CN117794048A

CN117794048A - 覆金属层叠板、电路基板、电子器件及电子设备

覆金属层叠板、电路基板、电子器件及电子设备 Download PDF

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Publication number: CN117794048A
Authority: CN; China
Prior art keywords: layer; insulating resin; metal; thermoplastic polyimide; diamine
Prior art date: 2022-09-29
Legal status : Pending

Application number

CN202311199034.3A

Other languages

English (en)

Chinese (zh)

Inventor

须藤芳树

川上翔平

Current Assignee

Nippon Steel Chemical and Materials Co Ltd

Original Assignee

Nippon Steel and Sumikin Chemical Co Ltd

Priority date

2022-09-29

Filing date

2023-09-18

Publication date

2024-03-29

2023-09-18 Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd

2024-03-29 Publication of CN117794048A publication Critical patent/CN117794048A/zh

Status Pending legal-status Critical Current

Links

239000010410 layer Substances 0.000 claims abstract description 315
229920005989 resin Polymers 0.000 claims abstract description 226
239000011347 resin Substances 0.000 claims abstract description 226
229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 199
239000012790 adhesive layer Substances 0.000 claims abstract description 104
229910052751 metal Inorganic materials 0.000 claims abstract description 67
239000002184 metal Substances 0.000 claims abstract description 67
229920001971 elastomer Polymers 0.000 claims abstract description 44
239000000806 elastomer Substances 0.000 claims abstract description 43
239000004793 Polystyrene Substances 0.000 claims abstract description 38
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238000003860 storage Methods 0.000 claims description 28
239000000758 substrate Substances 0.000 claims description 17
238000012545 processing Methods 0.000 abstract description 17
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239000004642 Polyimide Substances 0.000 description 69
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239000000243 solution Substances 0.000 description 42
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CN202311199034.3A 2022-09-29 2023-09-18 覆金属层叠板、电路基板、电子器件及电子设备 Pending CN117794048A (zh)