CN1294207C - 液晶聚合物组合物 - Google Patents

液晶聚合物组合物 Download PDF

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Publication number
CN1294207C
CN1294207C CNB038178397A CN03817839A CN1294207C CN 1294207 C CN1294207 C CN 1294207C CN B038178397 A CNB038178397 A CN B038178397A CN 03817839 A CN03817839 A CN 03817839A CN 1294207 C CN1294207 C CN 1294207C
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CN
China
Prior art keywords
weight
composition
aramid
particulate
present
Prior art date
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Expired - Lifetime
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CNB038178397A
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English (en)
Chinese (zh)
Other versions
CN1671770A (zh
Inventor
M·R·萨米尔斯
M·J·莫利托尔
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Ticona LLC
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EI Du Pont de Nemours and Co
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Publication of CN1671770A publication Critical patent/CN1671770A/zh
Application granted granted Critical
Publication of CN1294207C publication Critical patent/CN1294207C/zh
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Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K19/54—Additives having no specific mesophase characterised by their chemical composition
    • C09K19/542—Macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
CNB038178397A 2002-07-25 2003-07-23 液晶聚合物组合物 Expired - Lifetime CN1294207C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39871002P 2002-07-25 2002-07-25
US60/398,710 2002-07-25

Publications (2)

Publication Number Publication Date
CN1671770A CN1671770A (zh) 2005-09-21
CN1294207C true CN1294207C (zh) 2007-01-10

Family

ID=31188460

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038178397A Expired - Lifetime CN1294207C (zh) 2002-07-25 2003-07-23 液晶聚合物组合物

Country Status (9)

Country Link
US (1) US7128847B2 (enExample)
EP (1) EP1527121B1 (enExample)
JP (1) JP4425790B2 (enExample)
KR (1) KR20050025991A (enExample)
CN (1) CN1294207C (enExample)
AU (1) AU2003256774A1 (enExample)
CA (1) CA2493754A1 (enExample)
DE (1) DE60305926T2 (enExample)
WO (1) WO2004011526A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744802B2 (en) * 2004-06-25 2010-06-29 Intel Corporation Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
JP2006045517A (ja) * 2004-06-30 2006-02-16 Sumitomo Chemical Co Ltd フィルム
KR101148384B1 (ko) * 2009-11-26 2012-05-21 삼성전기주식회사 기판 형성용 조성물, 및 이를 이용한 프리프레그 및 기판
JP2015522086A (ja) * 2012-06-27 2015-08-03 ティコナ・エルエルシー 超低粘度の液晶性ポリマー組成物
CN108882515A (zh) * 2018-09-21 2018-11-23 维沃移动通信有限公司 一种信号传输器件、信号传输器件的加工方法及移动终端
JP2021109891A (ja) * 2020-01-07 2021-08-02 パナソニックＩｐマネジメント株式会社 液晶性樹脂組成物及び成形品
JP2021147476A (ja) * 2020-03-18 2021-09-27 Ｅｎｅｏｓ株式会社 樹脂組成物および該樹脂組成物からなる樹脂成形品
CN113930084B (zh) * 2021-09-18 2024-05-07 珠海万通特种工程塑料有限公司 一种液晶聚合物组合物及其应用
KR20240124361A (ko) 2021-12-28 2024-08-16 스미또모 가가꾸 가부시키가이샤 수지 조성물 및 성형체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US525700A (en) * 1894-09-11 Attachment for stone-working machines
US5348990A (en) * 1993-03-02 1994-09-20 Hoechst Celanese Corp. Low dielectric materials
CN1207110A (zh) * 1996-01-05 1999-02-03 纳幕尔杜邦公司 液晶聚合物组合物
US6121171A (en) * 1997-04-08 2000-09-19 Sumitomo Chemical Company, Ltd. Composite film comprising low-dielectric resin and paraoriented aromatic polyamide
CN1296508A (zh) * 1998-04-09 2001-05-23 纳幕尔杜邦公司 低粘度液晶聚合物组合物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PH15509A (en) 1974-05-10 1983-02-03 Du Pont Improvements in an relating to synthetic polyesters
JPH0455437A (ja) * 1990-06-26 1992-02-24 Matsushita Electric Works Ltd 低誘電率積層板用プリプレグ
US5466744A (en) 1990-11-05 1995-11-14 General Electric Company Polymerization of macrocyclic poly(alkylene dicarboxylate) oligomers
US5110896A (en) 1990-12-10 1992-05-05 E. I. Du Pont De Nemours And Company Thermotropic liquid crystalline polyester compositions
JPH0799646B2 (ja) 1991-05-03 1995-10-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 分子的多孔性エーロゲルで充填された低誘電率複合積層品
US5474842A (en) * 1991-08-20 1995-12-12 Hoiness; David E. Aramid particles as wear additives
JP2909215B2 (ja) 1993-05-14 1999-06-23 イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー 液晶ポリマー組成物
US5397502A (en) 1993-06-10 1995-03-14 E. I. Du Pont De Nemours And Company Heat resistant liquid crsytalline polymers
US6388202B1 (en) * 1997-10-06 2002-05-14 Motorola, Inc. Multi layer printed circuit board
KR20020063621A (ko) * 2000-01-13 2002-08-03 이 아이 듀폰 디 네모아 앤드 캄파니 소립자 충전제를 함유하는 액상 결정질 중합체 조성물

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US525700A (en) * 1894-09-11 Attachment for stone-working machines
US5348990A (en) * 1993-03-02 1994-09-20 Hoechst Celanese Corp. Low dielectric materials
CN1207110A (zh) * 1996-01-05 1999-02-03 纳幕尔杜邦公司 液晶聚合物组合物
US6121171A (en) * 1997-04-08 2000-09-19 Sumitomo Chemical Company, Ltd. Composite film comprising low-dielectric resin and paraoriented aromatic polyamide
CN1296508A (zh) * 1998-04-09 2001-05-23 纳幕尔杜邦公司 低粘度液晶聚合物组合物

Also Published As

Publication number Publication date
DE60305926T2 (de) 2007-01-25
WO2004011526A1 (en) 2004-02-05
EP1527121A1 (en) 2005-05-04
US7128847B2 (en) 2006-10-31
DE60305926D1 (de) 2006-07-20
AU2003256774A1 (en) 2004-02-16
KR20050025991A (ko) 2005-03-14
US20040056233A1 (en) 2004-03-25
JP4425790B2 (ja) 2010-03-03
EP1527121B1 (en) 2006-06-07
JP2005533908A (ja) 2005-11-10
CA2493754A1 (en) 2004-02-05
CN1671770A (zh) 2005-09-21

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C06 Publication
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SE01 Entry into force of request for substantive examination
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Owner name: TICONA LLC

Free format text: FORMER OWNER: E.I. DU PONT DE NEMOURS AND CO.

Effective date: 20120425

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120425

Address after: American Kentucky

Patentee after: Ticona LLC

Address before: Wilmington, Delaware, USA

Patentee before: E. I. du Pont de Nemours and Co.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20070110