CN115365920A - 用于运行双面加工机的方法以及双面加工机 - Google Patents

用于运行双面加工机的方法以及双面加工机 Download PDF

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Publication number
CN115365920A
CN115365920A CN202210510241.5A CN202210510241A CN115365920A CN 115365920 A CN115365920 A CN 115365920A CN 202210510241 A CN202210510241 A CN 202210510241A CN 115365920 A CN115365920 A CN 115365920A
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CN
China
Prior art keywords
working
heating
double
disk
processing machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210510241.5A
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English (en)
Chinese (zh)
Inventor
R·拉夫利奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apmaster Wolters Shenyang Precision Machinery Co ltd
Original Assignee
Lapmaster Wolters GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lapmaster Wolters GmbH filed Critical Lapmaster Wolters GmbH
Publication of CN115365920A publication Critical patent/CN115365920A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN202210510241.5A 2021-05-20 2022-05-11 用于运行双面加工机的方法以及双面加工机 Pending CN115365920A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021113131.6 2021-05-20
DE102021113131.6A DE102021113131A1 (de) 2021-05-20 2021-05-20 Verfahren zum Betreiben einer Doppelseitenbearbeitungsmaschine sowie Doppelseitenbearbeitungsmaschine

Publications (1)

Publication Number Publication Date
CN115365920A true CN115365920A (zh) 2022-11-22

Family

ID=81325319

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210510241.5A Pending CN115365920A (zh) 2021-05-20 2022-05-11 用于运行双面加工机的方法以及双面加工机

Country Status (7)

Country Link
US (1) US20220371154A1 (https=)
EP (1) EP4091767B1 (https=)
JP (1) JP2022179370A (https=)
KR (1) KR20220157305A (https=)
CN (1) CN115365920A (https=)
DE (1) DE102021113131A1 (https=)
TW (1) TW202300276A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042691A1 (ja) * 2024-08-20 2026-02-26 Ａｇｃ株式会社 ワークを研磨する方法、および当該方法を用いて研磨されたワーク

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1175964A2 (en) * 2000-07-27 2002-01-30 Agere Systems Guardian Corporation Polishing surface temperature conditioning system for a chemical mechanical planarization process
US20030027506A1 (en) * 2001-08-06 2003-02-06 Herb John D. Apparatus for distributing a fluid through a polishing pad
JP2003257914A (ja) * 2002-02-27 2003-09-12 Fujitsu Ltd 化学機械研磨方法と装置、及び半導体装置の製造方法
US20060040589A1 (en) * 2004-08-20 2006-02-23 Ulrich Ising Double sided polishing machine
EP1970159A1 (de) * 2007-03-13 2008-09-17 Peter Wolters GmbH Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
US20130025636A1 (en) * 2010-01-22 2013-01-31 Yoshiaki Kurokawa Substrate treatment device and substrate treatment method
CN110707028A (zh) * 2019-10-18 2020-01-17 长江存储科技有限责任公司 晶圆热处理装置及晶圆热处理方法
CN211193456U (zh) * 2019-12-11 2020-08-07 北京微纳精密机械有限公司 一种便于控制抛光盘温度的化学机械抛光机

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1257046A (en) * 1918-01-02 1918-02-19 Edward A Suverkrop Lapping-machine.
JPH11104951A (ja) * 1997-10-02 1999-04-20 Speedfam Co Ltd ラッピング加工方法
DE10007390B4 (de) 1999-03-13 2008-11-13 Peter Wolters Gmbh Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern
US6488571B2 (en) * 2000-12-22 2002-12-03 Intel Corporation Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
US7201634B1 (en) 2005-11-14 2007-04-10 Infineon Technologies Ag Polishing methods and apparatus
DE102006032455A1 (de) * 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit
US20100279435A1 (en) * 2009-04-30 2010-11-04 Applied Materials, Inc. Temperature control of chemical mechanical polishing
JP5411739B2 (ja) 2010-02-15 2014-02-12 信越半導体株式会社 キャリア取り付け方法
DE102013202488B4 (de) * 2013-02-15 2015-01-22 Siltronic Ag Verfahren zum Abrichten von Poliertüchern zur gleichzeitig beidseitigen Politur von Halbleiterscheiben
US20150306728A1 (en) * 2014-04-23 2015-10-29 Silicon Quest International, Incorporated Systems for, methods of, and apparatus for processing substrate surfaces
DE102016102223B4 (de) * 2016-02-09 2025-10-16 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine und Verfahren zum Betreiben einer Doppel- oder Einseiten-Bearbeitungsmaschine
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
US20210394331A1 (en) * 2020-06-17 2021-12-23 Globalwafers Co., Ltd. Semiconductor substrate polishing with polishing pad temperature control

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1175964A2 (en) * 2000-07-27 2002-01-30 Agere Systems Guardian Corporation Polishing surface temperature conditioning system for a chemical mechanical planarization process
US20030027506A1 (en) * 2001-08-06 2003-02-06 Herb John D. Apparatus for distributing a fluid through a polishing pad
JP2003257914A (ja) * 2002-02-27 2003-09-12 Fujitsu Ltd 化学機械研磨方法と装置、及び半導体装置の製造方法
US20060040589A1 (en) * 2004-08-20 2006-02-23 Ulrich Ising Double sided polishing machine
EP1970159A1 (de) * 2007-03-13 2008-09-17 Peter Wolters GmbH Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
US20130025636A1 (en) * 2010-01-22 2013-01-31 Yoshiaki Kurokawa Substrate treatment device and substrate treatment method
CN110707028A (zh) * 2019-10-18 2020-01-17 长江存储科技有限责任公司 晶圆热处理装置及晶圆热处理方法
CN211193456U (zh) * 2019-12-11 2020-08-07 北京微纳精密机械有限公司 一种便于控制抛光盘温度的化学机械抛光机

Also Published As

Publication number Publication date
TW202300276A (zh) 2023-01-01
US20220371154A1 (en) 2022-11-24
EP4091767A1 (de) 2022-11-23
EP4091767B1 (de) 2026-03-04
JP2022179370A (ja) 2022-12-02
EP4091767C0 (de) 2026-03-04
DE102021113131A1 (de) 2022-11-24
KR20220157305A (ko) 2022-11-29

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20250610

Address after: 110000 Liaoning Province Shenyang City Shenyang Economic and Technological Development Zone No. 3, Section 8 Road 2, Jia 2nd Floor

Applicant after: APMASTER WOLTERS (SHENYANG) PRECISION MACHINERY Co.,Ltd.

Country or region after: China

Address before: German rendsburg

Applicant before: Lapmaster Wolters GmbH

Country or region before: Germany

TA01 Transfer of patent application right