KR100740444B1 - 발광 사이리스터 매트릭스 어레이 및 그 구동 회로 - Google Patents

발광 사이리스터 매트릭스 어레이 및 그 구동 회로 Download PDF

Info

Publication number
KR100740444B1
KR100740444B1 KR1020017012311A KR20017012311A KR100740444B1 KR 100740444 B1 KR100740444 B1 KR 100740444B1 KR 1020017012311 A KR1020017012311 A KR 1020017012311A KR 20017012311 A KR20017012311 A KR 20017012311A KR 100740444 B1 KR100740444 B1 KR 100740444B1
Authority
KR
South Korea
Prior art keywords
light emitting
terminal
gate
matrix array
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020017012311A
Other languages
English (en)
Korean (ko)
Other versions
KR20020004984A (ko
Inventor
오노세이지
쿠스다유키히사
Original Assignee
후지제롯쿠스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지제롯쿠스 가부시끼가이샤 filed Critical 후지제롯쿠스 가부시끼가이샤
Publication of KR20020004984A publication Critical patent/KR20020004984A/ko
Application granted granted Critical
Publication of KR100740444B1 publication Critical patent/KR100740444B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Facsimile Heads (AREA)
KR1020017012311A 2000-01-31 2001-01-31 발광 사이리스터 매트릭스 어레이 및 그 구동 회로 Expired - Lifetime KR100740444B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00021458 2000-01-31
JP2000021458A JP4345173B2 (ja) 2000-01-31 2000-01-31 発光サイリスタアレイの駆動回路

Publications (2)

Publication Number Publication Date
KR20020004984A KR20020004984A (ko) 2002-01-16
KR100740444B1 true KR100740444B1 (ko) 2007-07-19

Family

ID=18547865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017012311A Expired - Lifetime KR100740444B1 (ko) 2000-01-31 2001-01-31 발광 사이리스터 매트릭스 어레이 및 그 구동 회로

Country Status (8)

Country Link
US (1) US6717183B2 (https=)
EP (1) EP1168462A1 (https=)
JP (1) JP4345173B2 (https=)
KR (1) KR100740444B1 (https=)
CN (1) CN1196206C (https=)
CA (1) CA2368988A1 (https=)
TW (1) TW476167B (https=)
WO (1) WO2001057935A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153168B2 (en) * 2002-07-09 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Method for deciding duty factor in driving light-emitting device and driving method using the duty factor
JP3901151B2 (ja) * 2003-12-25 2007-04-04 セイコーエプソン株式会社 ドライバｉｃ並びにドライバｉｃ及び出力装置の検査方法
JP4607696B2 (ja) * 2005-07-28 2011-01-05 京セラ株式会社 発光装置および画像記録装置
EP2006918A4 (en) 2006-02-20 2012-05-30 Kyocera Corp ARRAY LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ARRANGEMENT AND PICTURE GENERATION ARRANGEMENT
JP5225592B2 (ja) * 2006-02-20 2013-07-03 京セラ株式会社 発光素子アレイ、発光装置および画像形成装置
JP4885760B2 (ja) * 2006-02-20 2012-02-29 京セラ株式会社 発光素子アレイ、発光装置および画像形成装置
JP5343311B2 (ja) * 2006-10-24 2013-11-13 富士ゼロックス株式会社 露光装置および画像形成装置
JP4758921B2 (ja) * 2007-01-29 2011-08-31 株式会社日立製作所 線状光源装置、及びバックライト装置
US20100177155A1 (en) * 2007-06-25 2010-07-15 Kyocera Corporation Light Emitting Element Array, Light Emitting Device, and Image Forming Apparatus
JP4682231B2 (ja) 2008-08-01 2011-05-11 株式会社沖データ 光プリントヘッドおよび画像形成装置
JP5366511B2 (ja) * 2008-11-14 2013-12-11 株式会社沖データ 駆動回路、光プリントヘッド及び画像形成装置
JP5428591B2 (ja) * 2009-01-28 2014-02-26 富士ゼロックス株式会社 Ｌｅｄ基板装置、ｌｅｄプリントヘッドおよび画像形成装置
JP4871978B2 (ja) * 2009-07-10 2012-02-08 株式会社沖データ 半導体装置、及び光プリントヘッド
JP5582771B2 (ja) 2009-12-04 2014-09-03 株式会社沖データ 駆動装置及び画像形成装置
KR102139681B1 (ko) 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
JP2020120018A (ja) * 2019-01-25 2020-08-06 富士ゼロックス株式会社 発光装置、光学装置、光計測装置及び画像形成装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194978A (ja) * 1989-12-22 1991-08-26 Nippon Sheet Glass Co Ltd 発光素子アレイ
JPH09150543A (ja) * 1995-11-29 1997-06-10 Canon Inc 画像形成装置
JPH09216416A (ja) * 1996-05-31 1997-08-19 Nippon Sheet Glass Co Ltd 自己走査形発光素子アレイおよびその駆動方法
JPH09283792A (ja) * 1996-04-12 1997-10-31 Nippon Sheet Glass Co Ltd 面発光サイリスタおよび自己走査型発光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4394653A (en) * 1980-11-24 1983-07-19 General Instrument Corporation Bi-directional drive multiplexed display system
US5324958A (en) * 1991-02-19 1994-06-28 Synaptics, Incorporated Integrating imaging systgem having wide dynamic range with sample/hold circuits
JP3194978B2 (ja) 1991-05-07 2001-08-06 株式会社ユーシン コントロールノブの照明装置
EP0884781A3 (en) * 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194978A (ja) * 1989-12-22 1991-08-26 Nippon Sheet Glass Co Ltd 発光素子アレイ
JP2807910B2 (ja) * 1989-12-22 1998-10-08 日本板硝子株式会社 発光素子アレイ
JPH09150543A (ja) * 1995-11-29 1997-06-10 Canon Inc 画像形成装置
JPH09283792A (ja) * 1996-04-12 1997-10-31 Nippon Sheet Glass Co Ltd 面発光サイリスタおよび自己走査型発光装置
JPH09216416A (ja) * 1996-05-31 1997-08-19 Nippon Sheet Glass Co Ltd 自己走査形発光素子アレイおよびその駆動方法

Also Published As

Publication number Publication date
CA2368988A1 (en) 2001-08-09
CN1419714A (zh) 2003-05-21
JP4345173B2 (ja) 2009-10-14
WO2001057935A1 (fr) 2001-08-09
EP1168462A1 (en) 2002-01-02
US6717183B2 (en) 2004-04-06
CN1196206C (zh) 2005-04-06
KR20020004984A (ko) 2002-01-16
US20030071274A1 (en) 2003-04-17
JP2001217460A (ja) 2001-08-10
TW476167B (en) 2002-02-11

Similar Documents

Publication Publication Date Title
KR100740444B1 (ko) 발광 사이리스터 매트릭스 어레이 및 그 구동 회로
US6633322B2 (en) Light emitting element array, optical printer head using the same, and method for driving optical printer head
US6747940B2 (en) Optical writing head comprising self-scanning light-emitting element array
US6531826B1 (en) Self-scanning light-emitting device
US6853396B1 (en) Driving ic and optical print head
EP1134084B1 (en) Driver ic and optical print head
US5907572A (en) Two-dimensional surface light emitting element array
JP3233431B2 (ja) Ｌｅｄプリントヘッドの駆動回路
KR940009023B1 (ko) 발광다이오드 프린트 헤드
CN1185105C (zh) 自扫描型发光器件阵列的驱动电路及自扫描型发光器件阵列
JP2001284653A (ja) 発光素子アレイ
JP3357810B2 (ja) 光プリントヘッド
JP2001353902A (ja) 自己走査型２次元発光素子アレイ
EP1215050A1 (en) Driving ic and optical print head
KR940010877B1 (ko) 발광다이오드 프린트 헤드
US7136086B2 (en) Optical print head
JP3717807B2 (ja) 光プリントヘッド
JP3609799B6 (ja) 光プリントヘッド
JP3609799B2 (ja) 光プリントヘッド
JP2001077422A (ja) Ｌｅｄアレイチップおよびｌｅｄアレイチップと併用したプリント基板
JP3609798B6 (ja) 光プリントヘッド
JP3609798B2 (ja) 光プリントヘッド
JPH11268334A (ja) Ｌｅｄプリントヘッド
JPH03227266A (ja) 光プリンタヘッド
JP2001353903A (ja) 光プリントヘッド

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-5-5-P10-P19-oth-PG1701

Patent document republication publication date: 20080422

Republication note text: Request for Correction Notice (Document Request)

Gazette number: 1007404440000

Gazette reference publication date: 20070719

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20130621

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20140626

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20150618

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20160617

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20170616

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20180619

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20190619

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20210201

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000