JP5003874B2 - 回路素子実装フレキシブル配線材 - Google Patents
回路素子実装フレキシブル配線材 Download PDFInfo
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- JP5003874B2 JP5003874B2 JP2007047480A JP2007047480A JP5003874B2 JP 5003874 B2 JP5003874 B2 JP 5003874B2 JP 2007047480 A JP2007047480 A JP 2007047480A JP 2007047480 A JP2007047480 A JP 2007047480A JP 5003874 B2 JP5003874 B2 JP 5003874B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- Accessory Devices And Overall Control Thereof (AREA)
Description
3 記録ヘッド
32 アクチュエータ
39 表面電極
41 入力用接続電極
42 出力用接続電極
50 基材
53 回路素子
54 絶縁層
55 第1の出力端子
56 入力端子
57 第2の出力端子
60 第1の出力導線
70 第2の出力導線
71 上流側の第1の部分
72 下流側の第1の部分
73 第2の部分
80 入力導線
81a、81b 導電性材料
100 記録装置
150、250、350 補助基材
Claims (10)
- 複数の導線を平面状に有するとともにその導線に回路素子を実装し、一端側に入力用接続電極、他端側に出力用接続電極を有するフレキシブル配線材において、
前記回路素子には、一方の辺に沿って、複数の第1の出力端子が設けられ、且つ、それと反対側の他方の辺に沿って、複数の入力端子と複数の第2の出力端子とが並んで設けられ、
前記導線は、前記第1の出力端子から前記出力用接続電極に延びる第1の出力導線と、前記第2の出力端子から前記出力用接続電極に延びる第2の出力導線と、前記入力用接続電極から前記入力端子に延びる入力導線とを含み、
前記第2の出力導線が、部分的に前記フレキシブル配線材の前記回路素子とは反対側の面側を通って、前記回路素子の他方の辺側から、前記回路素子の一方の辺側へ延び、さらに、前記第1の出力導線と平行に延びて、前記出力用接続電極に接続されていることを特徴とするフレキシブル配線材。 - 前記入力端子は、前記回路素子の他方の辺のほぼ中央に配置され、前記第2の出力端子は、その回路素子の他方の辺において前記入力端子を挟む両側に配置されていることを特徴とする請求項1に記載のフレキシブル配線材。
- 可撓性を有する平板状の基材上に、前記入力導線、第1の出力導線および回路素子を有し、
前記第2の出力導線は、
前記基材上にて、前記回路素子の第2の出力端子から延びる部分と、
前記基材の、前記第1の出力導線と同じ側に位置して前記出力用接続電極と接続する部分と、
前記基材の前記回路素子とは反対側の他方の面側を通る部分とを有することを特徴とする請求項1または2に記載のフレキシブル配線材。 - 前記基材には、前記回路素子の前記両辺をほぼ挟む両側の位置に、当該基材を貫通するように導電性材料が設けられ、
前記第2の出力導線は、前記基材の一方の面側に位置する第1の部分と、前記基材の前記回路素子とは反対側の他方の面側を通る第2の部分とが、前記基材を貫通する導電性材料を介して接続されていることを特徴とする請求項3に記載のフレキシブル配線材。 - 前記第2の出力導線の第2の部分は、前記基材の他方の面側に印刷形成されていることを特徴とする請求項4に記載のフレキシブル配線材。
- 前記第2の出力導線の第2の部分は、前記基材の他方の面側に固着される補助基材上に形成され、その補助基材が前記他方の面側に、前記第2の部分と前記貫通した導電性材料とが接続する状態で固着されていることを特徴とする請求項4に記載のフレキシブル配線材。
- 前記補助基材は、前記基材の一側に連続して形成され、前記基材に対して折り曲げられた状態で前記基材の他方の面側に固着されていることを特徴とする請求項6に記載のフレキシブル配線材。
- 前記基材の一側に、前記回路素子の前記両辺の延長方向へ連続して形成され且つ前記基材の他方の面側へ折り曲げられた補助基材を備え、
前記第2の出力導線は、前記第2の出力端子と前記出力用接続電極との間に前記補助基材上を経て連続して形成されていることを特徴とする請求項3に記載のフレキシブル配線材。 - 前記補助基材が折り曲げられているとき、前記基材の幅は、前記補助基材がある部分と、ない部分とでほぼ同じであることを特徴とする請求項6から8のいずれかに記載のフレキシブル配線材。
- 前記出力用接続電極は、アクチュエータの選択的駆動により記録動作を行う記録ヘッドにおけるそのアクチュエータに接続されていることを特徴とする請求項1から9のいずれかに記載のフレキシブル配線材。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007047480A JP5003874B2 (ja) | 2007-02-27 | 2007-02-27 | 回路素子実装フレキシブル配線材 |
US12/037,924 US8134078B2 (en) | 2007-02-27 | 2008-02-26 | Flexible wiring cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007047480A JP5003874B2 (ja) | 2007-02-27 | 2007-02-27 | 回路素子実装フレキシブル配線材 |
Publications (2)
Publication Number | Publication Date |
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JP2008211048A JP2008211048A (ja) | 2008-09-11 |
JP5003874B2 true JP5003874B2 (ja) | 2012-08-15 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007047480A Active JP5003874B2 (ja) | 2007-02-27 | 2007-02-27 | 回路素子実装フレキシブル配線材 |
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US (1) | US8134078B2 (ja) |
JP (1) | JP5003874B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009009631A (ja) * | 2007-06-27 | 2009-01-15 | Sumitomo Bakelite Co Ltd | フレキシブル配線ユニットおよび電子機器 |
US7663062B1 (en) * | 2008-07-30 | 2010-02-16 | Himax Technologies Limited | Flexible circuit board |
JP5140028B2 (ja) * | 2009-03-26 | 2013-02-06 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
US20120194990A1 (en) * | 2011-01-31 | 2012-08-02 | Martin Kuster | Semiconductor Arrangements |
KR102371358B1 (ko) * | 2015-01-23 | 2022-03-08 | 삼성전자주식회사 | 반도체 패키지 및 이를 사용하는 패키지 모듈 |
JP6903873B2 (ja) | 2016-06-30 | 2021-07-14 | ブラザー工業株式会社 | 液体吐出ヘッド |
TWI601255B (zh) * | 2016-12-14 | 2017-10-01 | Chipmos Technologies Inc | 薄膜覆晶封裝結構 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000062162A (ja) * | 1998-08-20 | 2000-02-29 | Seiko Epson Corp | インクジェット式記録ヘッド |
JP2002083845A (ja) | 2000-07-05 | 2002-03-22 | Sharp Corp | フレキシブル配線基板、icチップ実装フレキシブル配線基板およびこれを用いた表示装置並びにicチップ実装構造、icチップ実装フレキシブル配線基板のボンディング方法 |
JP4151250B2 (ja) * | 2001-09-11 | 2008-09-17 | ブラザー工業株式会社 | 記録装置 |
US20040233641A1 (en) * | 2003-05-19 | 2004-11-25 | Mark Moshayedi | Processor/memory module with foldable substrate |
US7321496B2 (en) * | 2004-03-19 | 2008-01-22 | Matsushita Electric Industrial Co., Ltd. | Flexible substrate, multilayer flexible substrate and process for producing the same |
JP4243850B2 (ja) * | 2004-05-11 | 2009-03-25 | ブラザー工業株式会社 | 積層型圧電素子及びそれを備えたインクジェット記録ヘッド |
JP4671029B2 (ja) | 2005-06-29 | 2011-04-13 | ブラザー工業株式会社 | インク滴吐出装置 |
JP4770295B2 (ja) * | 2005-06-30 | 2011-09-14 | ブラザー工業株式会社 | 配線基板 |
-
2007
- 2007-02-27 JP JP2007047480A patent/JP5003874B2/ja active Active
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- 2008-02-26 US US12/037,924 patent/US8134078B2/en not_active Expired - Fee Related
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US8134078B2 (en) | 2012-03-13 |
JP2008211048A (ja) | 2008-09-11 |
US20080202797A1 (en) | 2008-08-28 |
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