WO2008026247A1 - Structure de barrière à onde électromagnétique et son procédé de formation - Google Patents

Structure de barrière à onde électromagnétique et son procédé de formation Download PDF

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Publication number
WO2008026247A1
WO2008026247A1 PCT/JP2006/316936 JP2006316936W WO2008026247A1 WO 2008026247 A1 WO2008026247 A1 WO 2008026247A1 JP 2006316936 W JP2006316936 W JP 2006316936W WO 2008026247 A1 WO2008026247 A1 WO 2008026247A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic wave
wave shielding
structure according
shielding structure
electromagnetic
Prior art date
Application number
PCT/JP2006/316936
Other languages
English (en)
Japanese (ja)
Inventor
Daiyu Kiuchi
Yasuo Shiina
Original Assignee
Nihon Houzai Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Houzai Co., Ltd. filed Critical Nihon Houzai Co., Ltd.
Priority to PCT/JP2006/316936 priority Critical patent/WO2008026247A1/fr
Priority to JP2008531905A priority patent/JPWO2008026247A1/ja
Publication of WO2008026247A1 publication Critical patent/WO2008026247A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components

Definitions

  • Electromagnetic wave shield structure and formation method thereof are Electromagnetic wave shield structure and formation method thereof
  • the present invention relates to an electromagnetic wave shielding structure that shields each electronic component on a wiring board of an electronic device from unnecessary electromagnetic waves, and a method for forming the same.
  • An information terminal such as a mobile phone is equipped with an imaging module in which components such as an imaging device, a lens, and an IC that is a driver for driving the imaging device are integrated as a package.
  • An electronic component such as a CCD is mounted on the wiring board. This electronic component generates electromagnetic waves, which may interfere with the communication function of the information terminal. For this reason, electromagnetic waves are shielded by covering the electronic components mounted on the wiring board with a shield case.
  • the wiring board 10 is made of metal in such a manner that the electronic parts 12 are accommodated.
  • the shield case 14 is assembled.
  • a continuous ground pattern 16 is formed on the surface of the wiring board 10 so as to surround the electronic component 12, and the lower edge of the shield case 14 assembled at a predetermined position of the wiring board 10 is ground pattern. Electromagnetic shielding is applied to each electronic component 12 by bringing it into contact with 16 to achieve conduction.
  • the shield case 18 is formed by, for example, applying a plating, vapor deposition, conductive coating or the like to the surface of a resin molded product, and has a housing 20 corresponding to each electronic component 12.
  • a continuous ground pattern 16 is formed so as to go around each electronic component 12, and a shield case 18 assembled at a predetermined position of the wiring board 10 is formed.
  • the lower edge of each of the electronic components 12 is brought into contact with the ground pattern 16 so as to conduct electricity, thereby shielding the electromagnetic wave from each electronic component 12.
  • Patent Document 1 JP 2004-71629 A
  • Patent Document 1 Japanese Patent Laid-Open No. 2002-232099
  • the conventional electromagnetic wave shield requires the shield cases 14 and 18, and the force of the shield cases 14 and 18 needs to be prepared in various types corresponding to the arrangement of the electronic components 12 on the wiring board 10.
  • various types of molds for manufacturing the shield cases 14 and 18 are required. Therefore, there is a problem that the manufacturing cost of the electronic equipment is increased due to the mold cost. .
  • the shield cases 14, 18 must be soldered to the wiring board 10, but the soldering process is costly, and this process increases the manufacturing cost of the electronic equipment, Then there was a problem.
  • the problem to be solved by the present invention is to reduce the cost of electromagnetic shielding of electronic equipment as much as possible by improving the structure and covering method of the electromagnetic shielding, and thus reduce the manufacturing cost of electronic equipment as much as possible. It is in the point to.
  • an electromagnetic wave shielding sheet is coated on a wiring board on which a plurality of electronic components are attached in a state of being plastically deformed along the shape of the electronic parts, and the wiring board has a plurality of penetrating holes.
  • the electromagnetic wave shielding sheet has a base layer made of a plastic sheet and an outer side of the base layer! And a metal layer laminated on the base layer directly or via another layer, wherein the ground pattern and the metal layer are electrically connected. .
  • an electromagnetic wave shielding sheet is coated on a wiring board on which a plurality of electronic components are attached, and the electromagnetic wave shielding sheet is sucked under reduced pressure through the wiring board.
  • the wiring board has a plurality of through holes, and the electromagnetic wave shielding sheet includes a base layer made of a plastic sheet and an outer side of the base layer. And a metal layer laminated on the base layer directly or via another layer, the plastic sheet is made of thermoplastic resin, and the vacuum suction is performed under heating. It is what.
  • a conductive plastic may be used as the other layer!
  • the conductive plastic for example, polyacetylene, polypyrrole, polythiophene, or polyarine, or a composite material in which graphite or metal powder is dispersed in general-purpose plastic can be used.
  • the thickness of the metal layer is preferably 1000 A to 3000 A.
  • the metal layer has a thickness of 10
  • the metal layer may be copper, aluminum, nickel, iron oxide (Fe 2 O 3), gold or silver.
  • the thickness of the base layer is preferably 50 to 2000 ⁇ m.
  • the thickness of the base layer is less than 50 ⁇ m, the handling of the electromagnetic wave shielding sheet in vacuum molding is too delicate, and when it exceeds 2000 m, the vacuum molding becomes difficult. This is because there is no inconvenient in the -2000 ⁇ m range.
  • a part of the through hole formed in the wiring board is formed in the vicinity of the electronic component. If the through hole is formed in the vicinity of the electronic component, the electromagnetic wave shielding sheet penetrates deeply between the electronic components, and each electronic component is well shielded against electromagnetic waves, thus improving the characteristics of the electronic device. is there.
  • the electromagnetic wave shielding sheet is sucked under reduced pressure
  • a molding material such as putty is added to the electronic component to correct the shape of the electronic component so that the wiring board is used as a mold.
  • the electromagnetic shielding sheet may be sucked under reduced pressure. If you do this This is because the metal layer is less cracked at the portion corresponding to the corner of the electronic component.
  • the electromagnetic shielding sheet is coated on the electronic component on the wiring board by utilizing the vacuum molding technique. Therefore, it is not necessary to mold the electromagnetic shielding with a mold. Only reducing the manufacturing cost of electronic equipment has the advantage.
  • the electromagnetic shielding film is coated on the electronic component on the wiring board by using the vacuum forming technique, the electromagnetic shielding is buried between the electronic components, and the electronic components are mutually connected. It has the advantage that it is well shielded and therefore the characteristics of the electronic device are good.
  • FIG. 1 is an exploded explanatory view of an electromagnetic wave shielding structure according to the present invention.
  • FIG. 2 is a cross-sectional view of an electromagnetic wave shielding structure according to the present invention.
  • FIG. 3 is an enlarged view of part A in FIG.
  • FIG. 4 is a graph showing the relationship between the shielding effect (dB) of the electromagnetic wave shielding sheet of sample number 1 and each frequency (MHz) of electromagnetic waves.
  • FIG. 5 is a graph showing the relationship between the shielding effect (dB) of the electromagnetic wave shielding sheet of sample number 2 and each frequency (MHz) of electromagnetic waves.
  • FIG. 7 is a graph showing the relationship between the shielding effect (dB) of the electromagnetic wave shielding sheet of sample number 4 and each frequency (MHz) of the electromagnetic wave.
  • FIG. 8 is a graph showing the relationship between the shielding effect (dB) of the electromagnetic wave shielding sheet of sample number 5 and each frequency (MHz) of electromagnetic waves.
  • FIG. 9 is a graph showing the relationship between the shielding effect (dB) of the electromagnetic wave shielding sheet of sample number 6 and each frequency (MHz) of electromagnetic waves.
  • FIG. 10 is a graph showing the relationship between the shielding effect (dB) of the plastic sheet of Sample No. 7 and each frequency (MHz) of electromagnetic waves.
  • FIG. 11 is an exploded explanatory view of an example of a conventional electromagnetic shielding structure.
  • FIG. 12 is an exploded explanatory view of another example of a conventional electromagnetic shielding structure.
  • FIG. 1 is an exploded explanatory view of the electromagnetic wave shielding structure according to the present invention
  • FIG. 2 is a cross-sectional view of the electromagnetic wave shielding structure according to the present invention
  • FIG. 3 is an enlarged view of a portion A in FIG.
  • Reference numeral 10 denotes a wiring board.
  • a plurality of electronic components 12 are attached on the wiring board 10, and a ground pattern 16 is formed on the upper surface of the wiring board 10.
  • the upper surface side of the wiring board 10 is covered with an electromagnetic wave shielding sheet 22 that is plastically deformed along the shape of the electronic component 12.
  • the wiring substrate 10 is provided with a plurality of through holes 24 in a dispersed state. Through hole 24 It is also provided along the electronic component 12.
  • a hole 32 is opened in advance so that the metal layer 30 side force is also directed toward the base layer 26, and the burr 34 at the edge of the hole 32 returns to the back side (wiring board 10 side).
  • the metal layer 30 of 34 is in contact with the ground pattern 16, the hole 32 is filled with solder, and the metal layer 30 of the hole 32 and the burr 34 is electrically and mechanically connected to the ground pattern 16.
  • the electromagnetic wave shielding sheet 22 is coated on the wiring board 10.
  • the electromagnetic shielding sheet 22 is coated with the metal layer 30 facing outward and the base layer 26 facing inside, ie, the base layer 26 facing the electronic component 12 side.
  • the electromagnetic wave shielding sheet 22 is heated and softened.
  • the wiring board 10 may be heated in advance, or the electromagnetic wave shielding sheet 22 may be heated after coating.
  • the electromagnetic wave shielding sheet 22 is sucked under reduced pressure through the wiring board 10.
  • the electromagnetic shielding sheet 22 is sucked to the wiring board 10 side by vacuum suction and is plastically deformed along the shape of the electronic component 12 on the wiring board 10 by heat to cover the electronic component 12.
  • the electromagnetic wave shielding sheet 22 has a hole 32 formed in advance so that the force on the metal layer 30 side also faces the base layer 26, and the burr 34 at the edge of the hole 32 returns to the back side. In this way, the metal layer 30 of the substrate 34 is in contact with the ground pattern 16. Then, by soldering the hole 32, the metal layer 30 of the hole 32 and the burr 34 is electrically and mechanically connected to the ground pattern 16.
  • the thickness of the metal layer 30 is 1000 A, 1500 A, and 3000 A, and the metal layer 30 does not have the metal layer 30 and the electromagnetic wave shielding sheet that also has a copper deposition force.
  • plastic Using a sheet (PC), the shielding ratio (dB) of electromagnetic waves was measured for each frequency of electromagnetic waves by the KEC method (Kansai Electronics Industry Promotion Center), and the results shown in Figs. 4 to 10 were obtained. It was.
  • the electromagnetic wave shielding structure according to the present invention has a noise suppression effect of 40 dB or more at an electromagnetic wave frequency of 10 1000 MHz, and this electromagnetic wave shielding structure was used. It can be seen that a shield rate of 99% can be achieved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'objet de la présente invention est de réduire le coût de fabrication d'un appareil électronique autant que possible en améliorant la structure et le procédé de formation d'une barrière à onde électromagnétique, ce qui réduit de la sorte le coût de la barrière à onde électromagnétique de l'appareil électronique autant que possible. Un tableau de connexions auquel une pluralité de composants électroniques sont fixés est recouvert d'une feuille de barrière à onde électromagnétique, puis la feuille de barrière à onde électromagnétique est aspirée à travers le tableau de connexions par réduction de la pression. La feuille de barrière à onde électromagnétique est constituée d'une couche de base composée d'une feuille thermoplastique et d'une couche de métal en feuillards sur la couche de base directement ou par l'intermédiaire d'une autre couche sur l'extérieur de la feuille de barrière à onde électromagnétique. La feuille de barrière à onde électromagnétique, aspirée par réduction de la pression, est déformée plastiquement le long du profil du composant électronique, recouvrant ainsi les composants électroniques individuellement.
PCT/JP2006/316936 2006-08-29 2006-08-29 Structure de barrière à onde électromagnétique et son procédé de formation WO2008026247A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2006/316936 WO2008026247A1 (fr) 2006-08-29 2006-08-29 Structure de barrière à onde électromagnétique et son procédé de formation
JP2008531905A JPWO2008026247A1 (ja) 2006-08-29 2006-08-29 電磁波シールド構造とその形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/316936 WO2008026247A1 (fr) 2006-08-29 2006-08-29 Structure de barrière à onde électromagnétique et son procédé de formation

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WO2008026247A1 true WO2008026247A1 (fr) 2008-03-06

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WO (1) WO2008026247A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164451A (ja) * 2011-02-04 2012-08-30 Auto Network Gijutsu Kenkyusho:Kk ワイヤハーネスに設けられるシールド体の製造方法
JP2015130484A (ja) * 2013-12-03 2015-07-16 東洋インキＳｃホールディングス株式会社 電子素子およびシート材
CN107424981A (zh) * 2016-04-12 2017-12-01 Tdk株式会社 电子电路模块以及其制造方法
WO2018008657A1 (fr) * 2016-07-08 2018-01-11 住友ベークライト株式会社 Film d'étanchéité, procédé d'étanchéité de substrat monté sur un composant électronique, et substrat monté sur un composant électronique recouvert d'un film d'étanchéité

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60241237A (ja) * 1984-05-15 1985-11-30 Mitsubishi Electric Corp 混成集積回路装置
JP2002184884A (ja) * 2000-12-18 2002-06-28 Tdk Corp 電子装置およびその製造方法
JP2003298273A (ja) * 2002-04-03 2003-10-17 Kitagawa Ind Co Ltd カバー構造及びその形成方法
WO2003092347A1 (fr) * 2002-04-23 2003-11-06 Nec Corporation Dispositif de circuit a blindage electromagnetique et procede de blindage associe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60241237A (ja) * 1984-05-15 1985-11-30 Mitsubishi Electric Corp 混成集積回路装置
JP2002184884A (ja) * 2000-12-18 2002-06-28 Tdk Corp 電子装置およびその製造方法
JP2003298273A (ja) * 2002-04-03 2003-10-17 Kitagawa Ind Co Ltd カバー構造及びその形成方法
WO2003092347A1 (fr) * 2002-04-23 2003-11-06 Nec Corporation Dispositif de circuit a blindage electromagnetique et procede de blindage associe

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164451A (ja) * 2011-02-04 2012-08-30 Auto Network Gijutsu Kenkyusho:Kk ワイヤハーネスに設けられるシールド体の製造方法
JP2015130484A (ja) * 2013-12-03 2015-07-16 東洋インキＳｃホールディングス株式会社 電子素子およびシート材
CN107424981A (zh) * 2016-04-12 2017-12-01 Tdk株式会社 电子电路模块以及其制造方法
TWI636711B (zh) * 2016-04-12 2018-09-21 Tdk股份有限公司 電子電路模組及其製造方法
US10225923B2 (en) 2016-04-12 2019-03-05 Tdk Corporation Electronic circuit module and manufacturing method of the same
CN107424981B (zh) * 2016-04-12 2022-03-29 Tdk株式会社 电子电路模块以及其制造方法
WO2018008657A1 (fr) * 2016-07-08 2018-01-11 住友ベークライト株式会社 Film d'étanchéité, procédé d'étanchéité de substrat monté sur un composant électronique, et substrat monté sur un composant électronique recouvert d'un film d'étanchéité
JPWO2018008657A1 (ja) * 2016-07-08 2018-07-05 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板

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