US20220371154A1 - Method for operating a double-sided processing machine and double-sided processing machine - Google Patents

Method for operating a double-sided processing machine and double-sided processing machine Download PDF

Info

Publication number
US20220371154A1
US20220371154A1 US17/747,575 US202217747575A US2022371154A1 US 20220371154 A1 US20220371154 A1 US 20220371154A1 US 202217747575 A US202217747575 A US 202217747575A US 2022371154 A1 US2022371154 A1 US 2022371154A1
Authority
US
United States
Prior art keywords
working
heating
disk
processing
disks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US17/747,575
Other languages
English (en)
Inventor
Robert Ravlic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lapmaster Wolters GmbH
Original Assignee
Lapmaster Wolters GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lapmaster Wolters GmbH filed Critical Lapmaster Wolters GmbH
Assigned to LAPMASTER WOLTERS GMBH reassignment LAPMASTER WOLTERS GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Ravlic, Robert
Publication of US20220371154A1 publication Critical patent/US20220371154A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Definitions

  • the following disclosure relates to a method for operating a double-sided processing machine, in particular a double-sided polishing machine, which comprises a top working disk and a bottom working disk which can be rotated relative to each other by means of a rotary drive and between which a working gap for processing flat workpieces is formed.
  • the disclosure also relates to a double-sided processing machine, in particular a double-sided polishing machine, comprising a top working disk and a bottom working disk, between which a working gap for processing flat workpieces is formed, and comprising a rotary drive with which the top working disk and the bottom working disk can be rotated relative to each other.
  • a double-sided processing machine in particular a double-sided polishing machine, comprising a top working disk and a bottom working disk, between which a working gap for processing flat workpieces is formed, and comprising a rotary drive with which the top working disk and the bottom working disk can be rotated relative to each other.
  • double-sided processing machines for example double-sided polishing machines
  • flat workpieces such as semiconductor wafers are processed, for example polished, in a working gap formed between a top working disk and a bottom working disk.
  • the working disks are rotated relative to each other by means of a rotary drive.
  • the flat workpieces can be located, for example, in recesses of what are known as rotor disks which move along a circular path through the working gap during processing and in doing so rotate about their axis.
  • the workpieces are thus guided along cycloidal paths through the working gap and processed.
  • Very high surface qualities of the processed workpieces in particular very high evenness, can be achieved with such double-sided processing machines.
  • An important parameter for the processing quality is known to be the GBIR value (Global Backside Ideal Focal Plane Range).
  • the top working disk and/or the bottom working disk can have corresponding supply openings. It is also known, for example, to provide the top working disk and/or the bottom working disk with, for example, labyrinthine tempering channels through which a cooling liquid, for example water, is conducted during processing in order to keep the working disks at a specified operating temperature during a processing step. It is also known to measure the thickness of the processed workpieces, for example, at multiple radially distanced locations of the working gap, during a processing step and to terminate the processing step after a specified target thickness has been reached. For the thickness measurement, various sensors are known, for example, eddy current sensors or also optical sensors.
  • the object of the invention is to provide a method and a double-sided processing machine of the type explained above, with which the throughput can be increased compared to the prior art even after longer downtime of the double-sided processing machine and the costs can be lowered accordingly.
  • At least the working disks are heated to an operating temperature by means of a heating apparatus in a heating step before a processing step is performed.
  • a heating apparatus is provided and is configured for heating at least the working disks to an operating temperature in a heating step before a processing step for processing workpieces.
  • the double-sided processing machine can be, for example, a double-sided polishing machine.
  • the working disks can each have a working covering, for example a polishing pad.
  • the flat workpieces can be, for example, semiconductor wafers.
  • the top working disk can be fastened to a top support disk. Accordingly, the bottom working disk can be fastened to a bottom support disk.
  • a corresponding rotary drive is provided for this.
  • the working disks can be driven to rotate in opposite directions to each other.
  • the invention is based on the knowledge that the processing runs described above that are required in order to reach the specified processing quality correlate with a temperature of the working disks that is still too low at the beginning In particular after longer downtime, the working disks and if applicable the support disks can cool below the operating temperature. In the course of the processing runs described in the prior art, the working disks are then successively heated until they have reached their operating temperature and the specified processing results have thus been achieved. As also explained above, this procedure leads, however, to reduced throughput or respectively increased costs.
  • the invention is therefore based on the idea of providing an external heating apparatus or respectively an external heating source with which at least the top and bottom working disks are heated before a first processing step to prevent the heating runs described above.
  • the external heating apparatus or respectively external heating source is in this case provided in addition to the components of the double-sided processing machine provided for the processing of the workpieces and is correspondingly not formed by processing workpieces in the working gap.
  • heat is also generated so that, after several heating runs, the working disks reach their operating temperature and the processing result thus meets the required criteria.
  • a heating apparatus is provided that is separate from this and that achieves a heating of the working disks even without processing workpieces in the working gap.
  • the heating step according to the invention, no workpieces to be processed are arranged in the working gap.
  • the heating runs explained above are avoided. Accordingly, after the conclusion of the heating step, a processing step can directly follow, wherein the workpieces processed hereby already meet the target parameters in the first processing run.
  • the throughput of the double-sided processing machine is increased accordingly and the costs are reduced.
  • the operating temperature of the top working disk and the bottom working disk can be, for example, in a range between 20° C. and 30° C., for example about 25° C.
  • support disks holding the working disks can of course also be heated to an operating temperature with the heating apparatus. This ensures that the working disks can hold their operating temperature at all times.
  • the processing steps comprise in particular material-removing processing of the workpieces, for example, polishing, lapping, or grinding.
  • multiple workpieces can be mounted in a floating manner in recesses of what are known as rotor disks for this purpose.
  • the rotor disks move, on one hand, along a circular path through the working gap and, on the other hand, rotate about their own axis.
  • the rotor disks can roll, for example, on sprockets on the inner and/or outer edge of the working gap.
  • the heating step can be controlled or respectively regulated, in particular initiated and terminated, by a control apparatus and/or a regulation apparatus of the double-sided processing machine.
  • the regulation apparatus can use in particular the temperature of the heating source and the duration of the heating step as regulation parameters.
  • the heating step can be controlled or respectively regulated by the control apparatus or respectively regulation apparatus.
  • a heated heating liquid is conducted into the working gap in the heating step.
  • This can be, for example, water heated by means of a heating source.
  • the heating liquid can have, for example, a somewhat higher temperature than the desired operating temperature, for example 5 to 10° C. higher.
  • the heating liquid can be conducted into the working gap through supply openings for a slurry.
  • the top working disk and/or the bottom working disk can have such supply openings for slurry to be supplied to the working gap.
  • the heating liquid can be conducted into the working gap through these, whereby at the same time a particularly even distribution of the heating liquid in the working gap is ensured.
  • the supply openings are designed, for example, as axial bores in the top working disk and/or the bottom working disk.
  • the working disks can be rotated in the same direction of rotation, in particular in the same direction, further particularly with the same rotational speed, by means of a rotary drive.
  • An even heating of the working disks, in particular of the entire radial extent of the working disks, and if applicable the support disks, can thereby be achieved, wherein the polishing pads are not influenced.
  • the working disks are not rotated, meaning stay still, during the heating step.
  • the working disks can be held during the heating step by spacers between the working disks or by locking a mount of the top and/or the bottom working disk at a defined distance to each other. This achieves a particularly defined and effective heating of the working disks and if applicable the support disks.
  • the top working disk and/or the bottom working disk can be settable in height by means of a corresponding mount in order to thus set the working gap in a defined manner. This setting can be used according to the previous exemplary embodiment in order to ensure a defined distance between the working disks during the heating step.
  • To lock the working disks for example, what are known as clamping shoes can be used.
  • the spacers can be held in the gap, for example, by setting a narrower gap in the radially outer region of the working gap than in the radially inner region of the working gap.
  • heated heating liquid can be conducted in the heating step through tempering channels designed in the top working disk and/or in the bottom working disk.
  • top working disks and/or bottom working disks of double-sided processing machines have tempering channels, through which a cooling liquid, for example water, is conducted during workpiece processing in order to prevent an undesired heating of the working disks during processing.
  • tempering channels configured in the top working disk and/or the bottom working disk can be used in the previous embodiment in a particularly practical manner in that, during the heating step, a heating liquid heated in a defined manner is conducted through the tempering channels instead of a cooling liquid and thus the heating of the working disks is realized effectively.
  • corresponding tempering channels can be designed between the top working disk and a top support disk and/or between a bottom working disk and a bottom support disk. It would also be conceivable for corresponding tempering channels to be designed in a top support disk and/or a bottom support disk. Accordingly, the heated heating liquid can also be conducted through tempering channels designed in this manner.
  • At least the working disks can be heated to an operating temperature in the heating step by means of an electrical heating apparatus, in particular by means of at least one electrical heating mat.
  • an electrical heating apparatus for example, an electrical heating mat
  • Such an electrical heating apparatus can be configured, for example, in the top working disk and/or the bottom working disk, in a top support disk and/or a bottom support disk and/or between a top working disk and a top support disk and/or a bottom working disk and a bottom support disk.
  • the temperature of the top working disk and/or the bottom working disk can be measured during the heating step, and the heating step can be terminated after the operating temperature has been reached, as determined by the temperature measurement.
  • temperature sensors for example, can be configured in the top working disk and/or the bottom working disk which measure the temperature of the top working disk and/or the bottom working disk during the heating step. If the temperature sensors detect that the operating temperature has been reached, the heating step can be terminated. The heating step can be terminated automatically after the operating temperature detected in this way has been reached.
  • the temperature measurement values of corresponding temperature sensors can be applied for this purpose to a control and/or regulation apparatus and the control and/or regulation of the heating step can be based on them accordingly.
  • An embodiment of the double-sided processing machine can be configured to perform the disclosed inventive method. Accordingly, the method according to the invention can be performed with a double-sided processing machine according to the invention.
  • FIG. 1 illustrates a sectional view of an embodiment of a double-sided processing machine
  • FIG. 2 illustrates a diagram of an embodiment of a method of operating a double-sided processing machine.
  • the double-sided processing machine shown in FIG. 1 in which it can be, for example, a double-sided polishing machine, has an annular top working disk 10 and a likewise annular bottom working disk 12 . Between the working disks 10 , 12 , an annular working gap 14 is formed in which flat workpieces, for example, semiconductor wafers, can be processed, for example polished. As explained, the workpieces can be mounted in a floating manner in recesses of what are known as rotor disks. The rotor disks can be moved along a circular path through the working gap 14 and in doing so rotate about their own axis. For this purpose, the rotor disks can roll, for example, on sprockets on the inner and/or outer edge of the working gap 14 . This is known per se and is therefore not explained in more detail.
  • the top working disk 10 is fastened to a top support disk 16
  • the bottom working disk 12 is fastened to a bottom support disk 18 .
  • the top support disk 16 and the bottom support disk 18 and with them the top working disk 10 and the bottom working disk 12 , are rotated relative to each other about an axis of rotation 20 by means of a rotary drive which is not shown in more detail.
  • the working disks 10 , 12 or respectively the support disks 16 , 18 can be driven to rotate in opposite directions.
  • FIG. 1 various further components of the top and bottom working disks 10 , 12 are shown, wherein they are shown only for one of the working disks 10 , 12 for reasons of clarity. It should be understood that the corresponding components, described in more detail in the following, can be configured in both working disks 10 , 12 .
  • the top working disk 10 has supply lines 22 for supplying a slurry to the working gap 14 .
  • the supply lines 22 each have supply openings 23 opening into the working gap 14 .
  • distance sensors 24 for example, eddy current sensors 24 , are provided in the top working disk 10 and measure the distance to the workpieces to be processed and thus their thickness at different radial locations of the working gap 14 during workpiece processing.
  • multiple temperature sensors 26 are also designed in the top working disk 10 , which sensors measure the temperature at least of the top working disk 10 in particular during a heating step but also, for example, during a processing step. As explained, temperature sensors can also be provided in the bottom working disk 12 .
  • the measurement results from the temperature sensors 26 are applied to a control and/or regulation apparatus 28 of the double-sided processing machine. This controls or respectively regulates the operation of the double-sided processing machine, including a heating step still to be explained in the following.
  • a heating element 30 is also shown schematically in the bottom working disk 12 .
  • the heating element 30 can be, for example, an electrical heating element 30 , for example an electrical heating mat 30 .
  • the heating element 30 can also be a, for example, labyrinthine arrangement of tempering channels 30 through which heated heating liquid is conducted in a heating step, as will also be explained below.
  • the heating element 30 can in turn also be configured in the top working disk 10 . The same applies to the top support disk 16 and the bottom support disk 18 .
  • the temperature of the top working disk 10 and the bottom working disk 12 is first brought to a specified operating temperature in a heating step.
  • a heating step This can be controlled or respectively regulated by the control and/or regulation apparatus 28 .
  • heated heating liquid can be conducted into the working gap 14 in the heating step through the supply lines 22 and the supply openings 23 .
  • the working disks 10 , 12 and the support disks 16 , 18 can be rotated in the working gap 14 during the supply of the heating liquid.
  • the working disks 10 , 12 can be held at a defined distance from each other, for example by locking a mount of the top working disk 10 and/or of the bottom working disk 12 .
  • the temperature sensors 26 can detect when the specified operating temperature has been reached.
  • the control and/or regulation apparatus 28 can then terminate the heating step.
  • workpieces can be processed in one or more processing steps, in particular material-removing processing, for example, polishing, lapping, or grinding.
  • heated heating liquid can be conducted through the tempering channels 30 in the heating step and the temperature of the working disks 10 , 12 can thereby be heated to the specified operating temperature. It is further possible alternatively or additionally to heat at least the working disks 10 , 12 to the operating temperature in the heating step by means of the electrical heating apparatus 30 , in particular the heating mat 30 . Detecting the operating temperature and the corresponding termination of the heating step can take place, as explained above, by the control and/or regulation apparatus 28 . The control and/or regulation apparatus 28 can use the temperature of the supplied heating liquid, the heating output of the electrical heating apparatus 30 and the duration of the heating step as control and/or regulation parameters. When the working disks 10 , 12 are rotated, the rotational speed of the working disks 10 , 12 can also be used.
  • FIG. 2 shows a diagram with results of a heating according to the prior art and according to the disclosed device/method.
  • the GBIR value is shown normalized in each case over the number of heating runs of the double-sided processing machine.
  • the curve 32 refers to the case in which the double-sided processing machine was not operated for three nights and days at room temperature and then was used to process workpieces in processing steps without a heating step according to the invention. It is shown that three heating runs were required in order to reach a specified GBIR value, which should be as close to 1 as possible in the normalized version.
  • the curve 34 describes a case corresponding to the curve 32 , wherein the double-sided processing machine stood idle, however, for only one night at room temperature.
  • the number of required heating runs until the desired GBIR value is reached is shortened to one run.
  • a corresponding throughput loss or respectively a corresponding cost increase is still registered.
  • the curve 36 shows the results for a double-sided processing machine which has stood idle for one night at room temperature and in which a heating step according to the invention was performed before the first processing step (run one).
  • the curve 36 shows that the first processing run here already has the desired GBIR value. Corresponding throughput loss or respectively corresponding cost increases could be avoided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
US17/747,575 2021-05-20 2022-05-18 Method for operating a double-sided processing machine and double-sided processing machine Pending US20220371154A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021113131.6 2021-05-20
DE102021113131.6A DE102021113131A1 (de) 2021-05-20 2021-05-20 Verfahren zum Betreiben einer Doppelseitenbearbeitungsmaschine sowie Doppelseitenbearbeitungsmaschine

Publications (1)

Publication Number Publication Date
US20220371154A1 true US20220371154A1 (en) 2022-11-24

Family

ID=81325319

Family Applications (1)

Application Number Title Priority Date Filing Date
US17/747,575 Pending US20220371154A1 (en) 2021-05-20 2022-05-18 Method for operating a double-sided processing machine and double-sided processing machine

Country Status (7)

Country Link
US (1) US20220371154A1 (https=)
EP (1) EP4091767B1 (https=)
JP (1) JP2022179370A (https=)
KR (1) KR20220157305A (https=)
CN (1) CN115365920A (https=)
DE (1) DE102021113131A1 (https=)
TW (1) TW202300276A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042691A1 (ja) * 2024-08-20 2026-02-26 Ａｇｃ株式会社 ワークを研磨する方法、および当該方法を用いて研磨されたワーク

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1257046A (en) * 1918-01-02 1918-02-19 Edward A Suverkrop Lapping-machine.
US20020081950A1 (en) * 2000-12-22 2002-06-27 Sujit Sharan Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
US20060040589A1 (en) * 2004-08-20 2006-02-23 Ulrich Ising Double sided polishing machine
US20100279435A1 (en) * 2009-04-30 2010-11-04 Applied Materials, Inc. Temperature control of chemical mechanical polishing
US20140235143A1 (en) * 2013-02-15 2014-08-21 Siltronic Ag Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers
US20150306728A1 (en) * 2014-04-23 2015-10-29 Silicon Quest International, Incorporated Systems for, methods of, and apparatus for processing substrate surfaces
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
US20210394331A1 (en) * 2020-06-17 2021-12-23 Globalwafers Co., Ltd. Semiconductor substrate polishing with polishing pad temperature control

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11104951A (ja) * 1997-10-02 1999-04-20 Speedfam Co Ltd ラッピング加工方法
DE10007390B4 (de) 1999-03-13 2008-11-13 Peter Wolters Gmbh Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern
EP1175964A3 (en) * 2000-07-27 2003-07-23 Agere Systems Guardian Corporation Polishing surface temperature conditioning system for a chemical mechanical planarization process
US6599175B2 (en) * 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
JP2003257914A (ja) * 2002-02-27 2003-09-12 Fujitsu Ltd 化学機械研磨方法と装置、及び半導体装置の製造方法
US7201634B1 (en) 2005-11-14 2007-04-10 Infineon Technologies Ag Polishing methods and apparatus
DE102006032455A1 (de) * 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit
DE102007011880A1 (de) * 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
CN102782807B (zh) * 2010-01-22 2015-07-08 芝浦机械电子装置股份有限公司 基板处理装置及基板处理方法
JP5411739B2 (ja) 2010-02-15 2014-02-12 信越半導体株式会社 キャリア取り付け方法
DE102016102223B4 (de) * 2016-02-09 2025-10-16 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine und Verfahren zum Betreiben einer Doppel- oder Einseiten-Bearbeitungsmaschine
CN110707028A (zh) * 2019-10-18 2020-01-17 长江存储科技有限责任公司 晶圆热处理装置及晶圆热处理方法
CN211193456U (zh) * 2019-12-11 2020-08-07 北京微纳精密机械有限公司 一种便于控制抛光盘温度的化学机械抛光机

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1257046A (en) * 1918-01-02 1918-02-19 Edward A Suverkrop Lapping-machine.
US20020081950A1 (en) * 2000-12-22 2002-06-27 Sujit Sharan Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
US20060040589A1 (en) * 2004-08-20 2006-02-23 Ulrich Ising Double sided polishing machine
US20100279435A1 (en) * 2009-04-30 2010-11-04 Applied Materials, Inc. Temperature control of chemical mechanical polishing
US20140235143A1 (en) * 2013-02-15 2014-08-21 Siltronic Ag Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers
US20150306728A1 (en) * 2014-04-23 2015-10-29 Silicon Quest International, Incorporated Systems for, methods of, and apparatus for processing substrate surfaces
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
US20210394331A1 (en) * 2020-06-17 2021-12-23 Globalwafers Co., Ltd. Semiconductor substrate polishing with polishing pad temperature control

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Translation of CN-110549239-A (Year: 2019) *

Also Published As

Publication number Publication date
TW202300276A (zh) 2023-01-01
EP4091767A1 (de) 2022-11-23
EP4091767B1 (de) 2026-03-04
JP2022179370A (ja) 2022-12-02
EP4091767C0 (de) 2026-03-04
DE102021113131A1 (de) 2022-11-24
CN115365920A (zh) 2022-11-22
KR20220157305A (ko) 2022-11-29

Similar Documents

Publication Publication Date Title
KR100315162B1 (ko) 반도체 웨이퍼의 연마 방법 및 그 장치
TWI774805B (zh) 晶圓加工方法
KR20130095626A (ko) 폴리싱 중 온도를 제어하기 위한 장치 및 방법
JP7005743B2 (ja) ホットウォールフラックスフリーはんだボール処理装置
KR20180075669A (ko) 웨이퍼 연마 방법 및 연마 장치
US20220371154A1 (en) Method for operating a double-sided processing machine and double-sided processing machine
KR102735236B1 (ko) 다수의 각도적 가압 가능한 구역들을 갖는 연마 캐리어 헤드
US20250319569A1 (en) Chemical mechanical polishing correction tool
KR101943213B1 (ko) 웨이퍼 마운팅 장치
JP6539467B2 (ja) 研削加工装置
KR102382807B1 (ko) 연마장치 및 웨이퍼의 연마방법
US7156933B2 (en) Configuration and method for mounting a backing film to a polish head
JP2016193458A (ja) ワーク加工装置
CN110303423B (zh) 工件的研磨方法及研磨装置
JP2019206076A (ja) 研削加工装置
KR100772270B1 (ko) 웨이퍼 휨 현상의 방지를 위한 급속 열처리 장치 및 방법
JP6712841B2 (ja) 研削加工方法
US20220362903A1 (en) Multiple polishing heads with cross-zone pressure element distributions for cmp
JP2024097548A (ja) 加工装置
KR101453683B1 (ko) 웨이퍼 에지 연마 장치 및 웨이퍼 에지 연마 방법
KR20190058939A (ko) 화학 기계적 연마 장치 및 화학 기계적 연마 방법
JP2940620B2 (ja) 液処理装置
US20160107183A1 (en) Application of Fluids to Substrates
CN110064999B (zh) 一种研磨设备和研磨台的调节方法
JP2020136445A (ja) ウエーハの加工方法

Legal Events

Date Code Title Description
STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

AS Assignment

Owner name: LAPMASTER WOLTERS GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:RAVLIC, ROBERT;REEL/FRAME:061291/0018

Effective date: 20220822

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

Free format text: NON FINAL ACTION COUNTED, NOT YET MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION COUNTED, NOT YET MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED