CN1128486A - 形成焊料球的方法 - Google Patents
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Abstract
本发明的形成焊球方法是一种在其上已形成导线的IC安装板(1)上形成焊球的方法,其特征在于:在其上已形成导线(2)的安装板的表面上形成光敏第一焊料抗蚀剂(3);通过光刻在第一焊料抗蚀剂3的待形成焊球的位置处形成第一孔(3a);在第一焊料抗蚀剂上形成第二焊料抗蚀剂(4);通过光刻在第二焊料抗蚀剂上的与第一孔相应位置处形成与第一孔连接的第二孔;用焊料填充第一、二孔;回流处理;然后进行腐蚀使其至少保留一部分第一焊料抗蚀剂。
Description
本发明涉及形成焊料球的方法。
随着IC芯片日益高度集成化,强烈要求芯片安装板上的导线和焊球微型化。作为按微型化的要求形成焊球的方法,即在安装板上形成焊料抗蚀剂的屏障图形和通过在此屏障图形上印刷焊料浆形成焊料球的方法已经公知。用这种公知的方法在安装板上形成光敏焊料抗蚀剂,用光刻的方法在待形成焊球的位置处形成孔,通过印刷将焊料浆施加到这些孔处,经回流处理,形成焊球。
因为连接芯片所用的焊料的量受到在焊料抗蚀剂所形成的孔容积的限制,所以上述已知的形成焊球的方法不能满足微型化的要求。也就是说,由于要微型化,在抗蚀剂层中所形成的孔的面积也要微型化,所以连接芯片所用焊料的实际量减少。结果,带来芯片连接可靠性下降的缺点。而且,当通过印刷填注焊料浆时,因要用焊料浆填注的孔的区域较小,所以要精确地将焊料浆送到孔是困难的。因此,就会使焊料浆落在孔的周边,存在使焊球之间短路的危险。此外在焊球周边上也产生焊剂和焊料等残渣,而存在使可靠性和寿命下降的危险。
因此,本发明的目的是提供一种能克服上述缺点的形成焊球方法,用此方法能形成更细小的,可靠性和寿命均匀的焊料球。
本发明的形成焊球的方法是一种在用以安装IC芯片的其上已形成导线的板上形成焊球的方法,此方法的特征是
在已形成有导线的板的表面上形成液态的第一光敏焊料抗蚀剂;
通过光刻在第一焊料抗蚀剂上待形成焊球的位置处形成第一孔;
在第一焊料抗蚀剂上形成第二焊料抗蚀剂;
通过光刻在第二抗蚀剂层上与第一孔相应的位置处形成与第一孔连接的第二孔;
用焊料填充第一和第二孔;
进行回流处理;
然后以这样方式进行蚀刻,即至少可使部分的第一焊料抗蚀剂保留下来。
随着导线的微型化,导线的宽度变得更小,在导线上所形成的焊球的面积也变得更小。因此,本发明使待形成的焊球尽可能地高,以确保足够的焊料量。在此情况下,由于还在第一焊料抗蚀剂上形成第二焊料抗蚀剂并要提供施加焊料用的孔,所以孔的深度甚至变得更深。结果,能施加大量的焊料以形成焊球。此外,由于通过腐蚀去除第二焊料抗蚀剂,也能去除污染物。而且焊球距抗蚀剂表面的高度能充分保证,可靠性提高。
本发明的形成焊球的方法是在用以安装IC芯片的其上已形成导线的安装板上形成焊球的方法,此方法的特征是:
在其上已形成导线的安装板的表面上涂覆液态的第一焊料抗蚀剂,以便填充导线之间的空间;
在第一焊料抗蚀剂层上形成第二焊料抗蚀剂层;
通过光刻在第一和第二焊料抗蚀剂层上的待形成焊球的位置处形成孔;
用焊料填充这些孔;
进行回流处理;
然后以这样方式腐蚀,即使其至少保留一部分第一焊料抗蚀剂层。
由于安装板上的导线图形微型化,导线之间的空间变得更小。因此,如果薄膜状焊料抗蚀剂直接设置在安装板上,用焊材料抗蚀剂材料填充导线之间的空间是困难的,在导线之间会形成气泡和产生短路。因而首先将液态焊料抗蚀剂涂覆在安装板上。此液态抗蚀剂渗进小隙缝,所以完全能用抗蚀剂材料充填导线之间的空间。但是由于受到涂覆液态抗蚀剂材料这种方法本身所能达到的厚度的限制。不能形成厚的抗蚀剂层。因此,在本发明中,在液态第一焊料抗蚀剂层上再叠合一层较厚的薄膜状焊料抗蚀剂作为第二焊料抗蚀剂层。能获得具有所要求厚度的焊料抗蚀剂膜,所以导线之间的空间能完全隔离,可形成具有所要求焊料量的焊球。
本发明的形成焊球方法的特征是:
在其上已形成导线的安装板的表面上涂覆液态第一焊料抗蚀剂,使其充满导线之间的空间;
在第一焊料抗蚀剂层上形成光敏第二焊料抗蚀剂层;
用光刻法在第二焊料抗蚀剂的待形成焊盘的位置处形成第一孔;
在第二焊抗蚀剂上形成第三焊料抗蚀剂;
用光刻法在第三抗蚀剂上的与第一孔相应的位置处形成与第一孔连接的第二孔;
用焊料充填此第一和第二孔;
进行回流处理;
然后除去第三焊料抗蚀剂。
如果第一和第二焊料抗蚀剂是由绝缘特性和耐用性都好的抗蚀剂材料制成,除了其上将形成焊球的部分之外,导线的所有区域都涂覆有绝缘材料,安装板的可靠性能进一步提高。
而且,如果第一孔的面积是S1,第二孔的面积是S2,则它们的比率是确定的,S2/S1>1,为形成焊球能施加大量的焊料,即使导线微型化,也能容易地形成具有所要求的焊料量的焊球。此外,通过以之字状图形形成焊球,虽然第一孔重叠导线,但此重叠的部分被厚的第二焊料层可靠地隔离开。由于回流处理,焊料处于收缩状态,焊球的截面积几乎与第一孔的截面积相同。因此不会发生与邻近焊球的导线短路的问题,而且能形成具有所要求的焊料量的焊球。结果,虽然导线图形进一步微型化,仍被可靠地绝缘,而且能形成具有所要求的焊料量的焊球。能容易地形成适用于甚至更细导线的焊球。
图1是用以说明本发明的形成焊料球方法的流程的示意性截面图。
图2是用以说明本发明的形成焊球方法工艺流程的示意性截面图。
图3是用以说明本发明的形成焊球方法工艺流程的示意性截面图。
图4是用以说明本发明的形成焊球方法工艺流程的示意性截面图。
图5是用以说明本发明的形成焊球方法工艺流程的示意性截面图。
图6是用以说明本发明的形成焊球方法工艺流程的示意性截面图。
图7是用以说明本发明的形成焊球方法工艺流程的示意性截面图。
图8是用以说明本发明的形成焊球方法工艺流程的示意性截面图。
图9是用以说明本发明的形成焊球方法的改进的示意性截面图。
图10是用以说明本发明的形成焊球方法的另一种改进的示意性截面图。
图11是用以说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
图12是用以说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
图13是用以说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
图14是用以说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
图15是用以说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
图16是用以说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
图17是说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
图18是说明本发明的形成焊球方法的另一种改进工艺的示意性截面图。
下面将参照附图说明本发明的实施例。图1-8是示出说明本发明的形成焊球方法的一连串工艺流程的图。首先,准备一适用的IC芯片安装板1,其上形成必须的导线。此安装板1可以是用树脂材料或陶瓷材料制成的印刷电路板。在本实施例中是使用低温烧结板。如图1所示,导线图形2使用铜浆通过丝网印刷形成在安装板1上。在此例中导线图形2的线宽是100μm,间距是150μm。不仅导线图形而且连不连续部分的焊盘(未绘出)也都形成在安装板1的表面上。
如图2所示,液态的第一焊料抗蚀剂3形成在其上已加工上导线图形2的安装板的表面上。这种焊料抗蚀剂3是一种光敏焊料抗蚀剂,并可配制得到,例如,将市售光敏焊料抗蚀剂混合以4∶1的基本树脂/固化剂比而得到。第一焊料抗蚀剂3是通过常规的丝网印刷涂覆在整个表面,随后在75℃下干燥25分钟。此第一焊料抗蚀剂厚15μm。
接着,通过光刻在第一焊料抗蚀剂3上的待形成焊球的位置处形成第一孔。首先利用光掩膜使第一焊料抗蚀剂层3曝光。曝光条件是用500W高压汞灯以800mJ/cm2的光能照射,只遮盖待形成焊球的区域,除此区域外都被固化。此焊球形成区的尺寸是200×100μm(在横向是200μm)的矩形。然后使用1%的碳酸钠水溶液进行喷雾显影,除去第一焊料抗蚀剂层3的待形成焊球的区域处的抗蚀剂以形成第一孔3a。显影条件是使用喷雾显影机在2kg/cm2的压强下显影60秒。然后清洗和干燥安装板,并得到图3所示的图形。
下面,在图3所示的安装板上形成第二焊料抗蚀剂4。在此例中,使用38μm厚的薄片形光敏干膜作为第二焊料抗蚀剂。由Du Pont生产的商品名称为Riston的干膜作为这种干膜的实例已被应用。此第二焊料抗蚀剂4是使用层合机叠合在第一焊料抗蚀剂3上。在这种情况下,在第一孔3a部位形成缝隙,但此部位随后被清除掉,所以也不成问题。通过光刻在此薄片形第二焊料抗蚀剂4中形成第二孔。这时使用在形成第一孔时所用的光掩膜。为了曝光使用500W高压汞灯,曝光量是50mJ/cm2。接着使用1%的碳酸钠水溶液进行喷雾显影,在焊球形成区形成与第一孔3a连接的第二孔4a。通过清洗和干燥工艺获得图5所示的图形。
随后如图6所示,使用0.03mm厚的金属掩模通过印刷向第一和第二孔施注焊料浆。焊料5也能不使用金属掩模用涂刷器直接充注到孔中。
然后,如图7所示,通过将其插入回流炉装置在230℃下对安装板进行回流处理。
接着再将基片在2%的氢氧化钠水溶液中浸渍5分钟,只去除第二焊料抗蚀剂。这时进行腐蚀,以便至少保留一部分第一焊抗蚀剂。当使用2%的氢氧化钠水溶液作为腐蚀液时,干膜的腐蚀速率快,而第一焊料抗蚀剂材料的腐蚀速率非常慢,所以能用这种方法得到图8所示的焊料球。通过清除焊料抗蚀剂4,也能清除掉在涂覆焊料期间所产生的焊剂和焊料的残渣,从而提高了寿命和可靠性。而且,通过使第一焊料抗蚀剂3和第二焊料抗蚀剂4,特别是使薄片形成第二焊料钪蚀剂形成适当的厚度,就能获得连接IC所必须的焊料量。
图9是表示本发明的改进的形成焊球方法的示意性截面图。在上述实例中,第一焊料抗蚀剂层3加工得相当厚,但在这里是涂覆第一焊料抗蚀剂以使液态焊料抗蚀剂充填到导线图形2中的空间如图9(a)所示,薄片形第二焊料抗蚀剂4叠置在其上(图9(b)),然后如图9(c)所示,通过光刻形成孔。在此实施例中,第一焊料抗蚀剂材料充填进导线之间的空间,第二焊料抗蚀剂4形成在导线图形上,然后通过光刻在待形成焊球的位置处形成孔4a如图9(c)所示。在这种情况下,第一和第二焊料抗蚀剂材料这两者都能通过曝光工艺而固化,这就省掉一步光刻工艺。焊球实质上是经焊料施加工艺和回流工艺形成的。在此实施例中可以用这样的工艺:涂覆液态的光敏焊料抗蚀剂材料使其充填进导线之间的空间;通过印刷施加同样的抗蚀剂材料以形成第一焊料抗蚀剂;通过光刻形成第一孔;叠置干膜;形成第二孔;施加焊料并进行回流处理;然后清除掉干膜。
图10-18是表示本发明的形成焊料球的其它改进方法的示意性截面图。这种实例说明了一种形成焊球方法,它能进一步微型化。与上述实施例相同结构的元件用相同符号说明。图10是示意性平面图,它直接示出在填入焊料前的构形。在此例中焊球是之字状图形形成的。图11-图17是一系列工艺流程图,其中安装板是从图10中线II-II看的视图。
如图11所示,在其上已形成有导线2a-2c的安装板1上涂覆第一焊料抗蚀剂3,以便使其填充导线2a-2c之间的空间。在此例中是使用液态光敏聚酰亚胺树脂作为第一焊料抗蚀膜,并将其干燥。
接着,如图12所示,在此安装板上叠置聚酰亚胺膜作为第二焊料抗蚀层4。在这种情况下,导线之间的空间被聚酰亚胺树脂充满,所以在导线之间的空间中不形成气孔。
下面再进行光刻。如图13所示,圆形的面积为S1的第一孔形成在导线上的待形成焊球的位置处。在此例中,在导线2b上焊球沿直线方向呈之字状。当蚀刻时使用主要包括N-甲基吡咯烷酮(NMP)的特殊显影剂作为显影剂。
再如图14所示,在其中已开有孔的第二焊料抗蚀剂4上叠置一干膜作为第三焊料抗蚀剂10。
第二孔开孔面积S2,是圆形并与第一孔连接,通过光刻在待形成球的位置形成此第二孔。在这种情况下使用1%的碳酸钠水溶液作为显影剂。这种1%碳酸钠水溶液对干膜10有很强的腐蚀作用,但对聚酰亚胺树脂几乎不腐蚀。因此,在下边的第二焊料抗蚀剂3像以前一样未被腐蚀。结果,形成如图15所示的构形的孔。形成这些孔以使第一和第二孔的面积比率S2/S1>1,最好是S2/S1>2。
随后,如图6所示,用焊料6充填孔。在此情况下第二孔有大的开孔面积,所以即使第一孔的开孔面积小,大量的焊料也能送进这些孔。
此后进行回流处理。通过这种回流处理,已灌入的焊料被液化并可靠地与置于其下的导线连接。由于焊料液化,在上边第二孔中的焊料聚集在中央,如图17所示,从而形成足够高的并具有足够焊料量的焊料球。而且即使第二孔与邻近一导线相交,最终形成的焊球直径与第一孔的直径大体相同,将被第二焊料抗蚀剂可靠地分隔开,所以它们将不与邻近导线短路。
然后,将其上已形成焊球的安装板浸渍在2%的氢氧化钠水溶液中以去除干膜5,就可得到如图18所示的焊球。由于用这种方法形成焊球,多条导线完全被聚酰亚胺树脂相互绝缘,所以不会出现像短路这样的问题。而且由于形成了足够高的并具有足够量焊料的焊球,所以即使进一步微型化,也能形成长寿命高可靠的焊球。
本发明不限于上述实施例,各种变更都是可能的。例如在上述实施例中形成二个开孔面积不同的孔,两孔都是圆的。但是下面的接触导线的孔可以是矩形的,上面的孔是圆的,或者上下两孔可以都是不同面积的矩形。而且也可下孔是圆的,上孔是矩形的。
可以使用焊料抗蚀剂材料的不同的组合。例如,可以涂覆光敏焊料抗蚀剂以便充填导线之间的空间,此外进行干燥,可以将同样的光敏焊料抗蚀剂材料形成为第一抗蚀剂层,并将干膜叠置其上。也可以使用一种液态光敏聚酰亚胺、液态光敏聚酰亚胺和干膜的组合此外,可以涂覆光敏聚酰亚胺,而光敏光刻胶层覆盖在它上面,并且干膜叠置其上。
如上所述,按照本发明,在其上已形成导线的安装板上形成第一焊料抗蚀剂,形成用以建立焊球的孔,在第一焊料抗蚀剂的顶上再形成第二焊料抗蚀剂,再形成孔,施注焊料,进行回流处理,然后去除第二焊料抗蚀剂。因此,即使导线被微型化,也能形成具有所要求焊料量的焊球,污染物也能被消除。结果,即使微型化也能形成高可靠的焊球。
Claims (8)
1.一种在其上已形成导线的IC芯片安装板上形成焊球的方法,其特征在于:
在其上已形成有导线的安装板的表面上形成一光敏第一焊料抗蚀剂;
通过光刻在第一焊料抗蚀剂的待放置焊球的位置处形成第一孔;
再在第一焊料抗蚀剂上形成第二焊料抗蚀剂;
通过光刻在第二焊抗蚀剂上的与第一孔相应的位置处形成与第一孔连接的第二孔;
用焊料填充第一和第二孔;
进行回流处理;
然后进行腐蚀使其至少保留一部分第一焊料抗蚀剂层。
2.一种在其上已形成导线的IC芯片安装板上形成焊球的方法,其特征在于:
在其上已形成有导线的安装板的表面上涂覆液态的第一焊料抗蚀剂,使其充填导线之间的空间;
在第一焊料抗蚀剂上形成第二焊料抗蚀剂;
通过光刻在第一和第二焊料抗蚀剂的待形成焊球的位置处形成孔;
用焊料充填这些孔;
进行回流处理;
然后进行腐蚀使其至少一部分第一焊料抗蚀剂被保留。
3.按照权利要求1或2所说的形成焊球的方法,其特征在于由薄膜状的光敏焊料抗蚀剂构成第二焊料抗蚀剂。
4.按照权利要求1或3所说的形成焊球的方法,其特征在于S2/S1≥1这里S1是第一孔的开孔面积,S2是第二孔的开孔面积。
5.按照权利要求1-4中任一项权利要求所说的形成焊球的方法,其特征在于使用相对特定的腐蚀剂其腐蚀速率比第二焊料抗蚀剂材料的腐蚀速率慢的材料来制作第一焊料抗蚀剂。
6.一种在其上已形成导线的IC安装板上形成焊球的方法,其特征在于:
在其上已形成导线的安装板的表面上涂覆液态的第一焊料抗蚀剂,使其充填进导线之间的空间;
在第一焊料抗蚀剂上形成光敏第二焊料抗蚀剂;
在第二焊料抗蚀剂上待形成焊球的位置处形成第一孔;
在第二焊料抗蚀剂上形成第三焊料抗蚀剂;
通过光刻在第三焊料抗蚀剂上与第一孔相应位置处形成与第一孔连接的第二孔;
用焊料充填第一和第二孔;
进行回流处理;
然后清除第三焊料抗蚀剂。
7.按照权利要求6所说的形成焊球的方法,其特征在于S2/S1≥1,其中S1是第一孔的开孔面积,S2是第二孔的开孔面积。
8.按照权利要求7所说的形成焊球的方法,其特征在于以之字状图形形成所说的孔。
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EP (1) | EP0675532A3 (zh) |
JP (1) | JPH07273439A (zh) |
KR (1) | KR950028585A (zh) |
CN (1) | CN1128486A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100415069C (zh) * | 2003-09-03 | 2008-08-27 | Tdk株式会社 | 焊球供应方法及供应装置 |
US7726544B2 (en) | 2004-12-09 | 2010-06-01 | Advanced Semiconductor Engineering, Inc. | Method of packaging flip chip and method of forming pre-solders on substrate thereof |
CN110676175A (zh) * | 2019-09-24 | 2020-01-10 | 浙江集迈科微电子有限公司 | 一种键合工艺制作大锡球的方法 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5750868A (en) * | 1994-12-08 | 1998-05-12 | Pioneer Hi-Bred International, Inc. | Reversible nuclear genetic system for male sterility in transgenic plants |
US6835895B1 (en) | 1996-12-19 | 2004-12-28 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
DE69620273T2 (de) * | 1996-12-20 | 2002-07-18 | Alcatel, Paris | Verfahren zur Herstellung von Abstandshaltern auf einer elektrischen Leiterplatte |
JP3500032B2 (ja) * | 1997-03-13 | 2004-02-23 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
WO2000010369A1 (fr) | 1998-08-10 | 2000-02-24 | Fujitsu Limited | Realisation de bossages de soudure, methode de montage d'un dispositif electronique et structure de montage pour ce dispositif |
JP3423930B2 (ja) * | 1999-12-27 | 2003-07-07 | 富士通株式会社 | バンプ形成方法、電子部品、および半田ペースト |
JP4707273B2 (ja) * | 2000-12-26 | 2011-06-22 | イビデン株式会社 | 多層プリント配線板の製造方法 |
JP4748889B2 (ja) * | 2000-12-26 | 2011-08-17 | イビデン株式会社 | 多層プリント配線板の製造方法 |
JP2006135156A (ja) * | 2004-11-08 | 2006-05-25 | Compeq Manufacturing Co Ltd | 回路基板上へのはんだバンプの形成方法 |
JP4669703B2 (ja) * | 2005-01-19 | 2011-04-13 | イビデン株式会社 | プリント配線板及びその製法 |
US7517788B2 (en) | 2005-12-29 | 2009-04-14 | Intel Corporation | System, apparatus, and method for advanced solder bumping |
GB0807485D0 (en) * | 2008-04-24 | 2008-06-04 | Welding Inst | Method of applying a bump to a substrate |
JP2010245317A (ja) * | 2009-04-07 | 2010-10-28 | Ricoh Microelectronics Co Ltd | 電子部品実装方法 |
CN102648668B (zh) * | 2009-09-23 | 2016-08-03 | 3M创新有限公司 | 电连接和用于制备该电连接的方法 |
JP5585354B2 (ja) * | 2010-09-29 | 2014-09-10 | 凸版印刷株式会社 | 半導体パッケージの製造方法 |
CN102458039A (zh) * | 2010-10-18 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | 一种厚铜线路板 |
CN113923885B (zh) * | 2021-09-18 | 2023-05-05 | 厦门大学 | 用于焊接微小芯片的柔性线路板的制作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57152146A (en) * | 1981-03-13 | 1982-09-20 | Citizen Watch Co Ltd | Manufacture of semiconductor device |
JPH0252436A (ja) * | 1988-08-17 | 1990-02-22 | Shimadzu Corp | ハンダバンプ製造方法 |
US5316788A (en) * | 1991-07-26 | 1994-05-31 | International Business Machines Corporation | Applying solder to high density substrates |
-
1994
- 1994-03-31 JP JP6063682A patent/JPH07273439A/ja not_active Withdrawn
-
1995
- 1995-03-31 KR KR1019950007230A patent/KR950028585A/ko not_active Application Discontinuation
- 1995-03-31 CN CN95104538A patent/CN1128486A/zh active Pending
- 1995-03-31 EP EP95104788A patent/EP0675532A3/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100415069C (zh) * | 2003-09-03 | 2008-08-27 | Tdk株式会社 | 焊球供应方法及供应装置 |
US7726544B2 (en) | 2004-12-09 | 2010-06-01 | Advanced Semiconductor Engineering, Inc. | Method of packaging flip chip and method of forming pre-solders on substrate thereof |
CN110676175A (zh) * | 2019-09-24 | 2020-01-10 | 浙江集迈科微电子有限公司 | 一种键合工艺制作大锡球的方法 |
Also Published As
Publication number | Publication date |
---|---|
KR950028585A (ko) | 1995-10-18 |
EP0675532A3 (en) | 1996-04-17 |
JPH07273439A (ja) | 1995-10-20 |
EP0675532A2 (en) | 1995-10-04 |
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