CN112913339A - 焊膏的涂布方法和掩模 - Google Patents
焊膏的涂布方法和掩模 Download PDFInfo
- Publication number
- CN112913339A CN112913339A CN201980069254.XA CN201980069254A CN112913339A CN 112913339 A CN112913339 A CN 112913339A CN 201980069254 A CN201980069254 A CN 201980069254A CN 112913339 A CN112913339 A CN 112913339A
- Authority
- CN
- China
- Prior art keywords
- region
- solder paste
- peripheral
- regions
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 213
- 238000000576 coating method Methods 0.000 title claims abstract description 87
- 239000011248 coating agent Substances 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims description 43
- 230000002093 peripheral effect Effects 0.000 claims abstract description 210
- 238000005304 joining Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 description 61
- 239000011800 void material Substances 0.000 description 50
- 230000000052 comparative effect Effects 0.000 description 19
- 230000004907 flux Effects 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000000843 powder Substances 0.000 description 13
- 238000007639 printing Methods 0.000 description 13
- 238000007650 screen-printing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018166395 | 2018-09-05 | ||
| JP2018-166395 | 2018-09-05 | ||
| PCT/JP2019/034832 WO2020050330A1 (ja) | 2018-09-05 | 2019-09-04 | ソルダペーストの塗布方法及びマスク |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112913339A true CN112913339A (zh) | 2021-06-04 |
Family
ID=69722428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980069254.XA Pending CN112913339A (zh) | 2018-09-05 | 2019-09-04 | 焊膏的涂布方法和掩模 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7438116B2 (ja) |
| KR (1) | KR20210052527A (ja) |
| CN (1) | CN112913339A (ja) |
| TW (1) | TWI833798B (ja) |
| WO (1) | WO2020050330A1 (ja) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220077A (zh) * | 1996-05-29 | 1999-06-16 | 罗姆股份有限公司 | 电路板上接线端的安装方法以及电路板 |
| JP2000252617A (ja) * | 1999-03-01 | 2000-09-14 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
| JP2004314601A (ja) * | 2003-03-31 | 2004-11-11 | Sanyo Electric Co Ltd | メタルマスク及びそれを用いた無鉛ソルダペースト印刷方法 |
| JP2007230392A (ja) * | 2006-03-01 | 2007-09-13 | Toyota Motor Corp | 車両側部構造 |
| JP2017139337A (ja) * | 2016-02-04 | 2017-08-10 | Ｎｅｃプラットフォームズ株式会社 | メタルマスク |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0712237U (ja) * | 1993-08-03 | 1995-02-28 | 住友ベークライト株式会社 | 半田ペースト印刷用メタルマスク |
| JP2001077521A (ja) | 1999-08-31 | 2001-03-23 | Senju Metal Ind Co Ltd | ソルダペーストの印刷方法およびソルダペーストの印刷装置 |
| TWI239618B (en) * | 2003-09-19 | 2005-09-11 | Advanced Semiconductor Eng | Method for mounting a semiconductor package onto PCB |
| JP4211828B2 (ja) * | 2006-09-12 | 2009-01-21 | 株式会社日立製作所 | 実装構造体 |
| WO2010147187A1 (ja) * | 2009-06-18 | 2010-12-23 | ローム株式会社 | 半導体装置 |
-
2019
- 2019-09-04 KR KR1020217009697A patent/KR20210052527A/ko not_active Application Discontinuation
- 2019-09-04 CN CN201980069254.XA patent/CN112913339A/zh active Pending
- 2019-09-04 JP JP2020541277A patent/JP7438116B2/ja active Active
- 2019-09-04 WO PCT/JP2019/034832 patent/WO2020050330A1/ja active Application Filing
- 2019-09-05 TW TW108132061A patent/TWI833798B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220077A (zh) * | 1996-05-29 | 1999-06-16 | 罗姆股份有限公司 | 电路板上接线端的安装方法以及电路板 |
| JP2000252617A (ja) * | 1999-03-01 | 2000-09-14 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
| JP2004314601A (ja) * | 2003-03-31 | 2004-11-11 | Sanyo Electric Co Ltd | メタルマスク及びそれを用いた無鉛ソルダペースト印刷方法 |
| JP2007230392A (ja) * | 2006-03-01 | 2007-09-13 | Toyota Motor Corp | 車両側部構造 |
| JP2017139337A (ja) * | 2016-02-04 | 2017-08-10 | Ｎｅｃプラットフォームズ株式会社 | メタルマスク |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020050330A1 (ja) | 2020-03-12 |
| TW202034752A (zh) | 2020-09-16 |
| JP7438116B2 (ja) | 2024-02-26 |
| KR20210052527A (ko) | 2021-05-10 |
| JPWO2020050330A1 (ja) | 2021-09-24 |
| TWI833798B (zh) | 2024-03-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |