KR20230156726A - 경화성 수지 조성물 - Google Patents

경화성 수지 조성물 Download PDF

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Publication number
KR20230156726A
KR20230156726A KR1020237032568A KR20237032568A KR20230156726A KR 20230156726 A KR20230156726 A KR 20230156726A KR 1020237032568 A KR1020237032568 A KR 1020237032568A KR 20237032568 A KR20237032568 A KR 20237032568A KR 20230156726 A KR20230156726 A KR 20230156726A
Authority
KR
South Korea
Prior art keywords
resin composition
curable resin
thermosetting resin
weight loss
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237032568A
Other languages
English (en)
Korean (ko)
Inventor
토모타카 노구치
치카 타카하시
마사유키 시무라
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20230156726A publication Critical patent/KR20230156726A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020237032568A 2021-03-26 2022-03-23 경화성 수지 조성물 Pending KR20230156726A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-054190 2021-03-26
JP2021054190 2021-03-26
PCT/JP2022/013718 WO2022202939A1 (ja) 2021-03-26 2022-03-23 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
KR20230156726A true KR20230156726A (ko) 2023-11-14

Family

ID=83395734

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237032568A Pending KR20230156726A (ko) 2021-03-26 2022-03-23 경화성 수지 조성물

Country Status (5)

Country Link
JP (1) JP7295506B2 (https=)
KR (1) KR20230156726A (https=)
CN (1) CN117120553B (https=)
TW (1) TW202239616A (https=)
WO (1) WO2022202939A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024075717A1 (ja) * 2022-10-07 2024-04-11 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP2024125720A (ja) * 2023-03-06 2024-09-19 味の素株式会社 樹脂組成物
JP7758002B2 (ja) * 2023-03-06 2025-10-22 味の素株式会社 樹脂組成物
TW202504971A (zh) * 2023-07-21 2025-02-01 日商拓自達電線股份有限公司 熱硬化性樹脂組成物、硬化物及印刷配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203463A (ja) 2000-01-21 2001-07-27 Taiyo Ink Mfg Ltd 層間接続用導電性ペースト、及びそれを用いた多層プリント配線板とその製造方法
JP2007509487A (ja) 2003-09-19 2007-04-12 ヴァイアシステムズ グループ インコーポレイテッド 閉ループ・バックドリル加工システム
JP2017017175A (ja) 2015-07-01 2017-01-19 日本電気株式会社 多層配線基板、高周波回路、通信装置、及び多層配線基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103666364B (zh) * 2012-09-13 2015-09-16 东睦新材料集团股份有限公司 金属软磁复合材料用有机绝缘粘结剂及制备金属软磁复合材料方法
CN106024359B (zh) * 2016-06-29 2018-07-03 深圳顺络电子股份有限公司 一种模压电感的制作方法
CN111937501A (zh) * 2018-03-30 2020-11-13 太阳油墨制造株式会社 固化性树脂组合物、其固化物和印刷电路板
CN112424889B (zh) * 2018-07-25 2024-12-24 味之素株式会社 磁性糊料
KR102617535B1 (ko) * 2018-07-25 2023-12-27 아지노모토 가부시키가이샤 자성 페이스트
EP3885062A4 (en) * 2018-11-22 2022-09-21 Ajinomoto Co., Inc. MAGNETIC PASTE
TWI850353B (zh) * 2019-03-20 2024-08-01 日商味之素股份有限公司 樹脂組成物
JP2021161211A (ja) * 2020-03-31 2021-10-11 太陽インキ製造株式会社 液状熱硬化性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203463A (ja) 2000-01-21 2001-07-27 Taiyo Ink Mfg Ltd 層間接続用導電性ペースト、及びそれを用いた多層プリント配線板とその製造方法
JP2007509487A (ja) 2003-09-19 2007-04-12 ヴァイアシステムズ グループ インコーポレイテッド 閉ループ・バックドリル加工システム
JP2017017175A (ja) 2015-07-01 2017-01-19 日本電気株式会社 多層配線基板、高周波回路、通信装置、及び多層配線基板の製造方法

Also Published As

Publication number Publication date
CN117120553B (zh) 2026-02-17
JPWO2022202939A1 (https=) 2022-09-29
WO2022202939A1 (ja) 2022-09-29
CN117120553A (zh) 2023-11-24
TW202239616A (zh) 2022-10-16
JP7295506B2 (ja) 2023-06-21

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