CN1263690A - 压接连接衬底、液晶装置及电子设备 - Google Patents
压接连接衬底、液晶装置及电子设备 Download PDFInfo
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- CN1263690A CN1263690A CN99800511A CN99800511A CN1263690A CN 1263690 A CN1263690 A CN 1263690A CN 99800511 A CN99800511 A CN 99800511A CN 99800511 A CN99800511 A CN 99800511A CN 1263690 A CN1263690 A CN 1263690A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/04—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions
- G09G3/16—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions by control of light from an independent source
- G09G3/18—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions by control of light from an independent source using liquid crystals
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9800798 | 1998-04-09 | ||
JP98007/1998 | 1998-04-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1263690A true CN1263690A (zh) | 2000-08-16 |
CN1166265C CN1166265C (zh) | 2004-09-08 |
Family
ID=14207682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998005118A Expired - Lifetime CN1166265C (zh) | 1998-04-09 | 1999-04-06 | 压接连接衬底、液晶装置及电子设备 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6781662B1 (zh) |
JP (1) | JP2000323818A (zh) |
KR (1) | KR100485966B1 (zh) |
CN (1) | CN1166265C (zh) |
TW (1) | TWI228628B (zh) |
WO (1) | WO1999053736A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101401496B (zh) * | 2006-03-14 | 2012-10-31 | 夏普株式会社 | 电路基板、电子电路装置和显示装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004260133A (ja) * | 2003-02-04 | 2004-09-16 | Seiko Epson Corp | 配線基板及び電気光学装置並びにこれらの製造方法並びに電子機器 |
JP4602150B2 (ja) * | 2005-04-20 | 2010-12-22 | シャープ株式会社 | 駆動回路基板と表示パネルの接続方法 |
KR20070044204A (ko) * | 2005-10-24 | 2007-04-27 | 엘지이노텍 주식회사 | 액정표시장치 |
JP5035519B2 (ja) * | 2007-02-22 | 2012-09-26 | ブラザー工業株式会社 | 回路素子実装フレキシブル配線材 |
JP2011049375A (ja) * | 2009-08-27 | 2011-03-10 | Panasonic Corp | 基板接続構造および電子機器 |
KR101925541B1 (ko) | 2012-08-06 | 2018-12-06 | 삼성디스플레이 주식회사 | 구동 ic실장 장치 및 구동 ic 실장 방법 |
JP6284717B2 (ja) * | 2013-05-16 | 2018-02-28 | 太陽誘電株式会社 | 電子部品、及び電子部品の製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2598030B2 (ja) | 1986-09-11 | 1997-04-09 | 株式会社東芝 | 液晶表示装置 |
EP0262580B1 (en) | 1986-09-25 | 1993-11-24 | Kabushiki Kaisha Toshiba | Method of electrically bonding two objects |
JP2601867B2 (ja) * | 1988-03-31 | 1997-04-16 | 株式会社東芝 | 半導体集積回路実装基板、その製造方法および半導体集積回路装置 |
JP3060334B2 (ja) | 1991-08-26 | 2000-07-10 | コニカ株式会社 | ハロゲン化銀カラー写真感光材料 |
JPH05152382A (ja) | 1991-12-02 | 1993-06-18 | Matsushita Electric Ind Co Ltd | 回路装置 |
JP2652107B2 (ja) | 1992-06-18 | 1997-09-10 | セイコーエプソン株式会社 | 電気的接続構造 |
US5467210A (en) * | 1993-02-16 | 1995-11-14 | Casio Computer Co., Ltd. | Arrangement of bonding IC chip to liquid crystal display device |
JPH06244545A (ja) | 1993-02-22 | 1994-09-02 | Mitsubishi Electric Corp | 部品実装ツール |
JP2867209B2 (ja) | 1993-08-27 | 1999-03-08 | 日東電工株式会社 | フレキシブル回路基板と接触対象物との接続方法およびその構造 |
SG63572A1 (en) | 1993-11-12 | 1999-03-30 | Seiko Epson Corp | Structure and method for mounting semiconductor devices and liquid crystal display |
JPH09148378A (ja) | 1995-11-20 | 1997-06-06 | Dainippon Printing Co Ltd | Icカード用icモジュールとその製造方法および当該icモジュールを使用したicカード |
JPH104122A (ja) | 1996-06-14 | 1998-01-06 | Hitachi Ltd | 半導体装置 |
JPH1013003A (ja) | 1996-06-26 | 1998-01-16 | Casio Comput Co Ltd | 半導体装置 |
JP3115253B2 (ja) | 1997-03-31 | 2000-12-04 | 三菱電機株式会社 | プリント基板及びプリント基板製造方法及びプリント基板設計方法及びプリント基板設計装置 |
KR100264162B1 (ko) * | 1997-08-28 | 2000-08-16 | 구본준 | 액정표시장치의 기판에 형성되는 패드의 구조 및 그 제조방법 |
JP4298068B2 (ja) * | 1998-08-18 | 2009-07-15 | セイコーエプソン株式会社 | 電気光学装置およびそれらを備えた電子機器並びに電気光学装置の製造方法 |
-
1999
- 1999-04-06 CN CNB998005118A patent/CN1166265C/zh not_active Expired - Lifetime
- 1999-04-06 KR KR10-1999-7010948A patent/KR100485966B1/ko not_active IP Right Cessation
- 1999-04-06 US US09/445,102 patent/US6781662B1/en not_active Expired - Lifetime
- 1999-04-06 WO PCT/JP1999/001832 patent/WO1999053736A1/ja active IP Right Grant
- 1999-04-08 TW TW088105618A patent/TWI228628B/zh not_active IP Right Cessation
-
2000
- 2000-04-03 JP JP2000100761A patent/JP2000323818A/ja not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101401496B (zh) * | 2006-03-14 | 2012-10-31 | 夏普株式会社 | 电路基板、电子电路装置和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2000323818A (ja) | 2000-11-24 |
US6781662B1 (en) | 2004-08-24 |
CN1166265C (zh) | 2004-09-08 |
KR20010012978A (ko) | 2001-02-26 |
TWI228628B (en) | 2005-03-01 |
KR100485966B1 (ko) | 2005-05-03 |
WO1999053736A1 (en) | 1999-10-21 |
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