JP4989716B2 - 少量の液体材料を分配するための方法 - Google Patents
少量の液体材料を分配するための方法 Download PDFInfo
- Publication number
- JP4989716B2 JP4989716B2 JP2009292532A JP2009292532A JP4989716B2 JP 4989716 B2 JP4989716 B2 JP 4989716B2 JP 2009292532 A JP2009292532 A JP 2009292532A JP 2009292532 A JP2009292532 A JP 2009292532A JP 4989716 B2 JP4989716 B2 JP 4989716B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- nozzle
- viscous material
- valve
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F13/00—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
- G01F13/006—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups measuring volume in function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lift Valve (AREA)
Description
本願は、米国特許出願第08/607,126号、(1996年2月26日提出)の一部継続出願である米国特許出願第08/559,332号(1995年11月16日提出)の関連出願である。
[発明の分野]
本発明は、液体材料を分配する分野に、より詳しくは電子部品やプリント回路基盤の組立てにおける少量の粘性接着剤、半田フラックス又は他の液体材料を迅速に分配するための方法に関する。
[発明の背景]
本発明は、電子工業でプリント回路基盤の様な表面上に流体材料を分配するための方法及び装置に関する。しかし、本発明の用途は広く、他の産業でも有利に使用できる。
本発明の目的は、先行技術の方法及び装置の問題及び制約を解決するために、プリント回路基盤の上に間隔をおいて配置されたノズルオリフィスから少量の液体又は粘性材料を高温で分配するための方法及び装置を提供することである。
d=ドットの直径
r=ドットの半径=2/d
c=糸の直径
h=糸の長さ h(d,c)=4r(d)3/6r(c)2
ρ=接着剤の密度1xgm./cm2
σ=接着剤の降伏応力=500x3Pa(パスカル)
M=糸の質量M(d,c)= ρxπxr(c)2 xh(d,c)
F(c)=分断に必要な力=σy xπxr(c)2
a(d,c)=力を発生するのに必要な加速
F(c)/M(d,c)
解析すべきドットの直径が0.020インチである場合、
c=0.006インチ
h=0.074インチ
M(d,c)=3.432x10−5gm
F(c)=2.736x10−5kg m sec−2
a(d,c)=797 m/sec2
ドットの加速及び減速、したがってドットに対する力に影響する重要な変数は、下記の通りである。
a)流体の密度及びドットの大きさにより設定される形成されるドットの質量、
b)ノズル先端における濡れた面積により設定される形成される流れの直径、
c)バルブの直径、速度及び流体粘度により設定されるバルブにより発生する圧力、
d)オリフィスの長さ及び直径により設定されるノズルオリフィス中の圧力低下、
e)シャフトとハウジングの間の輪状区域の長さ、シャフトの直径、及びハウジングの直径により設定されるバルブから供給源に戻る圧力低下、及び
f)バルブ直径及びシート直径により設定される、バルブ位置により変化するバルブとシートの間の圧力低下。
Claims (5)
- 基材上に液体又は粘性材料の滴を堆積させる方法であって、該方法は、
材料を第一の位置に吐出するノズルを有する吐出装置を移動させる工程と、
バルブを有する該ノズルのオリフィスの出口端を通して、液体又は粘性材料の流れを吐出する工程と、
該バルブを閉じることにより該液体又は粘性材料の流れを止め、該ノズルから急速に該流れを分断させて第一の大きさを有する液体又は粘性材料の滴を形成する工程と、
該ノズルから急速に該液体又は粘性材料の流れを分断させる際に、前記第一の大きさを有する液体又は粘性材料の滴を少なくとも2個形成する工程と、
該少なくとも2個の該液体又は粘性材料の滴を互いの上に落として該第一の位置において組み合わせることにより、第二の大きさを有する最終滴を形成する工程と、
吐出装置を第二の位置に移動させる工程と、
バルブを有する該ノズルのオリフィスの出口端を通して、液体又は粘性材料の流れを吐出する工程と、
該バルブを閉じることにより該液体又は粘性材料の流れを止め、該ノズルから急速に該流れを分断させて第三の大きさを有する液体又は粘性材料の滴を形成する工程と、
該ノズルから急速に該液体又は粘性材料の流れを分断させる際に、前記第三の大きさを有する液体又は粘性材料の滴を少なくとも2個形成する工程と、
該少なくとも2個の該液体又は粘性材料の滴を互いの上に落として該第二の位置において組み合わせることにより、第四の大きさを有する最終滴を形成する工程とを備えることを特徴とする該方法。 - 請求項1に記載の方法であって、さらに、該ノズルのオリフィスを基材表面に隣接して配置させ、該第一の大きさを有する少なくとも2つの滴を互いの上に落として該基材上の単一の場所で組み合わせて、該第二の大きさを有する最終滴を形成する工程を備えることを特徴とする方法。
- 請求項2に記載の方法であって、さらに、該基材上に吐出される該第二の大きさを有する最終滴が該基材上の表面から第一の高さとなるような温度まで該液体又は粘性材料を加熱する工程を備えることを特徴とする方法。
- 請求項1から3のいずれか一項に記載の方法であって,該方法は、回路基材に材料の滴を塗布するために使用されることを特徴とする方法。
- 請求項3に記載の方法であって,少なくとも2個の滴を互いの上に落として単一の場所にて組みあわせ、基材の上側表面から上に、該第一の高さよりも高い第二の高さを有する最終的な滴を形成するように少なくとも2個の滴を吐出する工程を有することを特徴とする方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55933295A | 1995-11-16 | 1995-11-16 | |
US60712696A | 1996-02-26 | 1996-02-26 | |
US08/559,332 | 1996-02-26 | ||
US08/607,126 | 1996-02-26 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004228340A Division JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010075930A JP2010075930A (ja) | 2010-04-08 |
JP4989716B2 true JP4989716B2 (ja) | 2012-08-01 |
Family
ID=27072035
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51911897A Expired - Lifetime JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
JP2004228340A Expired - Lifetime JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
JP2009292532A Expired - Lifetime JP4989716B2 (ja) | 1995-11-16 | 2009-12-24 | 少量の液体材料を分配するための方法 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51911897A Expired - Lifetime JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
JP2004228340A Expired - Lifetime JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
Country Status (6)
Country | Link |
---|---|
EP (4) | EP1437192A3 (ja) |
JP (3) | JP3616105B2 (ja) |
AU (1) | AU1119797A (ja) |
CA (1) | CA2235991C (ja) |
DE (3) | DE69611692T2 (ja) |
WO (1) | WO1997018054A1 (ja) |
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US6253957B1 (en) * | 1995-11-16 | 2001-07-03 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
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US6085943A (en) | 1997-06-30 | 2000-07-11 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US5957343A (en) * | 1997-06-30 | 1999-09-28 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US6324973B2 (en) * | 1997-11-07 | 2001-12-04 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
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DE20106464U1 (de) | 2001-04-12 | 2001-08-02 | Pac Tech - Packaging Technologies GmbH, 14641 Nauen | Vorrichtung zum Aufbringen von Lotkugeln |
US7617951B2 (en) * | 2002-01-28 | 2009-11-17 | Nordson Corporation | Compact heated air manifolds for adhesive application |
EP2095885B1 (en) * | 2003-07-14 | 2017-08-02 | Nordson Corporation | Apparatus for dispensing discrete amounts of viscous material |
DE10338360A1 (de) * | 2003-08-21 | 2005-03-31 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Verfahren und Vorrichtung zur Herstellung eines Wabenkörpers |
US7168463B2 (en) * | 2004-02-23 | 2007-01-30 | Nidec Corporation | Method of charging dynamic-pressure bearing device with lubricating fluid, and method of inspecting dynamic-pressure bearing device |
JP5344262B2 (ja) * | 2004-12-20 | 2013-11-20 | Uht株式会社 | 液滴射出装置 |
EP2283930B1 (en) | 2006-01-06 | 2015-11-11 | Nordson Corporation | Liquid dispenser having individualized process air control |
US20080099538A1 (en) * | 2006-10-27 | 2008-05-01 | United Technologies Corporation & Pratt & Whitney Canada Corp. | Braze pre-placement using cold spray deposition |
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DE202011107412U1 (de) | 2011-11-03 | 2013-02-04 | Lothar Hentschel | Einstellbares Ventil für die dosierte Abgabe von Flüssigkeiten |
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DE102013006106A1 (de) * | 2013-04-09 | 2014-10-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung |
EP3053660B1 (en) * | 2013-10-05 | 2019-07-24 | Musashi Engineering, Inc. | Method and device for filling of liquid material |
DE102014010843B4 (de) | 2014-07-24 | 2020-12-03 | Technische Universität Braunschweig | Dosierdüse und Verfahren zum dosierten Auftragen hochviskoser Medien |
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1996
- 1996-11-12 WO PCT/US1996/018380 patent/WO1997018054A1/en active IP Right Grant
- 1996-11-12 EP EP04075967A patent/EP1437192A3/en not_active Withdrawn
- 1996-11-12 JP JP51911897A patent/JP3616105B2/ja not_active Expired - Lifetime
- 1996-11-12 EP EP00303607A patent/EP1029626B1/en not_active Revoked
- 1996-11-12 EP EP96942008A patent/EP0861136B1/en not_active Expired - Lifetime
- 1996-11-12 EP EP06075088A patent/EP1655094A1/en not_active Withdrawn
- 1996-11-12 DE DE69611692T patent/DE69611692T2/de not_active Expired - Lifetime
- 1996-11-12 CA CA002235991A patent/CA2235991C/en not_active Expired - Lifetime
- 1996-11-12 DE DE69632795T patent/DE69632795T8/de not_active Revoked
- 1996-11-12 AU AU11197/97A patent/AU1119797A/en not_active Abandoned
- 1996-11-12 DE DE06075088T patent/DE06075088T1/de active Pending
-
2004
- 2004-08-04 JP JP2004228340A patent/JP4657648B2/ja not_active Expired - Lifetime
-
2009
- 2009-12-24 JP JP2009292532A patent/JP4989716B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69611692D1 (de) | 2001-03-01 |
CA2235991A1 (en) | 1997-05-22 |
DE69632795T3 (de) | 2005-07-14 |
EP1437192A2 (en) | 2004-07-14 |
DE69611692T2 (de) | 2001-09-06 |
EP0861136A1 (en) | 1998-09-02 |
WO1997018054A1 (en) | 1997-05-22 |
EP1655094A1 (en) | 2006-05-10 |
JP2004322099A (ja) | 2004-11-18 |
JP3616105B2 (ja) | 2005-02-02 |
AU1119797A (en) | 1997-06-05 |
JP4657648B2 (ja) | 2011-03-23 |
JP2010075930A (ja) | 2010-04-08 |
CA2235991C (en) | 2005-02-15 |
DE06075088T1 (de) | 2007-01-04 |
EP1029626A2 (en) | 2000-08-23 |
DE69632795T8 (de) | 2005-10-20 |
DE69632795D1 (de) | 2004-07-29 |
EP1437192A3 (en) | 2005-06-08 |
EP1029626A3 (en) | 2000-10-18 |
JP2000501331A (ja) | 2000-02-08 |
EP0861136B1 (en) | 2001-01-24 |
EP1029626B1 (en) | 2004-06-23 |
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