JP2000501331A - 少量の液体材料を分配するための方法及び装置 - Google Patents
少量の液体材料を分配するための方法及び装置Info
- Publication number
- JP2000501331A JP2000501331A JP9519118A JP51911897A JP2000501331A JP 2000501331 A JP2000501331 A JP 2000501331A JP 9519118 A JP9519118 A JP 9519118A JP 51911897 A JP51911897 A JP 51911897A JP 2000501331 A JP2000501331 A JP 2000501331A
- Authority
- JP
- Japan
- Prior art keywords
- valve
- nozzle
- liquid
- viscous material
- valve seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F13/00—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
- G01F13/006—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups measuring volume in function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lift Valve (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 少量の液体材料を分配するための装置であって、 その中を通って伸びる第1流動通路を有するバルブシート機構であって前 記第1流動通路は、液体材料の供給源に接続された入口、前記液体材料が中を通 って分配される出口、及び前記入口と出口の間のバルブシートを有するバルブシ ート機構)、 その中を通って伸びる第2流動通路を有するノズル機構であって前記第2 流動通路は、前記バルブシート機構の前記出口に接続された入口区域及び前記液 体材料の流れが分配される細長いノズルオリフィスを有するノズル機構と、 前記バルブシートから間隔をおいた第1位置、及び前記バルブシートと係 合する第2位置の間で移動するバルブ を含むことを特徴とする装置。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55933295A | 1995-11-16 | 1995-11-16 | |
| US08/559,332 | 1995-11-16 | ||
| US60712696A | 1996-02-26 | 1996-02-26 | |
| US08/607,126 | 1996-02-26 | ||
| PCT/US1996/018380 WO1997018054A1 (en) | 1995-11-16 | 1996-11-12 | Method and apparatus for dispensing small amounts of liquid material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004228340A Division JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000501331A true JP2000501331A (ja) | 2000-02-08 |
| JP3616105B2 JP3616105B2 (ja) | 2005-02-02 |
Family
ID=27072035
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51911897A Expired - Lifetime JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
| JP2004228340A Expired - Lifetime JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
| JP2009292532A Expired - Lifetime JP4989716B2 (ja) | 1995-11-16 | 2009-12-24 | 少量の液体材料を分配するための方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004228340A Expired - Lifetime JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
| JP2009292532A Expired - Lifetime JP4989716B2 (ja) | 1995-11-16 | 2009-12-24 | 少量の液体材料を分配するための方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (4) | EP0861136B1 (ja) |
| JP (3) | JP3616105B2 (ja) |
| AU (1) | AU1119797A (ja) |
| CA (1) | CA2235991C (ja) |
| DE (3) | DE06075088T1 (ja) |
| WO (1) | WO1997018054A1 (ja) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007530249A (ja) * | 2003-07-14 | 2007-11-01 | ノードソン コーポレーション | 個別量の粘性材料を分配するための装置及び方法 |
| JP2011230122A (ja) * | 2004-12-20 | 2011-11-17 | Next I&D株式会社 | 液滴射出装置 |
| KR20120079334A (ko) * | 2011-01-04 | 2012-07-12 | 주식회사 탑 엔지니어링 | 점성물질 젯팅 장치 |
| JP2013031805A (ja) * | 2011-08-02 | 2013-02-14 | Yaskawa Electric Corp | 接着剤塗布装置 |
| JP2013536261A (ja) * | 2010-06-05 | 2013-09-19 | ノードソン コーポレーション | 高粘着性接着剤を噴射する噴射ディスペンサー及び方法 |
| KR20190028430A (ko) * | 2016-07-14 | 2019-03-18 | 에프. 홀저 게엠베하 | 펌프 헤드 및 계량 장치 |
| KR20190030696A (ko) * | 2016-07-14 | 2019-03-22 | 에프. 홀저 게엠베하 | 펌프 헤드 및 계량 장치 |
| CN110252591A (zh) * | 2018-06-12 | 2019-09-20 | 玛珂系统分析和开发有限公司 | 喷射阀 |
| KR20190140843A (ko) * | 2018-06-12 | 2019-12-20 | 마르코 시스템애널라이즈 운트 엔트비크룽 게엠베하 | 제트 밸브 |
| JP2022089371A (ja) * | 2020-12-04 | 2022-06-16 | 株式会社ワークス | 電子部品接着用ノズル |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6267266B1 (en) | 1995-11-16 | 2001-07-31 | Nordson Corporation | Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate |
| US6253957B1 (en) | 1995-11-16 | 2001-07-03 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
| US6093251A (en) * | 1997-02-21 | 2000-07-25 | Speedline Technologies, Inc. | Apparatus for measuring the height of a substrate in a dispensing system |
| US5918648A (en) * | 1997-02-21 | 1999-07-06 | Speedline Techologies, Inc. | Method and apparatus for measuring volume |
| US5957343A (en) * | 1997-06-30 | 1999-09-28 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
| US6085943A (en) * | 1997-06-30 | 2000-07-11 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
| US6324973B2 (en) | 1997-11-07 | 2001-12-04 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
| ES2152817B1 (es) * | 1998-05-20 | 2001-08-16 | Barberan Sa | Perfeccionamientos en los cabezales de aplicacion por tobera de colas termofusibles o de poliuterano reactivo. |
| DE20106464U1 (de) | 2001-04-12 | 2001-08-02 | Pac Tech - Packaging Technologies GmbH, 14641 Nauen | Vorrichtung zum Aufbringen von Lotkugeln |
| US7617951B2 (en) | 2002-01-28 | 2009-11-17 | Nordson Corporation | Compact heated air manifolds for adhesive application |
| DE10338360A1 (de) * | 2003-08-21 | 2005-03-31 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Verfahren und Vorrichtung zur Herstellung eines Wabenkörpers |
| CN100335807C (zh) * | 2004-02-23 | 2007-09-05 | 日本电产株式会社 | 液体分配方法 |
| ES2560555T3 (es) | 2006-01-06 | 2016-02-19 | Nordson Corporation | Dispensador de líquidos con control individualizado de aire de proceso |
| US20080099538A1 (en) * | 2006-10-27 | 2008-05-01 | United Technologies Corporation & Pratt & Whitney Canada Corp. | Braze pre-placement using cold spray deposition |
| US20090095825A1 (en) * | 2007-10-11 | 2009-04-16 | Nordson Corporation | Dispenser nozzle having differential hardness |
| DE202008004350U1 (de) | 2008-03-31 | 2009-08-27 | Hentschel, Lothar | Dosierventil für die berührungsfreie Dosierung von reaktiven Fluiden |
| DE102008027259A1 (de) | 2008-06-06 | 2009-12-17 | Focke & Co.(Gmbh & Co. Kg) | Verfahren und Vorrichtung zur Herstellung von Zigarettenpackungen |
| DE202010013815U1 (de) | 2010-10-05 | 2012-01-13 | Lothar Hentschel | Elektropneumatisch betätigtes Ventil für die dosierte Abgabe von Flüssigkeiten |
| DE202011107412U1 (de) | 2011-11-03 | 2013-02-04 | Lothar Hentschel | Einstellbares Ventil für die dosierte Abgabe von Flüssigkeiten |
| CH705930B1 (de) * | 2011-12-22 | 2015-08-28 | Esec Ag | Verfahren zum Auftragen von Klebstoff auf ein Substrat. |
| DE102013006106A1 (de) * | 2013-04-09 | 2014-10-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung |
| WO2015050244A1 (ja) | 2013-10-05 | 2015-04-09 | 武蔵エンジニアリング株式会社 | 液体材料充填装置および方法 |
| DE102014010843B4 (de) | 2014-07-24 | 2020-12-03 | Technische Universität Braunschweig | Dosierdüse und Verfahren zum dosierten Auftragen hochviskoser Medien |
| CN106794483A (zh) * | 2014-08-28 | 2017-05-31 | 诺信公司 | 非冲击的喷射分配模块及方法 |
| DE102017126307A1 (de) | 2017-11-09 | 2019-05-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung sowie Verfahren zum Dosieren von flüssigen Medien |
| SG11202008194VA (en) * | 2018-03-20 | 2020-09-29 | Musashi Engineering Inc | Liquid material ejecting apparatus |
| DE102018133606B3 (de) | 2018-12-27 | 2019-12-24 | PerfecDos GbR (vertretungsberechtigte Gesellschafter: Lothar Hentschel, 82544 Egling; Benjamin Kratz, 82211 Hersching; Peter Friedl, 83623 Dietramszell) | Jet-Dosierventil |
| KR102326763B1 (ko) * | 2020-07-15 | 2021-11-16 | 주식회사 위너스에프에이 | 디스펜서 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2025509A (en) * | 1934-05-10 | 1935-12-24 | Hieber Karl | Electric soldering iron |
| US4066188A (en) * | 1976-08-10 | 1978-01-03 | Nordson Corporation | Thermoplastic adhesive dispenser having an internal heat exchanger |
| FR2637520B1 (fr) * | 1988-10-07 | 1990-11-23 | Bourton Gilles | Fer a souder integral a ecoulement automatique et simultane de la soudure et de son decapant |
| US4942998A (en) * | 1988-12-15 | 1990-07-24 | Horvath Bruce B | Apparatus and process for automatically dispensing metal alloy paste material for joining metal components |
| JP2572289B2 (ja) * | 1990-04-12 | 1997-01-16 | セイコー電子工業株式会社 | 高粘度液体定量吐出装置 |
| DE4013323C2 (de) * | 1990-04-26 | 1996-07-25 | Hhs Leimauftrags Systeme Gmbh | Dosierventil |
| JP2964540B2 (ja) * | 1990-05-09 | 1999-10-18 | ソニー株式会社 | 接着剤塗布装置 |
| JPH0430593A (ja) * | 1990-05-28 | 1992-02-03 | Matsushita Electric Works Ltd | 接着剤塗布方法及びフラックス塗布方法及び半田ペースト塗布方法 |
| JPH0522054A (ja) * | 1991-07-16 | 1993-01-29 | Nec Corp | エミツタ・フオロア付差動増幅回路 |
| JPH0531458A (ja) * | 1991-07-30 | 1993-02-09 | Tdk Corp | 水性エマルジヨン接着剤の塗布方法 |
| JP2527926Y2 (ja) * | 1991-09-05 | 1997-03-05 | 徳興 中橋 | ホットメルトアプリケータ |
| US5320250A (en) * | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
| JPH05168997A (ja) * | 1991-12-26 | 1993-07-02 | Matsushita Electric Ind Co Ltd | ディスペンサ |
-
1996
- 1996-11-12 DE DE06075088T patent/DE06075088T1/de active Pending
- 1996-11-12 DE DE69632795T patent/DE69632795T8/de not_active Revoked
- 1996-11-12 JP JP51911897A patent/JP3616105B2/ja not_active Expired - Lifetime
- 1996-11-12 EP EP96942008A patent/EP0861136B1/en not_active Expired - Lifetime
- 1996-11-12 EP EP00303607A patent/EP1029626B1/en not_active Revoked
- 1996-11-12 DE DE69611692T patent/DE69611692T2/de not_active Expired - Lifetime
- 1996-11-12 AU AU11197/97A patent/AU1119797A/en not_active Abandoned
- 1996-11-12 CA CA002235991A patent/CA2235991C/en not_active Expired - Lifetime
- 1996-11-12 WO PCT/US1996/018380 patent/WO1997018054A1/en not_active Ceased
- 1996-11-12 EP EP06075088A patent/EP1655094A1/en not_active Withdrawn
- 1996-11-12 EP EP04075967A patent/EP1437192A3/en not_active Withdrawn
-
2004
- 2004-08-04 JP JP2004228340A patent/JP4657648B2/ja not_active Expired - Lifetime
-
2009
- 2009-12-24 JP JP2009292532A patent/JP4989716B2/ja not_active Expired - Lifetime
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007530249A (ja) * | 2003-07-14 | 2007-11-01 | ノードソン コーポレーション | 個別量の粘性材料を分配するための装置及び方法 |
| JP2011230122A (ja) * | 2004-12-20 | 2011-11-17 | Next I&D株式会社 | 液滴射出装置 |
| JP2013536261A (ja) * | 2010-06-05 | 2013-09-19 | ノードソン コーポレーション | 高粘着性接着剤を噴射する噴射ディスペンサー及び方法 |
| JP2016128168A (ja) * | 2010-06-05 | 2016-07-14 | ノードソン コーポレーションNordson Corporation | 高粘着性接着剤を噴射する噴射ディスペンサー及び方法 |
| KR20120079334A (ko) * | 2011-01-04 | 2012-07-12 | 주식회사 탑 엔지니어링 | 점성물질 젯팅 장치 |
| KR101869089B1 (ko) * | 2011-01-04 | 2018-06-19 | 주식회사 탑 엔지니어링 | 점성물질 젯팅 장치 |
| JP2013031805A (ja) * | 2011-08-02 | 2013-02-14 | Yaskawa Electric Corp | 接着剤塗布装置 |
| KR20190030696A (ko) * | 2016-07-14 | 2019-03-22 | 에프. 홀저 게엠베하 | 펌프 헤드 및 계량 장치 |
| KR20190028430A (ko) * | 2016-07-14 | 2019-03-18 | 에프. 홀저 게엠베하 | 펌프 헤드 및 계량 장치 |
| KR102445849B1 (ko) | 2016-07-14 | 2022-09-21 | 에프. 홀저 게엠베하 | 펌프 헤드 및 계량 장치 |
| KR102501071B1 (ko) | 2016-07-14 | 2023-02-20 | 에프. 홀저 게엠베하 | 펌프 헤드 및 계량 장치 |
| CN110252591A (zh) * | 2018-06-12 | 2019-09-20 | 玛珂系统分析和开发有限公司 | 喷射阀 |
| KR20190140843A (ko) * | 2018-06-12 | 2019-12-20 | 마르코 시스템애널라이즈 운트 엔트비크룽 게엠베하 | 제트 밸브 |
| KR102300642B1 (ko) * | 2018-06-12 | 2021-09-08 | 마르코 시스템애널라이즈 운트 엔트비크룽 게엠베하 | 제트 밸브 |
| US11326697B2 (en) | 2018-06-12 | 2022-05-10 | Marco Systemanalyse Und Entwicklung Gmbh | Jet valve |
| JP2022089371A (ja) * | 2020-12-04 | 2022-06-16 | 株式会社ワークス | 電子部品接着用ノズル |
| JP7229558B2 (ja) | 2020-12-04 | 2023-02-28 | 株式会社ワークス | 電子部品接着用ノズル |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010075930A (ja) | 2010-04-08 |
| JP2004322099A (ja) | 2004-11-18 |
| DE69632795T3 (de) | 2005-07-14 |
| WO1997018054A1 (en) | 1997-05-22 |
| EP1437192A3 (en) | 2005-06-08 |
| EP1655094A1 (en) | 2006-05-10 |
| CA2235991C (en) | 2005-02-15 |
| EP1029626A2 (en) | 2000-08-23 |
| AU1119797A (en) | 1997-06-05 |
| DE69632795D1 (de) | 2004-07-29 |
| EP1437192A2 (en) | 2004-07-14 |
| EP1029626B1 (en) | 2004-06-23 |
| JP3616105B2 (ja) | 2005-02-02 |
| EP0861136B1 (en) | 2001-01-24 |
| DE69611692T2 (de) | 2001-09-06 |
| DE69611692D1 (de) | 2001-03-01 |
| CA2235991A1 (en) | 1997-05-22 |
| EP0861136A1 (en) | 1998-09-02 |
| JP4657648B2 (ja) | 2011-03-23 |
| DE06075088T1 (de) | 2007-01-04 |
| EP1029626A3 (en) | 2000-10-18 |
| DE69632795T8 (de) | 2005-10-20 |
| JP4989716B2 (ja) | 2012-08-01 |
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