CN114058324B - 热硬化性树脂组合物及其利用 - Google Patents

热硬化性树脂组合物及其利用 Download PDF

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Publication number
CN114058324B
CN114058324B CN202111514348.9A CN202111514348A CN114058324B CN 114058324 B CN114058324 B CN 114058324B CN 202111514348 A CN202111514348 A CN 202111514348A CN 114058324 B CN114058324 B CN 114058324B
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resin composition
thermosetting resin
group
thermosetting
compound
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Chinese (zh)
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CN114058324A (zh
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若田部悟史
森祥太
阪口豪
田中基贵
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Toyochem Co Ltd
Artience Co Ltd
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Toyo Ink SC Holdings Co Ltd
Toyochem Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202111514348.9A 2020-12-15 2021-12-10 热硬化性树脂组合物及其利用 Active CN114058324B (zh)

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JP2020207200A JP6981522B1 (ja) 2020-12-15 2020-12-15 熱硬化性樹脂組成物、およびその利用
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CN114058324A CN114058324A (zh) 2022-02-18
CN114058324B true CN114058324B (zh) 2022-06-17

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JP (2) JP6981522B1 (enExample)
KR (1) KR102401175B1 (enExample)
CN (1) CN114058324B (enExample)
TW (1) TWI759248B (enExample)

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JP7544086B2 (ja) * 2021-02-26 2024-09-03 荒川化学工業株式会社 接着剤組成物、硬化物、接着シート、樹脂付銅箔、銅張積層板、プリント配線板
WO2022201620A1 (ja) * 2021-03-25 2022-09-29 日本化薬株式会社 樹脂組成物、硬化物、樹脂シート、プリプレグ、金属箔張積層板、多層プリント配線板、封止用材料、繊維強化複合材料、接着剤及び半導体装置
TWI888666B (zh) 2021-03-25 2025-07-01 日商日本化藥股份有限公司 熱硬化性樹脂組成物、硬化物、樹脂片材、預浸體、覆金屬箔積層板、多層印刷配線板、密封用材料、纖維加強複合材料、接著劑以及半導體裝置
JP7156494B1 (ja) 2021-12-13 2022-10-19 東洋インキＳｃホールディングス株式会社 熱硬化性組成物、接着シート、プリント配線板および電子機器
JP7196275B1 (ja) * 2021-12-27 2022-12-26 東洋インキＳｃホールディングス株式会社 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
CN114800295B (zh) * 2022-03-30 2023-12-26 郑州九天工贸有限公司 一种自润滑树脂切割片及其制备方法
DE112023004212T5 (de) * 2022-10-07 2025-08-07 Sumitomo Electric Industries, Ltd. Leiterplatte und Verfahren zum Herstellen einer Leiterplatte

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TW201602239A (zh) * 2014-07-02 2016-01-16 東洋油墨Ｓｃ控股股份有限公司 熱硬化性樹脂組成物、聚醯胺、接著性片、硬化物及印刷配線板
CN106432725A (zh) * 2015-08-12 2017-02-22 爱沃特株式会社 聚酰胺酰亚胺树脂及其制造方法、热硬化性树脂组合物及其硬化物
JP2018123269A (ja) * 2017-02-03 2018-08-09 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用

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KR101503189B1 (ko) * 2011-07-08 2015-03-16 미쓰이 가가쿠 가부시키가이샤 폴리이미드 수지 조성물 및 그것을 포함하는 적층체
JP2016041797A (ja) 2014-08-19 2016-03-31 京セラケミカル株式会社 接着剤用樹脂組成物、接着シート、カバーレイフィルム及びフレキシブル配線板
JP6635403B2 (ja) * 2014-12-26 2020-01-22 荒川化学工業株式会社 樹脂付銅箔、銅張積層板、プリント配線板及び多層配線板
JP5796690B1 (ja) * 2015-02-02 2015-10-21 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP6593649B2 (ja) 2015-03-31 2019-10-23 荒川化学工業株式会社 接着剤組成物、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、フレキシブル銅張積層板、プリント配線板、フレキシブルプリント配線板、多層配線板、プリント回路板、及びフレキシブルプリント回路板
JP6939017B2 (ja) 2016-03-30 2021-09-22 荒川化学工業株式会社 ポリイミド、ポリイミド系接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板、並びに多層配線板及びその製造方法
CN107793991B (zh) 2016-09-05 2022-03-08 荒川化学工业株式会社 柔性印刷布线板用覆铜层叠板和柔性印刷布线板
WO2018097010A1 (ja) 2016-11-24 2018-05-31 ナミックス株式会社 樹脂組成物、それを用いた熱硬化性フィルム、樹脂硬化物、積層板、プリント配線板、および半導体装置
JP7114983B2 (ja) 2017-03-29 2022-08-09 荒川化学工業株式会社 接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP7040174B2 (ja) * 2018-03-19 2022-03-23 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、金属張積層板、プリント配線基板および半導体装置
JP7229725B2 (ja) 2018-10-31 2023-02-28 日鉄ケミカル＆マテリアル株式会社 金属張積層板、回路基板、多層回路基板及びその製造方法
CN112980385B (zh) 2019-12-16 2024-06-18 荒川化学工业株式会社 粘接剂组合物、粘接剂组合物的相关制品及其制备方法

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TW201602239A (zh) * 2014-07-02 2016-01-16 東洋油墨Ｓｃ控股股份有限公司 熱硬化性樹脂組成物、聚醯胺、接著性片、硬化物及印刷配線板
CN106432725A (zh) * 2015-08-12 2017-02-22 爱沃特株式会社 聚酰胺酰亚胺树脂及其制造方法、热硬化性树脂组合物及其硬化物
JP2018123269A (ja) * 2017-02-03 2018-08-09 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用

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JP2022094922A (ja) 2022-06-27
JP6981522B1 (ja) 2021-12-15
KR102401175B1 (ko) 2022-05-24
TW202229407A (zh) 2022-08-01
TWI759248B (zh) 2022-03-21
JP2022094372A (ja) 2022-06-27
JP7732330B2 (ja) 2025-09-02
CN114058324A (zh) 2022-02-18

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