CN116038461A - 磨削装置 - Google Patents
磨削装置 Download PDFInfo
- Publication number
- CN116038461A CN116038461A CN202211292066.3A CN202211292066A CN116038461A CN 116038461 A CN116038461 A CN 116038461A CN 202211292066 A CN202211292066 A CN 202211292066A CN 116038461 A CN116038461 A CN 116038461A
- Authority
- CN
- China
- Prior art keywords
- wafer
- holding
- grinding
- water
- holding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 55
- 235000012431 wafers Nutrition 0.000 description 102
- 238000004140 cleaning Methods 0.000 description 51
- 230000001681 protective effect Effects 0.000 description 11
- 239000007788 liquid Substances 0.000 description 9
- 239000012530 fluid Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 238000005507 spraying Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 241000904500 Oxyspora paniculata Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-176361 | 2021-10-28 | ||
JP2021176361A JP2023065933A (ja) | 2021-10-28 | 2021-10-28 | 研削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116038461A true CN116038461A (zh) | 2023-05-02 |
Family
ID=86122977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211292066.3A Pending CN116038461A (zh) | 2021-10-28 | 2022-10-21 | 磨削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2023065933A (ko) |
KR (1) | KR20230061244A (ko) |
CN (1) | CN116038461A (ko) |
TW (1) | TW202317325A (ko) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1131674A (ja) | 1997-07-10 | 1999-02-02 | Disco Abrasive Syst Ltd | ウェーハ洗浄装置 |
JP4229406B2 (ja) | 1999-01-13 | 2009-02-25 | 株式会社ディスコ | 搬送装置及びそれを用いた研削装置並びに搬送方法 |
JP5320014B2 (ja) | 2008-10-17 | 2013-10-23 | 株式会社ディスコ | 研削装置 |
JP5318536B2 (ja) | 2008-11-10 | 2013-10-16 | 株式会社ディスコ | 研削装置 |
JP2013145776A (ja) | 2012-01-13 | 2013-07-25 | Disco Abrasive Syst Ltd | 搬送方法 |
-
2021
- 2021-10-28 JP JP2021176361A patent/JP2023065933A/ja active Pending
-
2022
- 2022-09-19 KR KR1020220117721A patent/KR20230061244A/ko unknown
- 2022-10-21 CN CN202211292066.3A patent/CN116038461A/zh active Pending
- 2022-10-25 TW TW111140445A patent/TW202317325A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230061244A (ko) | 2023-05-08 |
TW202317325A (zh) | 2023-05-01 |
JP2023065933A (ja) | 2023-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110103131B (zh) | 磨削研磨装置和磨削研磨方法 | |
CN107887313B (zh) | 加工装置 | |
TWI758364B (zh) | 板狀工件的保持方法 | |
KR101995597B1 (ko) | 절삭 장치의 척테이블 | |
JP2018140450A (ja) | 研削装置 | |
JP6829590B2 (ja) | 研削装置 | |
TWI779164B (zh) | 磨削裝置 | |
CN110170892B (zh) | 磨削装置 | |
CN116038461A (zh) | 磨削装置 | |
KR101955274B1 (ko) | 반도체 패키지 그라인더 | |
CN112276792A (zh) | 晶片搬送机构和磨削装置 | |
JP7460475B2 (ja) | 加工装置 | |
JP7299773B2 (ja) | 研削装置 | |
CN116442081A (zh) | 磨削装置 | |
CN110370166B (zh) | 卡盘工作台和磨削装置 | |
JP2023101963A (ja) | 洗浄装置 | |
JP2022075141A (ja) | 研削装置 | |
JP2022134856A (ja) | チャックテーブルの洗浄方法 | |
CN114083425A (zh) | 加工装置 | |
JP2024013274A (ja) | 吸引保持監視方法、及び加工装置 | |
JP2023102458A (ja) | 加工装置 | |
JP2023008104A (ja) | 板状ワークを吸引保持するチャックテーブル、チャックテーブルを備える加工装置、及び加工装置を用いた板状ワークの加工方法 | |
JP2024025260A (ja) | スピンナ洗浄装置 | |
JP2024087307A (ja) | 研削装置 | |
JP2023072862A (ja) | 研削装置、及び加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication |