DE69906519D1 - Vorrichtung zum ausstoss von tröpfchen - Google Patents

Vorrichtung zum ausstoss von tröpfchen

Info

Publication number
DE69906519D1
DE69906519D1 DE69906519T DE69906519T DE69906519D1 DE 69906519 D1 DE69906519 D1 DE 69906519D1 DE 69906519 T DE69906519 T DE 69906519T DE 69906519 T DE69906519 T DE 69906519T DE 69906519 D1 DE69906519 D1 DE 69906519D1
Authority
DE
Germany
Prior art keywords
viscous medium
chamber
eject
droplets
tubular passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69906519T
Other languages
English (en)
Other versions
DE69906519T2 (de
Inventor
Johan Berg
William Holm
Johan Kronstedt
Kenth Nilsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mycronic Technologies AB
Original Assignee
MyData Automation AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MyData Automation AB filed Critical MyData Automation AB
Application granted granted Critical
Publication of DE69906519D1 publication Critical patent/DE69906519D1/de
Publication of DE69906519T2 publication Critical patent/DE69906519T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Air Bags (AREA)
  • Nozzles (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
DE69906519T 1998-06-11 1999-06-08 Vorrichtung zum ausstoss von tröpfchen Expired - Lifetime DE69906519T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9802079A SE513527C2 (sv) 1998-06-11 1998-06-11 Anordning och förfarande för utskjutning av små droppar
SE9802079 1998-06-11
PCT/SE1999/000996 WO1999064167A1 (en) 1998-06-11 1999-06-08 Device and method for jetting droplets

Publications (2)

Publication Number Publication Date
DE69906519D1 true DE69906519D1 (de) 2003-05-08
DE69906519T2 DE69906519T2 (de) 2004-03-04

Family

ID=20411664

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69906519T Expired - Lifetime DE69906519T2 (de) 1998-06-11 1999-06-08 Vorrichtung zum ausstoss von tröpfchen

Country Status (10)

Country Link
US (1) US6450416B1 (de)
EP (1) EP1083998B1 (de)
JP (1) JP4498606B2 (de)
KR (1) KR100601459B1 (de)
CN (1) CN1104965C (de)
AT (1) ATE235968T1 (de)
AU (1) AU4669699A (de)
DE (1) DE69906519T2 (de)
SE (1) SE513527C2 (de)
WO (1) WO1999064167A1 (de)

Families Citing this family (50)

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SE9901253D0 (sv) 1999-04-08 1999-04-08 Mydata Automation Ab Dispensing assembly
JP2002021715A (ja) * 2000-07-10 2002-01-23 Matsushita Electric Ind Co Ltd 流体供給装置及び流体供給方法
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
SE518640C2 (sv) 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
SE0003647D0 (sv) 2000-10-09 2000-10-09 Mydata Automation Ab Method, apparatus and use
SE0101503D0 (sv) 2001-04-27 2001-04-27 Mydata Automation Ab Method device and use of the device
KR100726770B1 (ko) * 2001-07-05 2007-06-11 삼성테크윈 주식회사 티비지에이 반도체 패키지의 제조장치와 이의 제조방법
SE0103737D0 (sv) * 2001-11-12 2001-11-12 Mydata Automation Ab Device for jetting droplets of a particle filled viscous medium
KR100413111B1 (ko) * 2001-11-15 2003-12-31 주식회사 프로텍 고속정량토출 제어용 헤드의 돗팅방법
SE0104210D0 (sv) * 2001-12-14 2001-12-14 Mydata Automation Ab Viscous medium feeder
JP4032729B2 (ja) * 2001-12-19 2008-01-16 松下電器産業株式会社 流体塗布方法
US6983867B1 (en) * 2002-04-29 2006-01-10 Dl Technology Llc Fluid dispense pump with drip prevention mechanism and method for controlling same
SE0202247D0 (sv) 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
JP2004283714A (ja) * 2003-03-20 2004-10-14 Fujitsu Display Technologies Corp 液剤吐出ディスペンサ
EP1654072A4 (de) * 2003-07-14 2007-10-03 Nordson Corp Vorrichtung und verfahren zur abgabe einzelner mengen von viskosem material
JP4183577B2 (ja) * 2003-07-25 2008-11-19 武蔵エンジニアリング株式会社 液滴調整方法及び液滴吐出方法並びにその装置
EP1701231A1 (de) 2005-03-08 2006-09-13 Mydata Automation AB Kalibrierverfahren
CN101356037A (zh) * 2005-11-14 2009-01-28 麦德塔自动化股份有限公司 喷射设备和通过使用测量气流的流量传感器改进喷射设备的性能的方法
US7980197B2 (en) * 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US8707559B1 (en) 2007-02-20 2014-04-29 Dl Technology, Llc Material dispense tips and methods for manufacturing the same
DE202009004251U1 (de) 2008-04-28 2009-06-10 Hormec Technic Sa Dosierungsvorrichtung
US8864055B2 (en) 2009-05-01 2014-10-21 Dl Technology, Llc Material dispense tips and methods for forming the same
US8757511B2 (en) 2010-01-11 2014-06-24 AdvanJet Viscous non-contact jetting method and apparatus
WO2012136343A1 (en) * 2011-04-05 2012-10-11 Eth Zurich Droplet dispensing device and light source comprising such a droplet dispensing device
US9346075B2 (en) 2011-08-26 2016-05-24 Nordson Corporation Modular jetting devices
US9254642B2 (en) 2012-01-19 2016-02-09 AdvanJet Control method and apparatus for dispensing high-quality drops of high-viscosity material
DE102012109124A1 (de) 2012-09-27 2014-03-27 Vermes Microdispensing GmbH Dosiersystem, Dosierverfahren und Herstellungsverfahren
DE102012109123A1 (de) 2012-09-27 2014-03-27 Vermes Microdispensing GmbH Dosiersystem, Dosierverfahren und Herstellungsverfahren
WO2014139569A1 (en) * 2013-03-13 2014-09-18 Micronic Mydata AB Methods for jetting viscous medium on workpiece
DE202013101134U1 (de) * 2013-03-15 2014-06-17 Vermes Microdispensing GmbH Dosierventil
DE102013102693A1 (de) * 2013-03-15 2014-09-18 Vermes Microdispensing GmbH Dosierventil und Dosierverfahren
US9625337B2 (en) * 2014-04-21 2017-04-18 John Brock Piezoelectric transducer assembly
DE102014209172A1 (de) 2014-05-15 2015-11-19 Robert Bosch Gmbh Vorrichtung zum Fokussieren eines aus einer Ausgabeöffnung einer Ausgabevorrichtung einer Jet-Vorrichtung ausgegebenen viskosen Mediums, Jet-System und Produktionsanlage
DE102014209171A1 (de) 2014-05-15 2015-11-19 Robert Bosch Gmbh Verfahren und Vorrichtung zum Fokussieren eines aus einer Ausgabeöffnung einer Ausgabevorrichtung einer Jet-Vorrichtung ausgegebenen viskosen Mediums
DE102014109934A1 (de) * 2014-07-15 2016-01-21 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots
KR20170092529A (ko) 2014-09-09 2017-08-11 마이크로닉 아베 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스
US9884444B2 (en) * 2014-10-17 2018-02-06 Ut-Battelle, Llc Enhanced additive manufacturing with a reciprocating platen
US10953413B2 (en) * 2015-06-04 2021-03-23 Nordson Corporation Jet cartridges for jetting fluid material, and related methods
DE102016008663A1 (de) 2016-07-20 2018-02-08 Jean-Claude Tytgat Vorrichtung zum genauen Dispensen von nieder- sowie hoch viskosen Materialien aus einer verschließbaren Dosierdüse zum Deponieren von Tröpfchen sowie raupenförmige Geometrien
JP6778426B2 (ja) 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
US20190275555A1 (en) * 2016-11-10 2019-09-12 Faustel, Inc. System and method for coating discrete patches on a moving substrate
WO2019011675A1 (en) 2017-07-12 2019-01-17 Mycronic AB VARIABLE AIRFLOW PROJECTION DEVICES AND METHODS OF REGULATING AIRFLOWS
KR102537372B1 (ko) 2017-07-12 2023-05-26 마이크로닉 아베 에너지 출력 장치들을 갖는 분사 장치들 및 그 제어 방법들
EP3651992A1 (de) 2017-07-12 2020-05-20 Mycronic Ab Strahlvorrichtungen mit akustischen wandlern und verfahren zu ihrer steuerung
DE102017221178A1 (de) * 2017-11-27 2019-05-29 Robert Bosch Gmbh Druckkopf für einen 3D-Drucker
KR102109529B1 (ko) * 2018-08-01 2020-05-12 신창호 유체 공급 기구
CN109437075A (zh) * 2018-11-27 2019-03-08 西南科技大学 高粘度膏状物的挤注装置
JP6815420B2 (ja) * 2019-01-25 2021-01-20 本田技研工業株式会社 ノズル距離確認装置及びノズル距離確認方法
WO2021151971A1 (en) * 2020-01-28 2021-08-05 Mycronic AB Jetting devices with flexible jetting nozzle
KR20220128437A (ko) * 2020-01-28 2022-09-20 마이크로닉 아베 공급 도관 액추에이터를 갖는 토출 장치들

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Also Published As

Publication number Publication date
EP1083998A1 (de) 2001-03-21
JP2002517736A (ja) 2002-06-18
EP1083998B1 (de) 2003-04-02
KR20010078735A (ko) 2001-08-21
CN1305398A (zh) 2001-07-25
JP4498606B2 (ja) 2010-07-07
US6450416B1 (en) 2002-09-17
SE9802079L (sv) 1999-12-12
DE69906519T2 (de) 2004-03-04
SE513527C2 (sv) 2000-09-25
CN1104965C (zh) 2003-04-09
ATE235968T1 (de) 2003-04-15
AU4669699A (en) 1999-12-30
SE9802079D0 (sv) 1998-06-11
WO1999064167A1 (en) 1999-12-16
KR100601459B1 (ko) 2006-07-19

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Legal Events

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8364 No opposition during term of opposition