JP2022179370A5 - - Google Patents

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Publication number
JP2022179370A5
JP2022179370A5 JP2022074481A JP2022074481A JP2022179370A5 JP 2022179370 A5 JP2022179370 A5 JP 2022179370A5 JP 2022074481 A JP2022074481 A JP 2022074481A JP 2022074481 A JP2022074481 A JP 2022074481A JP 2022179370 A5 JP2022179370 A5 JP 2022179370A5
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JP
Japan
Prior art keywords
double
designed
processing machine
carry out
heating
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Pending
Application number
JP2022074481A
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English (en)
Japanese (ja)
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JP2022179370A (ja
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Publication date
Priority claimed from DE102021113131.6A external-priority patent/DE102021113131A1/de
Application filed filed Critical
Publication of JP2022179370A publication Critical patent/JP2022179370A/ja
Publication of JP2022179370A5 publication Critical patent/JP2022179370A5/ja
Pending legal-status Critical Current

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JP2022074481A 2021-05-20 2022-04-28 両面加工機械の運転方法および両面加工機械 Pending JP2022179370A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021113131.6 2021-05-20
DE102021113131.6A DE102021113131A1 (de) 2021-05-20 2021-05-20 Verfahren zum Betreiben einer Doppelseitenbearbeitungsmaschine sowie Doppelseitenbearbeitungsmaschine

Publications (2)

Publication Number Publication Date
JP2022179370A JP2022179370A (ja) 2022-12-02
JP2022179370A5 true JP2022179370A5 (https=) 2024-05-15

Family

ID=81325319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022074481A Pending JP2022179370A (ja) 2021-05-20 2022-04-28 両面加工機械の運転方法および両面加工機械

Country Status (7)

Country Link
US (1) US20220371154A1 (https=)
EP (1) EP4091767B1 (https=)
JP (1) JP2022179370A (https=)
KR (1) KR20220157305A (https=)
CN (1) CN115365920A (https=)
DE (1) DE102021113131A1 (https=)
TW (1) TW202300276A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042691A1 (ja) * 2024-08-20 2026-02-26 Ａｇｃ株式会社 ワークを研磨する方法、および当該方法を用いて研磨されたワーク

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1257046A (en) * 1918-01-02 1918-02-19 Edward A Suverkrop Lapping-machine.
JPH11104951A (ja) * 1997-10-02 1999-04-20 Speedfam Co Ltd ラッピング加工方法
DE10007390B4 (de) 1999-03-13 2008-11-13 Peter Wolters Gmbh Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern
EP1175964A3 (en) * 2000-07-27 2003-07-23 Agere Systems Guardian Corporation Polishing surface temperature conditioning system for a chemical mechanical planarization process
US6488571B2 (en) * 2000-12-22 2002-12-03 Intel Corporation Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
US6599175B2 (en) * 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
JP2003257914A (ja) * 2002-02-27 2003-09-12 Fujitsu Ltd 化学機械研磨方法と装置、及び半導体装置の製造方法
DE102004040429B4 (de) * 2004-08-20 2009-12-17 Peter Wolters Gmbh Doppelseiten-Poliermaschine
US7201634B1 (en) 2005-11-14 2007-04-10 Infineon Technologies Ag Polishing methods and apparatus
DE102006032455A1 (de) * 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit
DE102007011880A1 (de) * 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
US20100279435A1 (en) * 2009-04-30 2010-11-04 Applied Materials, Inc. Temperature control of chemical mechanical polishing
CN102782807B (zh) * 2010-01-22 2015-07-08 芝浦机械电子装置股份有限公司 基板处理装置及基板处理方法
JP5411739B2 (ja) 2010-02-15 2014-02-12 信越半導体株式会社 キャリア取り付け方法
DE102013202488B4 (de) * 2013-02-15 2015-01-22 Siltronic Ag Verfahren zum Abrichten von Poliertüchern zur gleichzeitig beidseitigen Politur von Halbleiterscheiben
US20150306728A1 (en) * 2014-04-23 2015-10-29 Silicon Quest International, Incorporated Systems for, methods of, and apparatus for processing substrate surfaces
DE102016102223B4 (de) * 2016-02-09 2025-10-16 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine und Verfahren zum Betreiben einer Doppel- oder Einseiten-Bearbeitungsmaschine
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
CN110707028A (zh) * 2019-10-18 2020-01-17 长江存储科技有限责任公司 晶圆热处理装置及晶圆热处理方法
CN211193456U (zh) * 2019-12-11 2020-08-07 北京微纳精密机械有限公司 一种便于控制抛光盘温度的化学机械抛光机
US20210394331A1 (en) * 2020-06-17 2021-12-23 Globalwafers Co., Ltd. Semiconductor substrate polishing with polishing pad temperature control

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