CN1196206C - 发光闸流晶体管矩阵阵列 - Google Patents

发光闸流晶体管矩阵阵列 Download PDF

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Publication number
CN1196206C
CN1196206C CNB018000185A CN01800018A CN1196206C CN 1196206 C CN1196206 C CN 1196206C CN B018000185 A CNB018000185 A CN B018000185A CN 01800018 A CN01800018 A CN 01800018A CN 1196206 C CN1196206 C CN 1196206C
Authority
CN
China
Prior art keywords
light
emitting thyristor
emitting
chip
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB018000185A
Other languages
English (en)
Chinese (zh)
Other versions
CN1419714A (zh
Inventor
大野诚治
楠田幸久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd filed Critical Nippon Sheet Glass Co Ltd
Publication of CN1419714A publication Critical patent/CN1419714A/zh
Application granted granted Critical
Publication of CN1196206C publication Critical patent/CN1196206C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Facsimile Heads (AREA)
CNB018000185A 2000-01-31 2001-01-31 发光闸流晶体管矩阵阵列 Expired - Lifetime CN1196206C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000021458A JP4345173B2 (ja) 2000-01-31 2000-01-31 発光サイリスタアレイの駆動回路
JP21458/2000 2000-01-31

Publications (2)

Publication Number Publication Date
CN1419714A CN1419714A (zh) 2003-05-21
CN1196206C true CN1196206C (zh) 2005-04-06

Family

ID=18547865

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018000185A Expired - Lifetime CN1196206C (zh) 2000-01-31 2001-01-31 发光闸流晶体管矩阵阵列

Country Status (8)

Country Link
US (1) US6717183B2 (https=)
EP (1) EP1168462A1 (https=)
JP (1) JP4345173B2 (https=)
KR (1) KR100740444B1 (https=)
CN (1) CN1196206C (https=)
CA (1) CA2368988A1 (https=)
TW (1) TW476167B (https=)
WO (1) WO2001057935A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153168B2 (en) * 2002-07-09 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Method for deciding duty factor in driving light-emitting device and driving method using the duty factor
JP3901151B2 (ja) * 2003-12-25 2007-04-04 セイコーエプソン株式会社 ドライバｉｃ並びにドライバｉｃ及び出力装置の検査方法
JP4607696B2 (ja) * 2005-07-28 2011-01-05 京セラ株式会社 発光装置および画像記録装置
EP2006918A4 (en) 2006-02-20 2012-05-30 Kyocera Corp ARRAY LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ARRANGEMENT AND PICTURE GENERATION ARRANGEMENT
JP5225592B2 (ja) * 2006-02-20 2013-07-03 京セラ株式会社 発光素子アレイ、発光装置および画像形成装置
JP4885760B2 (ja) * 2006-02-20 2012-02-29 京セラ株式会社 発光素子アレイ、発光装置および画像形成装置
JP5343311B2 (ja) * 2006-10-24 2013-11-13 富士ゼロックス株式会社 露光装置および画像形成装置
JP4758921B2 (ja) * 2007-01-29 2011-08-31 株式会社日立製作所 線状光源装置、及びバックライト装置
US20100177155A1 (en) * 2007-06-25 2010-07-15 Kyocera Corporation Light Emitting Element Array, Light Emitting Device, and Image Forming Apparatus
JP4682231B2 (ja) 2008-08-01 2011-05-11 株式会社沖データ 光プリントヘッドおよび画像形成装置
JP5366511B2 (ja) * 2008-11-14 2013-12-11 株式会社沖データ 駆動回路、光プリントヘッド及び画像形成装置
JP5428591B2 (ja) * 2009-01-28 2014-02-26 富士ゼロックス株式会社 Ｌｅｄ基板装置、ｌｅｄプリントヘッドおよび画像形成装置
JP4871978B2 (ja) * 2009-07-10 2012-02-08 株式会社沖データ 半導体装置、及び光プリントヘッド
JP5582771B2 (ja) 2009-12-04 2014-09-03 株式会社沖データ 駆動装置及び画像形成装置
KR102139681B1 (ko) 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
JP2020120018A (ja) * 2019-01-25 2020-08-06 富士ゼロックス株式会社 発光装置、光学装置、光計測装置及び画像形成装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4394653A (en) * 1980-11-24 1983-07-19 General Instrument Corporation Bi-directional drive multiplexed display system
JP2807910B2 (ja) 1989-12-22 1998-10-08 日本板硝子株式会社 発光素子アレイ
US5324958A (en) * 1991-02-19 1994-06-28 Synaptics, Incorporated Integrating imaging systgem having wide dynamic range with sample/hold circuits
JP3194978B2 (ja) 1991-05-07 2001-08-06 株式会社ユーシン コントロールノブの照明装置
JP4068172B2 (ja) * 1996-04-12 2008-03-26 富士ゼロックス株式会社 面発光サイリスタおよび自己走査型発光装置
JPH09150543A (ja) * 1995-11-29 1997-06-10 Canon Inc 画像形成装置
JP2854556B2 (ja) * 1996-05-31 1999-02-03 日本板硝子株式会社 自己走査形発光素子アレイおよびその駆動方法
EP0884781A3 (en) * 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module

Also Published As

Publication number Publication date
CA2368988A1 (en) 2001-08-09
CN1419714A (zh) 2003-05-21
JP4345173B2 (ja) 2009-10-14
WO2001057935A1 (fr) 2001-08-09
EP1168462A1 (en) 2002-01-02
US6717183B2 (en) 2004-04-06
KR20020004984A (ko) 2002-01-16
US20030071274A1 (en) 2003-04-17
JP2001217460A (ja) 2001-08-10
TW476167B (en) 2002-02-11
KR100740444B1 (ko) 2007-07-19

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: FUJI XEROX CO., LTD.

Free format text: FORMER OWNER: NIPPON SHEET GLASS CO LTD

Effective date: 20071221

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20071221

Address after: Tokyo, Japan, Japan

Patentee after: Fuji Xerox Corp.

Address before: Osaka Japan

Patentee before: Nippon Sheet Glass Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20050406

CX01 Expiry of patent term