CN1157779C - 一种处理装入智能插卡的削薄的芯片的方法 - Google Patents

一种处理装入智能插卡的削薄的芯片的方法 Download PDF

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Publication number
CN1157779C
CN1157779C CNB008072833A CN00807283A CN1157779C CN 1157779 C CN1157779 C CN 1157779C CN B008072833 A CNB008072833 A CN B008072833A CN 00807283 A CN00807283 A CN 00807283A CN 1157779 C CN1157779 C CN 1157779C
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card
chip
intelligent plug
adhesive linkage
paillon foil
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Expired - Fee Related
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CNB008072833A
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Chinese (zh)
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CN1350701A (zh
Inventor
托马斯・格拉斯尔
托马斯·格拉斯尔
哈吉里-泰拉尼
亚亚·哈吉里－泰拉尼
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Giesecke and Devrient GmbH
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Giesecke and Devrient GmbH
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Credit Cards Or The Like (AREA)
CNB008072833A 1999-05-07 2000-05-04 一种处理装入智能插卡的削薄的芯片的方法 Expired - Fee Related CN1157779C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19921230A DE19921230B4 (de) 1999-05-07 1999-05-07 Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
DE19921230.9 1999-05-07

Publications (2)

Publication Number Publication Date
CN1350701A CN1350701A (zh) 2002-05-22
CN1157779C true CN1157779C (zh) 2004-07-14

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CNB008072833A Expired - Fee Related CN1157779C (zh) 1999-05-07 2000-05-04 一种处理装入智能插卡的削薄的芯片的方法

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Country Link
EP (1) EP1183726A1 (de)
JP (1) JP2002544669A (de)
CN (1) CN1157779C (de)
AU (1) AU4561200A (de)
DE (1) DE19921230B4 (de)
WO (1) WO2000068990A1 (de)

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JP2000040677A (ja) * 1998-07-23 2000-02-08 Nippon Telegr & Teleph Corp <Ntt> 半導体素子の製造方法

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DE19921230A1 (de) 2000-11-09
AU4561200A (en) 2000-11-21
EP1183726A1 (de) 2002-03-06
WO2000068990A1 (de) 2000-11-16
CN1350701A (zh) 2002-05-22
DE19921230B4 (de) 2009-04-02
JP2002544669A (ja) 2002-12-24

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