CN1212821A - 制造具有屏蔽作用的无线电设备外壳部件的方法 - Google Patents
制造具有屏蔽作用的无线电设备外壳部件的方法 Download PDFInfo
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- CN1212821A CN1212821A CN97192726A CN97192726A CN1212821A CN 1212821 A CN1212821 A CN 1212821A CN 97192726 A CN97192726 A CN 97192726A CN 97192726 A CN97192726 A CN 97192726A CN 1212821 A CN1212821 A CN 1212821A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0047—Casings being rigid plastic containers having conductive particles, fibres or mesh embedded therein
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3833—Hand-held transceivers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49988—Metal casting
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
本发明涉及制造具有屏蔽作用的外壳部件的一种方法,和按照这种方法制造的对无线电设备具有屏蔽作用的一种外壳部件,具有壳状的、和具有相互对面开启的侧边上下叠在一起安装的外壳部件,用于装入无线电设备的装置。为了节省制造工艺步骤,在一个用于待屏蔽外壳部件的加压灌铸模具中,放入一个与外壳部件的内部轮廓适当设置的金属丝编织物,在该金属丝编织物上所有面对接触对方的接触面,都用一个相应于所希望的接触面尺寸的薄膜覆盖,并且在随后的用一种绝缘材料加压灌铸工艺之后,将这些薄膜除去。
Description
本发明涉及制造具有屏蔽作用的外壳部件的一种方法,和按照这种方法制造的对无线电设备具有屏蔽作用的一种外壳部件,具有壳状的和具有相互对面开启的侧边上下叠在一起安装的外壳部件,用于装入无线电设备的装置。
在无线电设备中,例如在移动无线电或无绳电话设备中,为了保护高频组件和低频逻辑组件防止电磁辐射的干扰输入和干扰发射,就需要一种屏蔽。为了屏蔽,按已知方法例如可以采用焊接的屏蔽框架、屏蔽金属片、金属化的塑料外壳、压铸外壳等等。这类构件增加设备重量、增大设备体积、增加设备价格,并且由于大量复杂的装配工艺步骤使得制造很困难。采用金属化的或经电镀的塑料部件作为外壳部件,制造技术上成本也是高的,因为在每种情况下都必须使用两种完全分开的不同机床的工艺步骤。
本发明的任务在于,为上述类型的外壳,提出了一种以简单方式制造外壳部件的方法,这些部件具有良好的屏蔽作用。
该项制造开始所述类型外壳的任务是如下解决的,在一压铸模具中,为待屏蔽的外壳部件放入一个与外壳部件的内部轮廓相适应的金属丝编织物,在该编织物上所有对着接触区的接触面,都用一相应于所希望的接触面尺寸的薄膜覆盖,并且在随后的用一种绝缘材料加压灌铸工艺之后,将这些薄膜去除。
在按本发明制造的外壳部件中,解决了一个附加生产步骤的制造技术问题,因为该外壳部件可以在一个单一的工序中制造。此外,本发明使得省掉附加的EMV密封垫成为可能,从前必须在装配外壳时放入该密封垫或者必须通过一种附加的处理工艺步骤来省掉。
由DE 19 515 010.4已知一种外壳部件,在这种部件中再压铸一个薄膜。然而,在这种已知外壳部件中存在着这样的缺点,即这种薄膜不能与存在的小的半径相匹配,因此薄膜可能会撕裂。
由从属权利要求给出本发明其它适宜的结构,并由下面附图示出的一个实施例说明中给出。
下面借助附图中示出的一个实施例说明本发明。
这些附图是:
图1示出通过一个无线电设备的纵向截面,在此设备中使用了借助本发明方法制造的外壳部件,
图2示出通过图1无线电设备,在无线电设备的按键之间的一个截面,
图3第一实施结构的细节Y的一个详细示意图,和
图4第二实施结构的细节Y的一个详细示意图。
无线电设备1在其上侧具有一显示器2及一键盘3。在其上部端面的一侧安装天线4。该无线电设备的外壳由一上壳5和一下壳6组成,这两个壳以其相互面对开启的侧边叠在一起安装。上壳5还具有显示器2及键盘3的开口。在相互叠在一起的半壳5和6之间安装了一个电路板7,用于装配无线电设备的各高频元件和各逻辑组件。为了实现EMV屏蔽,因此必须将下壳6用作屏蔽。在所示实施例中下壳6具有8和9两个屏蔽室。
根据本发明下壳6是通过金属丝织物10的外部注入和再注入制造的。为此,在一个用于待屏蔽外壳部件6的一个加压灌铸模具中,放入一个与外壳部件6的内部轮廓相适应的金属丝编织物,在该金属丝编织物上所有面对接触对方的接触面,都用一个相应于所希望的接触面尺寸的薄膜覆盖,并且在绝缘材料加压灌铸工艺之后,将这些薄膜去除。
这就是说,所覆盖的面积或在压铸工艺之后暴露的面积被再灌铸,就是说金属丝编织物10在一侧是暴露的,并且金属丝编织物10未被覆盖的面积是由外部注入的。
暴露面11组成电的接触面,而外部灌铸面12用作内部绝缘层12,它对位于印刷电路板上的元件起着防止可能短路的绝缘作用。
通过接触面11,就是说金属丝编织物10的网格结构,由于所具有的对接触对方的以啮合形式出现的粗糙度而放弃附加的密封垫。
在一个制造工艺步骤中完成外壳部件6、接触面11和绝缘层12。
图3和图4在零件图中示出壳层边缘上电路板的支架区内的细节。其中在图3的实施结构中金属丝编织物10引导到直至下壳6的上侧,以便在这一位置与电路板7的接地面形成一个导电接触。在图4的实施结构中下壳的内侧在上部区域分成阶梯,其中在阶梯与电路板7平行的平面上,电路板7以它的下侧放置在金属丝编织物10上,该金属丝编织物在与电路板7的连接处建立一个到电路板7的接地面的低欧姆接触。
Claims (3)
1.制造具有无线电设备屏蔽作用的外壳部件的方法,该无线电设备具有壳状的和其壳相互对面开启的侧边上下叠在一起安装的外壳部件,用于装入无线电设备的装置,其特征在于,
在一个用于待屏蔽外壳部件的一个加压灌铸模具中,放入一个与外壳部件的内部轮廓相适应设置的金属丝编织物,在该金属丝编织物上所有面对接触对方的接触面,都用一个相应于所希望的接触面尺寸的薄膜覆盖,并且在用一种绝缘材料加压灌铸工艺之后,将这些薄膜除去。
2.根据权利要求1的方法,其特征在于,
将粘合薄膜用于覆盖。
3.按权利要求1或2的方法制造的外壳部件,其特征在于,
金属丝编织物(10)的暴露面,这些暴露面在制造过程之后位于外壳部件(6)的内侧,它们与接触对方,例如在组件电路板(7)上的接地面,建立一个低欧姆接触。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29619002 | 1996-10-31 | ||
DE29619002.0 | 1996-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1212821A true CN1212821A (zh) | 1999-03-31 |
Family
ID=8031370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97192726A Pending CN1212821A (zh) | 1996-10-31 | 1997-10-30 | 制造具有屏蔽作用的无线电设备外壳部件的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6137050A (zh) |
EP (1) | EP0873674A1 (zh) |
JP (1) | JP2000503266A (zh) |
CN (1) | CN1212821A (zh) |
CA (1) | CA2241851A1 (zh) |
DE (1) | DE19713949A1 (zh) |
NO (1) | NO982763L (zh) |
WO (1) | WO1998019507A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101640995B (zh) * | 2008-07-31 | 2012-07-04 | 深圳富泰宏精密工业有限公司 | 电子装置壳体 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19848833C1 (de) * | 1998-10-22 | 2000-09-07 | Fraunhofer Ges Forschung | Transpondervorrichtung mit einer Einrichtung zum Schutz vor elektromagnetischen Störfeldern |
JP3490017B2 (ja) * | 1999-03-18 | 2004-01-26 | 松下電器産業株式会社 | 無線端末装置 |
US6269537B1 (en) * | 1999-07-28 | 2001-08-07 | Methode Electronics, Inc. | Method of assembling a peripheral device printed circuit board package |
US20040119201A1 (en) * | 2002-07-12 | 2004-06-24 | Siegel-Robert, Inc. | Apparatus and method for manufacturing plastic products with EMI/RFI/ESD shield |
DE502004003830D1 (de) † | 2004-03-15 | 2007-06-28 | Novem Car Interior Design Meta | Kraftfahrzeug-Innenverkleidungsteil mit Metallstruktur |
US7733659B2 (en) * | 2006-08-18 | 2010-06-08 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
DE102012109447A1 (de) * | 2012-10-04 | 2014-04-10 | Elringklinger Ag | Gehäusebauteil |
WO2017001888A1 (en) | 2015-06-29 | 2017-01-05 | Bosch Car Multimedia Portugal, S.A. | Conductive polymeric housing for electronic component |
WO2023126667A1 (en) | 2021-12-29 | 2023-07-06 | Bosch Car Multimedia Portugal S.A | Cover, enclosure and manufacturing method thereof, for electromagnetic shielding |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5226210A (en) * | 1989-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method of forming metal fiber mat/polymer composite |
GB9002073D0 (en) * | 1990-01-30 | 1990-03-28 | Canadian Forest Prod | Conductive panel |
CA2042417A1 (en) * | 1990-05-29 | 1991-11-30 | Peter G. Donecker | Process to manufacture conductive composite articles |
JP2825670B2 (ja) * | 1990-12-14 | 1998-11-18 | 富士通株式会社 | 高周波回路装置のシールド構造 |
US5731963A (en) * | 1995-04-24 | 1998-03-24 | Siemens Aktiengesellschaft | Housing for a radio device having a thin electrically conductive film applied to an exterior surface thereof |
DE19630966A1 (de) * | 1995-08-31 | 1997-03-06 | Siemens Ag | Verfahren zur Herstellung eines Gehäuseteils mit Schirmwirkung für Funkgeräte |
DE19630967A1 (de) * | 1995-08-31 | 1997-03-06 | Siemens Ag | Verfahren zur Herstellung eines Gehäuseteils mit Schirmfunktion für Funkgeräte |
-
1997
- 1997-04-04 DE DE19713949A patent/DE19713949A1/de not_active Withdrawn
- 1997-10-30 JP JP10519912A patent/JP2000503266A/ja active Pending
- 1997-10-30 CA CA002241851A patent/CA2241851A1/en not_active Abandoned
- 1997-10-30 EP EP97949864A patent/EP0873674A1/de not_active Withdrawn
- 1997-10-30 CN CN97192726A patent/CN1212821A/zh active Pending
- 1997-10-30 WO PCT/DE1997/002530 patent/WO1998019507A1/de not_active Application Discontinuation
- 1997-10-30 US US09/101,120 patent/US6137050A/en not_active Expired - Lifetime
-
1998
- 1998-06-15 NO NO982763A patent/NO982763L/no not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101640995B (zh) * | 2008-07-31 | 2012-07-04 | 深圳富泰宏精密工业有限公司 | 电子装置壳体 |
Also Published As
Publication number | Publication date |
---|---|
DE19713949A1 (de) | 1998-05-07 |
CA2241851A1 (en) | 1998-05-07 |
NO982763L (no) | 1998-08-28 |
WO1998019507A1 (de) | 1998-05-07 |
NO982763D0 (no) | 1998-06-15 |
EP0873674A1 (de) | 1998-10-28 |
US6137050A (en) | 2000-10-24 |
JP2000503266A (ja) | 2000-03-21 |
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