CN114514662A - 光元件搭载用封装件及电子装置 - Google Patents

光元件搭载用封装件及电子装置 Download PDF

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Publication number
CN114514662A
CN114514662A CN202080067374.9A CN202080067374A CN114514662A CN 114514662 A CN114514662 A CN 114514662A CN 202080067374 A CN202080067374 A CN 202080067374A CN 114514662 A CN114514662 A CN 114514662A
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CN
China
Prior art keywords
mounting
package
light
optical element
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080067374.9A
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English (en)
Chinese (zh)
Inventor
北川明彦
木村贵司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN114514662A publication Critical patent/CN114514662A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4075—Beam steering

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
CN202080067374.9A 2019-09-30 2020-09-29 光元件搭载用封装件及电子装置 Pending CN114514662A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-178931 2019-09-30
JP2019178931 2019-09-30
PCT/JP2020/036910 WO2021065909A1 (ja) 2019-09-30 2020-09-29 光素子搭載用パッケージ及び電子装置

Publications (1)

Publication Number Publication Date
CN114514662A true CN114514662A (zh) 2022-05-17

Family

ID=75338393

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080067374.9A Pending CN114514662A (zh) 2019-09-30 2020-09-29 光元件搭载用封装件及电子装置

Country Status (5)

Country Link
US (1) US20220385044A1 (https=)
EP (1) EP4040614A4 (https=)
JP (2) JPWO2021065909A1 (https=)
CN (1) CN114514662A (https=)
WO (1) WO2021065909A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4297206A1 (en) * 2021-02-19 2023-12-27 Kyocera Corporation Light emitting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135526A (ja) * 2006-11-28 2008-06-12 Kyocera Corp 発光素子用連結基板および発光装置連結基板
JP2017069241A (ja) * 2015-09-28 2017-04-06 京セラ株式会社 半導体レーザ素子用パッケージおよび半導体レーザ装置
JP2017098494A (ja) * 2015-11-27 2017-06-01 京セラ株式会社 光素子搭載用パッケージ、光素子搭載用母基板および電子装置
JP2017208288A (ja) * 2016-05-20 2017-11-24 セイコーエプソン株式会社 光源装置およびプロジェクター

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
DE19508222C1 (de) * 1995-03-08 1996-06-05 Siemens Ag Optoelektronischer Wandler und Herstellverfahren
DE602004003459T2 (de) * 2003-12-16 2007-03-15 Matsushita Electric Industrial Co., Ltd., Kadoma Optischer Halbleiter und Verfahren zu seiner Herstellung
EP1830443B1 (en) * 2006-03-03 2016-06-08 Fraunhofer USA, Inc. High power diode laser having multiple emitters and method for its production
JP2011049338A (ja) * 2009-08-27 2011-03-10 Sanyo Electric Co Ltd 発光装置および光装置
US8471289B2 (en) * 2009-12-28 2013-06-25 Sanyo Electric Co., Ltd. Semiconductor laser device, optical pickup device and semiconductor device
DE102012205513B4 (de) * 2012-04-04 2021-12-09 Osram Gmbh Verfahren zum Herstellen einer Strahlungsanordnung und Strahlungsanordnung
US8897327B2 (en) * 2012-04-16 2014-11-25 Osram Opto Semiconductors Gmbh Laser diode devices
US9008139B2 (en) * 2013-06-28 2015-04-14 Jds Uniphase Corporation Structure and method for edge-emitting diode package having deflectors and diffusers
EP3038173B1 (en) * 2014-12-23 2019-05-22 LG Innotek Co., Ltd. Light emitting device
JP6288132B2 (ja) * 2015-05-20 2018-03-07 日亜化学工業株式会社 発光装置
JP6484588B2 (ja) * 2016-05-19 2019-03-13 日亜化学工業株式会社 発光装置及び発光装置用パッケージ
JP6915236B2 (ja) * 2016-06-29 2021-08-04 セイコーエプソン株式会社 光源装置およびプロジェクター
JP6880725B2 (ja) * 2016-12-27 2021-06-02 日亜化学工業株式会社 発光装置
JP6920823B2 (ja) * 2017-01-20 2021-08-18 シチズンファインデバイス株式会社 反射部材付基板及びその製造方法
US10431959B2 (en) * 2017-10-02 2019-10-01 Nichia Corporation Light emitting device and optical device
US12009633B2 (en) * 2018-10-17 2024-06-11 Osram Opto Semiconductors Gmbh Laser device and method for manufacturing a laser device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135526A (ja) * 2006-11-28 2008-06-12 Kyocera Corp 発光素子用連結基板および発光装置連結基板
JP2017069241A (ja) * 2015-09-28 2017-04-06 京セラ株式会社 半導体レーザ素子用パッケージおよび半導体レーザ装置
JP2017098494A (ja) * 2015-11-27 2017-06-01 京セラ株式会社 光素子搭載用パッケージ、光素子搭載用母基板および電子装置
JP2017208288A (ja) * 2016-05-20 2017-11-24 セイコーエプソン株式会社 光源装置およびプロジェクター

Also Published As

Publication number Publication date
EP4040614A1 (en) 2022-08-10
JP2024111284A (ja) 2024-08-16
EP4040614A4 (en) 2023-11-01
US20220385044A1 (en) 2022-12-01
WO2021065909A1 (ja) 2021-04-08
JPWO2021065909A1 (https=) 2021-04-08

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Application publication date: 20220517