CN115365920A - Method for operating a double-sided processing machine and double-sided processing machine - Google Patents
Method for operating a double-sided processing machine and double-sided processing machine Download PDFInfo
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- CN115365920A CN115365920A CN202210510241.5A CN202210510241A CN115365920A CN 115365920 A CN115365920 A CN 115365920A CN 202210510241 A CN202210510241 A CN 202210510241A CN 115365920 A CN115365920 A CN 115365920A
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- 238000012545 processing Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 96
- 238000003754 machining Methods 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 16
- 238000005498 polishing Methods 0.000 claims description 10
- 239000000725 suspension Substances 0.000 claims description 8
- 238000005496 tempering Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 description 16
- 238000005485 electric heating Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention relates to a method for operating a double-sided processing machine and to a double-sided processing machine having an upper and a lower work plate which can be rotated relative to one another by means of a rotary drive and between which a working gap for processing flat workpieces is formed, wherein at least the work plates are heated to an operating temperature by means of a heating device in a heating step before a processing step for processing the workpieces. The invention also relates to a corresponding double-sided processing machine.
Description
Technical Field
The invention relates to a method for operating a double-side processing machine, in particular a double-side polishing machine, having an upper and a lower working disk, which are rotatable relative to each other by means of a rotary drive and between which a working gap for processing flat workpieces is formed.
The invention further relates to a double-side processing machine, in particular a double-side polishing machine, having an upper working disk and a lower working disk, between which a working gap for processing flat workpieces is formed, and having a rotary drive, by means of which the upper working disk and the lower working disk can be rotated relative to one another.
Background
In double-side processing machines, for example double-side polishing machines, flat workpieces, such as semiconductor wafers, are processed, for example polished, in a working gap formed between an upper and a lower work plate. During the machining, the working disks are rotated relative to one another by means of a rotary drive. The flat workpiece can, for example, be located in the gap of a so-called rotary table, which during the machining moves along a circular path through the working gap and rotates about its axis. The workpiece is thus guided along a circular path through the working gap and machined. With such a double-sided processing machine, a very high surface quality, in particular a very high flatness, of the processed workpiece can be achieved. An important parameter for the quality of the processing is, for example, the GBIR value (Global back side Ideal Focal Plane Range).
During the machining of workpieces, in particular of abraded material, so-called suspensions (slury) are often fed into the working gap. For this purpose, the upper working disk and/or the lower working disk can have corresponding feed openings. It is also known to provide, for example, the upper and/or lower working disk with, for example, labyrinth-like temperature control channels, through which a cooling fluid, for example water, is conducted during the machining process in order to maintain the working disk at a predetermined operating temperature during the machining step. It is further known to measure the thickness of the machined workpiece during the machining step, for example at a plurality of radially spaced-apart locations of the working gap, and to end the machining step after a predetermined target thickness has been reached. Different sensors, for example eddy current sensors or also optical sensors, are known for thickness measurement.
In practice, it has been shown that, in particular after a long downtime of the double-sided machine, the processing result of the first processing operation carried out after the end of the downtime is not yet optimized. Thus, for example, the predetermined GBIR value is usually reached after a plurality of processing steps, wherein the number of processing steps required for this purpose appears to depend on the duration of the downtime of the double-side processing machine. During such a machining process, the machined workpiece up to the predetermined quality standard has a non-optimized machining result and is only used for smaller quality requirements, in particular, may not be used as a so-called positive (Prime) wafer. As long as test workpieces are used for the machining process for achieving the requirements for an optimized machining quality, rejects can be avoided. However, this results in a smaller processing capacity of the processing machine and a correspondingly higher outlay.
Disclosure of Invention
Starting from the explained prior art, the object of the present invention is to provide a method and a double-side processing machine of the type mentioned at the outset, with which the throughput of the double-side processing machine can be increased even after relatively long downtimes, and with which the costs can be reduced accordingly, compared to the prior art.
The invention solves the object by means of the independent claims 1 and 9. Advantageous embodiments are apparent from the dependent claims, the description and the drawings.
In a method of the type mentioned at the beginning, the invention solves the problem of heating at least the working disk to an operating temperature in a heating step before a machining step for machining the workpiece by means of a heating device. The invention is based on the object of providing a double-sided processing machine of the type mentioned at the outset with a heating device for heating at least the work plate to an operating temperature in a heating step preceding the processing step for processing the workpiece.
The double-side processing machine may be, for example, a double-side polisher. However, other double-side processing machines, such as double-side grinding machines or double-side grinding machines, are also conceivable. The working discs may each have a working surface, such as a polishing pad. The flat workpiece may be, for example, a semiconductor wafer. The upper working plate can be fixed on the upper bearing plate. Correspondingly, the lower work plate can be fixed to the lower carrier plate. The working discs can be rotated relative to each other during machining of a workpiece in a working gap formed between the working discs. Corresponding rotary drives are provided for this purpose. For example, the working disks can be driven in counter-rotation with respect to one another.
The invention is based on the recognition that the required machining process described at the outset until a predetermined machining quality is reached is associated with an initially still too low temperature of the working disk. In particular, after long downtimes, the working disks and possibly the carrier disks cool down below the operating temperature. During the operation of the machining process described in the prior art, the heating of the working disk is then continued until the working disk has reached its operating temperature and thus a predetermined machining result is achieved. As also explained at the outset, this approach of course leads to reduced processing capacity or increased costs.
The invention is therefore based on the idea of providing, in order to avoid the heating process described at the outset, an external heating device or an external heat source, with which at least the upper and lower work discs are heated before the first processing step. In this case, the external heating device or the external heat source is provided in addition to the components of the double-sided processing machine provided for processing the workpiece and is accordingly not formed by processing the workpiece in the working gap. As explained, heat is also generated in such a process, so that after some heating process the working disk reaches its operating temperature and thus the process result meets the required criteria. However, according to the invention, a separate heating device is provided, which also heats the work plate without the workpiece being machined in the working gap. In particular, no workpieces to be machined are arranged in the working gap during the heating step according to the invention. The heating process explained at the outset is avoided. Accordingly, a machining step can be directly followed after the end of the heating step, wherein the workpiece machined in this way already meets the target parameters during the first machining process. The processing capacity of the double-sided processing machine is correspondingly increased and the costs are reduced. The operating temperature of the upper and lower working disks may, for example, lie in a range between 20 ℃ and 30 ℃, for example approximately 25 ℃.
In addition to the working disks, it is of course also possible for the carrier disks holding the working disks, provided they are provided, to be heated to the operating temperature by means of a heating device. This ensures that the operating disk can maintain its operating temperature under any circumstances.
After the heating step, one or more processing steps are followed as explained for processing the workpiece in the working gap of the double-sided processing machine. The machining step comprises in particular the machining, for example polishing, lapping or grinding, of an abrasive material of the workpiece. As explained at the outset, for this purpose, a plurality of workpieces can be supported in a floating manner in the recesses of the so-called rungs. The carousel moves on the one hand along a circular path through the working gap and on the other hand rotates about its own axis. The workpiece thus moves in a cycloidal orbit through the working gap, whereby optimum machining results are achieved. The running disks can roll, for example, on a toothed ring on the inner and/or outer edge of the running gap.
The heating step can be controlled or regulated, in particular started and ended, by a control device and/or a regulating device of the double-side processing machine. The regulating device may in particular use the temperature of the heat source and the duration of the heating step as regulating parameters. The rotational speed of the working disk can also be used, for example, during the rotation of the working disk during the heating step. Correspondingly, the heating step may be controlled or regulated by a control device or a regulating device.
According to one embodiment, the heated heating liquid is guided into the working gap during the heating step. It may be, for example, water heated by means of a heat source. The heated liquid may for example have a slightly higher temperature than the desired operating temperature, for example 5 to 10 ℃ higher.
In a particularly practical manner, the heating liquid can be guided into the working gap through the delivery opening for the suspension. As explained at the outset, the upper working disk and/or the lower working disk can have such a feed opening for the suspended solids to be fed into the working gap. By means of these delivery openings, the heating liquid can be guided into the working gap, whereby at the same time a particularly uniform distribution of the heating liquid in the working gap is ensured. The feed openings are formed, for example, as axial bores of the upper and/or lower working disks.
During the heating step, the working disks can be rotated by means of the rotary drive in the same direction of rotation, in particular in the same direction, and further in particular at the same rotational speed. This makes it possible to achieve a complete radial expansion of the working disk, in particular of the working disk, and, if appropriate, a uniform heating of the carrier disk, without any effect on the polishing pad taking place. However, it is also possible that the working disk does not rotate, i.e. is stationary, during the heating step.
The working discs may be held during the heating step by distance holders between the working discs or by a locking of the suspension of the upper and/or lower working discs at a defined distance from each other. This achieves a particularly defined and effective heating of the working disk and, if appropriate, of the carrier disk. The upper and/or lower working disk can be adjustable in height by means of a corresponding suspension, in order to thus define an adjustment of the working gap. This adjustment can be utilized according to the above-mentioned embodiments in order to ensure a defined distance between the working discs during the heating step. For locking the working disk, so-called clamping shoes can be used, for example. However, it is also possible to ensure a defined distance between the working gaps by using suitable distance holders between the working disks. The distance holder can be held in the gap, for example, by setting a narrower gap in the region radially outside the working gap than in the region radially inside the working gap.
In a further embodiment, the heated liquid heated in the heating step can be guided through a temperature control channel formed in the upper and/or lower working plate. As also explained at the outset, for example, the upper and/or lower work plate of a double-sided processing machine has a temperature control channel, through which a coolant, for example water, is conducted during the processing of workpieces in order to prevent undesired heating of the work plate during the processing. These temperature control channels, which are formed, for example, in a labyrinth-like manner in the upper and/or lower working disks, can be used in the above-mentioned design in a particularly practical manner by: instead of the cooling liquid, the heated and defined heating liquid is guided through the temperature control channel during the heating step and thus effectively heats the working plate. It is of course also possible to form corresponding temperature control channels between the upper work plate and the upper carrier plate and/or between the lower work plate and the lower carrier plate. It is also conceivable to form corresponding temperature control channels in the upper carrier plate and/or the lower carrier plate. Correspondingly, the heated heating liquid can also be guided through the temperature control channel formed in this way.
In a further embodiment, at least the work plate can be heated to the operating temperature in the heating step by means of an electrical heating device, in particular by means of at least one electrical heating mat. Such an electric heating device, for example an electric heating mat, can be formed, for example, in the upper and/or lower work plate, in the upper and/or lower carrier plate and/or between the upper work plate and the upper carrier plate and/or between the lower work plate and the lower carrier plate. A particularly rapid and defined heating of the work disk can be achieved with such an electrical heating device.
According to a further embodiment, the temperature of the upper and/or lower working disk can be measured during the heating step, and the heating step can be ended after the operating temperature has been reached, as determined by the temperature measurement. For this purpose, a temperature sensor may be formed, for example, in the upper and/or lower work plate, which temperature sensor measures the temperature of the upper and/or lower work plate during the heating step. If the temperature sensor determines that the operating temperature is reached, the heating step may be ended. The end of the heating step can be carried out automatically after the operating temperature thus determined has been reached. The temperature measured values of the respective temperature sensors can be used for this purpose on the control and/or regulating device and accordingly form the basis for the control and/or regulation of the heating step.
The double-sided processing machine according to the invention can be designed to carry out the method according to the invention. Correspondingly, the method according to the invention can be carried out with a double-sided processing machine according to the invention.
Drawings
Embodiments of the invention are explained further below with the aid of the figures. Schematically showing:
FIG. 1 shows a cross-sectional view of a double-sided machine according to the invention; and
fig. 2 shows a diagram for explaining the method according to the invention.
Detailed Description
The same reference numerals denote the same objects in the drawings unless otherwise specified.
The double-side processing machine, which can be a double-side polishing machine, is shown in fig. 1 and has an annular upper working disk 10 and an likewise annular lower working disk 12. An annular working gap 14 is formed between the working disks 10, 12, in which a flat workpiece, for example a semiconductor wafer, can be processed, for example polished. The workpiece can be supported in a floating manner in the recesses of a so-called flight disk, as explained. The running disks can be moved along a circular path through the working gap 14 and can be rotated about their axis. For this purpose, the running disks can roll, for example, on a toothed ring on the inner and/or outer edge of the running gap 14. This is known per se and is therefore not explained further.
The upper work plate 10 is fixed to the upper carrier plate 16 and the lower work plate 12 is fixed to the lower carrier plate 18. During the processing of the workpieces in the working gap 14, the upper carrier plate 16 and the lower carrier plate 18, and together with the upper working plate 10 and the lower working plate 12, are rotated relative to one another about the axis of rotation 20 by means of a rotary drive, not illustrated in detail. For example, the working disks 10, 12 or the carrier disks 16, 18 can be driven in a counter-rotating manner.
Fig. 1 shows various further components of the upper and lower working disks 10, 12, wherein for clarity, these components are shown only for one of the working disks 10, 12. Of course, corresponding components, which are explained further below, can be formed in both working disks 10, 12.
The above working disk 10 has in the example shown a feed line 22 for feeding suspension into the working gap 14. The conveying lines 22 have conveying openings 23 which open into the working gap 14. Furthermore, in the upper working disk 10 in fig. 1, a distance sensor 24, for example an eddy current sensor 24, is provided, which measures the distance to the workpiece to be machined during the machining of the workpiece and thereby its thickness at different radial positions of the working gap 14. Furthermore, in fig. 1, a plurality of temperature sensors 26 are formed in the upper work plate 10, which temperature sensors measure the temperature of at least the upper work plate 10, in particular during the heating step, but also, for example, during the processing step. As explained, a temperature sensor can likewise be provided in the lower operating disk 12. The same applies to the upper carrier plate 16 and the lower carrier plate 18. The measurement result of the temperature sensor 26 is present in the example shown on a control and/or regulating device 28 of the perfecting machine. The control and/or regulating device controls or regulates the operation of the double-side processing machine, including the heating step as will be explained further below.
The heating element 30 is furthermore shown schematically in the lower operating disk 12. The heating element 30 may be, for example, an electric heating element 30, for example, an electric heating mat 30. The heating element 30 may, however, also be an arrangement of the tempering channel 30, for example in the shape of a labyrinth, through which the heated heating liquid is guided during the heating step, as is also explained below. The heating element 30 can again also be formed in the upper work plate 10. The same applies to the upper carrier plate 16 and the lower carrier plate 18.
In the method according to the invention, the upper working disk 10 and the lower working disk 12 are initially brought to a predetermined operating temperature in the heating step before the machining step for machining the workpiece in the working gap 14. This can be controlled or regulated by the control and/or regulating device 28. The heated heating liquid can be guided into the working gap 14, for example, in a heating step through the conveying conduit 22 and the conveying opening 23. The working discs 10, 12 and the carrier discs 16, 18 may be rotated during the delivery of the heating liquid into the working gap 14. During the heating step, the working discs 10, 12 may be kept at a defined distance from each other, for example by locking the suspension of the upper working disc 10 and/or the lower working disc 12. Attainment of the predetermined operating temperature may be determined by the temperature sensor 26. The control and/or regulating device 28 may then end the heating step. The workpiece can then be machined, in particular the abrasive material, for example by polishing, grinding or milling, in one or more machining steps.
Alternatively or additionally, the heated liquid heated in the heating step can be guided through the tempering channel 30 and thus the temperature of the working disks 10, 12 can be heated to a predetermined operating temperature. It is further alternatively or additionally possible to heat at least the working disks 10, 12 to the operating temperature in the heating step by means of an electrical heating device 30, in particular a heating mat 30. The determination of the operating temperature and the corresponding termination of the heating step can be carried out by means of the control and/or regulating device 28 as explained above. The control and/or regulating device 28 can use the temperature of the delivered heating liquid, the heating power of the electric heating device 30 and the duration of the heating step as control and/or regulating parameters. The rotational speed of the working disks 10, 12 can also be used when the working disks 10, 12 are rotating.
Fig. 2 shows a graph comprising the results of heating according to the prior art and according to the invention. In this case, the GBIR values normalized by the number of heating processes of the double-sided processing machine are shown in each case. Curve 32 relates to the case in which the double-sided processing machine is not operated at room temperature for three days and nights and is then used to process the workpiece in a processing step without a heating step according to the invention. It is shown that three heating courses are required in order to reach a predetermined GBIR value, which in a standardized version should be as 1 as possible.
List of reference numerals
Working plate above 10
Working plate under 12
14 working gap
16 upper bearing plate
Tray under 18
20 axis of rotation
22 delivery catheter
23 delivery opening
24 distance sensor
26 temperature sensor
28 control and/or regulating device
30 heating element
32 curve line
Claims (10)
1. Method for operating a double-side processing machine, in particular a double-side polishing machine, having an upper working disk (10) and a lower working disk (12), which can be rotated relative to each other by means of a rotary drive and between which a working gap (14) for processing flat workpieces is formed, characterized in that at least the working disks (10, 12) are heated to an operating temperature by means of a heating device (30) in a heating step before a processing step for processing workpieces.
2. Method according to claim 1, characterized in that the heated heating liquid is guided into the working gap (14) during the heating step.
3. Method according to claim 2, characterized in that the heating liquid is guided into the working gap (14) through a conveying opening (23) for the suspension.
4. Method according to one of the preceding claims, characterized in that during the heating step the working discs (10, 12) are rotated in the same rotational direction by means of a rotational drive.
5. Method according to one of the preceding claims, characterized in that the working discs (10, 12) are held during the heating step by a distance holder between the working discs (10, 12) or by locking the suspension of the upper and/or lower working discs (10, 12) at a defined distance from each other.
6. Method according to one of the preceding claims, characterized in that in the heating step the heated heating liquid is guided through a tempering channel (30) formed in the upper work disc (10) and/or the lower work disc (12).
7. Method according to one of the preceding claims, characterized in that at least the working discs (10, 12) are heated to the operating temperature in the heating step by means of an electrical heating device (30), in particular at least one electrical heating mat (30).
8. Method according to one of the preceding claims, characterized in that the temperature of the upper working plate (10) and/or the lower working plate (12) is measured during the heating step and the heating step is ended after the operating temperature has been reached.
9. Double-sided processing machine, in particular double-sided polishing machine, having an upper working disk (10) and a lower working disk (12), between which a working gap (14) for processing flat workpieces is formed; and having a rotary drive, by means of which the upper working disk (10) and the lower working disk (12) can be rotated relative to one another, characterized in that a heating device (30) is provided for heating at least the working disks (10, 12) to an operating temperature in a heating step prior to a machining step for machining the workpiece.
10. A double-sided processing machine according to claim 9, characterized in that it is configured for carrying out the method according to one of claims 1 to 8.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021113131.6A DE102021113131A1 (en) | 2021-05-20 | 2021-05-20 | Method for operating a double-sided processing machine and double-sided processing machine |
| DE102021113131.6 | 2021-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115365920A true CN115365920A (en) | 2022-11-22 |
Family
ID=81325319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210510241.5A Pending CN115365920A (en) | 2021-05-20 | 2022-05-11 | Method for operating a double-sided processing machine and double-sided processing machine |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220371154A1 (en) |
| EP (1) | EP4091767A1 (en) |
| JP (1) | JP2022179370A (en) |
| KR (1) | KR20220157305A (en) |
| CN (1) | CN115365920A (en) |
| DE (1) | DE102021113131A1 (en) |
| TW (1) | TW202300276A (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10007390B4 (en) | 1999-03-13 | 2008-11-13 | Peter Wolters Gmbh | Two-disc polishing machine, in particular for processing semiconductor wafers |
| US6488571B2 (en) * | 2000-12-22 | 2002-12-03 | Intel Corporation | Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity |
| DE102004040429B4 (en) * | 2004-08-20 | 2009-12-17 | Peter Wolters Gmbh | Double-sided polishing machine |
| US7201634B1 (en) | 2005-11-14 | 2007-04-10 | Infineon Technologies Ag | Polishing methods and apparatus |
| DE102006032455A1 (en) * | 2006-07-13 | 2008-04-10 | Siltronic Ag | Method for simultaneous double-sided grinding of a plurality of semiconductor wafers and semiconductor wafer with excellent flatness |
| US20100279435A1 (en) * | 2009-04-30 | 2010-11-04 | Applied Materials, Inc. | Temperature control of chemical mechanical polishing |
| JP5411739B2 (en) | 2010-02-15 | 2014-02-12 | 信越半導体株式会社 | Carrier mounting method |
| DE102013202488B4 (en) * | 2013-02-15 | 2015-01-22 | Siltronic Ag | Process for dressing polishing cloths for simultaneous two-sided polishing of semiconductor wafers |
| US20150306728A1 (en) * | 2014-04-23 | 2015-10-29 | Silicon Quest International, Incorporated | Systems for, methods of, and apparatus for processing substrate surfaces |
| DE102016102223A1 (en) * | 2016-02-09 | 2017-08-10 | Lapmaster Wolters Gmbh | Double or single side processing machine and method of operating a double or single side processing machine |
| CN110549239A (en) * | 2018-05-31 | 2019-12-10 | 长鑫存储技术有限公司 | Chemical mechanical polishing device and polishing pad surface dressing method |
| US20210394331A1 (en) * | 2020-06-17 | 2021-12-23 | Globalwafers Co., Ltd. | Semiconductor substrate polishing with polishing pad temperature control |
-
2021
- 2021-05-20 DE DE102021113131.6A patent/DE102021113131A1/en active Pending
-
2022
- 2022-03-25 TW TW111111387A patent/TW202300276A/en unknown
- 2022-04-05 EP EP22166751.2A patent/EP4091767A1/en active Pending
- 2022-04-28 JP JP2022074481A patent/JP2022179370A/en active Pending
- 2022-05-11 CN CN202210510241.5A patent/CN115365920A/en active Pending
- 2022-05-12 KR KR1020220058402A patent/KR20220157305A/en active Search and Examination
- 2022-05-18 US US17/747,575 patent/US20220371154A1/en active Pending
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| EP4091767A1 (en) | 2022-11-23 |
| DE102021113131A1 (en) | 2022-11-24 |
| TW202300276A (en) | 2023-01-01 |
| JP2022179370A (en) | 2022-12-02 |
| US20220371154A1 (en) | 2022-11-24 |
| KR20220157305A (en) | 2022-11-29 |
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