CN1171296C - 不满填充受控折叠芯片连接(c4)集成电路封装的生产流水线 - Google Patents

不满填充受控折叠芯片连接(c4)集成电路封装的生产流水线 Download PDF

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Publication number
CN1171296C
CN1171296C CNB008045658A CN00804565A CN1171296C CN 1171296 C CN1171296 C CN 1171296C CN B008045658 A CNB008045658 A CN B008045658A CN 00804565 A CN00804565 A CN 00804565A CN 1171296 C CN1171296 C CN 1171296C
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CN
China
Prior art keywords
substrate
discontented
packing material
integrated circuit
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008045658A
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English (en)
Chinese (zh)
Other versions
CN1344424A (zh
Inventor
D
D·库克
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S·拉马林加姆
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Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of CN1344424A publication Critical patent/CN1344424A/zh
Application granted granted Critical
Publication of CN1171296C publication Critical patent/CN1171296C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CNB008045658A 1999-03-03 2000-02-08 不满填充受控折叠芯片连接(c4)集成电路封装的生产流水线 Expired - Fee Related CN1171296C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/262,132 US6528345B1 (en) 1999-03-03 1999-03-03 Process line for underfilling a controlled collapse
US09/262,132 1999-03-03

Publications (2)

Publication Number Publication Date
CN1344424A CN1344424A (zh) 2002-04-10
CN1171296C true CN1171296C (zh) 2004-10-13

Family

ID=22996282

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008045658A Expired - Fee Related CN1171296C (zh) 1999-03-03 2000-02-08 不满填充受控折叠芯片连接(c4)集成电路封装的生产流水线

Country Status (7)

Country Link
US (1) US6528345B1 (https=)
JP (1) JP2002538624A (https=)
KR (1) KR100438991B1 (https=)
CN (1) CN1171296C (https=)
AU (1) AU2986100A (https=)
MX (1) MXPA01008581A (https=)
WO (1) WO2000052751A1 (https=)

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US6833629B2 (en) * 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US7238550B2 (en) * 2002-02-26 2007-07-03 Tandon Group Ltd. Methods and apparatus for fabricating Chip-on-Board modules
US6798806B1 (en) * 2002-09-03 2004-09-28 Finisar Corporation Hybrid mirror VCSELs
US7026376B2 (en) * 2003-06-30 2006-04-11 Intel Corporation Fluxing agent for underfill materials
US7242097B2 (en) * 2003-06-30 2007-07-10 Intel Corporation Electromigration barrier layers for solder joints
US20050121310A1 (en) * 2003-12-03 2005-06-09 Intel Corporation Method and substrate to control flow of underfill
JP5262045B2 (ja) * 2007-09-27 2013-08-14 富士通セミコンダクター株式会社 電極の形成方法及び半導体装置の製造方法
US7915732B2 (en) * 2008-06-30 2011-03-29 International Business Mahines Corporation Production of integrated circuit chip packages prohibiting formation of micro solder balls
JP7594195B2 (ja) 2022-07-13 2024-12-04 日亜化学工業株式会社 発光装置の製造方法及び発光装置

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JPH08153830A (ja) 1994-11-29 1996-06-11 Toshiba Corp 半導体装置およびその製造方法
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Also Published As

Publication number Publication date
JP2002538624A (ja) 2002-11-12
WO2000052751A1 (en) 2000-09-08
MXPA01008581A (es) 2002-04-24
KR100438991B1 (ko) 2004-07-02
US6528345B1 (en) 2003-03-04
KR20020005612A (ko) 2002-01-17
AU2986100A (en) 2000-09-21
CN1344424A (zh) 2002-04-10

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Granted publication date: 20041013

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