CN115449001A - 仿生湿面粘结促进剂及其制备与室温固化硅酮胶组合物及其制备 - Google Patents
仿生湿面粘结促进剂及其制备与室温固化硅酮胶组合物及其制备 Download PDFInfo
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- CN115449001A CN115449001A CN202211046238.9A CN202211046238A CN115449001A CN 115449001 A CN115449001 A CN 115449001A CN 202211046238 A CN202211046238 A CN 202211046238A CN 115449001 A CN115449001 A CN 115449001A
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- room temperature
- adhesive composition
- silicone adhesive
- wet
- temperature curing
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- 239000000203 mixture Substances 0.000 title claims abstract description 47
- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000011664 nicotinic acid Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 28
- 238000001723 curing Methods 0.000 claims abstract description 25
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 17
- 238000000746 purification Methods 0.000 claims abstract description 17
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 13
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 13
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 13
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 13
- LWTJEJCZJFZKEL-UHFFFAOYSA-N 2-chloro-3',4'-dihydroxyacetophenone Chemical compound OC1=CC=C(C(=O)CCl)C=C1O LWTJEJCZJFZKEL-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 238000000227 grinding Methods 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000000498 ball milling Methods 0.000 claims abstract description 5
- 238000001291 vacuum drying Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 21
- 239000002318 adhesion promoter Substances 0.000 claims description 18
- 239000003054 catalyst Substances 0.000 claims description 15
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 13
- 239000003431 cross linking reagent Substances 0.000 claims description 12
- 239000004014 plasticizer Substances 0.000 claims description 12
- -1 polysiloxane Polymers 0.000 claims description 12
- 239000011256 inorganic filler Substances 0.000 claims description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 230000003592 biomimetic effect Effects 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 239000012767 functional filler Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000004611 light stabiliser Substances 0.000 claims description 6
- 239000012974 tin catalyst Substances 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 239000000049 pigment Substances 0.000 claims description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 4
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 claims description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims description 3
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 claims description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 229910021485 fumed silica Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229940088417 precipitated calcium carbonate Drugs 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 3
- JLHMJWHSBYZWJJ-UHFFFAOYSA-N 1,2-thiazole 1-oxide Chemical class O=S1C=CC=N1 JLHMJWHSBYZWJJ-UHFFFAOYSA-N 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 claims description 2
- 150000003851 azoles Chemical class 0.000 claims description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 2
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 claims description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 2
- 150000003852 triazoles Chemical class 0.000 claims description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 2
- 150000003751 zinc Chemical class 0.000 claims description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 claims 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims 1
- 239000013522 chelant Substances 0.000 claims 1
- XDYHIPDYGQQEGC-UHFFFAOYSA-N dibutyl(dioctyl)stannane Chemical compound CCCCCCCC[Sn](CCCC)(CCCC)CCCCCCCC XDYHIPDYGQQEGC-UHFFFAOYSA-N 0.000 claims 1
- 238000003801 milling Methods 0.000 claims 1
- 230000003449 preventive effect Effects 0.000 claims 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 17
- 239000000853 adhesive Substances 0.000 abstract description 16
- 239000004826 Synthetic adhesive Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 238000011049 filling Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000010276 construction Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000004590 silicone sealant Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 3
- 239000012265 solid product Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229940045348 brown mixture Drugs 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000855 fungicidal effect Effects 0.000 description 2
- 239000000417 fungicide Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- TUGGFUSCPLPUFY-UHFFFAOYSA-N 3-triethoxysilylpropan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCN.CCO[Si](OCC)(OCC)CCCN TUGGFUSCPLPUFY-UHFFFAOYSA-N 0.000 description 1
- SDVVCEXZGFHIER-UHFFFAOYSA-N C(CCCCCCCCCCC)(=O)OCCCCCCCC.C(CCCCCCCCCCC)(=O)OCCCCCCCC Chemical compound C(CCCCCCCCCCC)(=O)OCCCCCCCC.C(CCCCCCCCCCC)(=O)OCCCCCCCC SDVVCEXZGFHIER-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003256 environmental substance Substances 0.000 description 1
- YYUPXWUUUZXFHG-UHFFFAOYSA-N ethoxy-dimethyl-propylsilane Chemical compound CCC[Si](C)(C)OCC YYUPXWUUUZXFHG-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- RXRIEAKKQPAUKB-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1.CO[Si](OC)(OC)CCCOCC1CO1 RXRIEAKKQPAUKB-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08F8/00—Chemical modification by after-treatment
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F126/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F126/06—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
- C08F126/10—N-Vinyl-pyrrolidone
-
- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
- C08F226/10—N-Vinyl-pyrrolidone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
- C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
- C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C09J139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
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- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08F2810/00—Chemical modification of a polymer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
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Abstract
本方案属于合成胶技术领域,公开了仿生湿面粘结促进剂及其制备与室温固化硅酮胶组合物及其制备。其中仿生湿面粘结促进剂的制备方法包括如下步骤:反应:使聚乙烯吡咯烷酮与2‑氯‑3',4'‑二羟基苯乙酮反应,纯化:提纯反应步骤所得产物,干燥:干燥纯化步骤所得产物,磨粉:将干燥步骤所得产物磨成粉;其中,聚乙烯吡咯烷酮与2‑氯‑3',4'‑二羟基苯乙酮的质量比为(0.8~1.2):1,纯化步骤采用正己烷提纯,干燥步骤采用真空干燥工艺,磨粉步骤采用球磨工艺。本方案的室温固化硅酮胶组合物中含有前述方法制得的仿生湿面粘结促进剂,在干、湿表面均具有良好的粘接性能,具有良好的柔韧性和持久耐用性,可应用于建筑领域,特别适用于目前市场上常用的室温固化硅酮结构胶产品不适用的潮湿环境。
Description
技术领域
本方案属于合成胶技术领域,更具体地,涉及仿生湿面粘结促进剂及其制备与室温固化硅酮胶组合物及其制备。
背景技术
现代技术中应用的胶粘剂主要是合成胶粘剂,简称合成胶。合成胶从应用角度可分为结构胶和非结构胶两大类。结构胶主要用于承受载荷,因而必须有足够的强度来承受载荷,同时必须具有足够的弹性模量来避免受载荷作用而产生大的移位;非结构胶常用于工艺定位、填补缺陷、导电连接和设备密封等。从化学成分的角度可分为硅酮类、环氧树脂类、聚氨酯类等。传统的硅酮胶包括硅酮结构胶和硅酮密封胶,都仅在清洁干燥的基材上具有良好的附着力,而在潮湿的基材表面很容易失去附着力,因而其使用时会受到以下限制:(1)长期浸水的地方不宜施工;(2)结霜或潮湿的表面不能粘合。为此,人们做了很多努力来提升硅酮胶在潮湿基材表面的附着力。
公开号US2019194508A1的美国专利披露了一种单组份硅酮密封胶组合物,可在室温下受潮固化,其以吸水性纳米填料作为湿面粘结促进剂来改善硅酮密封胶在潮湿基材表面的附着力,但该组合物不能作为用于承受载荷的硅酮结构胶。
公开号US2007066768A1的美国专利披露了含有低聚硅烷、氨基功能低聚硅氧烷或有机硅聚合物的单体硅烷组合物,其通过作为湿固化硅树脂的湿面粘结促进剂来改善密封剂或粘合剂或涂料与许多困难的基材的粘合,特别是干湿混凝土,但该方案同样不适合作为硅酮结构胶在潮湿基材表面上使用。
此前,本课题组提出了用于改善在湿基材上粘结性能的添加剂并将其应用于硅酮密封胶中,但该方案同样不适合作为硅酮结构胶在湿基材上使用。因此,有必要开发同时适用干表面和湿表面的硅酮结构胶。
发明内容
本方案旨在克服现有技术中的至少一种缺陷(不足),提供一种仿生湿面粘结促进剂的制备方法,得到同时适用干表面和湿表面的硅酮结构胶,以改善硅酮结构胶在湿基材上的附着力。
为了解决上述技术问题,采取下述技术方案:
第一方面,一种仿生湿面粘结促进剂的制备方法,包括如下步骤:
反应:使聚乙烯吡咯烷酮与2-氯-3',4'-二羟基苯乙酮反应,
纯化:提纯反应步骤所得产物,
干燥:干燥纯化步骤所得产物,
磨粉:将干燥步骤所得产物磨成粉;
其中,聚乙烯吡咯烷酮与2-氯-3',4'-二羟基苯乙酮的质量比为(0.8~1.2):1,纯化步骤采用正己烷提纯,干燥步骤采用真空干燥工艺,磨粉步骤采用球磨工艺。
第二方面,一种仿生湿面粘结促进剂,其由第一方面所描述的方法制备得到。
第三方面,一种室温固化硅酮胶组合物,包括:
a)2~5重量份仿生湿面粘结促进剂,其如第二方面所描述;
b)60~120重量份聚有机硅氧烷,其室温下粘度为3000~100000mPa·s;
c)20~50重量份塑化剂,其室温下粘度为50~1000mPa·s;
d)2~10重量份交联剂,包括三种以上,每种含有两个以上能够与所述聚有机硅氧烷反应的反应基团;
e)2~7重量份催化剂,包括锡催化剂和钛催化剂;
f)60~120重量份无机填料;以及
g)0~10重量份功能性填料;
基于ASTM C1135标准所测,所述组合物在干基板上具有0.9MPa以上的拉伸粘结强度;基于ISO 8339标准所测,所述组合物在湿基板上具有0.7MPa或更高的拉伸粘结强度。
第四方面,一种制备上述室温固化硅酮胶组合物的方法,包括如下步骤:
S1.取聚有机硅氧烷与塑化剂混合;
S2.加入无机填料,在90~140℃高温真空下充分混合分散;
S3.在40~80℃低温真空下加入交联剂和功能性填料;
S4.在氮气气氛下加入催化剂。
本方案与现有技术相比较有如下有益效果:
本方案的单组分室温固化硅酮胶组合物在干、湿表面均具有良好的粘接性能,具有良好的柔韧性和持久耐用性。结合其他需要的特性,如防霉性能,该单组分室温固化硅酮胶组合物可应用于建筑领域,特别适用于目前市场上常用的室温固化硅酮结构胶产品不适用的潮湿环境。
附图说明
图1是制备仿生湿面粘结促进剂的方法流程图。
图2是制备硅酮胶组合物的方法流程图。
具体实施方式
本方案提出一种室温固化硅酮胶组合物,该硅酮胶组合物包括:0.2-5重量份仿生湿面粘结促进剂、60~120重量份聚有机硅氧烷、20~50重量份塑化剂、2~10重量份交联剂、2~7重量份催化剂、60~120重量份无机填料和0~10重量份功能性填料。
在上述硅酮胶组合物中,仿生湿面粘结促进剂为聚乙烯吡咯烷酮(PVP)与2-氯-3',4'-二羟基苯乙酮(2-chloro-3',4'-dihydroxyacetophenone)反应的产物,其反应式如下:
请参见图1,其描述了制备仿生湿面粘结促进剂的方法流程图,该制备方法包括如下步骤:
S101.反应:使质量比为(0.8~1.2):1的聚乙烯吡咯烷酮与2-氯-3',4'-二羟基苯乙酮反应;
S102.纯化:采用正己烷提纯反应步骤所得产物;
S103.干燥:采用真空干燥工艺干燥纯化步骤所得产物;
S104.磨粉:采用球磨工艺将干燥步骤所得产物磨成粉。
上述方法具体为,将质量比为(0.8~1.2):1的聚乙烯吡咯烷酮和2-氯-3',4'-二羟基苯乙酮添加到容量1L的Parr台式反应器中,再加入乙醇,得到深棕色混合物。将气氛由空气替换为N2,然后在70℃下以200rpm的搅拌速度下进行反应,内压可达0.7atm。7小时后,得到反应产物与残留原料的混合物,将混合物冷却至室温,然后在容器中用正己烷进行纯化。纯化过程将容器放入超声波装置中1小时以去除残留的原料。提纯后,将反应产物转移到聚四氟乙烯板上,连同聚四氟乙烯板放入50℃的真空烘箱(-0.08MPa)中干燥1-2天,得到非常易碎的固态产物。将易碎的固态产物转移到约100毫升的罐中,以350rpm的速度球磨12小时,得到能够过230#目筛的粉末。其中,聚乙烯吡咯烷酮和2-氯-3',4'-二羟基苯乙酮的质量比优选为(0.9~1.1):1,最优选为1:1。
在上述硅酮胶组合物中,聚有机硅氧烷在室温(25℃)下粘度为3000~100000mPa·s;优选地,该聚有机硅氧烷包括具有不同粘度的两种以上。该聚有机硅氧烷为端烷氧基聚有机硅氧烷或端羟基聚有机硅氧烷,优选地,该聚有机硅氧烷为端烷氧基聚有机硅氧烷,其分子式为H3CO-[R2SiO]n-OCH3,式中R选自氢、甲基、乙基或苯基,n取500~2000之间的整数;或者该端烷氧基聚有机硅氧烷由分子式为HO-[R2SiO]n-OH的端羟基聚有机硅氧烷改性而得。
在上述硅酮胶组合物中,塑化剂在室温(25℃)下粘度为50~1000mPa·s。优选地,该塑化剂为端甲基聚有机硅氧烷。
在上述硅酮胶组合物中,交联剂包括三种以上,每种含有两个以上能够与所述聚有机硅氧烷反应的反应基团。优选地,该交联剂中的两种以上选自甲基三甲氧基硅烷(methyltrimethoxysilane)、甲基三乙氧基硅烷(methyltriethoxysilane)、二甲氧基二甲基硅烷(dimethoxydimethyl silane)、乙烯基三甲氧基硅烷(vinyltrimethoxysilane)、乙烯基三乙氧基硅烷(vinyltriethoxysilane)、乙烯基甲基二甲氧基硅烷(vinylmethyldimethoxysilane)、原硅酸四甲酯(tetramethyl orthosilicate)或原硅酸四乙酯(tetraethyl orthosilicate);一种选自3-氨基丙基三乙氧基硅烷(3-aminopropyltriethoxysilane)、3-氨基丙基三甲氧基硅烷(3-aminopropyltrimethoxysilane)、3-氨基丙基-甲基二乙氧基硅烷(3-Aminopropyl-methyldiethoxysilane)、[3-(2-氨基乙基氨基)丙基]三甲氧基硅烷([3-(2-aminoethylamino)propyl]trimethoxysilane)、3-(2-氨基乙基氨基)丙基甲基二甲氧基硅烷(3-(2-aminoethylamino)propylmethyldimethoxysilane)或γ-环氧丙氧基丙基三甲氧基硅烷(γ-glycidoxypropyltrimethoxysilane)。
在上述硅酮胶组合物中,催化剂包括锡催化剂和钛催化剂。优选地,锡催化剂选自二月桂酸二丁基锡(dibutyltin dilaurate)、二乙酸二丁基锡(dibutyltin diacetate)、二月桂酸二辛基锡(dioctyltin dilaurate)、二丁基二辛基锡(dibutyl dioctyl tin)或氧化二丁基锡(dibutyltin oxide)中的一种或多种;钛催化剂选自钛酸异丙酯(isopropyltitanate)、钛酸四丁酯(tetrabutyl titanate)或钛螯合物(titanium chelates)中的一种或多种。
在上述硅酮胶组合物中,无机填料优选自纳米碳酸钙(nano calciumcarbonate)、沉淀碳酸钙(precipitated calcium carbonate)、重质碳酸钙(groundcalcium carbonate)、气相二氧化硅(fumed silica)或沉淀二氧化硅(precipitatedsilica)中的一种或多种。
在上述硅酮胶组合物中,功能性填料选自防霉剂(anti-mould agent)、紫外线吸收剂(UV absorber)、光稳定剂(light stabilizer)、抗氧化剂(antioxidant)、颜料(pigment)中的一种或多种,其配比优选为0.1~9重量份。优选地,防霉剂选自唑类(azoles)、三唑类(triazoles)、异噻唑酮类(isothiazolones)、有机锌盐(organozincsalts)中的一种或多种。
请参见图2(待补充完整后补图),其示出了上述硅酮胶组合物的制备方法流程图,该制备方法包括如下步骤:
S201.取聚有机硅氧烷与塑化剂混合;
S202.加入无机填料,在高温(90~140℃)真空下充分混合分散;
S203.在低温(40~80℃)真空下加入交联剂和功能性填料;
S204.在氮气气氛下加入催化剂。
上述方法具体为,在负压状态下(-0.08MPa)将多种粘度的聚有机硅氧烷和塑化剂搅拌混合,并加热至80℃左右。加入无机填料,继续在负压状态下(-0.08MPa)充分搅拌分散,加热至130℃并保温一小时,然后降温至65℃,填充N2,加入交联剂、仿生湿面粘接促进剂、紫外线吸收剂和光稳定剂,在负压状态下(-0.07MPa)搅拌分散15分钟;填充N2,加入催化剂,低速搅拌10分钟,进而在在负压状态下(-0.08MPa)低速搅拌分散15分钟。充分混合均匀后,填充N2,挤出封装。
为了让本领域的技术人员更好地理解本方案,下面结合具体实施例和对比例进一步说明本方案。实施例和对比例中所使用的工艺方法如无特殊说明,均为常规方法;所用的材料,如无特殊说明,均可从商业途径得到。
其中,聚有机硅氧烷购自深圳市吉鹏硅氟材料有限公司和广州鑫冠化工科技有限公司;塑化剂购自深圳市吉鹏硅氟材料有限公司和湖北襄阳玖润氟硅材料有限公司;交联剂购自湖北新蓝天新材料股份有限公司(LT-550,LT-540,LT-560,LT-792,LT-602,LT-151,LT-171,LT-8122)、南京全希化工(MTMS,DMDMS,ViTMS)和广州远达新材料公司(KH-550,KH-560,ViTMS);锡催化剂购自深圳市吉鹏硅氟材料有限公司(D-80);钛催化剂购自长沙罗斯化工有限公司(元钛)、湖北环宇化工有限公司(HY-300)和南京能德新材料技术有限公司(TCA-DC);无机填料购自广西华纳新材料科技有限公司(CCS25i,1250-M);防霉剂购自XX(厂家及型号),紫外线吸收剂和光稳定剂购自上海万璐吉塑化科技有限公司和东莞市宝旭化工科技有限公司(UV B75),颜料购自深圳市吉田化工有限公司和上海复瑞化工有限公司(FR-5300,FR-6800)。
实施例1
(一)制备仿生湿面粘结促进剂:将40g聚乙烯吡咯烷酮和40g2-氯-3',4'-二羟基苯乙酮添加到容量1L的Parr台式反应器中,再加入150mL乙醇,得到深棕色混合物。在加热之前将气氛由空气替换为N2。反应在70℃下以200rpm的搅拌速度进行,内压可达0.7atm。7小时后,得到反应产物与残留原料的混合物,将混合物冷却至室温,然后在容器中用约500mL正己烷进行纯化。纯化过程将容器放入超声波装置中1小时以去除残留的原料。提纯后,将产品转移到聚四氟乙烯板上,连同聚四氟乙烯板放入50℃的真空烘箱(-0.08MPa)中干燥1-2天,得到非常易碎的固态产物。将易碎的产物转移到约100毫升的罐中,以350rpm的速度球磨12小时,得到能够过230#目筛的粉末。
(二)制备室温固化硅酮胶组合物:按表1中指定的各组分用量,在行星搅拌机中加入单一或多种室温粘度为3000~100000mPa·s的聚有机硅氧烷和相应的塑化剂,负压状态下(-0.08MPa)搅拌,并加热至80℃。加入无机填料,在负压状态下(-0.08MPa)充分搅拌分散,加热至130℃并保温一小时。其后降温至65℃,填充N2,加入交联剂、仿生湿面粘接促进剂、紫外线吸收剂和光稳定剂,在负压状态下(-0.07MPa)搅拌分散15分钟;填充N2,加入催化剂,低速搅拌10分钟,进而在在负压状态下(-0.08MPa)低速搅拌分散15分钟。充分混合均匀后,填充N2,挤出封装。
实施例2
按表1中的指定的各组分用量重复实施例1的方法。
实施例3
按表1中的指定的各组分用量重复实施例1的方法。
对比例1
按表1中的指定的各组分用量重复实施例1的方法,其中没有添加仿生湿面粘接促进剂。
对比例2
按表1中的指定的各组分用量重复实施例1的方法,其中没有添加仿生湿面粘接促进剂。
对比例3
按表1中的指定的各组分用量重复实施例1的方法,但制备仿生湿面粘接促进剂过程中,用粉碎机粉碎替代球磨,且未过筛网。
表1
为了表征所得到的硅酮胶组合物的性能,下面根据国际标准分别对上述实施例和对比例制得的硅酮胶进行测试。
拉伸强度和断裂伸长率参考标准ASTM D412-16方法A;邵氏硬度参考标准ASTMD2240-15的Type A;干面基材的拉伸粘结性测试参考标准ASTM C1135-19,这里的干面基材为阳极氧化铝基材;湿面基材的拉伸粘结性测试参考标准ISO 8339:2005,这里的湿面基材特指含水量大于90%的水泥板,是通过24小时常温水浸泡后,将表面的明水擦去得到的,这种基材本身易吸水,湿面模拟的是下雨后或潮湿天气情况下的状况,可以用来测试硅酮胶组合物在湿表面上的拉伸粘结强度;氙灯加速老化测试条件参考标准ASTM G155-21和ASTMC1442-14。测试结果记录在表2中。
表2
由实施例1~3可知,本方案对仿生湿面粘结促进剂的制备与纯化过程进行了优化,将反应物聚乙烯吡咯烷酮与2-氯-3',4'-二羟基苯乙酮的质量比控制在1:1左右,反应完全后用正己烷提纯,得到的仿生湿面粘结促进剂既能够改善硅酮胶在湿基材表面的附着力,又能够使得到的硅酮胶具备足够的强度与合适的模量以承受载荷。基于ASTM C1135标准所测,上述组合物在干基板上具有1.0MPa以上的拉伸粘结强度;基于ISO 8339标准所测,上述组合物在湿基板上具有0.7MPa以上的拉伸粘结强度。
综上,本方案的单组分室温固化硅酮胶组合物在干、湿表面均具有良好的粘接性能,具有良好的柔韧性和持久耐用性。结合其他需要的特性,如防霉性能,该单组分室温固化硅酮胶组合物可应用于建筑领域,特别适用于目前市场上常用的室温固化硅酮结构胶产品不适用的潮湿环境。
显然,本方案的上述实施例仅仅是为清楚地说明本方案所作的举例,而并非是对本方案的实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。凡在本方案的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本方案权利要求的保护范围之内。
Claims (12)
1.一种仿生湿面粘结促进剂的制备方法,包括如下步骤:
反应:使聚乙烯吡咯烷酮与2-氯-3',4'-二羟基苯乙酮反应,
纯化:提纯反应步骤所得产物,
干燥:干燥纯化步骤所得产物,
磨粉:将干燥步骤所得产物磨成粉;
其特征在于,所述聚乙烯吡咯烷酮与2-氯-3',4'-二羟基苯乙酮的质量比为(0.8~1.2):1,所述纯化步骤采用正己烷提纯,所述干燥步骤采用真空干燥工艺,所述磨粉步骤采用球磨工艺。
2.如权利要求1所述方法制备的仿生湿面粘结促进剂。
3.一种室温固化硅酮胶组合物,包括:
a)0.2~5重量份如权利要求2所述的仿生湿面粘结促进剂;
b)60~120重量份聚有机硅氧烷,其室温下粘度为3000~100000mPa·s;
c)20~50重量份塑化剂,其室温下粘度为50~1000mPa·s;
d)2~10重量份交联剂,包括三种以上,每种含有两个以上能够与所述聚有机硅氧烷反应的反应基团;
e)2~7重量份催化剂,包括锡催化剂和钛催化剂;
f)60~120重量份无机填料;以及
g)0~10重量份功能性填料;
基于ASTM C1135标准所测,所述组合物在干基板上具有0.90MPa以上的拉伸粘结强度;基于ISO 8339标准所测,所述组合物在湿基板上具有0.70MPa以上的拉伸粘结强度。
4.根据权利要求3所述室温固化硅酮胶组合物,其特征在于,
所述聚有机硅氧烷包括具有不同粘度的两种以上。
5.根据权利要求3所述室温固化硅酮胶组合物,其特征在于,
所述聚有机硅氧烷为端烷氧基聚有机硅氧烷,其分子式为H3CO-[R2SiO]n-OCH3,式中R选自氢、甲基、乙基或苯基,n取500~2000之间的整数;和/或
所述聚有机硅氧烷为端羟基聚有机硅氧烷,其分子式为HO-[R2SiO]n-OH,式中R选自氢、甲基、乙基或苯基,n取500~2000之间的整数。
6.根据权利要求3所述室温固化硅酮胶组合物,其特征在于,
所述塑化剂为端甲基聚有机硅氧烷。
7.根据权利要求3所述室温固化硅酮胶组合物,其特征在于,
所述交联剂中的两种以上选自甲基三甲氧基硅烷、甲基三乙氧基硅烷、二甲氧基二甲基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基甲基二甲氧基硅烷、原硅酸四甲酯或原硅酸四乙酯;和/或
所述交联剂中的一种选自3-氨基丙基三乙氧基硅烷、3-氨基丙基三甲氧基硅烷、3-氨基丙基-甲基二乙氧基硅烷、[3-(2-氨基乙基氨基)丙基]三甲氧基硅烷、3-(2-氨基乙基氨基)丙基甲基二甲氧基硅烷或γ-环氧丙氧基丙基三甲氧基硅烷。
8.根据权利要求3所述室温固化硅酮胶组合物,其特征在于,
所述锡催化剂选自二月桂酸二丁基锡、二乙酸二丁基锡、二月桂酸二辛基锡、二丁基二辛基锡、氧化二丁基锡中的一种或多种;和/或
所述钛催化剂选自钛酸异丙酯、钛酸四丁酯、钛螯合物中的一种或多种。
9.根据权利要求3所述室温固化硅酮胶组合物,其特征在于,
所述无机填料选自纳米碳酸钙、沉淀碳酸钙、重质碳酸钙、气相二氧化硅、沉淀二氧化硅中的一种或多种。
10.根据权利要求3所述室温固化硅酮胶组合物,其特征在于,
所述功能性填料选自防霉剂、紫外线吸收剂、光稳定剂、抗氧化剂、颜料中的一种或多种。
11.根据权利要求10所述室温固化硅酮胶组合物,其特征在于,
所述防霉剂选自唑类、三唑类、异噻唑酮类、有机锌盐中的一种或多种。
12.一种制备如权利要求3~11任一项所述室温固化硅酮胶组合物的方法,包括如下步骤:
S1.取聚有机硅氧烷与塑化剂混合;
S2.加入无机填料,在90~140℃真空下充分混合分散;
S3.在40~80℃真空下加入交联剂和功能性填料;
S4.在氮气气氛下加入催化剂。
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