CN112349647A - 树脂片的剥离方法 - Google Patents
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Abstract
本发明提供树脂片的剥离方法,能够容易地形成紧贴于板状物的树脂片的剥离起点。该树脂片的剥离方法从粘贴有树脂片的板状物将树脂片剥离,其中,该树脂片的剥离方法包含如下的步骤:树脂片加热步骤,对粘贴有树脂片的板状物的该树脂片的端部进行加热,使该树脂片从端部翻起而形成剥离起点;以及树脂片去除步骤,从该剥离起点将该树脂片剥离而将该树脂片从板状物去除。
Description
技术领域
本发明涉及树脂片的剥离方法。
背景技术
已知有将半导体晶片、树脂封装基板、玻璃基板、陶瓷基板等板状的被加工物利用磨削磨轮进行磨削而薄化、或者利用切削刀具或激光光线进行分割的加工技术。在这样的加工时,用于对被加工物的特别是形成有器件的面进行保护的粘接片粘贴于被加工物的正面上。粘接片通过强力的粘接层紧贴,以便在加工中不剥离。在将粘接片剥离时,使用如下的技术:将剥离用的热压接片强力地固定于粘接片并拉拽热压接片,从而使粘接片从被加工物剥离(参照专利文献1)。
专利文献1:日本特开2012-028478号公报
但是,在上述那样的方法中,需要热压接片这样的其他耗材,因此导致成本增加。虽然也开发了不使用热压接片而使爪部插入至树脂片与被加工物之间来进行剥离的技术,但是存在如下的问题:在树脂片强力地紧贴的情况下,难以使爪进入而形成剥离起点。
发明内容
由此,本发明的目的在于提供树脂片的剥离方法,能够容易地形成紧贴于板状物的树脂片的剥离起点。
根据本发明,提供树脂片的剥离方法,从粘贴有树脂片的板状物剥离树脂片,其中,该树脂片的剥离方法具有如下的步骤:树脂片加热步骤,对粘贴有树脂片的板状物的该树脂片的端部进行加热,使该树脂片从端部翻起而形成剥离起点;以及树脂片去除步骤,从该剥离起点剥离该树脂片而将该树脂片从板状物去除。
优选该树脂片是没有粘接材料层的树脂片。
优选该树脂片在粘贴于板状物的区域中具有没有粘接材料层的区域。
优选在该树脂片加热步骤中,隔着板状物而对树脂片进行加热。
根据本发明,能够容易地形成紧贴于板状物的树脂片的剥离起点。
附图说明
图1是在本发明实施方式的树脂片的剥离方法中使用的带有片的板状物的分解立体图。
图2是图1所示的带有片的板状物的立体图。
图3是将图2的一部分放大而示出的剖视图。
图4是以局部剖面示出图1所示的带有片的板状物的加工例的侧视图。
图5是示出实施方式的树脂片的剥离方法的流程的流程图。
图6是以局部剖面示出图5所示的树脂片的剥离方法的树脂片加热步骤的一例的侧视图。
图7是以局部剖面示出图5所示的树脂片的剥离方法的树脂片加热步骤的另一例的侧视图。
图8是以局部剖视示出图5所示的树脂片的剥离方法的树脂片去除步骤的一例的侧视图。
图9是以局部剖视示出图5所示的树脂片的剥离方法的树脂片去除步骤的另一例的侧视图。
图10是以局部剖视示出图5所示的树脂片的剥离方法的树脂片去除步骤的又一例的侧视图。
标号说明
10:板状物;12:正面;15:背面;18:树脂片;19:粘贴面;20:带有片的板状物;21:剥离起点;50:加热台;55:工作台;57:暖风干燥机;60:去除单元;65:空气喷射单元;70:剥离用带;72:去除单元;ST1:树脂片加热步骤;ST2:树脂片去除步骤。
具体实施方式
以下,参照附图对本发明的实施方式进行详细说明。本发明并不被以下实施方式所记载的内容限定。另外,在以下所记载的构成要素中包含本领域技术人员能够容易想到的内容、实质上相同的内容。另外,以下所记载的结构可以适当组合。另外,可以在不脱离本发明的主旨的范围内进行结构的各种省略、置换或变更。
根据附图,对实施方式的树脂片18的剥离方法进行说明。首先,对在实施方式的树脂片18的剥离方法中使用的带有片的板状物20的结构进行说明。图1是在实施方式的树脂片18的剥离方法中使用的带有片的板状物20的分解立体图。图2是图1所示的带有片的板状物20的立体图。图3是将图2的一部分放大而示出的剖视图。带有片的板状物20具有板状物10和树脂片18。
板状物10是以硅、蓝宝石、SiC(碳化硅)或砷化镓等作为基板11的圆板状的半导体晶片、光器件晶片等晶片。板状物10具有形成于基板11的正面12的多条分割预定线13以及形成于由呈格子状交叉的多条分割预定线13划分的各区域内的器件14。将基板11的位于与形成有器件14的正面12相反的一侧的面作为背面15。板状物10沿着分割预定线13分割而成为芯片16。在实施方式中,如图3所示,板状物10在正面12上搭载有多个电极凸点17,但在本发明中,也可以不搭载电极凸点17。电极凸点17从器件14的正面12突出。板状物10在器件14的正面12上通过搭载电极凸点17而具有凹凸。
树脂片18将一个面作为粘贴面19而粘贴于板状物10的正面12上,从而对器件14进行保护。树脂片18形成为与板状物10同径的圆板状。树脂片18是具有热塑性的合成树脂。树脂片18例如由聚烯烃树脂构成。在实施方式中,树脂片18是在粘贴于板状物10的区域内没有糊料等粘接材料层的树脂片。在实施方式中,树脂片18是没有糊料等粘接材料层的树脂片。在树脂片18不具有糊料等粘接层的情况下,例如利用辊或按压部件等对树脂片18赋予面方向且放射状的张力,一边拉伸一边紧贴于板状物10,从而粘贴于板状物10。
在实施方式中,树脂片18仅由基材层构成,该基材层由聚烯烃树脂等热塑性树脂构成,但在本发明中,也可以具有基材层和粘接材料层。树脂片18例如可以具有设置在粘贴于板状物10的区域以外的粘接材料层和基材层,也可以具有粘贴于板状物10的粘接材料层和基材层。
接着,对以带有片的板状物20作为加工对象的加工的一例进行说明。图4是以局部剖视示出图1所示的带有片的板状物的加工例的侧视图。图4所示的一例是通过磨削单元40从背面15对板状物10进行磨削而薄化至规定的厚度的磨削加工。
在磨削加工中,首先按照板状物10的正面12侧与卡盘工作台30的保持面31对置的方式载置带有片的板状物20。板状物10隔着粘贴于正面12的树脂片18而吸引保持于卡盘工作台30的保持面31上。形成于板状物10的正面12的器件14通过树脂片18进行保护而免受异物的附着或接触所致的损伤。
在磨削加工中,接着使卡盘工作台30绕轴心32旋转且使磨削单元40的磨削磨轮41绕轴心42旋转。在磨削加工中,接着一边通过磨削水提供单元45提供磨削水46一边使磨削磨轮41的磨削用磨具43按照规定的进给速度靠近卡盘工作台30。当磨削用磨具43与板状物10的背面15接触时,磨削用磨具43对板状物10的背面15侧进行磨削。当通过磨削单元40将板状物10薄化至规定的厚度时,解除卡盘工作台30的吸引保持,结束磨削加工。
接着,对实施方式的树脂片18的剥离方法进行说明。图5是示出实施方式的树脂片18的剥离方法的流程的流程图。树脂片18的剥离方法是将树脂片18从粘贴有树脂片18的图2和图3所示的板状物10剥离的方法,如图5所示,该方法包含树脂片加热步骤ST1和树脂片去除步骤ST2。
首先,对树脂片加热步骤ST1进行说明。树脂片加热步骤ST1是对粘贴有树脂片18的板状物10的树脂片18的端部进行加热从而使树脂片18从端部翻起而形成剥离起点21的步骤。
图6是以局部剖视示出图5所示的树脂片18的剥离方法的树脂片加热步骤ST1的一例的侧视图。在图6所示的一例中,在树脂片加热步骤ST1中,首先将带有片的板状物20载置于加热台50的载置面51上。此时,按照板状物10的背面15侧与载置面51接触、树脂片18成为上表面侧的方式载置带有片的板状物20。加热台50在至少能够对带有片的板状物20的外周缘部分进行加热的位置设置有发热部52。在图6所示的一例中,发热部52沿着载置带有片的板状物20的整个面设置。
在图6所示的一例中,在树脂片加热步骤ST1中,接着通过对加热台50的发热部52施加电压等,对发热部52进行加热。通过对发热部52进行加热而对加热台50的载置面51进行加热。加热台50通过载置面51的温度上升而对带有片的板状物20进行加热。加热台50隔着板状物10而对树脂片18进行加热。载置面51的正面温度在树脂片18为聚烯烃树脂片的情况下为80℃以上,优选为110℃以上。
带有片的板状物20的树脂片18具有热塑性,因此通过加热而软化变形。与此相对,作为晶片的板状物10的线膨胀系数比树脂片18低,因此加热所致的变形较小。由此,加热而变形的树脂片18相对于板状物10从作为外周部分的端部翻起。在树脂片18的端部形成剥离起点21。
图7是以局部剖视示出图5所示的树脂片18的剥离方法的树脂片加热步骤ST1的另一例的侧视图。在图7所示的一例中,在树脂片加热步骤ST1中,首先将带有片的板状物20载置于工作台55的载置面56上。此时,按照板状物10的背面15侧与载置面56接触、树脂片18成为上表面侧的方式载置带有片的板状物20。
在图7所示的一例中,在树脂片加热步骤ST1中,接着通过暖风干燥机57的热风58对带有片的板状物20进行加热。在树脂片加热步骤ST1中,优选使暖风干燥机57的热风58朝向作为带有片的板状物20的外周缘部分的端部。树脂片18的被加热的端部软化而变形。树脂片18的被加热而变形的端部相对于板状物10翻起。在树脂片18的端部形成剥离起点21。
在上述说明中,例示出两个加热方法,但树脂片加热步骤ST1中的加热方法只要至少能够对树脂片18的端部进行加热,则没有特别限定。加热方法例如可以使用远红外线等电磁波。
接着,对树脂片去除步骤ST2进行说明。树脂片去除步骤ST2是在树脂片加热步骤ST1之后将树脂片18从剥离起点21剥离而将树脂片18从板状物10去除的步骤。在以下的说明中,树脂片去除步骤ST2作为在图6所示的一例中的树脂片加热步骤ST1之后进行的步骤而进行说明,但也可以在图7所示的另一例中的树脂片加热步骤ST1之后进行。
图8是以局部剖视示出图5所示的树脂片18的剥离方法的树脂片去除步骤ST2的一例的侧视图。在图8所示的一例中,在树脂片去除步骤ST2中,首先利用去除单元60的把持部61对通过树脂片加热步骤ST1而形成的作为树脂片18的剥离起点21的端部进行把持。
在图8所示的一例中,在树脂片去除步骤ST2中,接着通过移动单元53使加热台50在与载置面51平行的水平方向且在从载置面51的中心朝向剥离起点21的把持部61所把持的部分的图8中箭头所示的方向上移动。去除单元60的把持部61从树脂片18的把持的部分朝向带有片的板状物20的中心相对地移动,从而以剥离起点21作为起点而将树脂片18的剩余的粘贴面19从板状物10的正面12剥离。由此,将树脂片18从板状物10去除。
图9是以局部剖视示出图5所示的树脂片18的剥离方法的树脂片去除步骤ST2的另一例的侧视图。在图9所示的一例中,在树脂片去除步骤ST2中,使空气喷射单元65的空气66从载置于加热台50的载置面51的带有片的板状物20的侧方朝向剥离起点21喷射。空气喷射单元65向板状物10与树脂片18之间提供空气66,从而以剥离起点21作为起点而将树脂片18的剩余的粘贴面19从板状物10的正面12剥离。由此,将树脂片18从板状物10去除。
图10是以局部剖视示出图5所示的树脂片18的剥离方法的树脂片去除步骤ST2的又一例的侧视图。在图10所示的一例中,在树脂片去除步骤ST2中,首先在通过树脂片加热步骤ST1而形成的作为树脂片18的剥离起点21的端部粘贴剥离用带70。此时,剥离用带70的一端71按照从树脂片18的外周缘探出到外侧的方式进行粘贴。在图10所示的一例中,在树脂片去除步骤ST2中,接着利用去除单元72的把持部73对剥离用带70的一端71进行把持。
在图10所示的一例中,在树脂片去除步骤ST2中,接着通过移动单元53使加热台50在与载置面51平行的水平方向且在从载置面51的中心朝向剥离起点21的把持部73所把持的部分的图10中箭头所示的方向上移动,并且使去除单元72在与载置面51垂直的方向上移动且向上方移动。去除单元72的把持部73从树脂片18的把持的部分朝向带有片的板状物20的中心相对地移动,从而借助剥离用带70而以剥离起点21作为起点将树脂片18的剩余的粘贴面19从板状物10的正面12剥离。由此,将树脂片18从板状物10去除。
在上述说明中,例示出三个去除方法,但树脂片去除步骤ST2中的去除方法只要能够对树脂片18的剥离起点21进行把持而剥离、或从剥离起点21促进树脂片18的剥离,则没有特别限定。在树脂片去除步骤ST2中,可以从树脂片加热步骤ST1继续进行树脂片18的加热。
如以上所说明的那样,实施方式的树脂片18的剥离方法中,从形成于树脂片18的端部的剥离起点21将树脂片18剥离,从而将树脂片18从板状物10去除。剥离起点21通过对树脂片18的端部进行加热而形成。由于树脂片18的热塑性以及与板状物10的线膨胀系数的不同,当树脂片18被加热时,产生从端部自然翻起的现象。即,通过至少对树脂片18的端部进行加热,能够使作为树脂片18的外周缘的端部翻起,因此即使是牢固地紧贴于板状物10的树脂片18,也能够容易地形成剥离起点21。通过形成剥离起点21,能够以剥离起点21作为起点而容易地将树脂片18的剩余的粘贴面19从板状物10的正面12剥离。
另外,在没有糊料等粘接层的树脂片18的情况下,在粘贴树脂片18时,赋予面方向且放射状的张力,因此通过加热,起到树脂片18的端部更容易翻起的效果。另外,没有糊料等粘接层的树脂片18例如与具有通过UV发生硬化的UV硬化型糊料层的粘接片等相比,难以控制粘贴力,因此本发明的树脂片的剥离方法更有用。
另外,本发明并不限于上述实施方式。即,可以在不脱离本发明的主旨的范围内进行各种变形并实施。
Claims (4)
1.一种树脂片的剥离方法,从粘贴有树脂片的板状物将树脂片剥离,其中,
该树脂片的剥离方法具有如下的步骤:
树脂片加热步骤,对粘贴有树脂片的板状物的该树脂片的端部进行加热,使该树脂片从端部翻起而形成剥离起点;以及
树脂片去除步骤,从该剥离起点将该树脂片剥离而将该树脂片从板状物去除。
2.根据权利要求1所述的树脂片的剥离方法,其中,
该树脂片是不具有粘接材料层的树脂片。
3.根据权利要求1所述的树脂片的剥离方法,其中,
该树脂片在粘贴于板状物的区域中具有不含粘接材料层的区域。
4.根据权利要求1所述的树脂片的剥离方法,其中,
在该树脂片加热步骤中,隔着该板状物而对该树脂片进行加热。
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