CN117882505A - 元件安装系统 - Google Patents
元件安装系统 Download PDFInfo
- Publication number
- CN117882505A CN117882505A CN202180101993.XA CN202180101993A CN117882505A CN 117882505 A CN117882505 A CN 117882505A CN 202180101993 A CN202180101993 A CN 202180101993A CN 117882505 A CN117882505 A CN 117882505A
- Authority
- CN
- China
- Prior art keywords
- determination
- inspection
- information
- category
- processing state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims abstract description 368
- 239000000758 substrate Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 42
- 238000013473 artificial intelligence Methods 0.000 claims description 11
- 238000003384 imaging method Methods 0.000 abstract description 41
- 238000001179 sorption measurement Methods 0.000 description 102
- 230000000875 corresponding effect Effects 0.000 description 93
- 238000007726 management method Methods 0.000 description 88
- 229910000679 solder Inorganic materials 0.000 description 67
- 238000004891 communication Methods 0.000 description 46
- 238000013500 data storage Methods 0.000 description 26
- 230000008569 process Effects 0.000 description 23
- 230000002950 deficient Effects 0.000 description 19
- 230000000007 visual effect Effects 0.000 description 14
- 102100029792 Dentin sialophosphoprotein Human genes 0.000 description 7
- 101000865404 Homo sapiens Dentin sialophosphoprotein Proteins 0.000 description 7
- WKKNCBFGLHEOCW-UHFFFAOYSA-N 4-[2-(4-sulfamoylphenyl)iminohydrazinyl]benzenesulfonamide Chemical compound C1=CC(S(=O)(=O)N)=CC=C1NN=NC1=CC=C(S(N)(=O)=O)C=C1 WKKNCBFGLHEOCW-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010801 machine learning Methods 0.000 description 5
- 238000013528 artificial neural network Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 239000008186 active pharmaceutical agent Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 210000004556 brain Anatomy 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 210000002569 neuron Anatomy 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/032842 WO2023037410A1 (ja) | 2021-09-07 | 2021-09-07 | 部品実装システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117882505A true CN117882505A (zh) | 2024-04-12 |
Family
ID=82594513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180101993.XA Pending CN117882505A (zh) | 2021-09-07 | 2021-09-07 | 元件安装系统 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023037410A1 (ko) |
| KR (1) | KR20240039039A (ko) |
| CN (1) | CN117882505A (ko) |
| TW (1) | TWI765839B (ko) |
| WO (1) | WO2023037410A1 (ko) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1022693A (ja) * | 1996-07-04 | 1998-01-23 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
| JP4541172B2 (ja) | 2005-01-28 | 2010-09-08 | ヤマハ発動機株式会社 | 部品実装ラインにおける情報管理システム |
| JP3818308B2 (ja) * | 2005-02-01 | 2006-09-06 | オムロン株式会社 | プリント基板の品質管理システム |
| TW201715243A (zh) * | 2015-07-31 | 2017-05-01 | Seiko Epson Corp | 電子零件搬送裝置及電子零件檢查裝置 |
| CN109923955B (zh) * | 2016-11-14 | 2020-10-30 | 株式会社富士 | 保存图像的再分类系统及再分类方法 |
| US11386546B2 (en) * | 2018-02-09 | 2022-07-12 | Fuji Corporation | System for creating learned model for component image recognition, and method for creating learned model for component image recognition |
-
2021
- 2021-09-07 WO PCT/JP2021/032842 patent/WO2023037410A1/ja active Application Filing
- 2021-09-07 JP JP2023546594A patent/JPWO2023037410A1/ja active Pending
- 2021-09-07 KR KR1020247007258A patent/KR20240039039A/ko unknown
- 2021-09-07 CN CN202180101993.XA patent/CN117882505A/zh active Pending
- 2021-11-09 TW TW110141636A patent/TWI765839B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI765839B (zh) | 2022-05-21 |
| KR20240039039A (ko) | 2024-03-26 |
| TW202312858A (zh) | 2023-03-16 |
| WO2023037410A1 (ja) | 2023-03-16 |
| JPWO2023037410A1 (ko) | 2023-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |