WO2023037410A1 - 部品実装システム - Google Patents

部品実装システム Download PDF

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Publication number
WO2023037410A1
WO2023037410A1 PCT/JP2021/032842 JP2021032842W WO2023037410A1 WO 2023037410 A1 WO2023037410 A1 WO 2023037410A1 JP 2021032842 W JP2021032842 W JP 2021032842W WO 2023037410 A1 WO2023037410 A1 WO 2023037410A1
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WO
WIPO (PCT)
Prior art keywords
determination
inspection
information
category
processing state
Prior art date
Application number
PCT/JP2021/032842
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
英樹 青山
正季 藤原
哲紅 金
順 浅井
真一 岡嵜
純一 小河
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to JP2023546594A priority Critical patent/JPWO2023037410A1/ja
Priority to CN202180101993.XA priority patent/CN117882505A/zh
Priority to PCT/JP2021/032842 priority patent/WO2023037410A1/ja
Priority to KR1020247007258A priority patent/KR20240039039A/ko
Priority to TW110141636A priority patent/TWI765839B/zh
Publication of WO2023037410A1 publication Critical patent/WO2023037410A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Definitions

  • An object of the present invention is to improve the accuracy of image-based judgment regarding the processing state of a processing device in a component mounting line.
  • a component mounting system includes a plurality of processing apparatuses including a component mounting apparatus that produces a component mounting board on which components are mounted, and one or more inspection apparatuses that inspect the processing state of the processing apparatuses. and a management device for managing the component mounting line.
  • At least one of the component mounting apparatus and the inspection apparatus has an imaging unit that acquires an image of the processing state of the processing device, and determines whether the processing state is good or bad by detecting a feature amount of the image. Then, the image is classified into a first category and a second category using a first judgment unit that outputs first judgment information indicating the judgment result, and an image classification method by artificial intelligence, and the image is classified into the first category.
  • a component mounting system 100 includes a component mounting line 10, a management data storage device 13, an algorithm storage device 14, and a management device 15.
  • a component mounting device 11B, a solder paste inspection device 12A, a mounting inspection device 12B, and a reflow inspection device 12C serves as a specific device that determines whether the processing state is good or bad based on an image. set.
  • the component mounting device 11B and the reflow inspection device 12C are set as specific devices.
  • a plurality of inspection devices 12 configured by the solder paste inspection device 12A, the mounting inspection device 12B, and the reflow inspection device 12C may be set as specific devices. In this embodiment, all of the component mounting device 11B, solder paste inspection device 12A, mounting inspection device 12B, and reflow inspection device 12C are set as specific devices.
  • the solder printing device 11A is a device for printing solder paste on a circuit board to obtain a solder paste-printed board PP.
  • This solder paste-printed substrate PP is carried into the solder paste inspection device 12A.
  • the solder paste inspection device 12A is arranged downstream of the solder printing device 11A and inspects the processing state of the solder printing device 11A.
  • the solder paste-printed board PP after inspection by the solder paste inspection device 12A is carried into the component mounting device 11B.
  • the component mounting apparatus 11B is an apparatus for producing a component mounting board PPA in which electronic components (hereinafter referred to as "components") are mounted on a solder paste printed board PP. This component mounting board PPA is carried into the mounting inspection apparatus 12B.
  • the mounting inspection device 12B is arranged downstream of the component mounting device 11B and inspects the processing state of the component mounting device 11B. After being inspected by the mounting inspection device 12B, the component-mounted substrate PPA is carried into the reflow device 11C.
  • the reflow device 11C is a device for obtaining a reflow board PPB by performing a reflow process in which the solder on the component mounting board PPA is melted and then hardened. This reflow board PPB is carried into the reflow inspection apparatus 12C.
  • the reflow inspection device 12C is arranged downstream of the reflow device 11C and inspects the processing state of the reflow device 11C.
  • FIG. 3 the directional relationship is shown using XY rectangular coordinates that are orthogonal to each other on the horizontal plane.
  • the component mounting apparatus 11B includes a mounting machine main body 2, a mounting control section 4, and a mounting communication section 40.
  • the mounting machine main body 2 constitutes a structural part that performs a component mounting process, etc., for mounting components on the solder paste-printed substrate PP during production of the component mounting substrate PPA.
  • the mounting communication unit 40 is an interface for performing data communication with a management data storage device 13 and an algorithm storage device 14, which will be described later.
  • the mounting control unit 4 controls the component mounting process of the mounting machine body 2 and the like, and controls data communication of the mounting communication unit 40 .
  • the mounting machine body 2 includes a body frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a board support unit 28.
  • the main body frame 21 is a structure in which each part constituting the mounting machine main body 2 is arranged, and is formed in a substantially rectangular shape when viewed in a plan view in a direction perpendicular to both the X-axis direction and the Y-axis direction (vertical direction). It is
  • the conveyor 23 extends in the X-axis direction and is arranged on the body frame 21 .
  • the conveyor 23 conveys the solder paste-printed board PP in the X-axis direction.
  • the solder paste-printed substrate PP conveyed on the conveyor 23 is positioned by the substrate support unit 28 at a predetermined work position (component mounting position where components are mounted on the solder paste-printed substrate PP). ing.
  • the substrate support unit 28 positions the solder paste-printed substrate PP on the conveyor 23 by supporting the solder paste-printed substrate PP from below.
  • the component supply units 24 are arranged on both ends of the body frame 21 in the Y-axis direction, with the conveyor 23 interposed therebetween.
  • the component supply unit 24 is an area in which a plurality of feeders 24F are mounted side by side in the main body frame 21. Each feeder is provided for each component to be held by a mounting head 251 provided in the head unit 25, which will be described later. 24F set positions are partitioned.
  • the feeder 24F is detachably attached to the component supply unit 24. As shown in FIG.
  • the feeder 24F is a device that performs component supply processing for supplying components.
  • the feeder 24F is not particularly limited as long as it can hold a plurality of components and supply the held components to a predetermined component supply position set in the feeder, and is, for example, a tape feeder.
  • the tape feeder is a feeder that has a reel wound with a component storage tape that stores components at predetermined intervals, and feeds the components by feeding the component storage tape from the reel.
  • the head unit 25 is held by a moving frame 27.
  • a fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotationally driven by a Y-axis servomotor 263 are arranged on the body frame 21 .
  • the moving frame 27 is arranged on a fixed rail 261 , and a nut portion 271 provided on this moving frame 27 is screwed onto a ball screw shaft 262 .
  • a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servomotor 274 are arranged on the moving frame 27 .
  • the head unit 25 is movably held by the guide member 272 , and a nut portion provided on the head unit 25 is screwed onto the ball screw shaft 273 .
  • the Y-axis servomotor 263 is operated to move the moving frame 27 in the Y-axis direction
  • the X-axis servomotor 274 is operated to move the head unit 25 relative to the moving frame 27 in the X-axis direction.
  • the head unit 25 can move in the Y-axis direction as the moving frame 27 moves, and can move along the moving frame 27 in the X-axis direction.
  • the head unit 25 is movable between the component supply unit 24 and the solder paste-printed board PP supported by the board support unit 28 .
  • the head unit 25 moves between the component supply unit 24 and the solder paste-printed board PP to perform a component mounting process of mounting the component on the solder paste-printed board PP.
  • the head unit 25 has a plurality of mounted heads 251. As shown in FIG. 4, the head unit 25 has a plurality of mounted heads 251. As shown in FIG. Each mounting head 251 has a suction nozzle 2511 attached to its tip (lower end).
  • the suction nozzle 2511 is a nozzle capable of sucking and holding components supplied by the feeder 24F.
  • the suction nozzle 2511 performs component suction processing for sucking components.
  • the suction nozzle 2511 can communicate with any one of a negative pressure generator, a positive pressure generator, and the atmosphere via an electric switching valve. In other words, when a negative pressure is supplied to the suction nozzle 2511, the component can be sucked and held by the suction nozzle 2511, and then when the positive pressure is supplied, the component is released from being sucked and held.
  • Each mounting head 251 performs a component mounting process of mounting the component sucked and held by the suction nozzle 2511 on the solder paste printed board PP, corresponding to each of a plurality of target mounting positions set on the solder paste printed board PP. do.
  • Each mounting head 251 obtains a component mounting board PPA by performing component mounting processing on the solder paste printed board PP.
  • Each mounting head 251 can move up and down in the Z-axis direction (vertical direction) with respect to the frame of the head unit 25, and can rotate around the head axis extending in the Z-axis direction.
  • Each mounting head 251 can move up and down along the Z-axis direction between a suctionable position where the suction nozzle 2511 can suck and hold a component and a retracted position above the suctionable position. That is, when a component is sucked and held by the suction nozzles 2511, each mounting head 251 descends from the retracted position toward the suckable position and sucks and holds the component at the suckable position.
  • each mounting head 251 after picking up and holding the component rises from the pickable position toward the retracted position. Further, each mounting head 251 has a mountable position at which the component sucked and held by the suction nozzle 2511 can be mounted at a predetermined target mounting position on the board PP printed with solder paste, and the retracted position. In between, it is possible to move up and down along the Z-axis direction.
  • the mounting machine main body 2 further includes a mounting imaging section 3.
  • the mounting imaging unit 3 acquires a captured image by performing an imaging operation of imaging an object to be imaged.
  • Mounted imaging section 3 includes first imaging section 31 , second imaging section 32 , and third imaging section 33 .
  • the second imaging unit 32 is an imaging camera arranged in the head unit 25 and equipped with an imaging element such as CMOS or CCD.
  • the second imaging unit 32 captures the component sucked and held by the suction nozzle 2511 of each mounting head 251 from the side to acquire the second suction image GA2.
  • the second suction image GA2 is an image showing the processing state of component suction processing by the suction nozzle 2511 .
  • the second suction image GA2 is an image with which it is possible to confirm, for example, the posture of the component sucked by the suction nozzle 2511 as the processing state of the component suction processing.
  • the second suction image GA2 is input to the mounting control unit 4 and referred to when the first suction determination unit 46 and the second suction determination unit 47 determine whether the processing state is good or bad.
  • the implementation control unit 4 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) that stores control programs, a RAM (Random Access Memory) that is used as a work area for the CPU, and the like.
  • the mounting control unit 4 controls the operation of each component of the mounting machine main body 2, controls the data communication operation of the mounting communication unit 40, and Executes various arithmetic processing.
  • the mounting control unit 4 includes a communication control unit 41, a board transfer control unit 42, a component supply control unit 43, a head control unit 44, and an imaging control unit 45 as main functional components. , a first adsorption determination unit 46 , a second adsorption determination unit 47 , and a third adsorption determination unit 48 .
  • the communication control unit 41 controls the mounting communication unit 40 to perform data communication between the component mounting apparatus 11B and the management data storage device 13 and data communication between the component mounting apparatus 11B and the algorithm storage device 14. to control.
  • the mounting communication unit 40 stores a component suction data set DSPP in which the first suction image GA1 and the second suction image GA2 are associated with third suction determination information DA3 output from the third suction determination unit 48, which will be described later, as management data.
  • Send to device 13 .
  • the on-board communication unit 40 also receives an inspection algorithm, which will be described later, stored in the algorithm storage device 14 .
  • the board transport control unit 42 controls the transport operation of the solder paste-printed board PP by the conveyor 23 .
  • the component supply control unit 43 controls component supply processing of each of the plurality of feeders 24F arranged in the component supply unit 24 .
  • the head controller 44 controls the mounting head 251 by controlling the head unit 25 . As a result, the head control unit 44 performs component mounting processing for mounting the component sucked and held by the suction nozzle 2511 on the solder paste-printed board PP at each of the plurality of target mounting positions set on the solder paste-printed board PP. , the mounting head 251 is made to execute.
  • the imaging control unit 45 controls imaging operations by the first imaging unit 31 , the second imaging unit 32 and the third imaging unit 33 that configure the mounting imaging unit 3 .
  • the first suction determination unit 46 determines whether the processing state of the component suction processing by the suction nozzle 2511 is good or bad by detecting the feature amount of the first suction image GA1 and the second suction image GA2, and the first suction determination unit 46 indicates the determination result. It outputs suction determination information DA1.
  • the feature amount is represented by the size and area of the region portion for checking the posture of the component sucked by the suction nozzle 2511 and the displacement amount of the suction position in the first suction image GA1 and the second suction image GA2. be.
  • the second suction determination unit 47 uses an AI (artificial intelligence) image classification technique to determine whether the processing state of the component suction processing by the suction nozzle 2511 is good or bad. Specifically, the second suction determination unit 47 classifies the first suction image GA1 and the second suction image GA2 into a first category and a second category. It is determined that the processing state of the adsorption process is good, and if it belongs to the second category, it is determined that the processing state is bad. Then, the second adsorption determination unit 47 outputs the second adsorption determination information DA2 indicating the above determination result using the image classification method by AI (artificial intelligence).
  • AI artificial intelligence
  • the third suction determination unit 48 performs component suction processing by the suction nozzle 2511 based on the determination results of the first suction determination unit 46 and the second suction determination unit 47, which use different determination methods. final judgment of the quality of the processing state of As a result, it is possible to improve the accuracy of the final determination of whether the processing state is good or bad.
  • the third adsorption determination unit 48 Third adsorption determination information DA3 indicating the result of determination made as the result of the final determination is output.
  • the first adsorption determination information DA1 and the second adsorption determination information DA2 are information indicating the determination result that the processing state is defective
  • the first adsorption image GA1 and the second adsorption image GA2 are used.
  • Visual determination by the operator may be performed.
  • the third adsorption determination unit 48 outputs information indicating the determination result of visual determination by the operator as third adsorption determination information DA3.
  • the third adsorption determination unit 48 outputs the final determination result indicating that the processing state is unsatisfactory. It outputs suction determination information DA3. As a result, it is possible to more strictly suppress deterioration in the quality of the component mounting board PPA due to the poor processing state of the component suction processing by the suction nozzle 2511 .
  • the third adsorption determination unit 48 may be configured to output the third adsorption determination information DA3 indicating the result of the final determination that the processing state is good. In this case, it is possible to prevent the determination criteria for the final determination by the third adsorption determination unit 48 from being set to excessively strict criteria.
  • the third adsorption determination unit 48 performs visual observation by the operator using the first adsorption image GA1 and the second adsorption image GA2.
  • Information indicating the determination result of the determination may be configured to be output as the third adsorption determination information DA3. That is, when the determination results indicated by the first adsorption determination information DA1 and the second adsorption determination information DA2 do not match, the operator may visually determine using the first adsorption image GA1 and the second adsorption image GA2. Then, the third adsorption determination unit 48 outputs information indicating the determination result of visual determination by the operator as third adsorption determination information DA3.
  • the third suction determination information DA3 output from the third suction determination unit 48 is associated with the first suction image GA1 and the second suction image GA2 to form a component suction data set DSPP.
  • This component pickup data set DSPP is sent to the management data storage device 13 via the mounting communication unit 40 .
  • the component mounting apparatus 11B starts the component mounting operation when the command signal for starting the component mounting operation of the component on the solder paste printed board PP is input by the operator's operation. First, the solder paste-printed board PP is conveyed on the conveyor 23 and positioned at a predetermined component mounting position.
  • the component supply control unit 43 controls the component supply processing of the feeder 24F.
  • the head control section 44 moves the head unit 25 so that the suction nozzle 2511 is positioned above the components supplied by the feeder 24F.
  • the head controller 44 lowers the suction nozzle 2511 .
  • the sucking nozzle 2511 that has been lowered sucks and holds the component (step a1).
  • the head control unit 44 raises the suction nozzle 2511 .
  • the second imaging unit 32 images the component sucked and held by the suction nozzle 2511 from the side to acquire the second suction image GA2 (step a2).
  • the head control section 44 moves the head unit 25 so that the suction nozzle 2511 is positioned above the component mounting position on the board PP with solder paste printed on the conveyor 23 .
  • the first imaging unit 31 acquires a first suction image GA1 by imaging the component sucked and held by the suction nozzle 2511 from below (step a2).
  • the first adsorption determination unit 46 determines the first adsorption image GA1 and the second adsorption image GA2. By detecting the feature amount, the quality of the processing state of the component suction processing by the suction nozzle 2511 is determined, and the first suction determination information DA1 indicating the determination result is output (step a3). Also, the second adsorption determination unit 47 classifies the first adsorption image GA1 and the second adsorption image GA2 into a first category and a second category.
  • the second adsorption determination unit 47 determines whether the processing state is good or bad according to the category to which the first adsorption image GA1 and the second adsorption image GA2 belong, and outputs the second adsorption determination information DA2 indicating the determination result ( step a3).
  • the head control unit 44 determines that the determination result of the third suction determination information DA3 indicates that the processing state of the component suction processing by the suction nozzle 2511 is good. (step a5). If the determination result is that the processing state of the component suction processing is good (YES in step a5), the head control unit 44 lowers the suction nozzle 2511 arranged above the component mounting position to perform solder paste printing. The component mounting operation of the component on the completed board PP is executed (step a6). In this way, the components can be mounted on the solder paste-printed board PP.
  • the head control unit 44 executes a component discarding operation of discarding the component sucked and held by the suction nozzle 2511.
  • the operation of the head unit 25 is controlled (step a7). In this way, by discarding the component when the processing state of the component suction process is unsatisfactory, it is possible to suppress the occurrence of defective mounting of the component on the solder paste-printed substrate PP.
  • the inspection apparatus 12 includes an inspection communication section 121 , an inspection imaging section 122 and an inspection control section 123 .
  • the inspection imaging unit 122 is, for example, an imaging camera equipped with an imaging device such as CMOS or CCD.
  • the inspection imaging unit 122 acquires an inspection image GI representing an image of the processing state of the corresponding processing device 11 .
  • the inspection imaging unit 122 of the solder paste inspection device 12A acquires, as the inspection image GI, an image of the solder paste-printed board PP that allows confirmation of the processing state of the printing process of the solder printing device 11A.
  • the inspection imaging unit 122 of the mounting inspection apparatus 12B acquires an image of the component mounting board PPA that allows confirmation of the processing state of the component mounting processing of the component mounting apparatus 11B as an inspection image GI.
  • the inspection imaging unit 122 of the reflow inspection device 12C acquires an image of the reflow board PPB that allows confirmation of the processing state of the reflow processing of the reflow device 11C as the inspection image GI.
  • the inspection control unit 123 is composed of a CPU, a ROM that stores control programs, a RAM that is used as a work area for the CPU, and the like.
  • the inspection control unit 123 controls the inspection communication unit 121 and the inspection imaging unit 122 by executing the control program stored in the ROM by the CPU, and executes various arithmetic processing.
  • the inspection control unit 123 includes a communication control unit 1231, an imaging control unit 1232, a first inspection determination unit 1233, a second inspection determination unit 1234, and a third inspection determination unit 1235 as main functional components.
  • the communication control unit 1231 controls data communication between the inspection device 12 and the management data storage device 13 and data communication between the inspection device 12 and the algorithm storage device 14 by controlling the inspection communication unit 121. do.
  • the inspection communication unit 121 sends to the management data storage device 13 an inspection data set DS that associates the inspection image GI with third inspection determination information DI3 output from a third inspection determination unit 1235 described later.
  • the inspection communication unit 121 of the solder paste inspection device 12A sends to the management data storage device 13 the solder paste inspection data set DSPT in which the inspection image GI and the third inspection determination information DI3 are associated.
  • the imaging control unit 1232 controls imaging operations by the inspection imaging unit 122 .
  • the first inspection determination unit 1233 determines whether the processing state of the corresponding processing device 11 is good or bad by detecting the feature amount of the inspection image GI, and outputs first inspection determination information DI1 indicating the determination result.
  • the feature amount is represented by the size, area, etc. of the area portion for checking the processing state of the corresponding processing device 11 in the inspection image GI.
  • the second inspection determination unit 1234 uses an AI (artificial intelligence) image classification method to determine whether the processing state of the corresponding processing device 11 is good or bad. Specifically, the second inspection determination unit 1234 classifies the inspection image GI into the first category and the second category, and when the inspection image GI belongs to the first category, the processing state of the corresponding processing device 11 is If the inspection image GI belongs to the second category, it is determined that the processing state is unsatisfactory. Then, the second inspection determination unit 1234 outputs second inspection determination information DI2 indicating the above-described determination result using an AI (artificial intelligence) image classification method.
  • AI artificial intelligence
  • the third inspection determination unit 1235 Based on the first inspection determination information DI1 and the second inspection determination information DI2, the third inspection determination unit 1235 generates third inspection determination information DI3 indicating the final determination result of the processing state of the corresponding processing device 11. Output.
  • the third inspection determination unit 1235 determines the processing state of the corresponding processing device 11 based on the determination results of the first inspection determination unit 1233 and the second inspection determination unit 1234 that use different determination methods. Make a final judgment on the quality of the product. As a result, it is possible to improve the accuracy of the final determination of whether the processing state is good or bad.
  • the third inspection determination unit 1235 Third inspection determination information DI3 indicating the determination result obtained as the final determination result is output. As a result, it is possible to maintain a high level of accuracy in the final determination of whether the processing state of the corresponding processing device 11 is good or bad.
  • the third inspection determination unit 1235 determines that the processing state is good. It outputs the third inspection determination information DI3 indicating that there is.
  • the third inspection determination unit 1235 output the third inspection determination information DI3 indicating the result of the final determination that the is defective. If the determination results indicated by the first inspection determination information DI1 and the second inspection determination information DI2 do not match, either information of the first inspection determination information DI1 or the second inspection determination information DI2 indicates that the processing state is defective. It becomes the information which shows the judgment result of. In this case, the possibility that the processing state of the corresponding processing device 11 is defective cannot be completely denied.
  • the third inspection determination unit 1235 outputs the third inspection result indicating the final determination result that the processing state is unsatisfactory. It outputs inspection determination information DAI3. As a result, it is possible to more strictly suppress deterioration in the quality of the component mounting board PPA due to the defective processing state of the corresponding processing apparatus 11 .
  • the third inspection judgment unit 1235 may be configured to output the third inspection determination information DI3 indicating the result of the final determination that the processing state is good. In this case, it is possible to prevent the determination criteria for the final determination by the third inspection determination unit 1235 from being set to excessively strict criteria.
  • the third inspection determination unit 1235 when the determination results indicated by the first inspection determination information DI1 and the second inspection determination information DI2 do not match, the third inspection determination unit 1235 outputs information indicating the determination result of visual determination by the operator using the inspection image GI. It may be configured to be output as the third inspection determination information DI3. That is, when the determination results indicated by the first inspection determination information DI1 and the second inspection determination information DI2 do not match, the operator may visually determine using the inspection image GI. Then, the third inspection determination unit 1235 outputs information indicating the determination result of visual determination by the operator as third inspection determination information DI3.
  • the third inspection determination information DI3 output from the third inspection determination unit 1235 is associated with the inspection image GI to form an inspection data set DS.
  • This inspection data set DS is sent to the management data storage device 13 via the inspection communication unit 121 .
  • the inspection apparatus 12 starts the inspection determination operation when the substrate unloaded from the corresponding processing apparatus 11 is loaded (step b1). First, the inspection imaging unit 122 acquires an inspection image GI (step b2).
  • the first inspection determination unit 1233 determines whether the processing state of the corresponding processing device 11 is good or bad by detecting the feature amount of the inspection image GI, and indicates the determination result.
  • First inspection determination information DI1 is output (step b3).
  • the second inspection determination unit 1234 classifies the inspection image GI into the first category and the second category. Then, the second inspection determination section 1234 determines whether the processing state is good or bad according to the category to which the inspection image GI belongs, and outputs second inspection determination information DI2 indicating the determination result (step b3).
  • the third inspection determination unit 1235 Based on the first inspection determination information DI1 and the second inspection determination information DI2, the third inspection determination unit 1235 generates third inspection determination information DI3 indicating the final determination result of the processing state of the corresponding processing device 11. Output (step b4).
  • the inspection control unit 123 executes a substrate disposal operation for discarding the inspected substrate (step b7).
  • the target component of the defective processing state is replaced with a new component. If possible, the operator may repair the component mounting board PPA by discarding the defective component and replacing it with a new component. On the other hand, if the defective target component cannot be replaced with a new component, the operator discards the component mounting board PPA.
  • the management data storage device 13 is connected to the component mounting device 11B so that data communication is possible. Also, the management data storage device 13 is connected to each of the solder paste inspection device 12A, the mounting inspection device 12B, and the reflow inspection device 12C, which constitute the plurality of inspection devices 12, so as to be capable of data communication. As described above, the component pickup data set DSPP output from the component mounting apparatus 11B is input to the management data storage device 13. FIG.
  • solder paste inspection data set DSPT output from the solder paste inspection device 12A
  • the reflow inspection data set DSRF output from the reflow inspection device 12C It is input to the management data storage device 13 .
  • the management device 15 is a device for managing the component mounting line 10 .
  • the management device 15 is connected for data communication with the management data storage device 13 and the algorithm storage device 14 .
  • the management device 15 can read the data group of the management data DM accumulated and stored in the management data storage device 13 .
  • the management device 15 can input an inspection algorithm IAL generated by a learning unit 1545 described later to the algorithm storage device 14 .
  • the algorithm storage device 14 is a device that stores the inspection algorithm IAL from the management device 15.
  • the algorithm storage device 14 is connected to the component mounting device 11B so as to be capable of data communication.
  • the algorithm storage device 14 is connected to each of the solder paste inspection device 12A, the mounting inspection device 12B, and the reflow inspection device 12C, which constitute the plurality of inspection devices 12, so as to be capable of data communication. Therefore, the component mounting apparatus 11B can read the inspection algorithm IAL stored in the algorithm storage device 14 .
  • the second suction determination unit 47 classifies the first suction image GA1 and the second suction image GA2 into a first category and a second category based on the inspection algorithm IAL, and determines the processing state of the suction nozzle 2511.
  • each inspection device 12 can load an inspection algorithm IAL stored in algorithm storage 14 .
  • the second inspection determination unit 1234 classifies the inspection image GI into a first category and a second category based on the inspection algorithm IAL, and determines whether the processing state of the corresponding processing device 11 is good or bad.
  • the management device 15 includes a management communication unit 151, a display unit 152, an operation unit 153, and a management control unit 154.
  • the management communication unit 151 is an interface for data communication with the management data storage device 13 and algorithm storage device 14 .
  • the management communication unit 151 acquires the data group of the management data DM from the management data storage device 13 and sends the inspection algorithm IAL to the algorithm storage device 14 .
  • the operation unit 153 is composed of a keyboard, a mouse, a touch panel provided in the display unit 152, or the like.
  • the operation unit 153 receives input operations of various commands by the operator.
  • the operation unit 153 receives category designation command information DCC from the operator.
  • the category designation command information DCC is an image corresponding to the component mounting apparatus 11B. This is information for designating to which category the item belongs to the second category.
  • the category designation command information DCC is an image corresponding to each inspection apparatus 12, and is an inspection data set constituting the solder paste inspection data set DSPT, the mounting inspection data set DSMT, and the reflow inspection data set DSRF included in the management data DM. This is information for designating to which category the image GI belongs, the first category or the second category.
  • the communication control unit 1541 controls data communication between the management device 15 and the management data storage device 13 and data communication between the management device 15 and the algorithm storage device 14 by controlling the management communication unit 151. do.
  • the display control section 1542 controls the display section 152 .
  • the category information generation unit 1543 determines whether the first suction image GA1 and the second suction image GA2 corresponding to the component mounting apparatus 11B and the inspection image GI corresponding to each inspection apparatus 12 belong to the first category or the second category.
  • category information DCT indicating whether it belongs to the category of
  • the category information generation unit 1543 generates category information DCT corresponding to all images of the first and second suction images GA1 and GA2 included in the data group of the management data DM and the inspection image GI.
  • the category information generation unit 1543 generates the third inspection determination information DI3 that constitutes the reflow inspection data set DSRF corresponding to the reflow inspection apparatus 12C (specific inspection apparatus) arranged on the most downstream side of the component mounting line 10, and the operation
  • the category information DCT is generated based on the category designation command information DCC input via the section 153 .
  • the learning data generation unit 1544 generates the learning data DLN in which the category information DCT is associated with the first picked-up image GA1 and the second picked-up image GA2 included in the data group of the management data DM, and outputs the learning data DLN to the second pickup determination unit 47 of the component mounting apparatus 11B. generated corresponding to .
  • the learning data generation unit 1544 generates learning data DLN in which the category information DCT is associated with the inspection image GI included in the data group of the management data DM, corresponding to the second inspection determination unit 1234 of each inspection apparatus 12. .
  • the learning data DLN used when the learning unit 1545 learns the classification criteria for image classification by the second suction determination unit 47 of the component mounting apparatus 11B and the second inspection determination unit 1234 of each inspection device 12 is generated by the learning data generator 1544 .
  • the learning data DLN corresponding to the second suction determination unit 47 of the component mounting apparatus 11B is data in which category information DCT is associated with the first suction image GA1 and the second suction image GA2 included in the data group of the management data DM.
  • the learning data DLN corresponding to the second inspection determination unit 1234 of each inspection apparatus 12 is data in which the inspection image GI included in the data group of the management data DM is associated with the category information DCT.
  • the category information DCT that constitutes the learning data DLN is normally set by the operator's input of category designation command information DCC via the operation unit 153 . That is, normally, the operator performs the input operation of the category designation command information DCC in correspondence with all images of the first suction image GA1 and the second suction image GA2 included in the data group of the management data DM and the inspection image GI. had to do. In this case, in order to improve the determination accuracy in the second suction determination section 47 of the component mounting apparatus 11B and the second inspection determination section 1234 of each inspection apparatus 12, the operator must designate a category corresponding to a huge amount of images. It is necessary to perform an input operation for the command information DCC. In this case, it becomes a heavy workload for the operator.
  • the category information generation unit 1543 when generating the category information DCT corresponding to each image of the first suction image GA1 and the second suction image GA2 included in the data group of the management data DM and the inspection image GI, refers not only to the category designation command information DCC but also to the third inspection determination information DI3 corresponding to the reflow inspection apparatus 12C.
  • the operator does not need to input the category designation command information DCC for all the images included in the data group of the management data DM.
  • the category information DCT corresponding to each image included in the data group of the management data DM can be generated while reducing the operator's workload. Therefore, it is possible to improve the determination accuracy of the second suction determination section 47 of the component mounting apparatus 11B and the second inspection determination section 1234 of each inspection device 12 while reducing the work burden on the operator.
  • the third inspection determination information DI3 corresponding to the most downstream reflow inspection device 12C is information indicating the determination result that it is good, and it corresponds to the solder paste inspection device 12A and the mounting inspection device 12B other than the reflow inspection device 12C. It is assumed that both the third inspection determination information DI3 and the third suction determination information DA3 corresponding to the component mounting apparatus 11B are information indicating the determination result that both are good. In this case, the category information generation unit 1543 generates category information DCT indicating that each of the first and second attraction images GA1 and GA2 included in the management data DM and the inspection image GI belongs to the first category. .
  • the target component with the defective processing state is replaced with a new component.
  • the operator may repair the component mounting board PPA by discarding the defective component and replacing it with a new component.
  • the third inspection determination information DI3 corresponding to the mounting inspection apparatus 12B is information indicating the determination result that it is defective
  • the repaired component mounting board PPA is downstream of the mounting inspection apparatus 12B. to indicate that the third inspection determination information DI3 corresponding to the most downstream reflow inspection device 12C is satisfactory.
  • Such third inspection determination information DI3 corresponding to the most downstream reflow inspection device 12C is information indicating the determination result that it is good, and the solder paste inspection device 12A other than the reflow inspection device 12C and the mounting inspection It is assumed that at least one of the third inspection determination information DI3 corresponding to the device 12B and the third suction determination information DA3 corresponding to the component mounting device 11B is information indicating the determination result that the component mounting device 11B is defective.
  • the category information generation unit 1543 determines that each of the first and second suction images GA1 and GA2 included in the management data DM and the inspection image GI belongs to the category designated by the category designation command information DCC.
  • the category information DCT shown is generated.
  • the category information corresponding to each image included in the data group of the management data DM is generated based on the category designation command information DCC designated by the operator.
  • a DCT can be generated.
  • the third inspection determination information DI3 corresponding to the most downstream reflow inspection device 12C is information indicating the determination result that the reflow inspection device 12C is defective
  • the solder printing device 11A and the component mounting device on the upstream side of the reflow inspection device 12C There is a possibility that the processing state of at least one of the processing devices 11, 11B and 11C, is defective. It is assumed that the third inspection determination information DI3 corresponding to the most downstream reflow inspection device 12C is information indicating the determination result that the reflow inspection device 12C is defective.
  • the management device 15 starts learning processing when the data group of the management data DM accumulated and stored in the management data storage device 13 is acquired via the management communication unit 151 (step c1).
  • the category information generation unit 1543 generates a third category corresponding to the most downstream reflow inspection device 12C for each management data DM uniquely specified by the board information DPP and the component information DP included in the data group of the management data DM. It is determined whether or not the inspection judgment information DI3 is information indicating the judgment result that the inspection result is good (step c2).
  • the category information generation unit 1543 If the third inspection determination information DI3 corresponding to the reflow inspection device 12C is information indicating the result of determination that it is good (YES in step c2), the category information generation unit 1543 generates the reflow inspection device for each management data DM. Information indicating that the third inspection determination information DI3 corresponding to the solder paste inspection device 12A and the mounting inspection device 12B other than 12C and the third suction determination information DA3 corresponding to the component mounting device 11B are both good. (step c3).
  • step c2 When the third inspection determination information DI3 corresponding to the reflow inspection device 12C is information indicating the determination result that the product is defective (NO in step c2), the process proceeds to step c5. Also, the determination result that at least one of the third inspection determination information DI3 corresponding to the solder paste inspection device 12A and the mounting inspection device 12B and the third suction determination information DA3 corresponding to the component mounting device 11B is defective. (NO in step c3), the process also proceeds to step c5.
  • the category information generation unit 1543 generates the first suction information associated with the third inspection determination information DI3 corresponding to the reflow inspection apparatus 12C and indicating that the determination result is defective.
  • a display request signal requesting display of the image GA1, the second suction image GA2, and each inspection image GI is output to the display control unit 1542.
  • the display control unit 1542 causes the display unit 152 to display the first suction image GA1, the second suction image GA2, and the inspection images GI.
  • the operation unit 153 receives the input of the category designation command information DCC by the operator in correspondence with the display of the first suction image GA1 and the second suction image GA2 and the inspection images GI on the display unit 152 . While confirming each image displayed on the display unit 152, the operator visually determines whether each image belongs to the first category or the second category, and issues a category designation command according to the visual determination.
  • Information DCC is input from the operation unit 153 .
  • the category information generation unit 1543 determines whether or not the category designation command information DCC has been input via the operation unit 153 (step c6).
  • the category information generation unit 1543 generates the first suction image GA1, the second suction image GA2, and the inspection image GI included in the management data DM.
  • Category information DCT indicating belonging to the category specified by the category specifying command information DCC is generated (step c7).
  • the learning unit 1545 When the learning data generation unit 1544 generates the learning data DLN, the learning unit 1545 causes the second suction determination unit 47 to determine the first suction image GA1 and the second suction image based on the learning data DLN corresponding to the component mounting apparatus 11B.
  • the classification criteria for classifying the image GA2 are machine-learned (step c9). Also, the learning unit 1545 machine-learns the classification criteria when the second inspection determination unit 1234 classifies the inspection images GI based on the learning data DLN corresponding to each inspection device 12 (step c9).
  • the learning unit 1545 transmits the inspection algorithm IAL indicating the procedure of image classification according to the learned classification criteria to the second suction determination unit 47 of the component mounting apparatus 11B and the second inspection determination unit 1234 of each inspection apparatus 12. It is generated correspondingly (step c10).
  • the inspection algorithm IAL generated by the learning unit 1545 is stored in the algorithm storage device 14.
  • the second pickup determination section 47 reads the inspection algorithm IAL stored in the algorithm storage device 14, and extracts the first pickup image GA1 and the second pickup image GA2 based on the inspection algorithm IAL. It can be classified into the first category and the second category, and whether the processing state of the suction nozzle 2511 is good or bad can be determined.
  • the third suction determination unit 48 determines the processing state of component suction processing by the suction nozzle 2511 based on the determination results of the first suction determination unit 46 and the second suction determination unit 47, which use different determination methods. Make a final pass/fail judgment. As a result, it is possible to improve the accuracy of the final determination of whether the processing state is good or bad.
  • the second inspection determination unit 1234 reads the inspection algorithm IAL stored in the algorithm storage device 14, and divides the inspection image GI into the first category and the second category based on the inspection algorithm IAL. , and the quality of the processing state of the corresponding processing device 11 can be determined.
  • the third inspection determination section 1235 determines whether the processing state of the corresponding processing apparatus 11 is good or bad based on the determination results of the first inspection determination section 1233 and the second inspection determination section 1234, which use different determination methods. Make a final judgment. As a result, it is possible to improve the accuracy of the final determination of whether the processing state is good or bad.
  • a component mounting system includes a plurality of processing apparatuses including a component mounting apparatus that produces a component mounting board on which components are mounted, and one or more inspection apparatuses that inspect the processing state of the processing apparatuses. and a management device for managing the component mounting line.
  • At least one of the component mounting apparatus and the inspection apparatus has an imaging unit that acquires an image of the processing state of the processing device, and determines whether the processing state is good or bad by detecting a feature amount of the image. Then, the image is classified into a first category and a second category using a first judgment unit that outputs first judgment information indicating the judgment result, and an image classification method by artificial intelligence, and the image is classified into the first category.
  • a second determination unit that outputs a third determination unit that outputs third determination information indicating a final determination result of the quality of the processing state based on the first determination information and the second determination information; including.
  • the management device includes an operation unit for inputting category designation command information for designating to which of the first category and the second category the image corresponding to each of the plurality of specific devices belongs; said image corresponding to each of said plurality of specific devices, based on said third determination information corresponding to said category designation command information and said third determination information corresponding to said most downstream device among said plurality of specific devices disposed most downstream in said component mounting line; a category information generating unit that generates category information indicating which category the image belongs to, the first category or the second category; and a learning data generation unit that generates corresponding to the second determination unit in each of the above, and learns a classification criterion when the second determination unit of the plurality of specific devices classifies the image based on the learning data. and a learning unit to.
  • the third determination unit determines the processing state of the processing device based on the determination results of the first determination unit and the second determination unit that use different determination methods. Make a final judgment on the quality of the product. As a result, it is possible to improve the accuracy of the final determination of whether the processing state is good or bad.
  • learning data used when the learning unit learns the classification criteria for image classification by the second determination unit of each specific device is generated by the learning data generation unit.
  • This learning data is data in which category information is associated with images in each specific device.
  • the category information that constitutes the learning data is normally set by the operator's input of category designation command information via the operation unit. That is, normally, the operator has to perform the input operation of the category designation command information corresponding to all the images in each specific device. In this case, in order to improve the determination accuracy of the second determination unit of each specific device, the operator needs to perform an input operation of category designation command information corresponding to a huge amount of images. In this case, it becomes a heavy workload for the operator.
  • the category information generation unit when generating the category information corresponding to each image, not only includes the category designation command information, but also the third determination information corresponding to the most downstream device arranged in the component mounting line. refer.
  • the operator does not need to input the category designation command information for all the images in each specific device. This makes it possible to generate category information corresponding to each image while reducing the work load on the operator. Therefore, it is possible to improve the determination accuracy of the second determination unit of each specific device while reducing the work load on the operator.
  • the category information generation unit when the third determination information corresponding to the most downstream device is information indicating a determination result that the processing state is good, as the category information and generating information indicating that the images corresponding to the plurality of specific devices belong to the first category.
  • the category information generation unit is configured such that the third determination information corresponding to the most downstream device is information indicating a determination result that the processing state is good, and the plurality of When the third determination information corresponding to the remaining specific devices other than the most downstream device among the specific devices is information indicating a determination result that the processing state is unsatisfactory, as the category information, the plurality of Information may be generated that indicates that the images corresponding to the specific devices belong to the category designated by the category designation command information.
  • third judgment information indicating a judgment result indicating that the processing state is defective is output from an inspection device arranged downstream of the component mounting device
  • the target component of the defective processing state is regarded as a new component.
  • the operator may repair the component-mounted board by discarding the defective component and replacing it with a new component.
  • the repaired component-mounted board is sent to the downstream side even though the third determination information corresponding to the inspection device on the downstream side of the component mounting apparatus indicates the determination result that it is defective.
  • the determination result may indicate that the third determination information corresponding to the most downstream device is good.
  • This information indicates that the third determination information corresponding to the most downstream device is good, and the third determination information corresponding to the remaining specific devices other than the most downstream device is defective. It is assumed that the information is information indicating the determination result of and.
  • the category information generation unit generates category information indicating that each image belongs to the category designated by the category designation command information.
  • category information corresponding to each image can be generated based on the category designation command information designated by the operator.
  • the category information generation unit when the third determination information corresponding to the most downstream device is information indicating a determination result that the processing state is unsatisfactory, the category information generation unit generates and generating information indicating that the image corresponding to each of the plurality of specific devices belongs to a category designated by the category designation command information.
  • the category information generation unit generates category information indicating that each image belongs to the category designated by the category designation command information.
  • category information corresponding to each image can be generated based on the category designation command information designated by the operator.
  • the operator concentrates on confirming only the images corresponding to scenes where the processing state of each processing device may be defective, and determines whether the images belong to the first category or the second category. It is possible to visually determine whether or not the category belongs, and to input category designation command information according to the visual determination from the operation unit.
  • the third determination unit is configured to determine whether the processing state is good or bad, which is indicated by the first determination information, and whether the processing state is good or bad, which is indicated by the second judgment information. If they match, the third determination information indicating the matching determination result as the final determination result may be output.
  • the third determination unit is configured to determine whether the processing state is good or bad, which is indicated by the first determination information, and whether the processing state is good or bad, which is indicated by the second judgment information. If they do not match, the third determination information indicating the result of the final determination that the processing state is defective may be output.
  • the third determination unit outputs the third determination information indicating the final determination result that the processing state is unsatisfactory. As a result, it is possible to more strictly prevent deterioration in the quality of the component-mounted board due to the processing state of the processing apparatus being unsatisfactory.
  • the third determination unit is configured to determine whether the processing state is good or bad, which is indicated by the first determination information, and whether the processing state is good or bad, which is indicated by the second judgment information. If they do not match, the third determination information may be output that indicates a final determination result that the processing state is good.
  • the third determination unit when the determination results indicated by the first determination information and the second determination information do not match, the third determination unit outputs the third determination information indicating the result of the final determination that the processing state of the processing device is good. to output In this case, it is possible to prevent the determination criteria for the final determination by the third determination section from being set to excessively strict criteria.

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  • General Physics & Mathematics (AREA)
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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
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PCT/JP2021/032842 2021-09-07 2021-09-07 部品実装システム WO2023037410A1 (ja)

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JP2006216589A (ja) * 2005-02-01 2006-08-17 Omron Corp プリント基板の品質管理システム
WO2018087932A1 (ja) * 2016-11-14 2018-05-17 株式会社Ｆｕｊｉ 保存画像の再分類システム及び再分類方法
WO2019155593A1 (ja) * 2018-02-09 2019-08-15 株式会社Ｆｕｊｉ 部品画像認識用学習済みモデル作成システム及び部品画像認識用学習済みモデル作成方法

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JPH1022693A (ja) * 1996-07-04 1998-01-23 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP4541172B2 (ja) 2005-01-28 2010-09-08 ヤマハ発動機株式会社 部品実装ラインにおける情報管理システム
CN106405369A (zh) * 2015-07-31 2017-02-15 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置

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Publication number Priority date Publication date Assignee Title
JP2006216589A (ja) * 2005-02-01 2006-08-17 Omron Corp プリント基板の品質管理システム
WO2018087932A1 (ja) * 2016-11-14 2018-05-17 株式会社Ｆｕｊｉ 保存画像の再分類システム及び再分類方法
WO2019155593A1 (ja) * 2018-02-09 2019-08-15 株式会社Ｆｕｊｉ 部品画像認識用学習済みモデル作成システム及び部品画像認識用学習済みモデル作成方法

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