JP2022179370A - 両面加工機械の運転方法および両面加工機械 - Google Patents

両面加工機械の運転方法および両面加工機械 Download PDF

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Publication number
JP2022179370A
JP2022179370A JP2022074481A JP2022074481A JP2022179370A JP 2022179370 A JP2022179370 A JP 2022179370A JP 2022074481 A JP2022074481 A JP 2022074481A JP 2022074481 A JP2022074481 A JP 2022074481A JP 2022179370 A JP2022179370 A JP 2022179370A
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JP
Japan
Prior art keywords
working
heating
double
processing machine
disc
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Pending
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JP2022074481A
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English (en)
Japanese (ja)
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JP2022179370A5 (https=
Inventor
ラブリック ロバート
Ravlic Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lapmaster Wolters GmbH
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Lapmaster Wolters GmbH
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Publication date
Application filed by Lapmaster Wolters GmbH filed Critical Lapmaster Wolters GmbH
Publication of JP2022179370A publication Critical patent/JP2022179370A/ja
Publication of JP2022179370A5 publication Critical patent/JP2022179370A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2022074481A 2021-05-20 2022-04-28 両面加工機械の運転方法および両面加工機械 Pending JP2022179370A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021113131.6 2021-05-20
DE102021113131.6A DE102021113131A1 (de) 2021-05-20 2021-05-20 Verfahren zum Betreiben einer Doppelseitenbearbeitungsmaschine sowie Doppelseitenbearbeitungsmaschine

Publications (2)

Publication Number Publication Date
JP2022179370A true JP2022179370A (ja) 2022-12-02
JP2022179370A5 JP2022179370A5 (https=) 2024-05-15

Family

ID=81325319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022074481A Pending JP2022179370A (ja) 2021-05-20 2022-04-28 両面加工機械の運転方法および両面加工機械

Country Status (7)

Country Link
US (1) US20220371154A1 (https=)
EP (1) EP4091767B1 (https=)
JP (1) JP2022179370A (https=)
KR (1) KR20220157305A (https=)
CN (1) CN115365920A (https=)
DE (1) DE102021113131A1 (https=)
TW (1) TW202300276A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042691A1 (ja) * 2024-08-20 2026-02-26 Ａｇｃ株式会社 ワークを研磨する方法、および当該方法を用いて研磨されたワーク

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11104951A (ja) * 1997-10-02 1999-04-20 Speedfam Co Ltd ラッピング加工方法
JP2008018528A (ja) * 2006-07-13 2008-01-31 Siltronic Ag 複数の半導体ウェハを同時に両面研磨する方法および半導体ウェハ

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1257046A (en) * 1918-01-02 1918-02-19 Edward A Suverkrop Lapping-machine.
DE10007390B4 (de) 1999-03-13 2008-11-13 Peter Wolters Gmbh Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern
EP1175964A3 (en) * 2000-07-27 2003-07-23 Agere Systems Guardian Corporation Polishing surface temperature conditioning system for a chemical mechanical planarization process
US6488571B2 (en) * 2000-12-22 2002-12-03 Intel Corporation Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
US6599175B2 (en) * 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
JP2003257914A (ja) * 2002-02-27 2003-09-12 Fujitsu Ltd 化学機械研磨方法と装置、及び半導体装置の製造方法
DE102004040429B4 (de) * 2004-08-20 2009-12-17 Peter Wolters Gmbh Doppelseiten-Poliermaschine
US7201634B1 (en) 2005-11-14 2007-04-10 Infineon Technologies Ag Polishing methods and apparatus
DE102007011880A1 (de) * 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
US20100279435A1 (en) * 2009-04-30 2010-11-04 Applied Materials, Inc. Temperature control of chemical mechanical polishing
CN102782807B (zh) * 2010-01-22 2015-07-08 芝浦机械电子装置股份有限公司 基板处理装置及基板处理方法
JP5411739B2 (ja) 2010-02-15 2014-02-12 信越半導体株式会社 キャリア取り付け方法
DE102013202488B4 (de) * 2013-02-15 2015-01-22 Siltronic Ag Verfahren zum Abrichten von Poliertüchern zur gleichzeitig beidseitigen Politur von Halbleiterscheiben
US20150306728A1 (en) * 2014-04-23 2015-10-29 Silicon Quest International, Incorporated Systems for, methods of, and apparatus for processing substrate surfaces
DE102016102223B4 (de) * 2016-02-09 2025-10-16 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine und Verfahren zum Betreiben einer Doppel- oder Einseiten-Bearbeitungsmaschine
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
CN110707028A (zh) * 2019-10-18 2020-01-17 长江存储科技有限责任公司 晶圆热处理装置及晶圆热处理方法
CN211193456U (zh) * 2019-12-11 2020-08-07 北京微纳精密机械有限公司 一种便于控制抛光盘温度的化学机械抛光机
US20210394331A1 (en) * 2020-06-17 2021-12-23 Globalwafers Co., Ltd. Semiconductor substrate polishing with polishing pad temperature control

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11104951A (ja) * 1997-10-02 1999-04-20 Speedfam Co Ltd ラッピング加工方法
JP2008018528A (ja) * 2006-07-13 2008-01-31 Siltronic Ag 複数の半導体ウェハを同時に両面研磨する方法および半導体ウェハ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042691A1 (ja) * 2024-08-20 2026-02-26 Ａｇｃ株式会社 ワークを研磨する方法、および当該方法を用いて研磨されたワーク

Also Published As

Publication number Publication date
TW202300276A (zh) 2023-01-01
US20220371154A1 (en) 2022-11-24
EP4091767A1 (de) 2022-11-23
EP4091767B1 (de) 2026-03-04
EP4091767C0 (de) 2026-03-04
DE102021113131A1 (de) 2022-11-24
CN115365920A (zh) 2022-11-22
KR20220157305A (ko) 2022-11-29

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