CN1209493C - 等离子电镀 - Google Patents

等离子电镀 Download PDF

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Publication number
CN1209493C
CN1209493C CNB018185576A CN01818557A CN1209493C CN 1209493 C CN1209493 C CN 1209493C CN B018185576 A CNB018185576 A CN B018185576A CN 01818557 A CN01818557 A CN 01818557A CN 1209493 C CN1209493 C CN 1209493C
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CN
China
Prior art keywords
electrolytic solution
bubble
electrode
electrolyzer
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018185576A
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English (en)
Chinese (zh)
Other versions
CN1473206A (zh
Inventor
陈祝平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THOMAS ZEMIN ZHANG
Cmt Chang
C M T CHANG
Original Assignee
Cmt Chang
C M T CHANG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cmt Chang, C M T CHANG filed Critical Cmt Chang
Publication of CN1473206A publication Critical patent/CN1473206A/zh
Application granted granted Critical
Publication of CN1209493C publication Critical patent/CN1209493C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/026—Anodisation with spark discharge
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inert Electrodes (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
CNB018185576A 2000-11-08 2001-11-08 等离子电镀 Expired - Fee Related CN1209493C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPR1299 2000-11-08
AUPR1299A AUPR129900A0 (en) 2000-11-08 2000-11-08 Plasma electroplating

Publications (2)

Publication Number Publication Date
CN1473206A CN1473206A (zh) 2004-02-04
CN1209493C true CN1209493C (zh) 2005-07-06

Family

ID=3825340

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018185576A Expired - Fee Related CN1209493C (zh) 2000-11-08 2001-11-08 等离子电镀

Country Status (6)

Country Link
US (1) US7166206B2 (fr)
EP (1) EP1348041A1 (fr)
JP (1) JP2004512430A (fr)
CN (1) CN1209493C (fr)
AU (2) AUPR129900A0 (fr)
WO (1) WO2002038827A1 (fr)

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GB2386907B (en) * 2002-03-27 2005-10-26 Isle Coat Ltd Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
CN100336586C (zh) 2002-04-01 2007-09-12 国立大学法人爱媛大学 液体等离子体发生装置、液体中等离子体发生方法以及由液体中等离子体分解有害物质的方法
AUPS220302A0 (en) * 2002-05-08 2002-06-06 Chang, Chak Man Thomas A plasma formed within bubbles in an aqueous medium and uses therefore
JP2005235662A (ja) * 2004-02-23 2005-09-02 Techno Network Shikoku Co Ltd 液中プラズマ装置および液中プラズマ発生方法
DE112005003029B4 (de) * 2004-12-03 2012-10-04 Kabushiki Kaisha Toyota Jidoshokki In-Flüssigkeit-Plasmaelektrode, In-Flüssigkeit-Plasmaerzeugungsvorrichtung, und In-Flüssigkeit-Plasmaerzeugungsverfahren
JP4665111B2 (ja) * 2005-03-30 2011-04-06 株式会社豊田自動織機 シリコン酸化膜の製造方法
DE112006000772T5 (de) * 2005-03-30 2008-01-24 Ehime University Verfahren zur Herstellung eines amorphen Kohlenstofffilms
JPWO2007063987A1 (ja) * 2005-12-02 2009-05-07 勝義 遠藤 超純水プラズマ泡による加工・洗浄方法及びその装置
BRPI0708517A2 (pt) * 2006-03-03 2011-05-31 Richard Furberg camada porosa
US20080086195A1 (en) * 2006-10-05 2008-04-10 Boston Scientific Scimed, Inc. Polymer-Free Coatings For Medical Devices Formed By Plasma Electrolytic Deposition
EP2187988B1 (fr) 2007-07-19 2013-08-21 Boston Scientific Limited Endoprothese pourvue d'une surface anti-encrassement
EP2185103B1 (fr) 2007-08-03 2014-02-12 Boston Scientific Scimed, Inc. Revêtement pour un dispositif médical ayant une aire surfacique accrue
GB0720982D0 (en) * 2007-10-25 2007-12-05 Plasma Coatings Ltd Method of forming a bioactive coating
JP5182989B2 (ja) * 2008-03-07 2013-04-17 株式会社豊田自動織機 液中プラズマ成膜装置、液中プラズマ用電極および液中プラズマを用いた成膜方法
EP2271380B1 (fr) 2008-04-22 2013-03-20 Boston Scientific Scimed, Inc. Dispositifs médicaux revêtus d une substance inorganique
US8932346B2 (en) 2008-04-24 2015-01-13 Boston Scientific Scimed, Inc. Medical devices having inorganic particle layers
JP4517098B2 (ja) * 2009-05-11 2010-08-04 国立大学法人愛媛大学 液中プラズマ発生方法
NL2003250C2 (en) * 2009-07-20 2011-01-24 Metal Membranes Com B V Method for producing a membrane and such membrane.
US8529749B2 (en) * 2009-08-13 2013-09-10 Case Western Reserve University Electrochemical cell including a plasma source and method of operating the electrochemical cell
CN102029169B (zh) * 2009-09-29 2014-03-26 中国科学院大连化学物理研究所 一种负载型过渡金属磷化物催化剂的制备方法
US20110214999A1 (en) * 2010-03-08 2011-09-08 Nottke Francis A Method and process for element and/or compound extraction, separation, and purification
JP5696447B2 (ja) * 2010-11-25 2015-04-08 Ｊｆｅスチール株式会社 表面処理金属材料の製造方法
CN102226289A (zh) * 2011-06-14 2011-10-26 淮海工学院 一种液相等离子体强化纳米复合镀层装置及其使用方法
CN102677137B (zh) * 2011-12-24 2015-03-18 河南科技大学 一种金属电沉积装置
JP5817907B2 (ja) * 2012-02-24 2015-11-18 Ｊｆｅスチール株式会社 金属材料、金属材料の製造方法、金属材料を基材とした撥水材料の製造方法、金属材料の製造装置、および金属材料の製造方法
WO2013125657A1 (fr) * 2012-02-24 2013-08-29 Ｊｆｅスチール株式会社 Procédé de traitement de la surface d'un matériau en métal et matériau en métal
CN103255467A (zh) * 2012-10-25 2013-08-21 北京太禹天工科技有限公司 一种新型材料表面改性的方法和装置
CN102978619B (zh) * 2012-11-14 2014-12-31 深圳大学 制备涂层、薄膜或复合材料的装置及方法
WO2014145671A1 (fr) * 2013-03-15 2014-09-18 Cap Technologies, Llc Procédé de dépôt métallique à l'aide d'un électroplasma
FR3008429A1 (fr) * 2013-07-12 2015-01-16 Commissariat Energie Atomique Procede de synthese d'une mousse metallique, mousse metallique, ses utilisations et dispositif comprenant une telle mousse metallique
EP3047709B1 (fr) * 2013-09-17 2020-07-15 California Institute of Technology Technique d'électroplacage de groupe micro-fabriqué
CN103484928B (zh) * 2013-10-09 2016-03-23 电子科技大学 一种基于等离子体的钢铁制品除锈抛光方法
WO2016205750A1 (fr) * 2015-06-18 2016-12-22 Kevin Kremeyer Dépôt d'énergie dirigé pour faciliter des applications haute vitesse
CN105568341B (zh) * 2016-02-22 2018-08-03 深圳市威勒科技股份限公司 一种氧化钨薄膜及其制备方法
CN106006758B (zh) * 2016-05-20 2017-07-18 西北师范大学 一种利用废铁丝制备纳米Fe3O4的方法
US10442688B1 (en) * 2018-04-26 2019-10-15 Kenneth Stephen Bailey Ionization chamber designed to enhance covalent bonding of atomic elements for the release of raw hydrogen and to eliminate waste water in the process
CN112065591B (zh) * 2020-09-11 2021-08-03 中国航发沈阳黎明航空发动机有限责任公司 一种航空发动机用电磁驱动式点火装置
CN113430613A (zh) * 2021-06-17 2021-09-24 西安交通大学 一种复杂异形构件内外表面制备陶瓷涂层的方法
CN114196976A (zh) * 2021-12-28 2022-03-18 苏州市枫港钛材设备制造有限公司 一种长寿命涂层及其制备方法

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Also Published As

Publication number Publication date
CN1473206A (zh) 2004-02-04
EP1348041A1 (fr) 2003-10-01
US20030052011A1 (en) 2003-03-20
AUPR129900A0 (en) 2000-11-30
JP2004512430A (ja) 2004-04-22
US7166206B2 (en) 2007-01-23
AU1479702A (en) 2002-05-21
WO2002038827A1 (fr) 2002-05-16

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: THOMAS ZEMIN ZHANG

Free format text: FORMER NAME OR ADDRESS: TRANSLATION THOMAS ZHANG MIN

CP03 Change of name, title or address

Address after: Hongkong, China

Patentee after: Zemin Thomas Chang

Address before: Queensland, Australia

Patentee before: Chang Chak Man Thomas

C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee