KR20220157305A - 양면 가공 기계를 작동하는 방법 및 양면 가공 기계 - Google Patents

양면 가공 기계를 작동하는 방법 및 양면 가공 기계 Download PDF

Info

Publication number
KR20220157305A
KR20220157305A KR1020220058402A KR20220058402A KR20220157305A KR 20220157305 A KR20220157305 A KR 20220157305A KR 1020220058402 A KR1020220058402 A KR 1020220058402A KR 20220058402 A KR20220058402 A KR 20220058402A KR 20220157305 A KR20220157305 A KR 20220157305A
Authority
KR
South Korea
Prior art keywords
working
heating
machining
double
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220058402A
Other languages
English (en)
Korean (ko)
Inventor
라브릭 로버트
Original Assignee
랩마스터 볼터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 랩마스터 볼터스 게엠베하 filed Critical 랩마스터 볼터스 게엠베하
Publication of KR20220157305A publication Critical patent/KR20220157305A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020220058402A 2021-05-20 2022-05-12 양면 가공 기계를 작동하는 방법 및 양면 가공 기계 Pending KR20220157305A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021113131.6 2021-05-20
DE102021113131.6A DE102021113131A1 (de) 2021-05-20 2021-05-20 Verfahren zum Betreiben einer Doppelseitenbearbeitungsmaschine sowie Doppelseitenbearbeitungsmaschine

Publications (1)

Publication Number Publication Date
KR20220157305A true KR20220157305A (ko) 2022-11-29

Family

ID=81325319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220058402A Pending KR20220157305A (ko) 2021-05-20 2022-05-12 양면 가공 기계를 작동하는 방법 및 양면 가공 기계

Country Status (7)

Country Link
US (1) US20220371154A1 (https=)
EP (1) EP4091767B1 (https=)
JP (1) JP2022179370A (https=)
KR (1) KR20220157305A (https=)
CN (1) CN115365920A (https=)
DE (1) DE102021113131A1 (https=)
TW (1) TW202300276A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042691A1 (ja) * 2024-08-20 2026-02-26 Ａｇｃ株式会社 ワークを研磨する方法、および当該方法を用いて研磨されたワーク

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1257046A (en) * 1918-01-02 1918-02-19 Edward A Suverkrop Lapping-machine.
JPH11104951A (ja) * 1997-10-02 1999-04-20 Speedfam Co Ltd ラッピング加工方法
DE10007390B4 (de) 1999-03-13 2008-11-13 Peter Wolters Gmbh Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern
EP1175964A3 (en) * 2000-07-27 2003-07-23 Agere Systems Guardian Corporation Polishing surface temperature conditioning system for a chemical mechanical planarization process
US6488571B2 (en) * 2000-12-22 2002-12-03 Intel Corporation Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
US6599175B2 (en) * 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
JP2003257914A (ja) * 2002-02-27 2003-09-12 Fujitsu Ltd 化学機械研磨方法と装置、及び半導体装置の製造方法
DE102004040429B4 (de) * 2004-08-20 2009-12-17 Peter Wolters Gmbh Doppelseiten-Poliermaschine
US7201634B1 (en) 2005-11-14 2007-04-10 Infineon Technologies Ag Polishing methods and apparatus
DE102006032455A1 (de) * 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit
DE102007011880A1 (de) * 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
US20100279435A1 (en) * 2009-04-30 2010-11-04 Applied Materials, Inc. Temperature control of chemical mechanical polishing
CN102782807B (zh) * 2010-01-22 2015-07-08 芝浦机械电子装置股份有限公司 基板处理装置及基板处理方法
JP5411739B2 (ja) 2010-02-15 2014-02-12 信越半導体株式会社 キャリア取り付け方法
DE102013202488B4 (de) * 2013-02-15 2015-01-22 Siltronic Ag Verfahren zum Abrichten von Poliertüchern zur gleichzeitig beidseitigen Politur von Halbleiterscheiben
US20150306728A1 (en) * 2014-04-23 2015-10-29 Silicon Quest International, Incorporated Systems for, methods of, and apparatus for processing substrate surfaces
DE102016102223B4 (de) * 2016-02-09 2025-10-16 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine und Verfahren zum Betreiben einer Doppel- oder Einseiten-Bearbeitungsmaschine
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
CN110707028A (zh) * 2019-10-18 2020-01-17 长江存储科技有限责任公司 晶圆热处理装置及晶圆热处理方法
CN211193456U (zh) * 2019-12-11 2020-08-07 北京微纳精密机械有限公司 一种便于控制抛光盘温度的化学机械抛光机
US20210394331A1 (en) * 2020-06-17 2021-12-23 Globalwafers Co., Ltd. Semiconductor substrate polishing with polishing pad temperature control

Also Published As

Publication number Publication date
TW202300276A (zh) 2023-01-01
US20220371154A1 (en) 2022-11-24
EP4091767A1 (de) 2022-11-23
EP4091767B1 (de) 2026-03-04
JP2022179370A (ja) 2022-12-02
EP4091767C0 (de) 2026-03-04
DE102021113131A1 (de) 2022-11-24
CN115365920A (zh) 2022-11-22

Similar Documents

Publication Publication Date Title
JP6543281B2 (ja) 両面または片面加工機、および両面または片面加工機を動作させる方法
TWI774805B (zh) 晶圓加工方法
JP2013536580A (ja) 研磨中の温度制御のための装置および方法
KR101005245B1 (ko) 반도체 웨이퍼 연삭법
TWI752045B (zh) 研磨裝置
KR102735236B1 (ko) 다수의 각도적 가압 가능한 구역들을 갖는 연마 캐리어 헤드
KR20220157305A (ko) 양면 가공 기계를 작동하는 방법 및 양면 가공 기계
US20250319569A1 (en) Chemical mechanical polishing correction tool
TWI652140B (zh) 雙碟式表面磨床中靜壓墊的熱變形預防設備以及雙碟式表面磨床
TW202408727A (zh) 用於組態雙面或單面加工機的方法以及雙面或單面加工機
JP6736728B2 (ja) 研削加工装置
US7156933B2 (en) Configuration and method for mounting a backing film to a polish head
JP3587283B2 (ja) ウェーハの両面ラップ方法及び装置
JP7525268B2 (ja) 平面研削装置
US12090685B2 (en) Ingot temperature controller and wire sawing device having same
KR101453683B1 (ko) 웨이퍼 에지 연마 장치 및 웨이퍼 에지 연마 방법
JP2023145215A (ja) ウエハ加工装置
JP6712841B2 (ja) 研削加工方法
KR102805996B1 (ko) 회전 가능한 헤드를 구비한 실리콘 링 폴리싱 장치 및 이를 이용한 실리콘 링 폴리싱 방법
CN110064999B (zh) 一种研磨设备和研磨台的调节方法
JP2748194B2 (ja) イオン注入装置におけるウェハ載置用ゴム板の押付け用モールド加工方法
JP6298681B2 (ja) 研磨装置、研磨パッドのドレス方法
WO2024203714A1 (ja) 研削装置及び研削方法
JPS641276B2 (https=)
JP2000042906A (ja) 研磨方法及び研磨装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902