CN1227742C - 在碳化硅中制造双极结晶体管的方法和得到的器件 - Google Patents
在碳化硅中制造双极结晶体管的方法和得到的器件 Download PDFInfo
- Publication number
- CN1227742C CN1227742C CNB008200653A CN00820065A CN1227742C CN 1227742 C CN1227742 C CN 1227742C CN B008200653 A CNB008200653 A CN B008200653A CN 00820065 A CN00820065 A CN 00820065A CN 1227742 C CN1227742 C CN 1227742C
- Authority
- CN
- China
- Prior art keywords
- silicon carbide
- carbide layer
- layer
- column
- conduction type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/01—Manufacture or treatment
- H10D10/051—Manufacture or treatment of vertical BJTs
- H10D10/056—Manufacture or treatment of vertical BJTs of vertical BJTs having the main current going through the whole substrate, e.g. power BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/40—Vertical BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Landscapes
- Bipolar Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB008200653A CN1227742C (zh) | 2000-12-11 | 2000-12-11 | 在碳化硅中制造双极结晶体管的方法和得到的器件 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2000/033627 WO2002049115A1 (en) | 2000-12-11 | 2000-12-11 | Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices |
| CNB008200653A CN1227742C (zh) | 2000-12-11 | 2000-12-11 | 在碳化硅中制造双极结晶体管的方法和得到的器件 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1461497A CN1461497A (zh) | 2003-12-10 |
| CN1227742C true CN1227742C (zh) | 2005-11-16 |
Family
ID=21742063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008200653A Expired - Lifetime CN1227742C (zh) | 2000-12-11 | 2000-12-11 | 在碳化硅中制造双极结晶体管的方法和得到的器件 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1342271B1 (https=) |
| JP (1) | JP5178988B2 (https=) |
| KR (1) | KR100718937B1 (https=) |
| CN (1) | CN1227742C (https=) |
| AU (1) | AU2001224295A1 (https=) |
| CA (1) | CA2425541C (https=) |
| WO (1) | WO2002049115A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101529598B (zh) * | 2006-11-29 | 2012-04-04 | 住友电气工业株式会社 | 碳化硅半导体器件的制造方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4777699B2 (ja) * | 2005-06-13 | 2011-09-21 | 本田技研工業株式会社 | バイポーラ型半導体装置およびその製造方法 |
| US7304334B2 (en) * | 2005-09-16 | 2007-12-04 | Cree, Inc. | Silicon carbide bipolar junction transistors having epitaxial base regions and multilayer emitters and methods of fabricating the same |
| US7345310B2 (en) * | 2005-12-22 | 2008-03-18 | Cree, Inc. | Silicon carbide bipolar junction transistors having a silicon carbide passivation layer on the base region thereof |
| CN103681816A (zh) * | 2012-09-09 | 2014-03-26 | 苏州英能电子科技有限公司 | 一种具有浮置环结构的双极型晶体管 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63202962A (ja) * | 1987-02-18 | 1988-08-22 | Fujitsu Ltd | バイポ−ラトランジスタおよび製造方法 |
| US4945394A (en) * | 1987-10-26 | 1990-07-31 | North Carolina State University | Bipolar junction transistor on silicon carbide |
| DE3802755A1 (de) | 1988-01-30 | 1989-08-10 | Kernforschungsanlage Juelich | Verfahren zur einlagerung von radioaktiven abfallstoffen |
| GB8926414D0 (en) * | 1989-11-18 | 1990-01-10 | Lsi Logic Europ | Bipolar junction transistors |
| JPH0548083A (ja) * | 1991-08-09 | 1993-02-26 | Toshiba Corp | 電力用半導体素子 |
| JPH05335497A (ja) * | 1992-06-01 | 1993-12-17 | Nippon Steel Corp | 半導体装置の製造方法 |
| DE4301333C2 (de) * | 1993-01-20 | 2003-05-15 | Daimler Chrysler Ag | Verfahren zur Herstellung von Silizium-Germanium-Heterobipolartransistoren |
| JP3152046B2 (ja) * | 1994-01-10 | 2001-04-03 | 富士電機株式会社 | バイポーラトランジスタおよびその製造方法 |
| JPH0878431A (ja) * | 1994-09-05 | 1996-03-22 | Fuji Electric Co Ltd | 炭化けい素たて型バイポーラトランジスタおよびその製造方法 |
| JPH08288500A (ja) * | 1995-04-20 | 1996-11-01 | Hitachi Ltd | 炭化珪素半導体素子とその製造法及び用途 |
| KR0171000B1 (ko) * | 1995-12-15 | 1999-02-01 | 양승택 | 자동 정의된 베이스 전극을 갖는 바이폴라 트랜지스터 구조 및 그 제조방법 |
| SE516338C2 (sv) * | 1999-05-31 | 2001-12-17 | Ericsson Telefon Ab L M | RF-effekttransistor med kollektor upp |
-
2000
- 2000-12-11 JP JP2002550320A patent/JP5178988B2/ja not_active Expired - Lifetime
- 2000-12-11 KR KR1020037005346A patent/KR100718937B1/ko not_active Expired - Lifetime
- 2000-12-11 CA CA2425541A patent/CA2425541C/en not_active Expired - Lifetime
- 2000-12-11 WO PCT/US2000/033627 patent/WO2002049115A1/en not_active Ceased
- 2000-12-11 AU AU2001224295A patent/AU2001224295A1/en not_active Abandoned
- 2000-12-11 EP EP00988041.0A patent/EP1342271B1/en not_active Expired - Lifetime
- 2000-12-11 CN CNB008200653A patent/CN1227742C/zh not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101529598B (zh) * | 2006-11-29 | 2012-04-04 | 住友电气工业株式会社 | 碳化硅半导体器件的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1342271A1 (en) | 2003-09-10 |
| JP5178988B2 (ja) | 2013-04-10 |
| WO2002049115A1 (en) | 2002-06-20 |
| KR20030061377A (ko) | 2003-07-18 |
| AU2001224295A1 (en) | 2002-06-24 |
| EP1342271B1 (en) | 2013-11-20 |
| KR100718937B1 (ko) | 2007-05-16 |
| CA2425541A1 (en) | 2002-06-20 |
| CA2425541C (en) | 2014-08-05 |
| JP2004516655A (ja) | 2004-06-03 |
| CN1461497A (zh) | 2003-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20051116 |