JPWO2021065909A1 - - Google Patents

Info

Publication number
JPWO2021065909A1
JPWO2021065909A1 JP2021551309A JP2021551309A JPWO2021065909A1 JP WO2021065909 A1 JPWO2021065909 A1 JP WO2021065909A1 JP 2021551309 A JP2021551309 A JP 2021551309A JP 2021551309 A JP2021551309 A JP 2021551309A JP WO2021065909 A1 JPWO2021065909 A1 JP WO2021065909A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021551309A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021065909A1 publication Critical patent/JPWO2021065909A1/ja
Priority to JP2024101202A priority Critical patent/JP2024111284A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4075—Beam steering

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
JP2021551309A 2019-09-30 2020-09-29 Pending JPWO2021065909A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024101202A JP2024111284A (ja) 2019-09-30 2024-06-24 電子装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019178931 2019-09-30
PCT/JP2020/036910 WO2021065909A1 (ja) 2019-09-30 2020-09-29 光素子搭載用パッケージ及び電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024101202A Division JP2024111284A (ja) 2019-09-30 2024-06-24 電子装置

Publications (1)

Publication Number Publication Date
JPWO2021065909A1 true JPWO2021065909A1 (https=) 2021-04-08

Family

ID=75338393

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021551309A Pending JPWO2021065909A1 (https=) 2019-09-30 2020-09-29
JP2024101202A Pending JP2024111284A (ja) 2019-09-30 2024-06-24 電子装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024101202A Pending JP2024111284A (ja) 2019-09-30 2024-06-24 電子装置

Country Status (5)

Country Link
US (1) US20220385044A1 (https=)
EP (1) EP4040614A4 (https=)
JP (2) JPWO2021065909A1 (https=)
CN (1) CN114514662A (https=)
WO (1) WO2021065909A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4297206A1 (en) * 2021-02-19 2023-12-27 Kyocera Corporation Light emitting device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264843A (ja) * 1995-03-08 1996-10-11 Siemens Ag オプトエレクトロニクス変換器
US20080084905A1 (en) * 2006-03-03 2008-04-10 Falk Doerfel High power diode laser having multiple emitters and method for its production
JP2011049338A (ja) * 2009-08-27 2011-03-10 Sanyo Electric Co Ltd 発光装置および光装置
US20130265770A1 (en) * 2012-04-04 2013-10-10 Osram Gmbh Light emitter and method for manufacturing the same
US20130272329A1 (en) * 2012-04-16 2013-10-17 Osram Opto Semiconductors Gmbh Laser diode devices
US20150003482A1 (en) * 2013-06-28 2015-01-01 Jds Uniphase Corporation Structure and method for edge-emitting diode package having deflectors and diffusers
JP2016219779A (ja) * 2015-05-20 2016-12-22 日亜化学工業株式会社 発光装置
JP2017208484A (ja) * 2016-05-19 2017-11-24 日亜化学工業株式会社 発光装置及び発光装置用パッケージ
JP2017208288A (ja) * 2016-05-20 2017-11-24 セイコーエプソン株式会社 光源装置およびプロジェクター
JP2018006477A (ja) * 2016-06-29 2018-01-11 セイコーエプソン株式会社 光源装置およびプロジェクター
US20190103723A1 (en) * 2017-10-02 2019-04-04 Nichia Corporation Light emitting device and optical device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004003459T2 (de) * 2003-12-16 2007-03-15 Matsushita Electric Industrial Co., Ltd., Kadoma Optischer Halbleiter und Verfahren zu seiner Herstellung
JP2008135526A (ja) * 2006-11-28 2008-06-12 Kyocera Corp 発光素子用連結基板および発光装置連結基板
US8471289B2 (en) * 2009-12-28 2013-06-25 Sanyo Electric Co., Ltd. Semiconductor laser device, optical pickup device and semiconductor device
EP3038173B1 (en) * 2014-12-23 2019-05-22 LG Innotek Co., Ltd. Light emitting device
JP2017069241A (ja) * 2015-09-28 2017-04-06 京セラ株式会社 半導体レーザ素子用パッケージおよび半導体レーザ装置
JP6747799B2 (ja) * 2015-11-27 2020-08-26 京セラ株式会社 光素子搭載用パッケージ、光素子搭載用母基板および電子装置
JP6880725B2 (ja) * 2016-12-27 2021-06-02 日亜化学工業株式会社 発光装置
JP6920823B2 (ja) * 2017-01-20 2021-08-18 シチズンファインデバイス株式会社 反射部材付基板及びその製造方法
US12009633B2 (en) * 2018-10-17 2024-06-11 Osram Opto Semiconductors Gmbh Laser device and method for manufacturing a laser device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264843A (ja) * 1995-03-08 1996-10-11 Siemens Ag オプトエレクトロニクス変換器
US20080084905A1 (en) * 2006-03-03 2008-04-10 Falk Doerfel High power diode laser having multiple emitters and method for its production
JP2011049338A (ja) * 2009-08-27 2011-03-10 Sanyo Electric Co Ltd 発光装置および光装置
US20130265770A1 (en) * 2012-04-04 2013-10-10 Osram Gmbh Light emitter and method for manufacturing the same
US20130272329A1 (en) * 2012-04-16 2013-10-17 Osram Opto Semiconductors Gmbh Laser diode devices
US20150003482A1 (en) * 2013-06-28 2015-01-01 Jds Uniphase Corporation Structure and method for edge-emitting diode package having deflectors and diffusers
JP2016219779A (ja) * 2015-05-20 2016-12-22 日亜化学工業株式会社 発光装置
JP2017208484A (ja) * 2016-05-19 2017-11-24 日亜化学工業株式会社 発光装置及び発光装置用パッケージ
JP2017208288A (ja) * 2016-05-20 2017-11-24 セイコーエプソン株式会社 光源装置およびプロジェクター
JP2018006477A (ja) * 2016-06-29 2018-01-11 セイコーエプソン株式会社 光源装置およびプロジェクター
US20190103723A1 (en) * 2017-10-02 2019-04-04 Nichia Corporation Light emitting device and optical device

Also Published As

Publication number Publication date
EP4040614A1 (en) 2022-08-10
JP2024111284A (ja) 2024-08-16
CN114514662A (zh) 2022-05-17
EP4040614A4 (en) 2023-11-01
US20220385044A1 (en) 2022-12-01
WO2021065909A1 (ja) 2021-04-08

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