JPWO2023037410A1 - - Google Patents

Info

Publication number
JPWO2023037410A1
JPWO2023037410A1 JP2023546594A JP2023546594A JPWO2023037410A1 JP WO2023037410 A1 JPWO2023037410 A1 JP WO2023037410A1 JP 2023546594 A JP2023546594 A JP 2023546594A JP 2023546594 A JP2023546594 A JP 2023546594A JP WO2023037410 A1 JPWO2023037410 A1 JP WO2023037410A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023546594A
Other languages
Japanese (ja)
Other versions
JP7542159B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023037410A1 publication Critical patent/JPWO2023037410A1/ja
Application granted granted Critical
Publication of JP7542159B2 publication Critical patent/JP7542159B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2023546594A 2021-09-07 2021-09-07 部品実装システム Active JP7542159B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/032842 WO2023037410A1 (ja) 2021-09-07 2021-09-07 部品実装システム

Publications (2)

Publication Number Publication Date
JPWO2023037410A1 true JPWO2023037410A1 (ko) 2023-03-16
JP7542159B2 JP7542159B2 (ja) 2024-08-29

Family

ID=82594513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023546594A Active JP7542159B2 (ja) 2021-09-07 2021-09-07 部品実装システム

Country Status (6)

Country Link
JP (1) JP7542159B2 (ko)
KR (1) KR20240039039A (ko)
CN (1) CN117882505A (ko)
DE (1) DE112021008199T5 (ko)
TW (1) TWI765839B (ko)
WO (1) WO2023037410A1 (ko)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022693A (ja) * 1996-07-04 1998-01-23 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP4541172B2 (ja) 2005-01-28 2010-09-08 ヤマハ発動機株式会社 部品実装ラインにおける情報管理システム
JP3818308B2 (ja) 2005-02-01 2006-09-06 オムロン株式会社 プリント基板の品質管理システム
CN106405369A (zh) * 2015-07-31 2017-02-15 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
CN109923955B (zh) 2016-11-14 2020-10-30 株式会社富士 保存图像的再分类系统及再分类方法
US11386546B2 (en) 2018-02-09 2022-07-12 Fuji Corporation System for creating learned model for component image recognition, and method for creating learned model for component image recognition

Also Published As

Publication number Publication date
DE112021008199T5 (de) 2024-07-11
JP7542159B2 (ja) 2024-08-29
WO2023037410A1 (ja) 2023-03-16
CN117882505A (zh) 2024-04-12
TW202312858A (zh) 2023-03-16
KR20240039039A (ko) 2024-03-26
TWI765839B (zh) 2022-05-21

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