CN1194602C - 元件安装方法 - Google Patents
元件安装方法 Download PDFInfo
- Publication number
- CN1194602C CN1194602C CNB011358475A CN01135847A CN1194602C CN 1194602 C CN1194602 C CN 1194602C CN B011358475 A CNB011358475 A CN B011358475A CN 01135847 A CN01135847 A CN 01135847A CN 1194602 C CN1194602 C CN 1194602C
- Authority
- CN
- China
- Prior art keywords
- electrode
- solder flux
- row
- electrodes series
- mounting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
一种将多个微小尺寸的片状元件以并列配置经焊接安装在基板上的元件安装方法,考虑到将元件端子与元件配置对应形成在基板上的电极进行焊接的焊接过程中,熔融焊剂的自校正效应,对各电极设定允许的偏置量。对电极位置偏移相同的偏置量进行焊剂印刷及元件安放。该偏置量由于熔融焊剂的自校正效应而消除,各元件就能固定在正确的位置。利用该安装方法,能放宽安装动作时的间隙条件,能防止印刷时或安放时的不良情况发生。
Description
技术领域
本发明涉及将例如电子元件安装到基板上的元件安装方法,尤其涉及能减少高密度安装微小尺寸元件时的安装不良的安装方法。
背景技术
近年来,半导体等电子元件不断趋向小型化,对基板安装要求高密度化。例如,将0.6mm×0.3mm左右的微小尺寸元件以0.1mm的窄间距安装到基板上用的安装图形已实际应用。为了将元件高密度安装到印有这样窄间距的安装图形的基板上,要求有极高的安装位置精度。因此,必须提高基板上形成的电极的位置精度,同时保证安放时元件的位置对准精度。
但是,进行如上所述的微小尺寸元件的窄间距安装,仅凭电极的位置精度及安放时元件的位置对准精度,并不能确保必要的安装精度。例如,当元件相对吸嘴保持的状态稍有位置偏移时,安放时往往容易影响相邻的已安放元件,会妨碍安放动作。此外,在安放元件之前在电极上印刷焊剂时,印刷在相邻电极上的焊剂容易相互连接而形成桥接,如果就这样进行再流焊,则有时电极间会产生短路。如上所述,现有的元件安装方法在微小尺寸元件进行窄间距安装时,存在容易产生安装不良的问题。
发明内容
为了解决上述问题,本发明的目的在于,提供一种在微小尺寸元件的窄间距安装中,能减少安装不良的元件安装方法。
本发明的元件安装方法如下所述。
本发明是将元件安放在基板上进行焊接的元件安装方法,包括:
(a)焊剂印刷工序,在基板的元件固定位置形成的、焊接元件端子用的电极之中的至少一个电极,相对该电极中心位置使位置偏移规定的偏置量,印刷焊剂;
(b)元件安放工序,焊剂印刷之后,相对电极的中心位置使位置偏移上述规定的偏置量来安放元件;
(c)元件移动工序,安放元件之后,加热基板使焊剂熔融,使元件向电极的中心位置方向移动的工序;
(d)元件移动之后,使焊剂固化,在固定位置将端子固定在电极上的工序。
上述偏置量考虑到例如电极与端子在焊接过程中熔融焊剂的自校正效应,设定为在上述工序(b)安放元件时端子位置与电极中心位置之间允许的值,
上述工序(c)中的移动是由于该自校正效应而产生的。
在另一个方面,本发明提供了这样一种将元件安放在基板上进行焊接的元件安装方法,所述方法包括:
(a)焊剂印刷工序,在所述基板的所述元件固定位置并列配置形成的、焊接所述元件的各端子用的多个电极列之中的至少一个电极列,相对构成该电极列的电极对的中心位置连接形成的中心线,使位置偏移规定的偏置量,印刷焊剂;
(b)元件安放工序,焊剂印刷之后,相对所述电极列的中心线使位置偏移上述偏置量来安放元件;
(c)元件移动工序,安放元件之后,加热所述基板使焊剂熔融,使所述元件向所述电极列的中心线方向移动;
(d)元件移动之后,使焊剂固化,在所述固定位置将所述端子固定在所述电极上的工序,
所述偏置量考虑所述电极与所述端子在焊接过程中熔融焊剂的自校正效应,设定为在上述工序(b)安放元件时所述端子位置与所述电极列中心线之间允许的值,所述工序(c)中的移动是由于所述自校正效应而产生的。
在另一个方面,本发明提出了这样一种将元件安放在基板上进行焊接的元件安装方法,其特征在于,所述方法包括:
(a)焊剂印刷工序,并列配置形成于所述基板上的多个电极列中,两外侧电极列的各电极在各列中心线向外侧偏移规定偏置量的位置印刷焊剂;
(b)元件安放工序,在所述两外侧电极列的各电极所印刷的焊剂之上,在从各列中心线向外侧偏移所述偏置量的位置安放所述元件;
(c)元件移动工序,加热元件安放之后的所述基板,使焊剂熔融,使所述元件向所述各列的中心线方向移动;
(d)使焊剂固化,将所述端子固定在所述电极上的工序,
其中,所述偏置量考虑再流焊工序的焊接过程中熔融焊剂的自校正效应而设定。
根据上述方法,将焊剂印刷在电极上时或将元件安放在基板上时,通过使位置偏移规定的偏置量,就能放宽安装动作时的间隙条件,防止发生印刷时及安放时的不良情况。
附图说明
图1所示为根据本发明实施例安装元件的基板一例的平面图。
图2A、图2B及图3A-图3C所示为本发明第1实施例的元件安装方法的工序说明图。
图4所示为本发明第2实施例的元件安装方法说明图。
具体实施方式
下面参照附图对本发明的实施例进行说明。
(第1实施例)
本发明的元件安装方法例如将微小尺寸的片状电子元件以窄间距并列配置,并通过焊接而安装到基板上。
图1所示为用本发明的实施例安装元件的基板一例的平面图。
在图1中,在作为元件安装对象的基板1上,与元件固定位置对应,形成有多个电极2。各电极2与安装元件的各端子焊接。在本实施例中,在相对的一对(2个)电极2上,安装有一个片状元件5(参见图3)。
因此,与基板1上并列配置安装的多个元件5的各位置对应,以窄间距并列配置形成一对电极2。在此,在基板1上,电极2配置成两种图形,一种是相邻安装3个元件用的电极组33的图形,另一种是相邻安装4个元件用的电极组34的图形。各电极组安装相同的微小尺寸元件5。
图2A、图2B及图3A-图3C是本发明第1实施例的元件安装方法的工序说明图。本第1实施例是对图1所示电极组33应用本发明的例子。
图2A所示为图1的电极组33中电极2的详细配置。一对电极2组成的电极列L1、L2、L3相互间的电极间间隙尺寸设定为0.1mm。
接着,在图2B所示的各电极2的上表面,印刷元件焊接用的焊膏4。此时,印刷位置未必是与分别构成各电极列L1、L2、L3的电极对的中心位置连接形成的中心线CL1、CL2、CL3一致的位置。即,在3列之中,仅位于中间的电极列L2在与中心线CL2对准的位置印刷焊膏4。而两侧的2列电极列L1和L3,在从中心线CL1和CL3向外侧偏移规定偏置量d1的位置印刷焊膏4。该偏置量d1如后所述,是考虑了焊接过程中熔融焊剂的自校正效应设定的。在本第1实施例中,偏置量d1为0.02mm。
接着如图3A所示,将元件5安放在印刷有焊膏4的电极2上。此时将元件5对准位置时,对两侧的2列电极列,相对各自的中心线使位置偏移上述的偏置量d1,使元件5与电极2位置对准。即,元件5相对所印刷的焊膏4位置对准,如图3B所示,安放动作中的元件相互间隙不是规定间隙0.1mm,而是在0.1mm上加上偏置量d1后的间隙。
然后,这样安放了元件5的基板1被送入再流焊工序,进行加热。由此,焊膏4中的焊剂成分熔融,元件5的端子与电极2焊接。在该焊接过程中,熔融的焊剂在电极2上浸润扩展流动而覆盖整个电极2的表面。随着该流动,元件5也如下移动。即如图3C所示,安放时位置处于偏移偏置量d1状态的元件5移动至电极2的中心位置。在该状态,通过焊剂固化,元件5焊接在电极2的正确固定位置。
如上所述,偏置量d1的规定值设定为在焊接过程中利用自校正效应可以纠正位置偏移的范围。使焊剂印刷位置及元件安放位置偏移偏置量,就能尽量放宽安装动作时的间隙条件,使焊剂印刷时形成焊剂桥及元件安放时发生元件间相互影响的情况减少。其结果是,能防止因此而引起的安装不良。
(第2实施例)
图4所示为本发明第2实施例的元件安装方法的说明图。
图4是相对图1所示电极组34应用本发明的例子。本第2实施例对4列电极列的两外侧2列,首先设定偏置量d3。此时,考虑焊接时的自校正效应在允许的范围内设定偏置量d3。接着,对内侧2列,设定相当于上述偏置量d3的1/2的偏置量d2。
将焊膏4印刷到电极2上时,以及将元件5安放到电极2上时,使位置从电极列的中心线向外侧分别偏移上述的偏置量d2、d3。由此,与以图1所示电极组33为对象的第1实施例一样,扩大了焊剂印刷时及元件安放时的间隙,能减少焊剂印刷时形成焊剂桥及元件安放时发生元件相互影响的情况。其结果是,能防止微小元件窄间距安装中不良情况的发生。
另外在上述第1和第2实施例中,分别示出电极列3列和4列的情况,在有4列以上列数的情况下,通过在最外侧位置偏置允许范围内的偏置量,并在各电极列依次偏置印刷位置和元件安放位置,就可收到减少不良发生概率的效果。
此外,电极列为1列、2列时,还有,对一个电极,也可以应用本发明的安装方法。
如上所述,根据本发明,考虑元件端子与基板电极在焊接过程中的自校正效应,按各电极设定允许的偏置量,对电极进行焊剂印刷及元件安放时,使位置偏移该偏置量,就能放宽安装动作时的间隙条件,能防止印刷时及安放时不良情况的发生。
Claims (13)
1.一种将元件安放在基板上进行焊接的元件安装方法,其特征在于,所述方法包括:
(a)焊剂印刷工序,在所述基板的所述元件固定位置形成的、焊接所述元件端子用的电极之中的至少一个电极,相对该电极中心位置使位置偏移规定的偏置量,印刷焊剂;
(b)元件安放工序,焊剂印刷之后,相对所述电极的中心位置使位置偏移上述规定的偏置量来安放元件;
(c)元件移动工序,安放元件之后,加热所述基板使焊剂熔融,使所述元件向所述电极的中心位置方向移动;
(d)元件移动之后,使焊剂固化,在所述固定位置将所述端子固定在所述电极上的工序,
所述偏置量考虑所述电极与所述端子在焊接过程中熔融焊剂的自校正效应,设定为在上述工序(b)安放元件时所述端子位置与所述电极中心位置之间允许的值,
所述工序(c)中的移动是由于所述自校正效应而产生的。
2.一种将元件安放在基板上进行焊接的元件安装方法,其特征在于,所述方法包括:
(a)焊剂印刷工序,在所述基板的所述元件固定位置并列配置形成的、焊接所述元件的各端子用的多个电极列之中的至少一个电极列,相对构成该电极列的电极对的中心位置连接形成的中心线,使位置偏移规定的偏置量,印刷焊剂;
(b)元件安放工序,焊剂印刷之后,相对所述电极列的中心线使位置偏移上述偏置量来安放元件;
(c)元件移动工序,安放元件之后,加热所述基板使焊剂熔融,使所述元件向所述电极列的中心线方向移动;
(d)元件移动之后,使焊剂固化,在所述固定位置将所述端子固定在所述电极上的工序,
所述偏置量考虑所述电极与所述端子在焊接过程中熔融焊剂的自校正效应,设定为在上述工序(b)安放元件时所述端子位置与所述电极列中心线之间允许的值,
所述工序(c)中的移动是由于所述自校正效应而产生的。
3.根据权利要求2所述的元件安装方法,其特征在于,
所述多个电极列是3列并列配置。
4.根据权利要求3所述的元件安装方法,其特征在于,
所述3列电极列之中,中心列的电极在与该电极列的中心线对准的位置印刷焊剂。
5.根据权利要求4所述的元件安装方法,其特征在于,
所述3列电极列之中,两外侧的电极在分别从电极列的中心线向外侧偏置的位置印刷焊剂。
6.根据权利要求2所述的元件安装方法,其特征在于,
所述多个电极列为4列并列配置。
7.根据权利要求6所述的元件安装方法,其特征在于,
在所述4列的所有电极列,分别在从电极列的中心线向外侧偏置的位置印刷焊剂。
8.一种将元件安放在基板上进行焊接的元件安装方法,其特征在于,所述方法包括:
(a)焊剂印刷工序,并列配置形成于所述基板上的多个电极列中,两外侧电极列的各电极在各列中心线向外侧偏移规定偏置量的位置印刷焊剂;
(b)元件安放工序,在所述两外侧电极列的各电极所印刷的焊剂之上,在从各列中心线向外侧偏移所述偏置量的位置安放所述元件;
(c)元件移动工序,加热元件安放之后的所述基板,使焊剂熔融,使所述元件向所述各列的中心线方向移动;
(d)使焊剂固化,将所述端子固定在所述电极上的工序,
所述偏置量考虑再流焊工序的焊接过程中熔融焊剂的自校正效应而设定。
9.根据权利要求8所述的元件安装方法,其特征在于,
所述多个电极列为3列并列配置。
10.根据权利要求9所述的元件安装方法,其特征在于,
所述3列电极列之中,中心列的电极在与该电极列的中心线对准的位置印刷焊剂。
11.根据权利要求8所述的元件安装方法,其特征在于,
所述电极列为4列并列配置。
12.根据权利要求11所述的元件安装方法,其特征在于,
在所述4列的所有电极列中,在从各电极列的中心线向外侧偏置的位置印刷焊剂。
13.根据权利要求12所述的元件安装方法,其特征在于,
对所述4列电极列中内侧两列的电极列设定的偏置量,比对两外侧2列电极列设定的偏置量要小。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP325322/2000 | 2000-10-25 | ||
JP2000325322A JP3656543B2 (ja) | 2000-10-25 | 2000-10-25 | 電子部品実装方法 |
JP325322/00 | 2000-10-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1350422A CN1350422A (zh) | 2002-05-22 |
CN1194602C true CN1194602C (zh) | 2005-03-23 |
Family
ID=18802705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011358475A Expired - Lifetime CN1194602C (zh) | 2000-10-25 | 2001-10-25 | 元件安装方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6729532B2 (zh) |
JP (1) | JP3656543B2 (zh) |
KR (1) | KR100503223B1 (zh) |
CN (1) | CN1194602C (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3656533B2 (ja) * | 2000-09-08 | 2005-06-08 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
JP4346827B2 (ja) * | 2001-03-06 | 2009-10-21 | パナソニック株式会社 | 電子部品実装方法 |
EP1541002B1 (en) | 2002-07-25 | 2007-02-28 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for inspecting cream solder printed on a substrate |
US8403203B2 (en) * | 2002-12-10 | 2013-03-26 | Neonoda Inc. | Component bonding using a capillary effect |
CN100527917C (zh) * | 2005-11-23 | 2009-08-12 | 比亚迪股份有限公司 | 一种线路板基体上焊盘的制造方法及焊盘 |
JP2007287779A (ja) * | 2006-04-13 | 2007-11-01 | Matsushita Electric Ind Co Ltd | 電子部品実装システムおよび搭載状態検査装置ならびに電子部品実装方法 |
CN101980071B (zh) * | 2009-03-10 | 2012-07-04 | 华映光电股份有限公司 | 导线图案以及监控膜材贴附偏差的方法 |
JP4751948B1 (ja) * | 2010-02-16 | 2011-08-17 | ヤマハ発動機株式会社 | 部品実装装置および部品実装方法 |
JP2011258703A (ja) * | 2010-06-08 | 2011-12-22 | Furukawa Electric Co Ltd:The | 波長可変レーザ素子の制御方法および波長可変レーザ装置 |
JP6107060B2 (ja) | 2011-12-26 | 2017-04-05 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP5062376B1 (ja) * | 2012-04-11 | 2012-10-31 | 富士ゼロックス株式会社 | 電子部品実装基板の製造方法 |
CN103037633B (zh) * | 2012-12-13 | 2015-08-12 | 无锡江南计算技术研究所 | 表面贴装器件防焊接偏移方法 |
US20160057855A1 (en) * | 2013-04-15 | 2016-02-25 | Heptagon Micro Optics Pte. Ltd. | Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering |
KR101361188B1 (ko) | 2013-10-10 | 2014-02-10 | (주)드림텍 | 솔더 위치 정밀도 향상을 위한 표면실장방법 |
US9847313B2 (en) * | 2015-04-24 | 2017-12-19 | Kulicke And Soffa Industries, Inc. | Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding |
KR102467030B1 (ko) | 2018-01-17 | 2022-11-14 | 삼성전자주식회사 | 반도체 패키지 및 그 패키지를 포함한 반도체 장치 |
JP7167721B2 (ja) * | 2019-01-10 | 2022-11-09 | 株式会社デンソー | 半導体装置およびその製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01230292A (ja) * | 1988-03-09 | 1989-09-13 | Fujitsu Ltd | 表面実装部品の半田付け方法 |
JPH02178993A (ja) * | 1988-12-29 | 1990-07-11 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法 |
WO1993015424A1 (en) * | 1992-01-28 | 1993-08-05 | British Telecommunications Public Limited Company | Alignment of integrated optical components |
FR2748849B1 (fr) * | 1996-05-20 | 1998-06-19 | Commissariat Energie Atomique | Systeme de composants a hybrider et procede d'hybridation autorisant des dilatations thermiques |
US6317513B2 (en) * | 1996-12-19 | 2001-11-13 | Cognex Corporation | Method and apparatus for inspecting solder paste using geometric constraints |
JP2947220B2 (ja) * | 1997-05-26 | 1999-09-13 | 日本電気株式会社 | フリップチップ接続方法及びフリップチップ搭載装置 |
JPH1117319A (ja) * | 1997-06-26 | 1999-01-22 | Matsushita Electric Ind Co Ltd | チップの実装方法 |
JP4026267B2 (ja) * | 1998-04-07 | 2007-12-26 | 株式会社デンソー | 電子部品の実装構造及び実装方法 |
DE29916075U1 (de) * | 1999-09-13 | 2000-12-14 | Siemens Ag | Einrichtung zur Inspektion einer dreidimensionalen Oberflächenstruktur |
JP2002076602A (ja) * | 2000-08-23 | 2002-03-15 | Yazaki Corp | 表示基板のチップ実装方法 |
-
2000
- 2000-10-25 JP JP2000325322A patent/JP3656543B2/ja not_active Expired - Lifetime
-
2001
- 2001-10-25 US US10/037,125 patent/US6729532B2/en not_active Expired - Lifetime
- 2001-10-25 CN CNB011358475A patent/CN1194602C/zh not_active Expired - Lifetime
- 2001-10-25 KR KR10-2001-0065953A patent/KR100503223B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6729532B2 (en) | 2004-05-04 |
JP3656543B2 (ja) | 2005-06-08 |
CN1350422A (zh) | 2002-05-22 |
JP2002134892A (ja) | 2002-05-10 |
KR100503223B1 (ko) | 2005-07-25 |
KR20020032390A (ko) | 2002-05-03 |
US20020112348A1 (en) | 2002-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1194602C (zh) | 元件安装方法 | |
US10667387B2 (en) | Accurate positioning and alignment of a component during processes such as reflow soldering | |
US7307221B2 (en) | Fabrication method and structure of PCB assembly, and tool for assembly thereof | |
KR101072336B1 (ko) | 플렉시블 배선 기판, 반도체칩 실장 플렉시블 배선 기판,표시 장치 및, 반도체칩 실장 방법 | |
US20040036181A1 (en) | Connection of integrated circuit to a substrate | |
US7644856B2 (en) | Solder ball mounting method and solder ball mounting apparatus | |
CN1258959C (zh) | 焊接凸点的形成方法 | |
KR100764668B1 (ko) | 플립칩 접속용 기판 및 그 제조방법 | |
US5842274A (en) | Method of forming discrete solder portions on respective contact pads of a printed circuit board | |
EP0723387A1 (en) | Soldermask gasketing of printed wiring board surface mount pads | |
KR100651465B1 (ko) | 전자 회로 모듈 및 집적 회로 장치의 제작 방법과 그를이용한 전자 회로 모듈 | |
JP3147868B2 (ja) | 電子部品の製造方法 | |
JP4522226B2 (ja) | 電子部品素子の実装方法及び電子装置の製造方法 | |
CN1980525A (zh) | 连接元器件焊脚的线路板焊盘及其连接结构和连接方法 | |
CN2594979Y (zh) | 集成电路芯片载板 | |
CN1929717A (zh) | 导线型电子器件安装印刷电路基板、导线型电子器件的软钎焊方法、空气调节器 | |
JP3498458B2 (ja) | 混成集積回路装置 | |
CN217283642U (zh) | 贴片组件 | |
CN1787723A (zh) | 印刷电路基板 | |
JP2008300690A (ja) | 表面部品実装方法および表面部品実装用基板 | |
KR0163975B1 (ko) | 혼성 집접회로용 고밀도 수동소자 실장구조 및 그의 실장방법 | |
CN115348752A (zh) | 一种电子器件及其加工方法 | |
CN100416807C (zh) | 半导体封装结构及其制造方法 | |
CN2681525Y (zh) | 线路载板 | |
CN1551341A (zh) | 半导体装置、电子器件、电子机器及半导体装置的制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20050323 |
|
CX01 | Expiry of patent term |