CN114174701A - 旋转轴密封装置及使用其的半导体基板处理装置 - Google Patents
旋转轴密封装置及使用其的半导体基板处理装置 Download PDFInfo
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Abstract
本发明公开一种旋转轴密封装置。根据本发明一实施例的选择轴密封装置,其被安装在用于旋转供容纳半导体基板的半导体加载单元并处理所述半导体基板的半导体基板处理装置,包括:中空的外壳,其安装在所述半导体基板处理装置;旋转轴,其容纳在所述外壳内,并连接到所述半导体加载单元以将旋转力传递到所述半导体加载单元;轴承,其支撑所述旋转轴,以使所述旋转轴可在所述外壳内旋转;密封部,其具有密封所述外壳与所述旋转轴之间的间隙的多个密封件;以及动力传递部,其安装在所述旋转轴的一端,并将旋转力传递到所述旋转轴。
Description
技术领域
本发明涉及一种旋转轴密封装置及使用其的半导体基板处理装置,以及涉及一种用于防止流体在旋转轴与外壳之间泄漏的转轴轴密封装置及具有其的半导体基板处理装置。
背景技术
半导体装置用于大规模生产集成电路。为了在半导体晶片或玻璃等基板上沉积预定厚度的薄膜,使用溅射等物理气相沉积(PVD)和利用化学反应的化学气相沉积(CVD)。化学气相沉积方法包括大气压化学气相沉积(APCVD)、低压化学气相沉积(LPCVD)、等离子体有机化学气相沉积(Plasma Enhanced CVD)等。另外,用于基板热处理的炉(Furnace)设备用于半导体晶片的成膜、氧化、退火和杂质扩散处理。
在这种半导体设备中使用真空压力设备的旋转轴密封装置。旋转轴密封装置设置在面对高压区和低压区并在它们之间旋转的外周面上,以将高压区和低压区彼此密封。
传统的用于真空压力设备的密封装置包括外壳及贯通所述外壳被耦合的旋转轴。所述旋转轴面向高压区与低压区,所述外壳位于所述高压区与低压区的交界处。此外,所述外壳与所述旋转轴之间设有用于密封的密封件。用于密封的所述密封件用于密封所述外壳与所述旋转轴之间的间隙,因此,所述旋转轴与所述密封件之间也会产生摩擦。
在这种密封装置中,必须防止异物流入半导体真空压力设备,或者相反地,防止来自所述半导体真空压力设备的异物流入。
发明内容
要解决的技术问题
本发明实施例的目的在于提供一种旋转轴密封装置及使用其的半导体基板处理装置,其不需要单独的润滑油供给,由此可将结构变得非常简单。
另外,本发明实施例的目的在于使旋转轴密封装置的旋转轴的振动最小化,防止来自半导体基板处理装置的颗粒等异物流入所述旋转轴密封装置内部,并防止来自所述旋转轴密封装置的异物泄露到所述半导体基板处理装置。
在实施例中要解决的问题并不限于上述问题,本领域技术人员可以从下面的描述中清楚地理解本文未提及的其他问题。
解决问题的技术方法
根据本发明一实施例的旋转轴密封装置,其被安装在用于旋转供容纳半导体基板的半导体加载单元并处理所述半导体基板的半导体基板处理装置,可以包括:中空的外壳,其安装在所述半导体基板处理装置;旋转轴,其容纳在所述外壳内,并连接到所述半导体加载单元以将旋转力传递到所述半导体加载单元;轴承,其支撑所述旋转轴,以使所述旋转轴可在所述外壳内旋转;密封部,其具有被设置在所述外壳内的多个密封件,以密封所述外壳与所述旋转轴之间的间隙;以及动力传递部,其安装在所述旋转轴的一端,并将旋转力传递到所述旋转轴。
并且,所述密封部可以设置在所述轴承的上部,以便更靠近与所述半导体基板处理装置耦合的所述外壳的凸缘部,并且,所述动力传递部可以设置在所述轴承的下部。
并且,所述密封部包括:一个以上的真空密封件,其用于保持所述半导体基板处理装置的真空;以及一个以上的弹性密封件,其用于支撑所述旋转轴并抑制振动,并且,所述真空密封件及所述弹性密封件可以由塑料材料制成,所述弹性密封件可以比所述真空密封件具有更大的弹力。
并且,所述真空密封件可以是在环形密封件的内圆周上形成有弧形唇的唇形密封件,所述弹性密封件可以是将弹性构件插入密封体内部。
并且,环形的旋转防止构件可以设置在所述真空密封件及所述弹性密封件的朝向所述外壳的外周面,以防止所述真空密封件及所述弹性密封件在所述外壳内与所述外壳相对旋转。
并且,所述真空密封件及所述弹性密封件相邻串联布置,所述真空密封件可以布置在比所述弹性密封件更靠近耦合到所述半导体基板处理装置的所述外壳的凸缘部,所述弹性密封件可以比所述真空密封件更靠近所述轴承。
并且,当所述半导体基板处理装置的内部被加压时,所述密封部还可以包括用于防止异物从所述半导体基板处理装置流入内部的压力密封件。
并且,在所述密封部的上部可以设置有用于防止来自所述半导体基板处理装置的异物流入所述外壳的迷宫式密封件。
并且,所述外壳可以包括在所述密封部周围设置的冷却水套,以冷却所述密封部。
并且,所述外壳可以包括:吹扫气体流入通道,其设置在所述外壳中,以防止来自所述半导体基板处理装置的异物流入所述外壳;以及吹扫气体入口,其设置在所述外壳的侧面,以通过所述吹扫气体流入通道从外部引入吹扫气体。
并且,在所述密封部的上部可以设置有用于防止来自所述半导体基板处理装置的异物流入所述外壳的迷宫式密封件,通过所述吹扫气体流入通道移动的所述吹扫气体可以通过所述迷宫式密封件被供应到所述半导体基板处理装置。
根据本发明一实施例的用于处理半导体基板的半导体基板处理装置,可以包括:工艺管,其在内部容纳多个半导体基板;半导体加载单元,其设置成可在所述工艺管中升降;喷嘴单元,其设置在所述工艺管的内侧,以注入工艺气体;密封帽,其连接到所述半导体加载单元并密封所述工艺管的下部;以及旋转轴密封装置,其在旋转所述半导体加载单元的同时,执行密封功能,其中,所述旋转轴密封装置可以包括:中空的外壳,其安装在所述密封帽;旋转轴,其容纳在所述外壳内,并连接到所述半导体加载单元以将旋转力传递到所述半导体加载单元;轴承,其支撑所述旋转轴,以使所述旋转轴可在所述外壳内旋转;密封部,其具有密封所述外壳与所述旋转轴之间的间隙的多个密封件;以及动力传递部,其安装在所述旋转轴的一端,并将旋转力传递到所述旋转轴。
并且,所述密封部可以设置在所述轴承的上部,以便更靠近与所述密封帽耦合的所述外壳的凸缘部,并且所述动力传递部可以设置在所述轴承的下部。
并且,所述密封部包括:一个以上的真空密封件,其用于保持所述工艺管的真空;以及一个以上的弹性密封件,其用于支撑所述旋转轴并抑制振动,所述真空密封件及所述弹性密封件可以由塑料材料制成,所述弹性密封件可以比所述真空密封件具有更大的弹力。
并且,所述真空密封件可以是在环形密封件的内圆周上形成有弧形唇的唇形密封件,所述弹性密封件可以是将弹性构件插入密封体内部。
并且,环形的旋转防止构件可以设置在所述真空密封件及所述弹性密封件的朝向所述外壳的外周面,以防止所述真空密封件及所述弹性密封件在所述外壳内与所述外壳相对旋转。
并且,所述真空密封件及所述弹性密封件相邻串联布置,所述真空密封件可以布置在比所述弹性密封件更靠近耦合到所述半导体基板处理装置的所述外壳的凸缘部,所述弹性密封件可以比所述真空密封件更靠近所述轴承。
并且,当所述半导体基板处理装置的内部被加压时,所述密封部还可以包括用于防止异物从所述半导体基板处理装置流入内部的压力密封件。
并且,在所述密封部的上部可以设置有用于防止来自所述半导体基板处理装置的异物流入所述外壳的迷宫式密封件。
并且,所述外壳可以包括在所述密封部周围设置的冷却水套,以冷却所述密封部。
并且,所述外壳可以包括:吹扫气体流入通道,其设置在所述外壳中,以防止来自所述半导体基板处理装置的异物流入所述外壳;以及吹扫气体入口,其设置在所述外壳的侧面,以通过所述吹扫气体流入通道从外部引入吹扫气体。
并且,在所述密封部的上部可以设置有用于防止来自所述半导体基板处理装置的异物流入所述外壳的迷宫式密封件,通过所述吹扫气体流入通道移动的所述吹扫气体可以通过所述迷宫式密封件被供应到所述半导体基板处理装置。
发明的效果
根据本发明实施例的旋转轴密封装置及使用其的半导体基板处理装置,通过使密封部与旋转对象物体进行线接触,可以使摩擦力最小化,使得不需要单独的润滑油供给,由此可将结构变得非常简单。
另外,可以使所述旋转轴密封装置的旋转轴的振动最小化,并防止来自所述半导体基板处理装置的颗粒等异物流入所述旋转轴密封装置内部。
另外,通过所述旋转轴密封装置包括冷却水套,可以将密封部的温度保持在较低的温度,从而延长所述密封部的寿命。
另外,通过在轴承上部配置所述密封部,可以防止在所述轴承中产生的异物流入所述半导体基板处理装置。
另外,通过使吹扫气体向所述密封部的上部流动并排出至所述半导体基板处理装置,可以防止在所述半导体基板处理装置中产生的异物流入所述密封部。
附图说明
图1为显示根据本发明一实施例的旋转轴密封装置及半导体基板处理装置的附图。
图2为显示根据本发明一实施例的旋转轴密封装置的透视图。
图3为显示图2的旋转轴密封装置的平面图。
图4为显示沿图2的IV-IV线截取的断面图。
图5为显示根据本发明另一实施例的旋转轴密封装置的断面图。
图6为示意性地示出根据本发明一实施例的密封部的结构的附图。
图7为示意性地示出根据本发明另一实施例的密封部的结构的附图。
具体实施方式
下面,将参照附图详细描述本发明的实施例,以便本领域普通技术人员能够容易地实施本发明。然而,本发明可以以各种不同的形式实施并且不限于在此描述的实施例。并且,为了在附图中清楚地描述本发明的实施例,将省略与描述无关的部分。
在本文所使用的术语仅用于描述具体实施例,并不用于限制本发明。除非上下文另有明确规定,否则单数表达可以包括复数表达。
在本说明书中,“包括”或者“具有”等术语用于表达存在说明书中所记载的特征、数字、步骤、操作、构成要素、配件或其组合,并不排除还具有一个或以上的其他特征、数字、步骤、操作、构成要素、配件或其组合,或者附加功能。
另外,提供以下实施例是为了使本领域普通技术人员能够更清楚地说明,附图中元件的形状和尺寸可能被夸大以进行更清楚的描述。
下面,参照附图对根据本发明的优选实施例进行说明。
图1为显示根据本发明一实施例的旋转轴密封装置及半导体基板处理装置的附图,图2为显示根据本发明一实施例的旋转轴密封装置的透视图,图3为显示图2的旋转轴密封装置的平面图。
首先,参照图1,根据本发明一实施例的半导体基板处理装置10可以是例如用于热处理半导体基板的竖炉装置。半导体基板处理装置10包括工艺管220、半导体加载单元250、喷嘴单元230、密封帽224及旋转轴密封装置100。
工艺管220具有能够容纳需要热处理的多个半导体基板W的空间,其底部是开放的,并且所述底部可以通过密封帽224被封闭或打开。当工艺管220的底部被密封帽224封闭时,在工艺管220的法兰222与密封帽224之间可以设置有O形圈226已进行密封。
半导体加载单元250用于保持多个半导体基板W,可以被设置成可在工艺管220中进行升降。具体地,半导体加载单元250可以在垂直方向上以预定间隔保持半导体基板W,及被处理基板。保温机构252及转台254可以设置在半导体加载单元250的下部。半导体加载单元250、保温机构252及转台254可以通过升降装置270与密封帽224一起相对于工艺管220进行升高和降低。在半导体加载单元250下降的位置中,多个半导体基板W可以布置在半导体加载单元250上,并且在上升的位置中,半导体加载单元250被容纳在工艺管220中,由此工艺管220的底部可由密封帽224被封闭。
另外,在工艺管220中设置有用于注入待处理半导体基板W的工艺气体的喷嘴单元230,并且可以设置有排气管240,其用于排放所述工艺气体并将工艺管220的内部保持在真空中。
此外,用于加热工艺管220的加热组件210可以布置在工艺管220周围。加热器组件210可以使用辐射热对容纳在半导体加载单元250中的半导体基板W进行热处理。
旋转轴密封装置100用于旋转半导体加载单元250的同时,执行密封功能。在密封帽224的中心部形成有轴通孔,并且旋转轴密封装置100的旋转轴120的一端可以贯通所述轴通孔来突出。转台254连接到突出的旋转轴120的一端。因此,转台254根据旋转轴120的旋转而旋转,并且布置在转台254上的半导体加载单元250也可以一起旋转。
参照图2至图4,旋转轴密封装置100用于旋转半导体加载单元250。旋转轴密封装置100可以包括外壳110、旋转轴120、轴承130、密封部150及动力传递部140。
外壳110为中空形,在其内部可以容纳旋转轴120、轴承130、密封部150及动力传递部140。在外壳110的上部可以设置有被安装在半导体基板处理装置的法兰部112。例如,如图1所示,当半导体基板处理装置为熔炉装置时,旋转轴密封装置100可以安装在密封帽224的下部。可以在法兰部112上提供O形圈113,以在法兰部112与密封帽224之间进行密封。此外,可以在外壳110的一侧设置有电机等驱动装置200。
轴承130可以设置在外壳110中以支撑旋转轴120,使其可在外壳110内旋转。在本实施例中,轴承130设置在动力传递部140的上部,并通常设置在外壳110的大约中心处,以抑制旋转轴120的振动并稳定地支撑旋转轴120。在本实施例中,轴承130是止推轴承,并且可以是双列角接触轴承。双列角接触轴承130可以支撑施加到旋转轴120的负载,以便支撑容纳多个半导体基板W的半导体加载单元250的负载。同时,可以设置有用于填充轴承130与密封部150之间的间隙的垫片116。
密封部150用于密封外壳110与旋转轴120之间的间隙。密封部150防止在旋转轴密封装置100中产生的异物(颗粒等)流入设置在旋转轴密封装置100的上侧的真空的半导体基板处理装置,以及进行密封,使得所述半导体基板处理装置的内部保持真空。可以通过组合多个密封件来布置密封部150。后面将对密封部150进行详细描述。
动力传递部140设置在旋转轴120的一端,即在本实施例中在轴承130的下部,并且被设置为将旋转力传递到旋转轴120。由如马达等驱动装置200产生的旋转力可以通过动力传递部140传递到旋转轴120。在本实施例中,可以将动力传递部140设置为蜗轮,以改变由驱动装置200产生的旋转力的方向。由此,可以降低外壳110的高度并小型化旋转轴密封装置100的尺寸,从而节省空间且易于安装,还可以可以方便更换和维护。
在本实施例中,密封部150可以布置在比轴承130更靠近耦合到所述半导体基板处理装置的外壳110的凸缘部112的位置,即,在轴承130的上部。另外,动力传递部140可以具有布置在轴承130的下部的结构。由此,可以防止诸如在轴承130的操作期间可能产生的颗粒之类的异物由于压差而流入所述半导体基板处理装置。另外,由于轴承130设置在动力传递部140与密封部150之间,因此可以更稳定地支撑旋转轴120。
另外,当所述半导体基板处理装置在类似于炉装置的高温环境中操作时,由于密封部150被布置在法兰部112附近而不是其他部件以更靠近所述半导体基板处理装置,因此在旋转轴密封装置100的部件中密封部150的温度可以相对较高。在本实施例中,在密封部150的周长处可以设置有冷却水套182,以冷却密封部150。相应地,可以通过降低密封部150的温度来延长设置在密封部150中的多个密封件152、156的寿命。
同时,可以终止所述半导体基板处理装置中的半导体基板处理工艺,或者可以以清洁等为由将所述半导体基板处理装置中的压力改变为高于大气压力,而不是真空。在这种情况下,所述半导体基板处理装置内部的压力反而可以大于旋转轴密封装置100内部的压力。由此,留在所述半导体基板处理装置中的颗粒等异物可以反向流入旋转轴密封装置100的内部。为了防止这种情况,在本实施例中,可以在外壳110的法兰部112上设置迷宫式密封件(labyrinth seal)114。
另外,在本实施例中,可以在外壳110的壁中设置吹扫气体流入通道172,以防止留在所述半导体基板处理装置中的异物(例如,所述颗粒)流入旋转轴密封装置100。此外,可以在外壳110的侧表面上设置吹扫气体入口170,以通过吹扫气体流入通道172从外部引入吹扫气体。吹扫气体流入通道172可以向上延伸至外壳110壁中的法兰部112,并且可以与法兰部112中提供的迷宫式密封件114连通。由此,流经吹扫气体流入通道172的吹扫气体可以穿过迷宫式密封件114,并供应至所述半导体基板处理装置。
图5为显示根据本发明另一实施例的旋转轴密封装置的断面图。
参照图5,根据本发明另一实施例的旋转轴密封装置与图4所示的旋转轴密封装置相同,唯一的区别在于,其包括吹扫气体流入通道172朝向密封部150额外设置的分支部172a。由于吹扫气体流入通道172通过分支部172a与密封部150内部的缓冲空间150a连通,因此即使在密封部150之间留下颗粒等异物,也可以通过吹扫气体进行清除。在本实施例中,缓冲空间150a可以设置在弹性密封件156之间。
同时,真空泵(未示出)可以连接到吹扫气体流入通道172。由此,与分支部分172a连通的缓冲空间150a可以保持在真空中。因此,即使真空密封件152的一部分被损坏,得益于形成真空的缓冲空间150a,也可以保持区域A中的真空。
以下,参照图6来详细说明上述旋转轴密封装置所使用的密封部的结构。
参照图6,根据本发明一实施例的密封部150可以包括多个真空密封件152和多个弹性密封件156。真空密封件152用于保持布置在旋转轴密封装置100上部的半导体基板处理装置的真空,并且,弹性密封件156用于支撑旋转轴120并抑制振动。真空密封件152和弹性密封件156都可以由塑料材质形成。此外,弹性密封件156可以具有比真空密封件152更大的弹力,且可以是两倍以上。
真空密封件152是在环形密封件的内圆周上形成有弧形唇的由塑料材质形成的唇形密封件,如图6所示,其在相反方向上弯曲以保持形成真空的区域A中的真空。
弹性密封件156用于与轴承130一起支撑旋转轴120,使得当旋转轴120旋转时,轴线122不会由于振动等而改变。另外,当轴线122发生变化时,在转轴120与真空密封件152之间可能存在间隙,并且异物可能引入其间。在本实施例中,即使轴线122发生变化,由于设置有弹性密封件156,因此可以阻止流入到旋转轴120与真空密封件152之间的异物进入区域B。弹性密封件156包括由具有在一方向上形成的凹槽的塑料材料制成的密封体156a,以及容纳在密封体156a中以将密封体156a朝旋转轴120(156b)按压的弹性构件156b。弹性构件156b可以是例如O形环、方形环或金属弹簧,但并不限于此。
真空密封件152和弹性密封件156在轴线122方向上彼此串联布置,如图4所示,真空密封件152比弹性密封件156更靠近外壳110的法兰部112,并且弹性密封件156可以比真空密封件152更靠近轴承130。此外,真空密封件152和弹性密封件156可以分别设置为多个,使得即使真空密封件152或弹性密封件156中的任何一个被损坏,也可以保持其功能。
另外,为了防止真空密封件152和弹性密封件156在外壳110内部与外壳110相对旋转,朝向真空密封件152和弹性密封件156的外壳110的外圆周表面上可以设置有旋转防止构件159。旋转防止构件159用于向旋转轴120进一步按压真空密封件152和弹性密封件156。另外,当不存在旋转防止构件159时,即,与真空密封件152和弹性密封件156与外壳110的内周面直接接触时相比,旋转防止构件159与真空密封件152和弹性密封件156之间的摩擦力更大。由此,可以抑制真空密封件152和弹性密封件156在外壳110内部与外壳110相对旋转。
另外,在由于损坏、检查等原因拆卸和组装旋转轴密封装置100的情况下,即使外壳110的表面粗糙度相对粗糙,在拆卸和组装过程中,旋转防止构件159与外壳110的内圆周表面摩擦,由此密封部150可以最小化由于外壳110的低表面粗糙度而造成的损伤。此外,由于旋转防止构件159具有即使其受到某种程度的损坏也可以重复使用的优点,因此旋转轴密封装置100可以更容易地被拆卸和组装。
图7为示意性地示出根据本发明另一实施例的密封部的结构的附图。
参照图7,根据本发明另一实施例的密封部与图6所示的实施例相同,唯一的区别在于仅增加压力密封件158。当半导体基板处理装置的颞部因清洁等为由被施加压力时,压力密封件158防止异物从所述半导体基板处理装置流入。在本实施例中,压力密封件158布置在真空密封件152的前面,即,与真空密封件152相比,压力密封件158更接近迷宫式密封件114。与真空密封件152相同,压力密封件158可以是在环形密封件的内圆周上形成有弧形唇的由塑料材质形成的唇形密封件。如图所示,当区域(A)被施加压力时,压力密封件158在区域(A)的方向上具有弯曲形状,以防止异物从区域(A)流入。
根据上述实施例的旋转轴密封装置及使用其的半导体基板处理装置,通过使密封部与旋转对象物体进行线接触,可以使摩擦力最小化,使得不需要单独的润滑油供给,由此可将结构变得非常简单。
另外,可以使所述旋转轴密封装置的旋转轴的振动最小化,并防止来自所述半导体基板处理装置的颗粒等异物流入所述旋转轴密封装置内部。
另外,通过所述旋转轴密封装置包括冷却水套,可以将密封部的温度保持在较低的温度,从而延长所述密封部的寿命。
另外,通过在轴承上部配置所述密封部,可以防止在所述轴承中产生的异物流入所述半导体基板处理装置。
另外,通过使吹扫气体向所述密封部的上部流动并排出至所述半导体基板处理装置,可以防止在所述半导体基板处理装置中产生的异物流入所述密封部。
综上,通过特定事项、有限的实施例及附图对具体组件等进行了说明,但这仅为了帮助进一步理解本发明,本发明并不限于上述实施例。本领域普通技术人员能够基于上述描述进行多种更改与变形。
因此,本发明的精神不应局限于上述实施例,不仅是下述权利要求,所有下述权利要求的等同替代均包括在本发明的权利要求范围。
Claims (15)
1.一种旋转轴密封装置,其被安装在用于旋转供容纳半导体基板的半导体加载单元并处理所述半导体基板的半导体基板处理装置,其特征在于,
包括:
中空的外壳,其安装在所述半导体基板处理装置;
旋转轴,其容纳在所述外壳内,并连接到所述半导体加载单元以将旋转力传递到所述半导体加载单元;
轴承,其支撑所述旋转轴,以使所述旋转轴可在所述外壳内旋转;
密封部,其具有被设置在所述外壳内的多个密封件,以密封所述外壳与所述旋转轴之间的间隙;以及
动力传递部,其安装在所述旋转轴的一端,并将旋转力传递到所述旋转轴。
2.根据权利要求1所述的旋转轴密封装置,其特征在于,
所述密封部设置在所述轴承的上部,以便更靠近与所述半导体基板处理装置耦合的所述外壳的凸缘部,
所述动力传递部设置在所述轴承的下部。
3.根据权利要求1所述的旋转轴密封装置,其特征在于,
所述密封部,包括:
一个以上的真空密封件,其用于保持所述半导体基板处理装置的真空;以及
一个以上的弹性密封件,其用于支撑所述旋转轴并抑制振动,
所述真空密封件及所述弹性密封件由塑料材料制成,所述弹性密封件比所述真空密封件具有更大的弹力。
4.根据权利要求3所述的旋转轴密封装置,其特征在于,
所述真空密封件是在环形密封件的内圆周上形成有弧形唇的唇形密封件,
所述弹性密封件是将弹性构件插入密封体内部。
5.根据权利要求3所述的旋转轴密封装置,其特征在于,
环形的旋转防止构件设置在所述真空密封件及所述弹性密封件的朝向所述外壳的外周面,以防止所述真空密封件及所述弹性密封件在所述外壳内与所述外壳相对旋转。
6.根据权利要求3所述的旋转轴密封装置,其特征在于,
所述真空密封件及所述弹性密封件相邻串联布置,
所述真空密封件布置在比所述弹性密封件更靠近耦合到所述半导体基板处理装置的所述外壳的凸缘部,
所述弹性密封件比所述真空密封件更靠近所述轴承。
7.根据权利要求3所述的旋转轴密封装置,其特征在于,
当所述半导体基板处理装置的内部被加压时,所述密封部还包括用于防止异物从所述半导体基板处理装置流入内部的压力密封件。
8.根据权利要求1所述的旋转轴密封装置,其特征在于,
在所述密封部的上部设置有用于防止来自所述半导体基板处理装置的异物流入所述外壳的迷宫式密封件。
9.根据权利要求1所述的旋转轴密封装置,其特征在于,
所述外壳包括在所述密封部周围设置的冷却水套,以冷却所述密封部。
10.根据权利要求1所述的旋转轴密封装置,其特征在于,
所述外壳,包括:
吹扫气体流入通道,其设置在所述外壳中,以防止来自所述半导体基板处理装置的异物流入所述外壳;以及
吹扫气体入口,其设置在所述外壳的侧面,以通过所述吹扫气体流入通道从外部引入吹扫气体。
11.根据权利要求10所述的旋转轴密封装置,其特征在于,
在所述密封部的上部设置有用于防止来自所述半导体基板处理装置的异物流入所述外壳的迷宫式密封件,
通过所述吹扫气体流入通道移动的所述吹扫气体通过所述迷宫式密封件被供应到所述半导体基板处理装置。
12.一种用于处理半导体基板的半导体基板处理装置,其特征在于,
包括:
工艺管,其在内部容纳多个半导体基板;
半导体加载单元,其设置成可在所述工艺管中升降;
喷嘴单元,其设置在所述工艺管的内侧,以注入工艺气体;
密封帽,其连接到所述半导体加载单元并密封所述工艺管的下部;以及
旋转轴密封装置,其在旋转所述半导体加载单元的同时,执行密封功能,
所述旋转轴密封装置,包括:
中空的外壳,其安装在所述密封帽;
旋转轴,其容纳在所述外壳内,并连接到所述半导体加载单元以将旋转力传递到所述半导体加载单元;
轴承,其支撑所述旋转轴,以使所述旋转轴可在所述外壳内旋转;
密封部,其具有密封所述外壳与所述旋转轴之间的间隙的多个密封件;以及
动力传递部,其安装在所述旋转轴的一端,并将旋转力传递到所述旋转轴。
13.根据权利要求12所述的半导体基板处理装置,其特征在于,
所述密封部设置在所述轴承的上部,以便更靠近与所述密封帽耦合的所述外壳的凸缘部,
所述动力传递部设置在所述轴承的下部。
14.根据权利要求12所述的半导体基板处理装置,其特征在于,
所述密封部,包括:
一个以上的真空密封件,其用于保持所述工艺管的真空;以及
一个以上的弹性密封件,其用于支撑所述旋转轴并抑制振动,
所述真空密封件及所述弹性密封件由塑料材料制成,所述弹性密封件比所述真空密封件具有更大的弹力。
15.根据权利要求14所述的半导体基板处理装置,其特征在于,
所述真空密封件是在环形密封件的内圆周上形成有弧形唇的唇形密封件,
所述弹性密封件是将弹性构件插入密封体内部。
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CN1647250A (zh) * | 2002-04-09 | 2005-07-27 | 东京毅力科创株式会社 | 纵型热处理装置 |
KR20170040567A (ko) * | 2015-10-05 | 2017-04-13 | (주) 디노솔루션 | 자성유체씰 및 이를 기반으로 하는 반도체 공정 이상유무 판단방법 |
KR20190108287A (ko) * | 2018-03-14 | 2019-09-24 | 씰링크 주식회사 | 직선 및 회전운동 밀폐장치 |
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JP2023110096A (ja) | 2023-08-08 |
EP4170702A4 (en) | 2024-07-24 |
KR20210157261A (ko) | 2021-12-28 |
JP7357390B2 (ja) | 2023-10-06 |
WO2021256772A1 (ko) | 2021-12-23 |
US11764102B2 (en) | 2023-09-19 |
US20210398844A1 (en) | 2021-12-23 |
KR102378581B1 (ko) | 2022-03-24 |
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