CN1227742C - 在碳化硅中制造双极结晶体管的方法和得到的器件 - Google Patents

在碳化硅中制造双极结晶体管的方法和得到的器件 Download PDF

Info

Publication number
CN1227742C
CN1227742C CNB008200653A CN00820065A CN1227742C CN 1227742 C CN1227742 C CN 1227742C CN B008200653 A CNB008200653 A CN B008200653A CN 00820065 A CN00820065 A CN 00820065A CN 1227742 C CN1227742 C CN 1227742C
Authority
CN
China
Prior art keywords
silicon carbide
carbide layer
layer
column
conduction type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB008200653A
Other languages
English (en)
Chinese (zh)
Other versions
CN1461497A (zh
Inventor
R·辛
A·K·阿加瓦尔
S·-H·亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to CNB008200653A priority Critical patent/CN1227742C/zh
Publication of CN1461497A publication Critical patent/CN1461497A/zh
Application granted granted Critical
Publication of CN1227742C publication Critical patent/CN1227742C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/01Manufacture or treatment
    • H10D10/051Manufacture or treatment of vertical BJTs
    • H10D10/056Manufacture or treatment of vertical BJTs of vertical BJTs having the main current going through the whole substrate, e.g. power BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/40Vertical BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide

Landscapes

  • Bipolar Transistors (AREA)
CNB008200653A 2000-12-11 2000-12-11 在碳化硅中制造双极结晶体管的方法和得到的器件 Expired - Lifetime CN1227742C (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB008200653A CN1227742C (zh) 2000-12-11 2000-12-11 在碳化硅中制造双极结晶体管的方法和得到的器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/US2000/033627 WO2002049115A1 (en) 2000-12-11 2000-12-11 Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices
CNB008200653A CN1227742C (zh) 2000-12-11 2000-12-11 在碳化硅中制造双极结晶体管的方法和得到的器件

Publications (2)

Publication Number Publication Date
CN1461497A CN1461497A (zh) 2003-12-10
CN1227742C true CN1227742C (zh) 2005-11-16

Family

ID=21742063

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008200653A Expired - Lifetime CN1227742C (zh) 2000-12-11 2000-12-11 在碳化硅中制造双极结晶体管的方法和得到的器件

Country Status (7)

Country Link
EP (1) EP1342271B1 (https=)
JP (1) JP5178988B2 (https=)
KR (1) KR100718937B1 (https=)
CN (1) CN1227742C (https=)
AU (1) AU2001224295A1 (https=)
CA (1) CA2425541C (https=)
WO (1) WO2002049115A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529598B (zh) * 2006-11-29 2012-04-04 住友电气工业株式会社 碳化硅半导体器件的制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4777699B2 (ja) * 2005-06-13 2011-09-21 本田技研工業株式会社 バイポーラ型半導体装置およびその製造方法
US7304334B2 (en) * 2005-09-16 2007-12-04 Cree, Inc. Silicon carbide bipolar junction transistors having epitaxial base regions and multilayer emitters and methods of fabricating the same
US7345310B2 (en) * 2005-12-22 2008-03-18 Cree, Inc. Silicon carbide bipolar junction transistors having a silicon carbide passivation layer on the base region thereof
CN103681816A (zh) * 2012-09-09 2014-03-26 苏州英能电子科技有限公司 一种具有浮置环结构的双极型晶体管

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202962A (ja) * 1987-02-18 1988-08-22 Fujitsu Ltd バイポ−ラトランジスタおよび製造方法
US4945394A (en) * 1987-10-26 1990-07-31 North Carolina State University Bipolar junction transistor on silicon carbide
DE3802755A1 (de) 1988-01-30 1989-08-10 Kernforschungsanlage Juelich Verfahren zur einlagerung von radioaktiven abfallstoffen
GB8926414D0 (en) * 1989-11-18 1990-01-10 Lsi Logic Europ Bipolar junction transistors
JPH0548083A (ja) * 1991-08-09 1993-02-26 Toshiba Corp 電力用半導体素子
JPH05335497A (ja) * 1992-06-01 1993-12-17 Nippon Steel Corp 半導体装置の製造方法
DE4301333C2 (de) * 1993-01-20 2003-05-15 Daimler Chrysler Ag Verfahren zur Herstellung von Silizium-Germanium-Heterobipolartransistoren
JP3152046B2 (ja) * 1994-01-10 2001-04-03 富士電機株式会社 バイポーラトランジスタおよびその製造方法
JPH0878431A (ja) * 1994-09-05 1996-03-22 Fuji Electric Co Ltd 炭化けい素たて型バイポーラトランジスタおよびその製造方法
JPH08288500A (ja) * 1995-04-20 1996-11-01 Hitachi Ltd 炭化珪素半導体素子とその製造法及び用途
KR0171000B1 (ko) * 1995-12-15 1999-02-01 양승택 자동 정의된 베이스 전극을 갖는 바이폴라 트랜지스터 구조 및 그 제조방법
SE516338C2 (sv) * 1999-05-31 2001-12-17 Ericsson Telefon Ab L M RF-effekttransistor med kollektor upp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529598B (zh) * 2006-11-29 2012-04-04 住友电气工业株式会社 碳化硅半导体器件的制造方法

Also Published As

Publication number Publication date
EP1342271A1 (en) 2003-09-10
JP5178988B2 (ja) 2013-04-10
WO2002049115A1 (en) 2002-06-20
KR20030061377A (ko) 2003-07-18
AU2001224295A1 (en) 2002-06-24
EP1342271B1 (en) 2013-11-20
KR100718937B1 (ko) 2007-05-16
CA2425541A1 (en) 2002-06-20
CA2425541C (en) 2014-08-05
JP2004516655A (ja) 2004-06-03
CN1461497A (zh) 2003-12-10

Similar Documents

Publication Publication Date Title
US6329675B2 (en) Self-aligned bipolar junction silicon carbide transistors
US6218254B1 (en) Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices
US7282753B2 (en) Vertical conducting power semiconducting devices made by deep reactive ion etching
US7345310B2 (en) Silicon carbide bipolar junction transistors having a silicon carbide passivation layer on the base region thereof
US7838377B2 (en) Power semiconductor devices with mesa structures and buffer layers including mesa steps
CN100555663C (zh) 碳化硅器件及其制造方法
CN1126180C (zh) 免闭锁功率金属氧化物半导体-双极型晶体管及其形成方法
JP4774196B2 (ja) 成長したベース領域を有する炭化ケイ素バイポーラ接合トランジスタ
US20150311325A1 (en) Igbt structure on sic for high performance
US8343841B2 (en) Method for fabricating a semiconductor device
CN217405436U (zh) 结势垒肖特基器件和结势垒肖特基装置
CN115832016A (zh) 半导体器件
US9236433B2 (en) Semiconductor devices in SiC using vias through N-type substrate for backside contact to P-type layer
CN1227742C (zh) 在碳化硅中制造双极结晶体管的方法和得到的器件
CN116314327A (zh) 集成肖特基二极管的垂直碳化硅沟槽型mosfet
US4459605A (en) Vertical MESFET with guardring
CN115706147A (zh) 半导体器件及其制作方法
US9029250B2 (en) Method for producing semiconductor regions including impurities
US12136647B2 (en) Super junction power device and method of making the same
CN116230740A (zh) 一种具有载流子存储层的超结igbt器件及其制造方法
CN114783879A (zh) 一种改善超结vdmos器件抗辐照能力的器件制作方法
CN114823309A (zh) 倾斜超级结器件的侧壁离子注入优化工艺方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20051116