet | Viscous non-contact jetting method and apparatus |
US9307625B2 (en) | 2011-04-05 | 2016-04-05 | Eth Zurich | Droplet dispensing device and light source comprising such a droplet dispensing device |
US9346075B2 (en) | 2011-08-26 | 2016-05-24 | Nordson Corporation | Modular jetting devices |
US9254642B2 (en) | 2012-01-19 | 2016-02-09 | AdvanJet | Control method and apparatus for dispensing high-quality drops of high-viscosity material |
DE102012109124A1 (de) | 2012-09-27 | 2014-03-27 | Vermes Microdispensing GmbH | Dosiersystem, Dosierverfahren und Herstellungsverfahren |
DE202013101134U1 (de) * | 2013-03-15 | 2014-06-17 | Vermes Microdispensing GmbH | Dosierventil |
US9625337B2 (en) * | 2014-04-21 | 2017-04-18 | John Brock | Piezoelectric transducer assembly |
DE102014209172A1 (de) | 2014-05-15 | 2015-11-19 | Robert Bosch Gmbh | Vorrichtung zum Fokussieren eines aus einer Ausgabeöffnung einer Ausgabevorrichtung einer Jet-Vorrichtung ausgegebenen viskosen Mediums, Jet-System und Produktionsanlage |
DE102014209171A1 (de) | 2014-05-15 | 2015-11-19 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Fokussieren eines aus einer Ausgabeöffnung einer Ausgabevorrichtung einer Jet-Vorrichtung ausgegebenen viskosen Mediums |
WO2016037694A1 (en) * | 2014-09-09 | 2016-03-17 | Mycronic AB | Method and device for applying solder paste flux |
US9884444B2 (en) * | 2014-10-17 | 2018-02-06 | Ut-Battelle, Llc | Enhanced additive manufacturing with a reciprocating platen |
US10953413B2 (en) * | 2015-06-04 | 2021-03-23 | Nordson Corporation | Jet cartridges for jetting fluid material, and related methods |
DE102016008663A1 (de) | 2016-07-20 | 2018-02-08 | Jean-Claude Tytgat | Vorrichtung zum genauen Dispensen von nieder- sowie hoch viskosen Materialien aus einer verschließbaren Dosierdüse zum Deponieren von Tröpfchen sowie raupenförmige Geometrien |
US20190275555A1 (en) * | 2016-11-10 | 2019-09-12 | Faustel, Inc. | System and method for coating discrete patches on a moving substrate |
JP7137614B2 (ja) | 2017-07-12 | 2022-09-14 | マイクロニック アクティエボラーグ | 音響トランスジューサを伴う噴射装置およびその制御方法 |
WO2019011675A1 (en) | 2017-07-12 | 2019-01-17 | Mycronic AB | VARIABLE AIRFLOW PROJECTION DEVICES AND METHODS OF REGULATING AIRFLOWS |
CN110913998A (zh) | 2017-07-12 | 2020-03-24 | 迈康尼股份公司 | 具有能量输出装置的喷射装置及其控制方法 |
DE102017221178A1 (de) * | 2017-11-27 | 2019-05-29 | Robert Bosch Gmbh | Druckkopf für einen 3D-Drucker |
KR102109529B1 (ko) * | 2018-08-01 | 2020-05-12 | 신창호 | 유체 공급 기구 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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US3711020A (en) * | 1970-07-06 | 1973-01-16 | R Zelna | High frequency solder paste gun |
IT1133265B (it) | 1980-04-03 | 1986-07-09 | Gd Spa | Dispositivo distributore per materiali vischiosi |
SE465713B (sv) | 1990-02-12 | 1991-10-21 | Mydata Automation Ab | Anordning foer att utlaegga pastor och lim |
JPH0449108A (ja) * | 1990-06-18 | 1992-02-18 | Iwashita Eng Kk | スクリュー式吐出装置 |
US5248087A (en) * | 1992-05-08 | 1993-09-28 | Dressler John L | Liquid droplet generator |
JPH07156222A (ja) * | 1993-12-10 | 1995-06-20 | Matsushita Electric Ind Co Ltd | 流体供給装置 |
US5656339A (en) * | 1994-06-20 | 1997-08-12 | U.S. Philips Corporation | Method of and arrangement for applying a fluid to a surface using a vibrating needle |
US5564606A (en) * | 1994-08-22 | 1996-10-15 | Engel; Harold J. | Precision dispensing pump for viscous materials |
US5894980A (en) * | 1995-09-25 | 1999-04-20 | Rapid Analysis Development Comapny | Jet soldering system and method |
US5747102A (en) * | 1995-11-16 | 1998-05-05 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
US5819983A (en) * | 1995-11-22 | 1998-10-13 | Camelot Sysems, Inc. | Liquid dispensing system with sealing augering screw and method for dispensing |
JPH09181434A (ja) * | 1995-12-21 | 1997-07-11 | M & M Prod Kk | クリーム半田塗布装置 |
US5988480A (en) * | 1997-12-12 | 1999-11-23 | Micron Technology, Inc. | Continuous mode solder jet apparatus |
US5931355A (en) | 1997-06-04 | 1999-08-03 | Techcon Systems, Inc. | Disposable rotary microvalve |
US5984147A (en) * | 1997-10-20 | 1999-11-16 | Raytheon Company | Rotary dispensing pump |
-
1998
- 1998-06-11 SE SE9802079A patent/SE513527C2/sv not_active IP Right Cessation
-
1999
- 1999-06-08 US US09/719,237 patent/US6450416B1/en not_active Expired - Lifetime
- 1999-06-08 WO PCT/SE1999/000996 patent/WO1999064167A1/en active IP Right Grant
- 1999-06-08 DE DE69906519T patent/DE69906519T2/de not_active Expired - Lifetime
- 1999-06-08 AU AU46696/99A patent/AU4669699A/en not_active Abandoned
- 1999-06-08 KR KR1020007014043A patent/KR100601459B1/ko not_active IP Right Cessation
- 1999-06-08 AT AT99930088T patent/ATE235968T1/de not_active IP Right Cessation
- 1999-06-08 CN CN99807276A patent/CN1104965C/zh not_active Expired - Lifetime
- 1999-06-08 JP JP2000553221A patent/JP4498606B2/ja not_active Expired - Lifetime
- 1999-06-08 EP EP99930088A patent/EP1083998B1/en not_active Expired - Lifetime
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100441070C (zh) * | 2002-07-18 | 2008-12-03 | 麦德塔自动化股份有限公司 | 喷射装置和应用该喷射装置的方法 |
CN100439820C (zh) * | 2003-07-14 | 2008-12-03 | 诺信公司 | 用于分配不连续量的粘性物质的装置和方法 |
CN104684656A (zh) * | 2012-09-27 | 2015-06-03 | 微密斯点胶技术有限公司 | 配量系统、配量方法和制造方法 |
CN105189004A (zh) * | 2013-03-13 | 2015-12-23 | 麦克罗尼克迈达塔有限责任公司 | 将粘性介质喷射在工件上的方法 |
CN105050731A (zh) * | 2013-03-15 | 2015-11-11 | 微密斯点胶技术有限公司 | 计量阀和计量方法 |
CN106536110A (zh) * | 2014-07-15 | 2017-03-22 | 派克泰克封装技术有限公司 | 用于单独施加连接材料沉积物的装置 |
CN106536110B (zh) * | 2014-07-15 | 2020-05-19 | 派克泰克封装技术有限公司 | 用于单独施加连接材料沉积物的装置 |
TWI783948B (zh) * | 2016-09-20 | 2022-11-21 | 日商武藏工業股份有限公司 | 液體材料吐出裝置 |
CN109437075A (zh) * | 2018-11-27 | 2019-03-08 | 西南科技大学 | 高粘度膏状物的挤注装置 |
CN111482329B (zh) * | 2019-01-25 | 2021-09-24 | 本田技研工业株式会社 | 喷嘴距离确认装置和喷嘴距离确认方法 |
CN111482329A (zh) * | 2019-01-25 | 2020-08-04 | 本田技研工业株式会社 | 喷嘴距离确认装置和喷嘴距离确认方法 |
CN114929400A (zh) * | 2020-01-28 | 2022-08-19 | 迈康尼股份公司 | 具有供应导管致动器的喷射装置 |
CN114945429A (zh) * | 2020-01-28 | 2022-08-26 | 迈康尼股份公司 | 具有柔性喷嘴的喷射装置 |
Also Published As
Publication number | Publication date |
---|---|
AU4669699A (en) | 1999-12-30 |
ATE235968T1 (de) | 2003-04-15 |
DE69906519T2 (de) | 2004-03-04 |
DE69906519D1 (de) | 2003-05-08 |
EP1083998A1 (en) | 2001-03-21 |
SE9802079D0 (sv) | 1998-06-11 |
EP1083998B1 (en) | 2003-04-02 |
SE9802079L (sv) | 1999-12-12 |
WO1999064167A1 (en) | 1999-12-16 |
CN1104965C (zh) | 2003-04-09 |
KR20010078735A (ko) | 2001-08-21 |
JP2002517736A (ja) | 2002-06-18 |
US6450416B1 (en) | 2002-09-17 |
KR100601459B1 (ko) | 2006-07-19 |
SE513527C2 (sv) | 2000-09-25 |
JP4498606B2 (ja) | 2010-07-07 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Swedish tibbers Patentee after: Macro Nick Technologies AG Address before: Swedish Broma Patentee before: Mydata Automation AB |
|
TR01 | Transfer of patent right |
Effective date of registration: 20161129 Address after: Swedish tibbers Patentee after: Macro Nick AG Address before: Swedish tibbers Patentee before: Macro Nick Technologies AG |
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CX01 | Expiry of patent term |
Granted publication date: 20030409 |
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CX01 | Expiry of patent term |