CN1174046C - 阻燃树脂组合物、以及使用该组合物的预浸材料和层压品 - Google Patents
阻燃树脂组合物、以及使用该组合物的预浸材料和层压品 Download PDFInfo
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Abstract
本发明提供了一种无需使用任何含卤阻燃剂就具有优异阻燃性的阻燃树脂组合物、以及使用该树脂组合物的预浸材料和层压品。更具体地说,本发明提供了一种阻燃树脂组合物,包含以下基本组分:(A)环氧树脂、(B)固化剂、和(C)包含氧化膦化合物至少作为其一部分的磷化合物;一种通过将该阻燃树脂组合物浸渍在纤维基料中而得到的预浸材料;以及一种通过将该预浸材料的单个片材或一叠两个或多个片材进行热压而得到的层压品。
Description
技术领域
本发明涉及一种没有加入任何含卤阻燃剂就具有优异阻燃性的树脂组合物、以及使用该树脂组合物的预浸材料和层压品。
背景技术
以环氧树脂为代表的热固性树脂由于其卓越性能而普遍用于电气和电子器件,而且在许多情况下,这些树脂具有阻燃性以保证在使用时的防火安全。通常,这些树脂通过加入含卤化合物而阻燃,如溴化环氧树脂。尽管这些含卤化合物阻燃性高,但芳族溴化合物的问题在于,它们不仅在热解过程中放出腐蚀性溴和溴化氢,而且如果在氧气存在下分解,可能形成非常毒性的聚溴二苯并呋喃和聚二溴苯并恶嗪(polydibromobenzoxine)。此外,更大的问题来自含溴废弃物的处理。为此,目前已认真研究使用磷和氮化合物以及无机填料作为阻燃剂以替代常规的含溴阻燃剂。
如上所述,树脂的阻燃作用可通过使用磷化合物、氮化合物和无机填料而实现。这基于以下观点:氮和磷化合物可加速树脂的碳化作用以防其燃烧,而无机填料可通过其添加来帮助降低可燃树脂的量,使得树脂较不可燃。无机填料如金属氢氧化物在燃烧至较低温度时可释放水并因此防止燃烧。正如JP-A-10-19578和JP-A-10-166501所公开,本领域已知通过加入磷化合物和氮化合物以及无机填料替代使用卤素化合物而赋予树脂以阻燃性,而且利用这些树脂组合物的预浸材料和层压品已实际使用。
电路板生产工艺包括各种化学液体处理步骤。例如在去脏步骤中,需要氢氧化钠之类的碱性化合物,而使用氧化化合物对致黑处理是必要的。常用作阻燃剂的磷化合物如磷酸酯的问题在于,它们容易与上述处理化合物反应而造成困难。
作为可与环氧树脂和环氧树脂固化剂反应的磷化合物,除了磷酸酯,已知9,10-二氢-9-氧杂-10-磷菲-10-氧化物(由Sanko ChemicalCo.,Ltd.生产并以商品名HCA售卖)。(参见,例如,JP-A-11-1244489和JP-A-2000-7898)。HCA难以水解且耐化学性优异,但与环氧树脂的反应性高,因此在单独使用HCA作为磷化合物时,其含量必须增加且在具有环氧树脂的预固化清漆的状态下就进行反应,这样最终产品如层压品可能不具备所需的性能,如耐焊热性。
发明内容
本发明在研究解决上述问题的过程中产生,因此它提供了一种通过使用具有低水解倾向的氧化膦化合物作为含磷阻燃剂而具有优异耐化学性和阻燃性的树脂组合物。本发明还可预见提供使用这种树脂组合物的预浸材料、以及包含这些预浸材料的阻燃层压品。
具体地说,本发明提供了一种阻燃树脂组合物,包含以下基本组分:(A)环氧树脂、(B)固化剂、和(C)包含氧化膦化合物至少作为其一部分的磷化合物。本发明还提供了一种通过在基料中浸渍该阻燃树脂组合物而得到的预浸材料、以及一种通过热压该预浸材料的单个片材或两个或多个片材的片材堆而得到的阻燃层压品或包铜阻燃层压品。
如上所述,用作含磷阻燃剂的添加型磷酸酯,如磷酸三苯酯和磷酸甲酚基二苯基酯容易水解并往往在化学溶液中洗脱。因此,包含这种化合物作为阻燃剂的树脂组合物在用于层压品时存在问题。
氧化膦化合物由于具有P-C键而较不易水解。因此,不同于具有P-O键的磷酸酯,这些化合物具有卓越的耐化学性。此外,由于磷含量高,它们仅少量添加就可产生令人满意的阻燃性。
一般来说,磷化合物是吸湿性的,因此加入太多磷化合物会对固化树脂组合物的耐湿性和其它性能产生不利影响。相反,氧化膦化合物的水解倾向有限且吸湿性低。还可注意到,通过使用线型酚醛-环氧树脂和酚醛清漆树脂作为固化剂,添加相对常规技术所需量较少量的磷化合物就可产生令人满意的阻燃性,因为这些树脂的苯环含量高并因此具有高耐热性和阻燃性。
因此,按照本发明的阻燃树脂组合物的特征在于,通过使用环氧树脂和具有高耐热性的固化剂并使用氧化膦化合物作为阻燃剂,可使该组合物具有令人满意的阻燃性和耐化学性而无需使用卤素化合物。
具体实施方式
可用于本发明的环氧树脂(A)的例子包括双酚A环氧树脂、双酚F环氧树脂、苯酚线型酚醛-环氧树脂、甲酚线型酚醛-环氧树脂、和双酚A线型酚醛-环氧树脂,但并不局限于这些环氧树脂。还可同时使用两种或多种不同的环氧树脂。
考虑到耐热性,优选使用具有高苯环含量和高耐热性的线型酚醛-环氧树脂,尤其是苯酚线型酚醛-环氧树脂和甲酚线型酚醛-环氧树脂。由以下结构式(1)表示的苯酚芳烷基环氧树脂、由以下结构式(2)表示的萘芳烷基环氧树脂、和由以下结构式(3)表示的联苯改性环氧树脂也是优选的,因为这些树脂具有高芳环含量且极性基团的比率低,因此耐热性高并能够降低该组合物的吸水性:
其中n是自然数,
其中n是自然数,和
其中n是自然数。
在本发明中,以上类型的环氧树脂的用量优选为整个环氧树脂的至少50%重量,这样可理想地提高耐热性和阻燃性。
作为用作本发明组分(B)的固化剂,可以使用线型酚醛树脂、胺化合物、酸酐和类似物。线型酚醛树脂是优选的,因为它们具有高耐热性并能够降低磷化合物的加入量。通常使用苯酚线型酚醛树脂和苯酚芳烷基树脂。优选使用由以下结构式(4)表示的三嗪改性线型酚醛树脂,因为阻燃性可通过存在为含氮组分的三嗪环而进一步提高:
其中R为NH2、烷基或苯基;且m和n分别为自然数。
考虑到磷化合物包含在该组合物,氮含量优选为每100总重量份的环氧树脂、固化剂和磷化合物,2.5-4%重量。如果氮含量低于2.5%重量,可能不能实现所需的阻燃性,而且如果超过4.0%重量,所得化合物往往具有太高的吸湿性。
由以下结构式(5)表示的苯酚芳烷基树脂、由以下结构式(6)表示的萘芳烷基树脂、由以下结构式(7)表示的联苯改性线型酚醛树脂、和由以下结构式(8)表示的甲苯-、二甲苯-或均三苯改性线型酚醛树脂也优选用于本发明,因为这些树脂具有高含量的芳环和低比率的极性基团,因此耐热性高并具有导电性以降低该组合物的吸水性:
其中n是自然数,
其中n是自然数,
其中n是自然数,和
其中m和n分别为自然数,且1是1、2或3。
如果使用线型酚醛树脂作为固化剂(B),优选结合使用(a)结构式(4)的三嗪改性线型酚醛树脂、和(b)选自结构式(5)苯酚芳烷基树脂、结构式(6)萘芳烷基树脂、结构式(7)联苯改性线型酚醛树脂、和结构式(8)甲苯-、二甲苯-或均三苯改性线型酚醛树脂的至少一种物质,因为这种线型酚醛树脂混合物具有高的耐热性和优异的阻燃性。考虑到以上性能,优选的(a)/(b)比率为60/40至20/80。
如果使用线型酚醛树脂作为固化剂,根据当量比率(苯酚羟基/环氧基团)的线型酚醛树脂与环氧树脂的比率优选为0.8-1.2。如果该比率在以上确定的范围之外,游离的环氧基团或苯酚羟基就留在组合物中,从而对其耐热性和吸水性产生不利影响。
在本发明中,氧化膦化合物(C)用作起阻燃剂作用的磷化合物。氧化膦化合物难以水解且耐化学性高。这种氧化膦化合物的例子通常为三苯基氧化膦和三甲酚基氧化膦。将如同所述氧化膦化合物难以水解并具有高耐化学性的9,10-二氢-9-氧杂-10-磷菲-10-氧化物(HCA)与所述氧化膦化合物结合使用是本发明的一个优选实施方案。
在本发明中,由磷化合物如氧化膦化合物(C)提供的磷含量优选为每100总重量份的环氧树脂、固化剂和磷化合物,0.5-3%重量。如果磷含量低于0.5%重量,可能不能实现所需的阻燃性,而且如果超过3.0%重量,所得组合物往往具有太高的吸湿性。
本发明的阻燃树脂组合物包含作为基本组分的上述的环氧树脂、固化剂和用作阻燃剂的磷化合物,但可以加入其它种类的环氧树脂和固化剂、或其它种类的树脂和固化剂、固化促进剂、偶联剂或其它必需组分,只要不违背本发明的目的。但在本发明中,优选不加入磷酸酯,否则会降低树脂和层压品的固有性能,尤其是耐化学性。按照本发明,尽管组合物中不含任何磷酸酯,可以实现优异的阻燃性。
本发明的阻燃树脂组合物有各种应用方式。如果将该组合物在纤维基料中浸渍,其使用形式通常为通过将组合物溶解在溶剂中而得到的清漆。作为溶剂,通常使用非常能够溶解该组合物的溶剂,但只要不造成不利影响,并不排除使用不良溶剂。
通过将本发明阻燃树脂组合物溶解在溶剂中而得到的清漆可施用到或浸渍在基料如纺织玻璃织物、无纺玻璃织物、或由玻璃纤维之外的其它材料制成的纺织或无纺织物,然后在80-200℃下干燥得到预浸材料。这种预浸材料可热压成层压品或包铜层压品。本发明的阻燃树脂组合物是一种无需包含任何卤素化合物就具有突出阻燃性的热固性树脂组合物,因此尤其适用作印刷玻璃板所用预浸材料和层压品的基础材料。
以下通过参考实施例进一步详细描述本发明。
实施例1
将100重量份苯酚线型酚醛-环氧树脂(Epiclon N-770,由DainipponInk and Chemicals,Inc.制造)、49重量份苯酚芳烷基树脂(MilexXLC-LL,由Mitsui Chemical,Co.,Ltd.制造)、31重量份三嗪改性苯酚线型酚醛树脂(LA-7054,由Dainippon Ink and Chemicals,Inc.制造)、和40重量份三苯基氧化膦溶解在甲基溶纤剂中,制成一种非挥发份浓度60%重量的清漆。每100总重量份的环氧树脂、固化剂和磷化合物,该清漆的磷含量为2.0%重量且氮含量为1.7%重量。
将该清漆以80重量份固体物质的量浸渍在100重量份的纺织玻璃织物(0.18毫米厚,由Nitto Boseki KK生产),然后在150℃干燥炉中干燥5分钟,得到树脂含量44.4%重量的预浸材料。
将6片该预浸材料相互堆放,并将35μm厚的电解铜箔放在该片材堆的上方和底部,然后在40kgf/cm2和190℃的条件下热压塑120分钟,得到1.2毫米厚的双面包铜层压品。
实施例2-6和对比例1-4
将具有表1(实施例)和表2(对比例)所示配方的树脂组合物溶解在甲基溶纤剂中,制成一种非挥发份浓度60%重量的清漆。然后重复实施例1的相同步骤,制成双面包铜层压品。
测定所得包铜层压品的阻燃性、耐焊热性、包铜剥离强度和耐化学性。评估结果在表1和2中给出。按照以下所述,确定以上性能。
1.阻燃性
按照UL-94标准,通过垂直火焰法来评估。
2.耐焊热性
按照JIS C-6481来测定。将已通过2小时煮沸而进行吸湿处理的每个测试片浸渍在260℃焊剂浴中120秒,然后检查外观异常。
3.铜箔剥离强度
按照JIS C-6481来测定。
4.耐化学性
测定在80℃的20%重量氢氧化钠水溶液中浸渍10分钟之后的百分重量损失(a)、以及在70℃的20%重量过硫酸钾水溶液中浸渍96小时之后的百分重量损失(b)。
表1
项目 实施例1 实施例2 实施例3 实施例4 实施例5 实施例6 |
苯酚线型酚醛-环氧树脂1) 100甲酚线型酚醛-环氧树脂2) 100 100萘芳烷基环氧树脂3) 100联苯改性环氧树脂4) 100 100配方 苯酚芳烷基树脂5) 49 52 39 38(重量份) 三嗪改性苯酚线型酚醛-环氧树脂6) 31 15 23 26苯酚线型酚醛树脂7) 38二甲苯改性线型酚醛树脂8) 71HCA 9) 17 11三苯基氧化膦 40 38 35 30 15 20 |
磷(%重量) 2.0 2.1 2.0 2.0 2.0 1.9氮(%重量) 1.7 0.9 1.4 0.0 0.0 1.6 |
阻燃性(UL94) V-0 V-0 V-0 V-0 V-0 V-0耐焊热性 无异常 无异常 无异常 无异常 无异常 无异常性能 铜箔剥离强度(kN/m) 1.5 1.4 1.5 1.3 1.4 1.4耐化学性(百分重量损失)(a)氢氧化钠 0.15 0.14 0.13 0.13 0.13 0.15(b)过硫酸钾 0.05 0.05 0.05 0.04 0.03 0.04 |
表2
项目 对比例1 对比例2 对比例3 对比例4 |
苯酚线型酚醛-环氧树脂1) 100甲酚线型酚醛-环氧树脂2) 100 100 100配方 苯酚芳烷基树脂5) 32 32 40 38(重量份) 三嗪改性苯酚线型酚醛-环氧树脂6) 35 37 29 26磷酸三苯酯 40 20HCA9) 11 |
磷(%重量) 0.0 0.0 1.8 2.0氮(%重量) 2.5 2.6 1.7 1.6 |
阻燃性(UL94) HB HB V-0 V-0耐焊热性 异常 异常 异常 异常性能 铜箔剥离强度(kN/m) 1.5 1.4 1.4 1.3耐化学性(百分重量损失)(a)氢氧化钠 0.15 0.14 0.98 0.85(b)过硫酸钾 0.02 0.05 0.35 0.25 |
表1和2的附注:
1)Epiclon N-770,由Dainippon Ink and Chemicals,Inc.制造,环氧当量:190
2)Epiclon N-690,由Dainippon Ink and Chemicals,Inc.制造,环氧当量:210
3)ESN-155,由Shin Nittetsu Chemical Co.,Ltd.制造,环氧当量:275
4)NC-3000P,由Nippon Kayaku KK制造,环氧当量:275
5)Milex XLC-LL,由Mitsui Chemical,Co.,Ltd.制造,环氧当量:175
6)LA-7054,由Dainippon Ink and Chemicals,Inc.制造,羟基当量:125;氮含量:12%重量
7)PR-51470,由Sumitomo Durez Co.,Ltd.制造,羟基当量:105
8)R-54537,由Sumitomo Durez Co.,Ltd.制造,羟基当量:190
9)9,10-二氢-9-氧杂-10-磷菲-10-氧化物
从表1和2可以看出,实施例中得到的任何包铜层压品都具有优异的阻燃性、耐焊热性和耐化学性。
如上所述,按照本发明的阻燃树脂组合物无需包含任何卤素化合物就具有卓越的阻燃性,而且优于其它性能如耐热性。因此,本发明提供了一种可用作预期将来会增加需求的无卤材料的新型热固性树脂组合物。由以上树脂组合物制成的预浸材料和层压品、以及包含这种层压品的印刷电路板不仅阻燃性而且其它性能如耐焊热性也性能优异。
Claims (12)
1.一种阻燃树脂组合物,包含以下基本组分:(A)线型酚醛环氧树脂、(B)固化剂、和(C)氧化膦化合物,和9,10-二氢-9-氧杂-10-磷菲-10-氧化物,其中所述氧化膦化合物是三苯基氧化膦或三甲酚基氧化膦。
2.根据权利要求1的阻燃树脂组合物,其中所述环氧树脂(A)的一部分或全部是苯酚线型酚醛-环氧树脂、甲酚线型酚醛-环氧树脂、或苯酚线型酚醛-环氧树脂与甲酚线型酚醛-环氧树脂的混合物。
4.根据权利要求1的阻燃树脂组合物,其中所述固化剂(B)的一部分或全部是线型酚醛树脂。
7.根据权利要求1的阻燃树脂组合物,其中将结构式(4)三嗪改性线型酚醛树脂、与选自结构式(5)苯酚芳烷基树脂、结构式(6)萘芳烷基树脂、结构式(7)联苯改性线型酚醛树脂、和结构式(8)甲苯-、二甲苯-或均三甲苯改性线型酚醛树脂中的至少一种树脂结合用作固化剂。
8.根据权利要求1的阻燃树脂组合物,其中所述氧化膦化合物的用量是每100重量份环氧树脂为不超过3%重量。
9.根据权利要求1的阻燃树脂组合物,其中所述氧化膦化合物的用量是每100重量份环氧树脂为0.5-3%重量。
10.一种预浸材料,通过将权利要求1所述的阻燃树脂组合物浸渍在纤维基料中而得到。
11.一种层压品,其特征在于将权利要求10所述的单片预浸材料或一叠两片或多片预浸材料进行热压。
12.一种包铜层压品,其特征在于将权利要求10所述的单片预浸材料或一叠两片或多片预浸材料进行热压。
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Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7247876B2 (en) | 2000-06-30 | 2007-07-24 | Intel Corporation | Three dimensional programmable device and method for fabricating the same |
CN100432081C (zh) | 2001-02-15 | 2008-11-12 | 帕布服务公司 | 双(羟苯基)氧化膦、缩水甘油醚和环氧组合物及由其衍生的复合材料和层压材料 |
US6887950B2 (en) | 2001-02-15 | 2005-05-03 | Pabu Services, Inc. | Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
JP4396274B2 (ja) | 2001-11-07 | 2010-01-13 | 東レ株式会社 | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料の製法および繊維強化複合材料 |
ATE494329T1 (de) | 2002-11-08 | 2011-01-15 | Akzo Nobel Nv | Vernetzungsverfahren für eine epoxidharzzusammensetzung enthaltend reaktives phosphonat |
WO2006006592A1 (ja) * | 2004-07-13 | 2006-01-19 | Hitachi Chemical Co., Ltd. | 封止用エポキシ樹脂成形材料及び電子部品装置 |
WO2006006593A1 (ja) * | 2004-07-13 | 2006-01-19 | Hitachi Chemical Co., Ltd. | 封止用エポキシ樹脂成形材料及び電子部品装置 |
US8129456B2 (en) | 2004-09-28 | 2012-03-06 | Isola Usa Corp. | Flame retardant compositions with a phosphorated compound |
US7411508B2 (en) | 2005-06-17 | 2008-08-12 | Perkinemer Las, Inc. | Methods and systems for locating and identifying labware using radio-frequency identification tags |
JP5034181B2 (ja) * | 2005-07-22 | 2012-09-26 | 住友ベークライト株式会社 | プリプレグおよび積層板 |
CN100447175C (zh) * | 2006-02-10 | 2008-12-31 | 康富春 | 一种环氧树脂及其制备方法和应用 |
JP5334373B2 (ja) * | 2007-03-05 | 2013-11-06 | 新日鉄住金化学株式会社 | 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物 |
TWI381017B (zh) * | 2008-06-09 | 2013-01-01 | Taiwan Union Technology Corp | Composition and Manufacturing Method of Halogen - free Printed Circuit Board with Low Dielectric Loss |
WO2011009876A1 (en) * | 2009-07-24 | 2011-01-27 | Basf Se | Derivatives of diphosphines as flame retardants in aromatic and/or heteroaromatic epoxy resins |
US20110065838A1 (en) | 2009-09-11 | 2011-03-17 | Chemtura Corporation | Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins |
US20110065870A1 (en) | 2009-09-11 | 2011-03-17 | Chemtura Corporation | Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins |
JP5935690B2 (ja) * | 2010-04-08 | 2016-06-15 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグおよび積層板 |
KR101228734B1 (ko) * | 2010-11-05 | 2013-02-01 | 삼성전기주식회사 | 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판 |
US9145488B2 (en) | 2011-05-19 | 2015-09-29 | Chemtura Corporation | Aluminum phosphorus acid salts as epoxy resin cure inhibitors |
US9534108B2 (en) | 2015-03-13 | 2017-01-03 | Chemtura Corporation | Flame retardant epoxy resins comprising phosphorus containing flame retardants |
KR102146995B1 (ko) * | 2017-12-29 | 2020-08-21 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
JP7074278B2 (ja) | 2018-04-10 | 2022-05-24 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物、プリプレグおよび金属箔積層板 |
CN112409572A (zh) * | 2019-08-22 | 2021-02-26 | 苏州巨峰新材料科技有限公司 | 含磷阻燃低热膨胀系数环氧树脂及其制备方法和所涉及的中间产物以及应用 |
CN112266572B (zh) * | 2020-10-29 | 2023-07-14 | 苏州生益科技有限公司 | 树脂组合物、半固化片、层压板、电路基板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61127748A (ja) * | 1984-11-27 | 1986-06-16 | Sumitomo Bakelite Co Ltd | 低放射線性エポキシ樹脂組成物 |
JPH0749465B2 (ja) * | 1987-01-21 | 1995-05-31 | 株式会社東芝 | 樹脂封止型半導体装置 |
JP2757938B2 (ja) * | 1987-09-14 | 1998-05-25 | 日東電工株式会社 | 半導体装置 |
JP2654093B2 (ja) | 1988-06-09 | 1997-09-17 | 株式会社東芝 | 樹脂封止型半導体装置 |
US5084546A (en) | 1990-12-12 | 1992-01-28 | American Cyanamid Company | Fire retardant epoxy resin compositions containing methylol substituted phosphine oxides |
WO1996037532A1 (de) * | 1995-05-24 | 1996-11-28 | Siemens Aktiengesellschaft | Epoxidharzformmassen mit halogenfreiem flammschutz |
JP2931262B2 (ja) | 1996-12-13 | 1999-08-09 | 東芝ケミカル株式会社 | ガラスエポキシ銅張積層板の製造方法 |
JPH10195178A (ja) | 1997-01-06 | 1998-07-28 | Toshiba Chem Corp | 難燃性エポキシ樹脂組成物、プリプレグ、積層板、銅張積層板及びプリント配線板 |
JP3611435B2 (ja) | 1997-10-22 | 2005-01-19 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
US6297332B1 (en) | 1998-04-28 | 2001-10-02 | Mitsui Chemicals, Inc. | Epoxy-resin composition and use thereof |
US6310147B1 (en) | 1998-05-21 | 2001-10-30 | Mitsui Chemicals, Inc. | Epoxy-resin composition and use thereof |
JP2000007898A (ja) * | 1998-06-25 | 2000-01-11 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
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