JP5035519B2 - 回路素子実装フレキシブル配線材 - Google Patents
回路素子実装フレキシブル配線材 Download PDFInfo
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- JP5035519B2 JP5035519B2 JP2007042617A JP2007042617A JP5035519B2 JP 5035519 B2 JP5035519 B2 JP 5035519B2 JP 2007042617 A JP2007042617 A JP 2007042617A JP 2007042617 A JP2007042617 A JP 2007042617A JP 5035519 B2 JP5035519 B2 JP 5035519B2
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- circuit element
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- 239000000463 material Substances 0.000 title claims description 69
- 239000004020 conductor Substances 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 34
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims 1
- 239000010931 gold Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14217—Multi layer finger type piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
さらに、基材の裏面側に実装されている第1の回路素子と、表面側に実装されている第2の回路素子とは、平面視で重ならない位置に配置されているから、回路素子をそれに対応する導線に実装するとき、他方の回路素子と干渉することがなく、容易に実装することができる。
また、前記基材における前記各回路素子が実装される領域では、複数の前記導線を部分的に外部に露出させて、それぞれの上に導電材製のバンプが配置され、これら複数のバンプを介在させて、前記各回路素子が電気的に接続されており、前記第1の回路素子に接続するバンプは、平面視で前記第2入力用導線と重なり、前記第2の回路素子に接続するバンプは、平面視で前記第1出力用導線と重なっているので、このことからも導線の配線数を従来の2倍にしても、導線の線幅を細くすることなく、従来と同じ配線ピッチを維持でき、基材を大きくする必要がない。
3 記録ヘッド
32 アクチュエータ
39a 個別用表面電極
41 入力用端子電極
42 出力用端子電極
42a 第1の端子電極
42b 第2の端子電極
50 基材
51a,51b,51c,51d,51e 導線
52 絶縁層
53a,53b 回路素子
55 貫通部
56 バンプ
100 記録装置
Claims (5)
- 複数の導線を平面状に有するとともにその導線に回路素子を実装し、一端側に出力用の端子電極、他端側に入力用の端子電極を有するフレキシブル配線材において、
可撓性を有する平板状の基材と、前記基材の裏面に配線された複数の第1導線と、前記基材の表面に配線された複数の第2導線と、前記導線を覆う絶縁層と、前記基材の裏面の第1導線に実装されている第1の回路素子と、前記基材の表面の前記第2導線に実装されている第2の回路素子とを有し、
前記基材の一方の面には、出力用の複数の端子電極が設けられ、
前記第1導線は、前記第1の回路素子へ入力するための第1入力用導線と、前記第1の回路素子から出力するための第1出力用導線とを含み、
前記第2導線は、前記第2の回路素子へ入力するための第2入力用導線と、前記第2の回路素子から出力するための第2出力用導線とを含み、
前記出力用の端子電極は、前記基材の前記裏面側に配線されている前記第1出力用導線を部分的に外部に露出させて形成された第1の端子電極と、前記基材の表裏面を貫通して形成された貫通部を介して、前記基材の表面側に配線されている前記第2出力用導線を前記裏面側の外部に露出させて形成された第2の端子電極とを含んでおり、
前記第1の回路素子と、前記第2の回路素子とは、平面視で重ならない位置に配置されており、
前記基材における前記各回路素子が実装される領域では、複数の前記導線を部分的に外部に露出させて、それぞれの上に導電材製のバンプが配置され、これら複数のバンプを介在させて、前記各回路素子が電気的に接続されており、
前記第1の回路素子に接続するバンプは、平面視で前記第2入力用導線と重なり、前記第2の回路素子に接続するバンプは、平面視で前記第1出力用導線と重なっていることを特徴とするフレキシブル配線材。 - 前記第1及び第2の回路素子と、前記第1導線及び第2導線とは、インクジェット式記録ヘッドにおけるアクチュエータへ駆動信号を送るために設けられ、
前記第1及び第2の回路素子における定電位の電極に接続する第3の導線は、前記第1の回路素子と前記第2の回路素子とが基材上で並ぶ方向に沿って延在していることを特徴とする請求項1に記載のフレキシブル配線材。 - 前記第1の回路素子と前記第2の回路素子とが前記基材上で並ぶ方向と交差する方向に、複数のノズルが並ぶノズル列を前記記録ヘッドに形成し、
前記ノズル列は前記並ぶ方向に複数並んで前記記録ヘッドに配置され、
前記第1の回路素子と前記第2の回路素子とは、前記ノズル列毎に接続されていることを特徴とする請求項2に記載のフレキシブル配線材。 - 複数の前記バンプが配置されている箇所におけるフレキシブル配線材の厚みがすべて同じになるように、前記バンプが配置された面の反対側の面の配線がなされ、
前記バンプが配置されている箇所の、前記基材を挟んだ反対側の箇所には、前記導線におけるバンプが配置されていない部分が配線されていることを特徴とする請求項1乃至3のいずれかに記載のフレキシブル配線材。 - 前記貫通部は、前記基材の前記一方の面側の開口が前記他方の面側の開口よりも拡径されたテーパ形状に形成されており、
前記第2の端子電極は、前記他方の面側の前記導線と一端を連続させ前記基材の前記一方の面側に他端を露出させるように前記貫通部に充填した導電性材料によって形成されていることを特徴とする請求項1から4のいずれかに記載のフレキシブル配線材。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007042617A JP5035519B2 (ja) | 2007-02-22 | 2007-02-22 | 回路素子実装フレキシブル配線材 |
US12/034,492 US7935894B2 (en) | 2007-02-22 | 2008-02-20 | Flexible wiring cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007042617A JP5035519B2 (ja) | 2007-02-22 | 2007-02-22 | 回路素子実装フレキシブル配線材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008205390A JP2008205390A (ja) | 2008-09-04 |
JP5035519B2 true JP5035519B2 (ja) | 2012-09-26 |
Family
ID=39714597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007042617A Active JP5035519B2 (ja) | 2007-02-22 | 2007-02-22 | 回路素子実装フレキシブル配線材 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7935894B2 (ja) |
JP (1) | JP5035519B2 (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4246595A (en) * | 1977-03-08 | 1981-01-20 | Matsushita Electric Industrial Co., Ltd. | Electronics circuit device and method of making the same |
JP2914795B2 (ja) * | 1991-09-02 | 1999-07-05 | キヤノン株式会社 | 両面フレキシブルプリント配線板 |
JPH081499B2 (ja) * | 1993-01-05 | 1996-01-10 | 日本電気株式会社 | 液晶表示装置 |
JP2606177B2 (ja) * | 1995-04-26 | 1997-04-30 | 日本電気株式会社 | 印刷配線板 |
JP3150582B2 (ja) * | 1995-08-24 | 2001-03-26 | 富士機工電子株式会社 | エアリア・グリッド・アレイ・パッケージ用基板およびその製造方法 |
JP3645667B2 (ja) * | 1996-09-03 | 2005-05-11 | 株式会社アドバンスト・ディスプレイ | 液晶表示装置 |
CN1166265C (zh) * | 1998-04-09 | 2004-09-08 | 精工爱普生株式会社 | 压接连接衬底、液晶装置及电子设备 |
JP2002076542A (ja) * | 2000-08-23 | 2002-03-15 | Canon Inc | プリント回路基板 |
JP2002289764A (ja) * | 2001-03-26 | 2002-10-04 | Sharp Corp | フレキシブル回路基板、それを用いた表示装置および電子機器 |
US6862184B2 (en) * | 2002-06-27 | 2005-03-01 | Intel Corporation | High performance microprocessor power delivery solution using flex connections |
US6841739B2 (en) * | 2002-07-31 | 2005-01-11 | Motorola, Inc. | Flexible circuit board having electrical resistance heater trace |
JP2004273617A (ja) * | 2003-03-06 | 2004-09-30 | Canon Inc | 半導体装置 |
JP4243850B2 (ja) * | 2004-05-11 | 2009-03-25 | ブラザー工業株式会社 | 積層型圧電素子及びそれを備えたインクジェット記録ヘッド |
JP4622359B2 (ja) * | 2004-07-22 | 2011-02-02 | コニカミノルタホールディングス株式会社 | インクジェットヘッドの製造方法 |
JP4671029B2 (ja) | 2005-06-29 | 2011-04-13 | ブラザー工業株式会社 | インク滴吐出装置 |
JP2007012899A (ja) * | 2005-06-30 | 2007-01-18 | Brother Ind Ltd | 配線基板及びインクジェットヘッド |
-
2007
- 2007-02-22 JP JP2007042617A patent/JP5035519B2/ja active Active
-
2008
- 2008-02-20 US US12/034,492 patent/US7935894B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080202796A1 (en) | 2008-08-28 |
JP2008205390A (ja) | 2008-09-04 |
US7935894B2 (en) | 2011-05-03 |
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