CN117120553B - 固化性树脂组合物 - Google Patents

固化性树脂组合物

Info

Publication number
CN117120553B
CN117120553B CN202280025075.8A CN202280025075A CN117120553B CN 117120553 B CN117120553 B CN 117120553B CN 202280025075 A CN202280025075 A CN 202280025075A CN 117120553 B CN117120553 B CN 117120553B
Authority
CN
China
Prior art keywords
resin composition
curable resin
epoxy resin
thermosetting resin
diluent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202280025075.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN117120553A (zh
Inventor
野口智崇
高桥千夏
志村优之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of CN117120553A publication Critical patent/CN117120553A/zh
Application granted granted Critical
Publication of CN117120553B publication Critical patent/CN117120553B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202280025075.8A 2021-03-26 2022-03-23 固化性树脂组合物 Active CN117120553B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021054190 2021-03-26
JP2021-054190 2021-03-26
PCT/JP2022/013718 WO2022202939A1 (ja) 2021-03-26 2022-03-23 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
CN117120553A CN117120553A (zh) 2023-11-24
CN117120553B true CN117120553B (zh) 2026-02-17

Family

ID=83395734

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280025075.8A Active CN117120553B (zh) 2021-03-26 2022-03-23 固化性树脂组合物

Country Status (5)

Country Link
JP (1) JP7295506B2 (https=)
KR (1) KR20230156726A (https=)
CN (1) CN117120553B (https=)
TW (1) TW202239616A (https=)
WO (1) WO2022202939A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024075717A1 (ja) * 2022-10-07 2024-04-11 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP2024125720A (ja) * 2023-03-06 2024-09-19 味の素株式会社 樹脂組成物
JP7758002B2 (ja) * 2023-03-06 2025-10-22 味の素株式会社 樹脂組成物
TW202504971A (zh) * 2023-07-21 2025-02-01 日商拓自達電線股份有限公司 熱硬化性樹脂組成物、硬化物及印刷配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020105704A1 (ja) * 2018-11-22 2020-05-28 味の素株式会社 磁性ペースト
CN112424889A (zh) * 2018-07-25 2021-02-26 味之素株式会社 磁性糊料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203463A (ja) 2000-01-21 2001-07-27 Taiyo Ink Mfg Ltd 層間接続用導電性ペースト、及びそれを用いた多層プリント配線板とその製造方法
WO2005029928A2 (en) 2003-09-19 2005-03-31 Viasystems Group, Inc. Closed loop backdrilling system
CN103666364B (zh) * 2012-09-13 2015-09-16 东睦新材料集团股份有限公司 金属软磁复合材料用有机绝缘粘结剂及制备金属软磁复合材料方法
JP2017017175A (ja) 2015-07-01 2017-01-19 日本電気株式会社 多層配線基板、高周波回路、通信装置、及び多層配線基板の製造方法
CN106024359B (zh) * 2016-06-29 2018-07-03 深圳顺络电子股份有限公司 一种模压电感的制作方法
CN111937501A (zh) * 2018-03-30 2020-11-13 太阳油墨制造株式会社 固化性树脂组合物、其固化物和印刷电路板
KR102617535B1 (ko) * 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트
TWI850353B (zh) * 2019-03-20 2024-08-01 日商味之素股份有限公司 樹脂組成物
JP2021161211A (ja) * 2020-03-31 2021-10-11 太陽インキ製造株式会社 液状熱硬化性樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112424889A (zh) * 2018-07-25 2021-02-26 味之素株式会社 磁性糊料
WO2020105704A1 (ja) * 2018-11-22 2020-05-28 味の素株式会社 磁性ペースト

Also Published As

Publication number Publication date
KR20230156726A (ko) 2023-11-14
JPWO2022202939A1 (https=) 2022-09-29
WO2022202939A1 (ja) 2022-09-29
CN117120553A (zh) 2023-11-24
TW202239616A (zh) 2022-10-16
JP7295506B2 (ja) 2023-06-21

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