CN113287373B - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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Publication number
CN113287373B
CN113287373B CN201980088486.XA CN201980088486A CN113287373B CN 113287373 B CN113287373 B CN 113287373B CN 201980088486 A CN201980088486 A CN 201980088486A CN 113287373 B CN113287373 B CN 113287373B
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China
Prior art keywords
posture control
semiconductor package
solder
pad
posture
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CN201980088486.XA
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English (en)
Chinese (zh)
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CN113287373A (zh
Inventor
葛西崇生
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Denso Corp
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Denso Corp
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
CN201980088486.XA 2019-01-10 2019-12-19 半导体装置及其制造方法 Active CN113287373B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-002913 2019-01-10
JP2019002913A JP7167721B2 (ja) 2019-01-10 2019-01-10 半導体装置およびその製造方法
PCT/JP2019/049879 WO2020145076A1 (ja) 2019-01-10 2019-12-19 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
CN113287373A CN113287373A (zh) 2021-08-20
CN113287373B true CN113287373B (zh) 2024-06-21

Family

ID=71521501

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980088486.XA Active CN113287373B (zh) 2019-01-10 2019-12-19 半导体装置及其制造方法

Country Status (5)

Country Link
US (1) US12354937B2 (enExample)
JP (1) JP7167721B2 (enExample)
CN (1) CN113287373B (enExample)
DE (1) DE112019006628T5 (enExample)
WO (1) WO2020145076A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7749436B2 (ja) * 2021-12-02 2025-10-06 三菱電機株式会社 プリント配線板
CN115988747A (zh) * 2022-12-30 2023-04-18 上海拿森汽车电子有限公司 一种兼容式pcb板触点的制作方法及pcb板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002350244A (ja) * 2001-05-25 2002-12-04 Hitachi Cable Ltd ニオイ検知式熱監視システム

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067272U (ja) 1992-06-25 1994-01-28 日本電子機器株式会社 面実装型電子部品用プリント基板
US6060780A (en) 1996-02-23 2000-05-09 Denson Corporation Surface mount type unit and transducer assembly using same
JPH1117319A (ja) * 1997-06-26 1999-01-22 Matsushita Electric Ind Co Ltd チップの実装方法
JP2001156432A (ja) * 1999-11-29 2001-06-08 Opnext Japan Inc モジュール及び電子部品の実装方法
JP2001196731A (ja) * 2000-01-13 2001-07-19 Sony Corp バンプ形成方法および半導体チップの接合方法
JP3656543B2 (ja) * 2000-10-25 2005-06-08 松下電器産業株式会社 電子部品実装方法
JP2002223062A (ja) * 2001-01-26 2002-08-09 Toyo Commun Equip Co Ltd プリント配線基板のパッド形状
JP4637380B2 (ja) * 2001-02-08 2011-02-23 ルネサスエレクトロニクス株式会社 半導体装置
JP3850755B2 (ja) * 2002-05-29 2006-11-29 シャープ株式会社 半導体装置およびその製造方法
WO2006104032A1 (ja) * 2005-03-29 2006-10-05 Murata Manufacturing Co., Ltd. 電子部品の実装構造
JP2007043134A (ja) * 2005-07-05 2007-02-15 Oki Electric Ind Co Ltd 半導体チップパッケージ及びその製造方法
JP4807199B2 (ja) * 2006-09-13 2011-11-02 株式会社デンソー 湿度センサ装置
JP5220766B2 (ja) * 2007-12-26 2013-06-26 株式会社フジクラ 実装基板
JP2011193109A (ja) * 2010-03-12 2011-09-29 Seiko Epson Corp 電子デバイス
JP5229267B2 (ja) 2010-05-06 2013-07-03 株式会社デンソー 電子装置
JP5853525B2 (ja) * 2011-09-16 2016-02-09 富士電機株式会社 半導体チップの位置決め治具及び半導体装置の製造方法
JP5991915B2 (ja) * 2012-12-27 2016-09-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2014236187A (ja) * 2013-06-05 2014-12-15 イビデン株式会社 配線板及びその製造方法
JP2015015362A (ja) * 2013-07-04 2015-01-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
DE112015005174T5 (de) * 2014-12-19 2017-08-17 Myron Walker Mit speichen versehener lötanschluss zum verbessern der lötbarkeit und selbstausrichtung von baugruppen integrierter schaltungen
JP6522980B2 (ja) * 2015-02-18 2019-05-29 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5992078B2 (ja) * 2015-08-03 2016-09-14 ルネサスエレクトロニクス株式会社 半導体装置
JP2018056234A (ja) * 2016-09-27 2018-04-05 キヤノン株式会社 プリント回路板、電子機器及びプリント回路板の製造方法
JP6956552B2 (ja) * 2017-07-19 2021-11-02 株式会社小糸製作所 車載用電子回路実装基板
JP7298304B2 (ja) 2019-05-29 2023-06-27 スズキ株式会社 車両用加飾部材固定構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002350244A (ja) * 2001-05-25 2002-12-04 Hitachi Cable Ltd ニオイ検知式熱監視システム

Also Published As

Publication number Publication date
DE112019006628T5 (de) 2021-09-23
JP2020113626A (ja) 2020-07-27
US20210335700A1 (en) 2021-10-28
JP7167721B2 (ja) 2022-11-09
CN113287373A (zh) 2021-08-20
US12354937B2 (en) 2025-07-08
WO2020145076A1 (ja) 2020-07-16

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