JP4657648B2 - 少量の液体材料を分配するための方法及び装置 - Google Patents
少量の液体材料を分配するための方法及び装置 Download PDFInfo
- Publication number
- JP4657648B2 JP4657648B2 JP2004228340A JP2004228340A JP4657648B2 JP 4657648 B2 JP4657648 B2 JP 4657648B2 JP 2004228340 A JP2004228340 A JP 2004228340A JP 2004228340 A JP2004228340 A JP 2004228340A JP 4657648 B2 JP4657648 B2 JP 4657648B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- liquid
- viscous material
- drops
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F13/00—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
- G01F13/006—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups measuring volume in function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Description
本願は、米国特許出願第08/607,126号、(1996年2月26日提出)の一部継続出願である米国特許出願第08/559,332号(1995年11月16日提出)の関連出願である。
本発明は、液体材料を分配する分野に、より詳しくは電子部品やプリント回路基盤の組立てにおける少量の粘性接着剤、半田フラックス又は他の液体材料を迅速に分配するための方法及び装置に関する。
本発明は、電子工業でプリント回路基盤の様な表面上に流体材料を分配するための方法及び装置に関する。しかし、本発明の用途は広く、他の産業でも有利に使用できる。
本発明の目的は、先行技術の方法及び装置の問題及び制約を解決するために、プリント回路基盤の上に間隔をおいて配置されたノズルオリフィスから少量の液体又は粘性材料を高温で分配するための方法及び装置を提供することである。
d=ドットの直径
r=ドットの半径=2/d
c=糸の直径
h=糸の長さ h(d,c)=4r(d)3/6r(c)2
ρ=接着剤の密度1xgm./cm2
σ=接着剤の降伏応力=500x3Pa(パスカル)
M=糸の質量M(d,c)= ρxπxr(c)2 xh(d,c)
F(c)=分断に必要な力=σy xπxr(c)2
a(d,c)=力を発生するのに必要な加速
F(c)/M(d,c)
解析すべきドットの直径が0.020インチである場合、
c=0.006インチ
h=0.074インチ
M(d,c)=3.432x10−5gm
F(c)=2.736x10−5kg m sec−2
a(d,c)=797 m/sec2
ドットの加速及び減速、したがってドットに対する力に影響する重要な変数は、下記の通りである。
a)流体の密度及びドットの大きさにより設定される形成されるドットの質量、
b)ノズル先端における濡れた面積により設定される形成される流れの直径、
c)バルブの直径、速度及び流体粘度により設定されるバルブにより発生する圧力、
d)オリフィスの長さ及び直径により設定されるノズルオリフィス中の圧力低下、
e)シャフトとハウジングの間の輪状区域の長さ、シャフトの直径、及びハウジングの直径により設定されるバルブから供給源に戻る圧力低下、及び
f)バルブ直径及びシート直径により設定される、バルブ位置により変化するバルブとシートの間の圧力低下。
Claims (4)
- 吐出装置を用いて、基材の上に液体又は粘性材料の被覆を堆積させる方法であって、
前記吐出装置は、
貫通して延在し、入口と出口とを有する第一流路を有するバルブ組立体であって、前記第一流路の入口は前記液体又は粘性材料源と流体的に連通するバルブ組立体と、
ノズル入口とノズル出口とを有する第二流路を有するノズルであって、該ノズル入口は前記第一流路の出口と流体的に連通するノズルと、
該第一流路を通して可動なバルブシャフトであって、該バルブシャフトは、該ノズルまで該液体または粘性材料を流す開位置と該ノズルまでの該液体または粘性材料の流れを妨げる閉位置との間を可動なバルブシャフトとを備え、
前記方法は、
該閉位置に向かっての該バルブシャフトの急速な移動により、前記ノズルの第二流路の出口を通って前記液体又は粘性材料の流れを分出する分出工程と、
該バルブシャフトを該閉位置まで移動させることにより、該前記液体又は粘性材料の流れを停止して、該流れを該ノズルから分断し、選択された大きさの滴を形成する滴形成工程と、
該分出工程と該滴形成工程とを繰り返して、該選択された大きさの複数の滴からなる前記液体又は粘性材料の選択された量の滴を形成する工程と、
列をなすように前記選択された量の滴を選択された間隔をおいて前記基材の上に堆積させ、前記選択された大きさの複数の滴からなる前記液体又は粘性材料の選択された量の滴が流れて被覆としてまとめる工程とを備えることを特徴とする該方法。 - 請求項1に記載の該方法であって、前記液体又は粘性材料を分出する分出工程は半田フラックスの分出を含む該方法。
- 請求項1または2に記載の該方法であって、前記基材上に前記選択された量の滴を塗布する工程は、前記半田フラックスの滴をプリント回路基板の表面上に間隔をおいた位置に塗布する工程を含む該方法。
- 請求項1から3のいずれか一項に記載の方法であって、該列は、2以上の列であることを特徴とする該方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55933295A | 1995-11-16 | 1995-11-16 | |
US60712696A | 1996-02-26 | 1996-02-26 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51911897A Division JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009292532A Division JP4989716B2 (ja) | 1995-11-16 | 2009-12-24 | 少量の液体材料を分配するための方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004322099A JP2004322099A (ja) | 2004-11-18 |
JP2004322099A5 JP2004322099A5 (ja) | 2006-03-23 |
JP4657648B2 true JP4657648B2 (ja) | 2011-03-23 |
Family
ID=27072035
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51911897A Expired - Lifetime JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
JP2004228340A Expired - Lifetime JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
JP2009292532A Expired - Lifetime JP4989716B2 (ja) | 1995-11-16 | 2009-12-24 | 少量の液体材料を分配するための方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51911897A Expired - Lifetime JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009292532A Expired - Lifetime JP4989716B2 (ja) | 1995-11-16 | 2009-12-24 | 少量の液体材料を分配するための方法 |
Country Status (6)
Country | Link |
---|---|
EP (4) | EP1437192A3 (ja) |
JP (3) | JP3616105B2 (ja) |
AU (1) | AU1119797A (ja) |
CA (1) | CA2235991C (ja) |
DE (3) | DE69611692T2 (ja) |
WO (1) | WO1997018054A1 (ja) |
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US5957343A (en) * | 1997-06-30 | 1999-09-28 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US6085943A (en) | 1997-06-30 | 2000-07-11 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US6324973B2 (en) * | 1997-11-07 | 2001-12-04 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
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US7617951B2 (en) | 2002-01-28 | 2009-11-17 | Nordson Corporation | Compact heated air manifolds for adhesive application |
WO2005009627A2 (en) * | 2003-07-14 | 2005-02-03 | Nordson Corporation | Apparatus and method for dispensing discrete amounts of viscous material |
DE10338360A1 (de) * | 2003-08-21 | 2005-03-31 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Verfahren und Vorrichtung zur Herstellung eines Wabenkörpers |
US7182106B2 (en) * | 2004-02-23 | 2007-02-27 | Nidec Corporation | Fluid dispensation method |
JP5344262B2 (ja) * | 2004-12-20 | 2013-11-20 | Uht株式会社 | 液滴射出装置 |
ES2560555T3 (es) | 2006-01-06 | 2016-02-19 | Nordson Corporation | Dispensador de líquidos con control individualizado de aire de proceso |
US20080099538A1 (en) * | 2006-10-27 | 2008-05-01 | United Technologies Corporation & Pratt & Whitney Canada Corp. | Braze pre-placement using cold spray deposition |
US20090095825A1 (en) * | 2007-10-11 | 2009-04-16 | Nordson Corporation | Dispenser nozzle having differential hardness |
DE202008004350U1 (de) | 2008-03-31 | 2009-08-27 | Hentschel, Lothar | Dosierventil für die berührungsfreie Dosierung von reaktiven Fluiden |
DE102008027259A1 (de) * | 2008-06-06 | 2009-12-17 | Focke & Co.(Gmbh & Co. Kg) | Verfahren und Vorrichtung zur Herstellung von Zigarettenpackungen |
US8753713B2 (en) * | 2010-06-05 | 2014-06-17 | Nordson Corporation | Jetting dispenser and method of jetting highly cohesive adhesives |
DE202010013815U1 (de) | 2010-10-05 | 2012-01-13 | Lothar Hentschel | Elektropneumatisch betätigtes Ventil für die dosierte Abgabe von Flüssigkeiten |
KR101869089B1 (ko) * | 2011-01-04 | 2018-06-19 | 주식회사 탑 엔지니어링 | 점성물질 젯팅 장치 |
JP5435308B2 (ja) * | 2011-08-02 | 2014-03-05 | 株式会社安川電機 | 接着剤塗布装置 |
DE202011107412U1 (de) | 2011-11-03 | 2013-02-04 | Lothar Hentschel | Einstellbares Ventil für die dosierte Abgabe von Flüssigkeiten |
CH705930B1 (de) * | 2011-12-22 | 2015-08-28 | Esec Ag | Verfahren zum Auftragen von Klebstoff auf ein Substrat. |
DE102013006106A1 (de) * | 2013-04-09 | 2014-10-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung |
KR102288108B1 (ko) | 2013-10-05 | 2021-08-09 | 무사시 엔지니어링 가부시키가이샤 | 액체 재료 충전 장치 및 방법 |
DE102014010843B4 (de) | 2014-07-24 | 2020-12-03 | Technische Universität Braunschweig | Dosierdüse und Verfahren zum dosierten Auftragen hochviskoser Medien |
EP3186016A4 (en) * | 2014-08-28 | 2018-04-11 | Nordson Corporation | Non-impact jetting dispensing module and method |
DE102016212893A1 (de) * | 2016-07-14 | 2018-01-18 | F. Holzer Gmbh | Pumpkopf sowie Dosiervorrichtung |
DE102016212892C5 (de) * | 2016-07-14 | 2020-01-30 | F. Holzer Gmbh | Pumpkopf sowie Dosiervorrichtung |
DE102017126307A1 (de) | 2017-11-09 | 2019-05-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung sowie Verfahren zum Dosieren von flüssigen Medien |
US11833335B2 (en) * | 2018-03-20 | 2023-12-05 | Musashi Engineering, Inc. | Liquid material ejecting apparatus |
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DE102018133606B3 (de) | 2018-12-27 | 2019-12-24 | PerfecDos GbR (vertretungsberechtigte Gesellschafter: Lothar Hentschel, 82544 Egling; Benjamin Kratz, 82211 Hersching; Peter Friedl, 83623 Dietramszell) | Jet-Dosierventil |
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1996
- 1996-11-12 JP JP51911897A patent/JP3616105B2/ja not_active Expired - Lifetime
- 1996-11-12 EP EP04075967A patent/EP1437192A3/en not_active Withdrawn
- 1996-11-12 EP EP00303607A patent/EP1029626B1/en not_active Revoked
- 1996-11-12 AU AU11197/97A patent/AU1119797A/en not_active Abandoned
- 1996-11-12 EP EP96942008A patent/EP0861136B1/en not_active Expired - Lifetime
- 1996-11-12 EP EP06075088A patent/EP1655094A1/en not_active Withdrawn
- 1996-11-12 CA CA002235991A patent/CA2235991C/en not_active Expired - Lifetime
- 1996-11-12 DE DE69611692T patent/DE69611692T2/de not_active Expired - Lifetime
- 1996-11-12 DE DE69632795T patent/DE69632795T8/de not_active Revoked
- 1996-11-12 WO PCT/US1996/018380 patent/WO1997018054A1/en active IP Right Grant
- 1996-11-12 DE DE06075088T patent/DE06075088T1/de active Pending
-
2004
- 2004-08-04 JP JP2004228340A patent/JP4657648B2/ja not_active Expired - Lifetime
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2009
- 2009-12-24 JP JP2009292532A patent/JP4989716B2/ja not_active Expired - Lifetime
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Publication number | Priority date | Publication date | Assignee | Title |
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US4066188A (en) * | 1976-08-10 | 1978-01-03 | Nordson Corporation | Thermoplastic adhesive dispenser having an internal heat exchanger |
DE4013323A1 (de) * | 1990-04-26 | 1991-10-31 | Heino Kaiser | Dosierventil |
JPH0522054U (ja) * | 1991-09-05 | 1993-03-23 | 徳興 中橋 | ホツトメルトアプリケータ |
Also Published As
Publication number | Publication date |
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JP2004322099A (ja) | 2004-11-18 |
CA2235991C (en) | 2005-02-15 |
JP2010075930A (ja) | 2010-04-08 |
DE69632795D1 (de) | 2004-07-29 |
DE69632795T3 (de) | 2005-07-14 |
JP4989716B2 (ja) | 2012-08-01 |
EP1437192A3 (en) | 2005-06-08 |
CA2235991A1 (en) | 1997-05-22 |
DE69611692T2 (de) | 2001-09-06 |
EP1029626B1 (en) | 2004-06-23 |
JP2000501331A (ja) | 2000-02-08 |
DE69632795T8 (de) | 2005-10-20 |
EP1029626A3 (en) | 2000-10-18 |
AU1119797A (en) | 1997-06-05 |
EP1437192A2 (en) | 2004-07-14 |
EP1655094A1 (en) | 2006-05-10 |
JP3616105B2 (ja) | 2005-02-02 |
DE69611692D1 (de) | 2001-03-01 |
EP0861136A1 (en) | 1998-09-02 |
EP0861136B1 (en) | 2001-01-24 |
DE06075088T1 (de) | 2007-01-04 |
EP1029626A2 (en) | 2000-08-23 |
WO1997018054A1 (en) | 1997-05-22 |
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