CN1119245C - 包含辐射固化树脂层的喷墨打印头 - Google Patents
包含辐射固化树脂层的喷墨打印头 Download PDFInfo
- Publication number
- CN1119245C CN1119245C CN98108878A CN98108878A CN1119245C CN 1119245 C CN1119245 C CN 1119245C CN 98108878 A CN98108878 A CN 98108878A CN 98108878 A CN98108878 A CN 98108878A CN 1119245 C CN1119245 C CN 1119245C
- Authority
- CN
- China
- Prior art keywords
- print head
- ink jet
- ink
- resin combination
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims abstract description 66
- 229920005989 resin Polymers 0.000 title claims abstract description 66
- 230000005855 radiation Effects 0.000 title claims abstract description 19
- 239000004593 Epoxy Substances 0.000 claims abstract description 46
- 150000001875 compounds Chemical class 0.000 claims abstract description 41
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 239000011342 resin composition Substances 0.000 claims abstract description 11
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 150000003839 salts Chemical class 0.000 claims description 39
- 239000000203 mixture Substances 0.000 claims description 30
- 239000011159 matrix material Substances 0.000 claims description 29
- -1 vinylformic acid hydroxyethyl ester Chemical class 0.000 claims description 26
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 18
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 12
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 10
- 230000001588 bifunctional effect Effects 0.000 claims description 10
- 229910000077 silane Inorganic materials 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 125000002091 cationic group Chemical group 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- 238000007596 consolidation process Methods 0.000 claims description 3
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000000976 ink Substances 0.000 description 40
- 239000002253 acid Substances 0.000 description 39
- 239000010410 layer Substances 0.000 description 19
- 239000000243 solution Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 238000001723 curing Methods 0.000 description 9
- 229910052740 iodine Inorganic materials 0.000 description 9
- 239000011630 iodine Substances 0.000 description 9
- 238000003847 radiation curing Methods 0.000 description 9
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 9
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000007921 spray Substances 0.000 description 6
- 150000002118 epoxides Chemical group 0.000 description 5
- 150000002596 lactones Chemical class 0.000 description 5
- 230000004304 visual acuity Effects 0.000 description 5
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 206010034960 Photophobia Diseases 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 208000013469 light sensitivity Diseases 0.000 description 3
- LSDPWZHWYPCBBB-UHFFFAOYSA-O methylsulfide anion Chemical compound [SH2+]C LSDPWZHWYPCBBB-UHFFFAOYSA-O 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 3
- 239000012953 triphenylsulfonium Substances 0.000 description 3
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 2
- KCGZGJOBKAXVSU-UHFFFAOYSA-N (4-iodophenyl)methanamine Chemical compound NCC1=CC=C(I)C=C1 KCGZGJOBKAXVSU-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920006397 acrylic thermoplastic Polymers 0.000 description 2
- 239000012296 anti-solvent Substances 0.000 description 2
- 150000001503 aryl iodides Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- MBAKFIZHTUAVJN-UHFFFAOYSA-I hexafluoroantimony(1-);hydron Chemical compound F.F[Sb](F)(F)(F)F MBAKFIZHTUAVJN-UHFFFAOYSA-I 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- 150000000130 (4R)-limonene 1,2-epoxide derivatives Chemical class 0.000 description 1
- SYSZENVIJHPFNL-UHFFFAOYSA-N (alpha-D-mannosyl)7-beta-D-mannosyl-diacetylchitobiosyl-L-asparagine, isoform B (protein) Chemical compound COC1=CC=C(I)C=C1 SYSZENVIJHPFNL-UHFFFAOYSA-N 0.000 description 1
- UCCUXODGPMAHRL-UHFFFAOYSA-N 1-bromo-4-iodobenzene Chemical compound BrC1=CC=C(I)C=C1 UCCUXODGPMAHRL-UHFFFAOYSA-N 0.000 description 1
- GWQSENYKCGJTRI-UHFFFAOYSA-N 1-chloro-4-iodobenzene Chemical compound ClC1=CC=C(I)C=C1 GWQSENYKCGJTRI-UHFFFAOYSA-N 0.000 description 1
- NHXKOPSTJPLWPK-UHFFFAOYSA-N 1-heptyl-4-iodobenzene Chemical compound CCCCCCCC1=CC=C(I)C=C1 NHXKOPSTJPLWPK-UHFFFAOYSA-N 0.000 description 1
- CBYAZOKPJYBCHE-UHFFFAOYSA-N 1-iodo-3-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC(I)=C1 CBYAZOKPJYBCHE-UHFFFAOYSA-N 0.000 description 1
- BDKOUDYNKRCDEC-UHFFFAOYSA-N 1-iodo-4-phenoxybenzene Chemical compound C1=CC(I)=CC=C1OC1=CC=CC=C1 BDKOUDYNKRCDEC-UHFFFAOYSA-N 0.000 description 1
- NHPPIJMARIVBGU-UHFFFAOYSA-N 1-iodonaphthalene Chemical compound C1=CC=C2C(I)=CC=CC2=C1 NHPPIJMARIVBGU-UHFFFAOYSA-N 0.000 description 1
- ZQKJCBDCOGLKCQ-UHFFFAOYSA-N 2,4-dichloro-1-iodobenzene Chemical compound ClC1=CC=C(I)C(Cl)=C1 ZQKJCBDCOGLKCQ-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- KVBWBCRPWVKFQT-UHFFFAOYSA-N 3-iodobenzoic acid Chemical compound OC(=O)C1=CC=CC(I)=C1 KVBWBCRPWVKFQT-UHFFFAOYSA-N 0.000 description 1
- KLVQPGKEKTXVCN-UHFFFAOYSA-N 3-methoxy-4-sulfanylbenzenesulfonic acid Chemical compound COC1=CC(S(O)(=O)=O)=CC=C1S KLVQPGKEKTXVCN-UHFFFAOYSA-N 0.000 description 1
- VUFOTXYLUWEYFC-UHFFFAOYSA-N 4-phenoxybenzenethiol Chemical compound C1=CC(S)=CC=C1OC1=CC=CC=C1 VUFOTXYLUWEYFC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- WGINUBKWLUSQGI-UHFFFAOYSA-N C1(=CC=CC=C1)C1=CC=CC=C1.[I] Chemical compound C1(=CC=CC=C1)C1=CC=CC=C1.[I] WGINUBKWLUSQGI-UHFFFAOYSA-N 0.000 description 1
- OGHWAMUMXMSAJE-UHFFFAOYSA-N C1(=CC=CC=C1)IC1=CC=C(C=C1)CN Chemical compound C1(=CC=CC=C1)IC1=CC=C(C=C1)CN OGHWAMUMXMSAJE-UHFFFAOYSA-N 0.000 description 1
- QMJAZFHCQPCNSJ-UHFFFAOYSA-N CC(NC(C=C1)=CC=C1C(C=CC=C1)=C1C1=CC=CC=C1)=O.S Chemical compound CC(NC(C=C1)=CC=C1C(C=CC=C1)=C1C1=CC=CC=C1)=O.S QMJAZFHCQPCNSJ-UHFFFAOYSA-N 0.000 description 1
- QGCKNNZHXQUNSH-UHFFFAOYSA-N CC(OC(C=C1)=CC=C1C(C=CC=C1)=C1C1=CC=CC=C1)=O.S Chemical compound CC(OC(C=C1)=CC=C1C(C=CC=C1)=C1C1=CC=CC=C1)=O.S QGCKNNZHXQUNSH-UHFFFAOYSA-N 0.000 description 1
- QGOCBHVDBYVTNH-UHFFFAOYSA-N CCCCOC(C=C1)=CC=C1C1=CC=CC=C1.S Chemical compound CCCCOC(C=C1)=CC=C1C1=CC=CC=C1.S QGOCBHVDBYVTNH-UHFFFAOYSA-N 0.000 description 1
- DPKRZQNIOUWGJY-UHFFFAOYSA-N COC1=CC(=C=O)C(C=C1)SC Chemical compound COC1=CC(=C=O)C(C=C1)SC DPKRZQNIOUWGJY-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000011243 crosslinked material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- XXROGKLTLUQVRX-UHFFFAOYSA-N hydroxymethylethylene Natural products OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NPXOIGSBRLCOSD-UHFFFAOYSA-N methyl 3-iodobenzoate Chemical compound COC(=O)C1=CC=CC(I)=C1 NPXOIGSBRLCOSD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- SIULLDWIXYYVCU-UHFFFAOYSA-N n-(4-iodophenyl)acetamide Chemical compound CC(=O)NC1=CC=C(I)C=C1 SIULLDWIXYYVCU-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
Landscapes
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Polymerization Catalysts (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
本发明涉及一种具有墨通道的喷墨打印头,墨通道形成在粘着在基体上的辐射固化树脂层中,墨通道以液体流动的方式与孔板上的排墨口相连。为了在树脂层中形成墨通道,把树脂组合物曝光于按预定图型设置的辐射源中以固化树脂层的某些区域,而其它形成墨通道的区域未被固化。从树脂层除去未固化的区域,留下所需要的墨通道。用于形成辐射固化层的树脂组合物包括:第一多官能团环氧化合物,第二多官能团环氧化合物,光引发剂,和非光反应溶剂。
Description
本发明涉及一种包含改进的辐射固化树脂层的喷墨打印头。
通常,喷墨打印机的喷墨打印头包括:一在基体上的带有孔或喷射部件的孔板,用于喷射记录用的墨;将孔板上的孔与一供墨装置及一能量传递装置联系起来的墨通道,用于经过孔从打印头喷墨。大多数情况下,记录期间用于喷墨的能量由阻抗元件或压电元件产生。
制造喷墨打印头的墨通道的方法包括,例如,通过切割或蚀刻在玻璃、金属、或塑料的薄层中形成细槽,然后将另一材料的薄层粘结到上面形成有这样的槽的薄层上,形成液体通道。另一种方法涉及通过照相平版印刷技术在被涂敷在载有能量传递装置的基体上的光敏树脂中形成槽。当在光敏树脂中形成槽时,把另一薄层材料固定在有槽的树脂上,以形成(例如)喷嘴板。
在制备喷墨打印头的这些方法中,由于能够高精度和大批量地制造液体通道并能高质量和低成本地获得喷液打印头,所以使用光敏树脂提供至少一部分墨通道层的方法优于其它方法。需要的光敏树脂具有(1)作为固化薄膜对于基体的极好的粘结性;(2)固化后极好的机械强度和寿命;(3)用辐射源成图案时,极好的感光度和分辨率。
已知的照相固化树脂中,美国专利No.4,623,676介绍了一种用作照相元件保护层的辐射固化组合物,其包括一可聚合的丙烯酸系化合物,一可聚合的环氧一官能团硅烷,一能引发所述丙烯酸系化合物的聚合作用的自由基芳族配盐光引发剂,和一能引发所述环氧官能团硅烷的聚合作用的阳离子芳族配盐光引发剂。
美国专利No.4,688,053介绍了一种具有辐射固化树脂组合物的喷液打印头,所述树脂组合物包含一玻璃转变温度至少为50℃、平均分子量至少为3.0×104的线形高聚物,一具有不饱合烯键的单体,一具有一个或更多环氧基的环氧树脂,和一通过激活能源辐射能产生路易斯酸的聚合作用引发剂。
美国专利No.4,090,936介绍了一种可光照固化的组合物,该组合物包含一平均环氧化物功能度在约1~1.3范围内的有机化合物;一从由丙烯酸酯或甲基丙烯酸酯单体的聚合物、苯乙烯和烯丙醇共聚物和聚乙烯醇缩丁醛聚合物中选择的有机聚合物;和一芳族配盐芳族配盐光引发剂。
然而,已知的光敏树脂中没有一种能提供喷墨打印头应用时所需的所有性能。例如,用于打印板、打印线等中形成图案的光敏树脂当固化后尽管它们可能具有良好的感光度和分辨率,但对玻璃、金属、陶瓷和塑料的粘结性差,并且机械强度和寿命不足。由于这些原因,当在打印头中使用光敏树脂时,在使用过程中易于发生光敏树脂层的变形或从基体层离或降解,由于在墨通道中阻止了墨流或使墨滴喷射明显地不稳定,这会降低喷墨打印头的可靠性。
另一方面,能粘结在玻璃、金属、陶瓷和塑料上并能提供满意的机械强度和寿命的光照固化树脂在固化后感光度和分辨率较差。光照固化树脂的内在特征使得它们不适合用来提供墨通道,因为它们不能按照供喷墨打印头里使用所需要的精确图案固化。
本发明的一个目的是提供一种在喷墨打印头中使用的改进的辐射固化树脂。
本发明的另一个目的是提供一种包括由满足上述所有要求的树脂制成的墨通道层的喷墨打印头,该打印头价格低、精度高、具有高的可靠性和极好的寿命。
本发明的另一个目的是提供一种具有精密制造的墨通道的喷墨打印头。
本发明提供了一种包含墨通道的喷墨打印头,墨通道形成在粘着在基体上的辐射固化树脂中,基体上载有用于从打印头喷墨的能量传递装置。通过使辐射固化树脂层受到预定辐射图案处理从而形成树脂的固化区域,在树脂中形成通道。然后除去树脂未固化的区域。关于上述和其它目的,本发明提供了一种辐射固化树脂组合物,包括:约5-50%wt、优选为约10-20%wt的第一多官能团环氧化合物;约0.05-20%wt、优选为约0.1-5.0%wt的第二多官能团环氧化合物;约1.0-10%wt、优选为约1.5-5%wt的能产生阳离子的光引发剂,象芳族配盐光引发剂;约20-90%wt、优选为约45-75%wt的非光反应性溶剂,其中,重量百分比是相对于树脂组合物的全部重量而言的,可以包括包含在这里的全部子范围。
树脂组合物使用了环境可接受的非光反应性溶剂系统(可是含水的或非水的)。本发明的辐射固化树脂层展现出较大的分辨率,较高的图象宽高比和增强的对金属表面如金或金/钽的粘着性,从而扩展了它对于现有和预计的产品需求的应用。另外,固化树脂提供了一永久确定的、高pH值墨的阻挡层,它能够控制喷墨打印头中的墨滴尺寸,并抗腐蚀或墨本身的化学侵蚀。
当喷嘴盘是涂敷醇的聚合物时,如涂敷有酚缩丁醛的聚酰亚胺喷嘴盘,在喷嘴盘和基体之间,辐射固化树脂也产生了意想不到的优良的粘结性。
在下面的详细说明中,参照附图,将进一步介绍本发明的上述和其它特征,其中:
图1是具有本发明的辐射固化树脂组合物的喷墨打印头的横截面图。
本发明涉及一种具有墨通道的喷黑打印头,所述墨通道形成在附着在基体上的放射固化树脂层上。通道以液流传送的方式与孔板提供的排墨口连接。为了在树脂层中形成通道,树脂组合物按预定的图象暴露于辐射源中,以固化树脂层的某些区域,而构成通道的其它区域仍未固化。从树脂层除去未固化的区域,留下所预期的通道。所使用的用于形成放射固化层的树脂组合物包括:一第一多官能团环氧化合物,一第二多官能团环氧化合物,一能产生阳离子的光引发剂,和一非光反应的溶剂。在优选实施例中,树脂组合物还包括一薄膜增强剂,如丙烯酸酯或甲基丙烯酸酯聚合物,以及具有能与第一多官能团环氧化合物、第二多官能团环氧化合物和光引发剂中的至少之一反应的官能团的硅烷。这种硅烷优选是具有环氧官能团的硅烷,如类似γ-缩水甘油氧基丙基三甲氧基-硅烷的缩水甘油氧基烷基三烷氧基-硅烷。硅烷的数量占树脂组合物总重量的约0.05-10%wt,优选为0.1-2.0%wt,包括包含在其中的所有子范围。这里所使用的薄膜增强剂是一种可溶于树脂组合物的有机材料,它有助于树脂组合物的成膜性能。
在这里,还要注意到,当固化树脂组合物中没有使用硅烷时,所使用的第二多官能团环氧化合物的数量少于约4.5%,优选少于约4.0%。
树脂组合物的第一组分是第一多官能团环氧化合物,它包括任何优选具有至少两个通过开环作用可聚合的环氧乙烷环的有机化合物。因此,多官能团表示具有大于1.0和优选大于或等于2的平均环氧官能团。还注意到第一多官能团环氧化合物和/或第二多官能团环氧化合物可以聚合和/或交联。第二多官能团环氧化合物优选是初级交联剂。第一多官能团环氧化合物优选是双官能团环氧化合物,包括主链和取代基的性质可以不同的单体双官能团环氧化合物和聚合型双官能团环氧化合物。进一步说,第一多官能团环氧化合物优选具有羟基作为取代基。除了优选的羟基取代基外,其它可用的取代基包括,例如,卤素、酯基、醚、磺基、硅氧烷基、硝基和磷酸基。第一多官能团环氧化合物的分子量(Mn)可以从约75~100,000不等。
双官能团环氧化合物或双官能团环氧化合物的混合物优选是液体,然而,只要最终的混合物是液相,混合物中可以包括一种或多种固体双官能团环氧化合物。
可以使用的双官能团环氧化合物包括:双酚A二缩水甘油醚(如,Shell化学公司提供的下列商名的产品“Epon828”,“Epon1004”,“Epon1001F”,“Epon SU-8”,和“Epon1010”,Dow化学公司提供的下列商名的产品“DER-331”,“DER-332”和“DER-334”),3,4-环氧基环己基甲基-3,4-环氧基环己烯羧酸酯(如联合碳化物公司的“ERL-422”),3,4-环氧基-6-甲基环己基甲基-3,4环氧基-6-甲基环己烯羧酸酯(如联合碳化物公司的“ERL-420”),双(3,4-环氧基-6-甲基环乙基甲基)己二酸酯(如联合碳化物公司的“ERL-4289”),双(2,3-环氧基环戊基)醚(如联合碳化物公司的“ERL-0400”)。双官能团环氧化合物在组合物中的数量为约5-50%wt,优选为10-20%wt。
树脂组合物的第二组分是第二多官能团环氧化合物。第二多官能团环氧化合物优选增加了交联密度,从而增加了分辨率并改善了抗溶剂膨胀性能。第二多官能团环氧化合物的种类一般不受限制,只要它能产生预期的树脂即可。这样的第二多官能团环氧化合物的例子包括,例如,酚的反应产物;醛和环氧化物,如DEN-431,DEN-438,DEN-439(可从Dow Plastics买到的)的。
第二多官能团环氧化合物在组合物中的数量为树脂组合物总重量的约0.5-20%wt,较好为约1-10%wt,优选为约1-5%wt。当介绍本发明的第一和第二多官能团化合物时,化合物意味着包括单体和聚合物。
树脂组合物的第三组分是能产生阳离子的光引发剂,如芳族配盐光引发剂,可以从VA族元素鎓盐、VIA族元素鎓盐和芳族卤盐中选择。当这些配盐暴露于紫外线照射或电子束照射中时,能够产生引发与环氧化物反应的部分。芳族配盐芳族配盐光引发剂在组合物中的数量为树脂组合物总重量的约1.0-10%wt,优选为约1.5-5%wt。
优选的芳族配盐光引发剂包括芳族碘鎓配盐和芳族锍配盐。芳族碘鎓配盐芳族配盐光引发剂的例子包括:
四氟硼酸二苯基碘鎓
四氟硼酸二(4-甲基苯基)碘鎓
四氟硼酸苯基-4-甲基苯基碘鎓
四氟硼酸二(4-庚基苯基)碘鎓
六氟磷酸二(3-硝基苯基)碘鎓
六氟磷酸二(4-氯代苯基)碘鎓
四氟硼酸二(萘基)碘鎓
四氟硼酸二(4-三氟代甲基苯基)碘鎓
六氟磷酸二苯基碘鎓
六氟磷酸二(4-甲基苯基)碘鎓
六氟砷酸二苯基碘鎓
四氟硼酸二(4-苯氧基苯基)碘鎓
六氟磷酸苯基-2-噻吩基碘鎓
六氟磷酸3,5-二甲基吡唑基-4-苯基碘鎓
六氟锑酸二苯基碘鎓
四氟硼酸2,2’-二苯碘鎓
六氟磷酸二(2,4-二氯代苯基)碘鎓
六氟磷酸二(4-溴代苯基)碘鎓
六氟磷酸二(4-甲氧苯基)碘鎓
六氟磷酸二(3-羧基苯基)碘鎓
六氟磷酸二(3-甲氧羰基苯基)碘鎓
六氟磷酸二(3-甲氧磺酰基苯基)碘鎓
六氟磷酸二(4-乙酰氨基苯基)碘鎓
六氟磷酸二(2-苯并ethienyl)碘鎓
适用于本发明的组合物的优选的芳族碘鎓配盐是六氟磷酸双芳基碘鎓和六氟锑酸双芳基碘鎓。这些盐被优选是因为在一般情况下,它们比配离子的其它芳族碘鎓配盐具有更好的热稳定性,有利于更快的进行反应,并且在惰性有机溶剂中的溶解度更大。
芳族锍配盐芳族配盐光引发剂的例子包括:
四氟硼酸三苯基锍
四氟硼酸甲基二苯基锍
六氟磷酸二甲基苯基锍
六氟磷酸三苯基锍
六氟锑酸三苯基锍
六氟砷酸二苯基萘基锍
六氟磷酸三甲苯基锍
六氟锑酸甲氧苯基二苯基锍
四氟硼酸4-丁氧基二苯基锍
六氟锑酸4-氯代苯基二苯基锍
六氟磷酸三(4-苯氧基苯基)锍
六氟砷酸二(4-乙氧基苯基)甲基锍
四氟硼酸4-乙酸基-苯基二苯基锍
六氟磷酸三(4-硫代甲氧苯基)锍
六氟锑酸二(甲氧基磺酰基苯基)甲基锍
四氟硼酸二(甲氧基萘基)甲基锍
六氟磷酸二(羰基甲氧基苯基)甲基锍
四氟硼酸4-乙酰氨基苯基二苯基锍
六氟磷酸二甲基萘基锍
四氟硼酸三氟代甲基二苯基锍
六氟锑酸甲基(n-甲基吩噻嗪基)锍
六氟磷酸苯基甲基苄基锍
适用于本发明的组合物的优选的芳族锍配盐是三芳基取代的盐,如六氟磷酸三苯基锍。三芳基取代盐被优选是因为它们比单芳基和双芳基取代盐具有更好的热稳定性,从而使单部分的系统具有长的贮存寿命。三芳基取代配盐也更适合于染色敏化。因此,使用这种配盐产生的组合物更多地应用于用近紫外线和可视光进行曝光的场合。如果需要的话,该组合物可以制成储藏稳定的浓缩形式(如,具有高含量的配盐),适于以后稀释成商业上实际使用的涂层组合物。
最优选的能产生阳离子的光引发剂是一种混合的六氟锑酸三芳基锍盐,可从联合碳化物公司买到(UV1-6975)。
树脂组合物的第四个组分是非光反应溶剂。这种溶剂仅限于这样的范围,即,所需要的组分在固化前可溶于其中。优选的非光反应溶剂包括γ-丁内脂,C1-6乙酸酯,四氢呋喃低分子量酮,以及它们的混合物和类似物。
非光反应性溶剂在组合物中的数量为树脂组合物总重量的约20-90%wt,优选是约45-75%wt。
优选的,本发明的树脂组合物可以包括最多到约35%wt且优选为约10-20%wt的从至少一种丙烯酸酯或甲基丙烯酸酯单体产生的丙烯酸酯或甲基丙烯酸酯聚合物。该聚合物可以是均聚物、共聚物或掺和物。这里使用的术语“聚合物”既包括低聚物(如,平均分子量低至约1000的材料),也包括高聚物(它们的平均分子量范围最高达约1,000,000)。丙烯酸酯或甲基丙烯酸酯聚合物的平均分子量优选为约10,000-60,000,更优选为约20,000-30,000。
优选的丙烯酸酯或甲基丙烯酸酯聚合物可以从各种单体产生,只要这些单体中至少有一种是丙烯酸酯或甲基丙烯酸酯单体。例如,使用的典型的丙烯酸酯或甲基丙烯酸酯单体包括:甲基丙烯酸甲酯,丙烯酸n-丁基酯,丙烯酸羟基乙基酯,甲基丙烯酸羟基乙基酯,甲基丙烯酸n-丁基酯,丙烯酸羟基丙基酯,甲基丙烯酸羟基丙基酯,和丙烯酸乙基酯。优选的,丙烯酸酯和甲基丙烯酸酯是具有1-4个碳原子的脂族醇或2-4个碳原子的脂族二醇的丙烯酸或甲基丙烯酸的酯类。
使用的典型的从前述单体产生的丙烯酸酯或甲基丙烯酸酯聚合物包括:甲基丙烯酸甲基酯/苯乙烯/丙烯酸n-丁基酯/丙烯酸羟基乙基酯,甲基丙烯酸甲基酯/甲基丙烯酸n-丁基酯/甲基丙烯酸羟基乙基酯,和甲基丙烯酸甲基酯/甲基丙烯酸n-丁基酯。通常,丙烯酸酯或甲基丙烯酸酯聚合物的主链包含了丙烯酸酯或甲基丙烯酸酯组分的大部分重量,而非丙烯酸酯组分(即使有)只占主链的一小部分。
使用的可购买到的丙烯酸酯或甲基丙烯酸酯聚合物包括“Elvacite2008”,“Elvacite 2013”(可从ICI Acrylics买到),它是甲基丙烯酸甲基酯(73)/甲基丙烯酸n-丁基酯(27)共聚物;“B-48N”(可从Rohm和Haas买到),它是丙烯酸系聚合物;“Ionac X-208”(可从Ionac化学公司买到),它是甲基丙烯酸甲基酯(44)/甲基丙烯酸n-丁基酯(45)/丙烯酸羟基乙基酯(11)共聚物;“QR-572”(可从Rohm和Haas买到),它是丙烯酸n-丁基酯(80)/丙烯酸羟基乙基酯(15)/乙酸乙烯基酯(5)共聚物;和“G-Cure 868”(可从General Mills买到),它是甲基丙烯酸甲基酯(30)/丙烯酸n-丁基酯(50)/丙烯酸羟基乙基酯(20)共聚物。可以使用丙烯酸酯或甲基丙烯酸酯单体的组合物。
本发明的树脂组合物也可以包含各种附加物,如常规填料(如硫酸钡,滑石,玻璃珠),粘度调节剂(如热解二氧化硅),颜料,等等。
在本发明的一个实施例中,组合物包含约45-75%wt的γ-丁内脂,约10-20%wt的第一多官能团环氧化合物,约0.1-5.0%wt的第二多官能团环氧化合物,约1.5-5%wt的芳族配盐光引发剂,约0.1-2%wt的γ-缩水甘油氧基丙基三甲氧基-硅烷。在另一实施例中,该组合物包含约45-75%wt的γ-丁内脂,约10-20%wt的聚甲基丙烯酸甲基酯-共-甲基丙烯酸,约10-20%wt的第一官能团环氧化合物,约0.1-5.0%wt的第二多官能团环氧化合物,约1.5-3.0%wt的芳族配盐光引发剂,和约0.1-2%wt的γ-缩水甘油氧基丙基三甲氧基-硅烷。
一种用于把该组合物涂到基体上的方法,包括把基体对中地放在耐旋涂机或常规的耐沉积干胶片带的尺寸适当的夹盘上。人工地或机械地将该组合物投放在基体的中心。然后,载有基体的夹盘以一预定的每分钟转数旋转,从而均匀地将组合物从基体的中心分散到基体的边缘。可以调整基体的转速或改变材料的粘度,以改变所得到的薄膜的厚度。然后,人工地或机械地从盘上取下所得到的涂覆基体,并将其放在控温热板上或控温烘箱中,直到材料被“软”烘过。从液体中除去部分溶剂的步骤使基体上产生部分干燥的膜。把基体从热源移开,并让其冷却到室温。
为了在所得到的薄膜上形成图型,必须将材料遮蔽,然后使其曝光于所对准的紫外线辐射源中,在曝光和显影后烘干,除去不需要的材料,以形成最终的图型。这个过程与标准半导体平版印刷工艺很相似。遮蔽物是透明的、平的物体,通常是玻璃或石英,其上带有不透明的用于确定要从涂层薄膜(如,负性抗光蚀剂)上去除的图象的区域。不透明区域防止紫外线对遮蔽在它下面的薄膜进行交联。然后,用显影剂溶解并除去非交联材料,把预定的图型留在基体上。
通过将具有涂层的基体浸没在槽状的装置中并进行搅拌或通过喷洒而使显影剂与该涂覆基体相接触。进行喷洒或使基体浸没将足以去除通过光遮蔽和曝光而确定的多余的材料。显影液的例子包括:例如,二甲苯和乙二醇单丁醚乙酸酯混合物,和类似丁基乙酸酯的C1-6乙酸酯。
当组合物暴露于波长在紫外线和可视光谱区域中的任何适合的发射光化射线的发射源中时,本发明的树脂组合物发生固化。曝光时间可以从少于约1秒到10分钟或更多,这取决于所使用的具体的环氧材料和芳族配盐的数量,同时取决于发射源和距该发射源的距离及要被固化的抗蚀图型的厚度。树脂组合物也可以通过暴露于电子束照射中而被固化。
包含能量传递装置的喷墨打印头的基体是由玻璃、金属、陶瓷或硅制成的介电层。
固化是触发反应,即,一旦通过暴露于辐射源而引发了芳族配盐的降解反应,固化反应就开始进行,并且辐射源被移去后将继续。在暴露于辐射源期间或之后,使用热能通常会加速固化反应,并且适当地增加温度会极大地加快固化速率。
例如,在不促进固化的条件下,通过简单地混合第一和第二多官能团环氧化合物、硅烷、丙烯酸酯和非光反应溶剂,可制取本发明的树脂组合物。一旦制得了树脂混合物,所制取的树脂混合物通过如旋涂、喷涂、辊涂和类似的现有工艺而涂敷在(例如)喷墨打印头基体上。
参见附图,图1是本发明的喷墨打印头的示意图。该喷墨打印头包括:基体2,在该基体上的放射固化树脂层4,喷墨室10,孔板12,和通道6。通道6以液体流动的方式与孔板12相连通。打印头包含一个用于从孔板12喷墨的能量传递装置18。通过向能量传递装置18提供电信号来产生用于喷墨的能量。这些能量传递装置包括按预定图型排列在基体2上的热阻元件或压电元件。
下列材料用于实施例。
ELVACITE 2008是一种低分子量的聚甲基丙烯酸甲基酯(包括2-3%羧酸官能度),它是一种非光反应、冲击吸收粘结剂,它展现出极好的成膜性能,并且提供了热压粘结所需的良好的热粘性和粘着性。ELVACITE2008可从ICI Acrylics买到。
EPON 1001F是一种双官能团环氧化合物,它能增加膜上旋涂物(thespun)的抗张强度和弹性。EPON 1001F可从Shell化学公司买到。
DEN 431是一种多官能团环氧树脂,它能增加交联密度,从而增加分辨率并提高抗溶剂膨胀性。DEN 431可从Dow化学公司买到。
Cyracure UVI 6974是一种芳族配盐光引发剂,当UV光透过一光学遮蔽物照射到下面的薄膜时,这种芳族配盐光引发剂可用于确定薄膜中的图型。通过冲洗掉非交联的薄膜、将高分辨率的图像留在环氧厚膜上,而形成最终的图型。
下列非限制性的例子进一步说明了本发明的各种方案。
例1
制备在γ-丁内脂中为50g/50g的ELVACITE 2008溶液。混合物在混料机上滚动16小时。把40克的EPON 1001F碾成粉末并加入到溶液中。该溶液在混料机上滚动16小时。将10克DEN 431、5克苎烯氧化物(单官能团环氧基低粘度液体)加入到溶液中并混合,直到溶液均匀。加入10克UVI6974,并彻底混合。
利用旋涂机中的硅片,溶液以2.5K rpm转速共30秒被旋涂到用来制作喷墨打印机的打印头的基体上,以产生一30微米厚的随后显影的薄膜。在用常规粘结技术将喷嘴板粘结到基体上后,就制作出喷墨打印头。将喷墨打印头放在常规的喷墨用的墨(在60℃)中,约1个月后该喷嘴板开始剥离。
例2
制备在γ-丁内脂中为50g/50g的ELVACITE 2008溶液。混合物在混料机上滚动16小时。把40克的EPON 1001F碾成粉末并加入到溶液中。该溶液在混料机上滚动16小时。将10克DEN 431加入溶液中并混合,直到溶液均匀。加入5克UVI 6974,并彻底混合。将1克缩水甘油氧基丙基三甲氧基-硅烷加入所得到的溶液中。
利用旋涂机中的硅片,溶液以2.5K rpm转速共30秒被旋涂到用来制作喷墨打印机的打印头的基体上,以产生一30微米厚的被显影的薄膜。此后,用常规粘结技术将涂敷酚缩丁醛的聚酰亚胺喷嘴板粘结到基体上,就制作出喷墨打印头。将喷墨打印头放在常规的喷墨用的墨中(在60℃),约1个月后,甚至更长时间,喷嘴板没有开始剥离。
已经参照特定的实施例介绍了本发明,但应理解的是,在本申请要求保护的实质和范围之内能够在工艺上进行各种变化和改进。
Claims (7)
1.一种具有与基体上的排墨口相连的墨通道的喷墨打印头,通过使辐射固化树脂组合物层受到所述射线预定图型的曝光、从而形成所述树脂组合物的固化区域并从所述组合物层除去未固化的树脂组合物区域,而形成所述墨通道,所述辐射固化树脂组合物包括:
(A)5-50%wt的双官能团第一环氧化合物;
(B)0.05-20%wt的多官能团第二交联的环氧化合物;
(C)1.0-10%wt的能产生阳离子的光引发剂;
(D)0.05-10%wt的具有能与A、B、C中至少之一反应的官能团的硅烷;
(E)20-90%wt的非光反应性溶剂,其中,重量百分比是基于树脂组合物的全部重量而言的。
2.一种具有与基体上的排墨口相连的墨通道的喷墨打印头,通过使辐射固化树脂组合物层受到所述射线预定图型的曝光、从而形成所述树脂组合物的固化区域并从所述组合物层除去未固化的树脂组合物区域,而形成所述墨通道,所述辐射固化树脂组合物包括:
(A)10-20%wt的双官能团第一环氧化合物;
(B)少于4.5%wt的多官能团第二交联的环氧化合物;
(C)1.0-10%wt的能产生阳离子的光引发剂;
(D)20-90%wt的非光反应性溶剂,其中,重量百分比是基于树脂组合物的全部重量而言的。
3.如权利要求1所述的喷墨打印头,其中第一多官能团环氧化合物的分子重量为100-100,000。
4.如权利要求1所述的喷墨打印头,其中第一多官能团环氧化合物是双酚A的二缩水甘油醚。
5.如权利要求1所述的喷墨打印头,其中光引发剂是从包含VA族元素的鎓盐、VIA族元素的鎓盐、芳族卤盐和它们的组合物中选择的芳族配盐光引发剂。
6.如权利要求1所述的喷墨打印头,其中该树脂组合物还包括最多35%wt的丙烯酸酯或甲基丙烯酸酯聚合物。
7.如权利要求6所述的喷墨打印头,其中丙烯酸酯或甲基丙烯酸酯聚合物是从包括下列共聚物的一组中选择的,即,甲基丙烯酸甲基酯/甲基丙烯酸n-丁基酯,甲基丙烯酸甲基酯/甲基丙烯酸n-丁基酯/甲基丙烯酸羟基乙基酯,甲基丙烯酸甲基酯/苯乙烯/丙烯酸n-丁基酯/丙烯酸羟基乙基酯,苯乙烯/丙烯酸羟基乙基酯,和丙烯酸n-丁基酯/丙烯酸羟基乙基酯/乙酸乙烯基酯。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US827564 | 1997-03-28 | ||
US08/827,564 US5907333A (en) | 1997-03-28 | 1997-03-28 | Ink jet print head containing a radiation curable resin layer |
US827,564 | 1997-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1197817A CN1197817A (zh) | 1998-11-04 |
CN1119245C true CN1119245C (zh) | 2003-08-27 |
Family
ID=25249544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN98108878A Expired - Lifetime CN1119245C (zh) | 1997-03-28 | 1998-03-27 | 包含辐射固化树脂层的喷墨打印头 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5907333A (zh) |
EP (1) | EP0867488B1 (zh) |
JP (1) | JP4051467B2 (zh) |
KR (1) | KR100527608B1 (zh) |
CN (1) | CN1119245C (zh) |
AT (1) | ATE242299T1 (zh) |
DE (1) | DE69815189T2 (zh) |
TW (1) | TW412633B (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6124372A (en) * | 1996-08-29 | 2000-09-26 | Xerox Corporation | High performance polymer compositions having photosensitivity-imparting substituents and thermal sensitivity-imparting substituents |
US6158843A (en) * | 1997-03-28 | 2000-12-12 | Lexmark International, Inc. | Ink jet printer nozzle plates with ink filtering projections |
US6193359B1 (en) * | 1998-04-21 | 2001-02-27 | Lexmark International, Inc. | Ink jet print head containing a radiation curable resin layer |
US6371600B1 (en) * | 1998-06-15 | 2002-04-16 | Lexmark International, Inc. | Polymeric nozzle plate |
CA2253409C (en) * | 1998-11-04 | 2003-06-17 | Microjet Technology Co., Ltd. | Method and device for manufacturing ink jet printhead |
US6294317B1 (en) * | 1999-07-14 | 2001-09-25 | Xerox Corporation | Patterned photoresist structures having features with high aspect ratios and method of forming such structures |
US6322848B1 (en) * | 1999-10-26 | 2001-11-27 | Lord Corporation | Flexible epoxy encapsulating material |
KR100469879B1 (ko) * | 1999-12-10 | 2005-02-02 | 후지 샤신 필름 가부시기가이샤 | 잉크젯 헤드, 잉크젯 헤드의 제조 방법 및 인쇄 장치 |
US6409316B1 (en) | 2000-03-28 | 2002-06-25 | Xerox Corporation | Thermal ink jet printhead with crosslinked polymer layer |
US6327458B1 (en) | 2000-04-06 | 2001-12-04 | Lexmark International, Inc. | Method and apparatus for positioning paper in an imaging system having an intermediate transfer medium |
US6283584B1 (en) | 2000-04-18 | 2001-09-04 | Lexmark International, Inc. | Ink jet flow distribution system for ink jet printer |
US6830646B2 (en) * | 2000-08-30 | 2004-12-14 | Lexmark International, Inc. | Radiation curable resin layer |
US6783918B2 (en) * | 2000-08-30 | 2004-08-31 | Lexmark International, Inc. | Radiation curable resin layer |
US6387719B1 (en) * | 2001-02-28 | 2002-05-14 | Lexmark International, Inc. | Method for improving adhesion |
AU2003242488A1 (en) * | 2002-06-20 | 2004-01-06 | Hitachi Maxell, Ltd. | Pigment ink composition |
DE10328525B4 (de) * | 2003-06-24 | 2008-02-28 | W.C. Heraeus Gmbh | Verwendung von Siebdrucklacken bei der Herstellung von Abziehbildern zur Dekoration von keramischen Substraten, Porzellan und Glas |
US7244014B2 (en) * | 2003-10-28 | 2007-07-17 | Lexmark International, Inc. | Micro-fluid ejection devices and method therefor |
US7196136B2 (en) * | 2004-04-29 | 2007-03-27 | Hewlett-Packard Development Company, L.P. | UV curable coating composition |
US7183353B2 (en) * | 2004-04-29 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | UV curable coating composition |
KR100590881B1 (ko) * | 2004-05-14 | 2006-06-19 | 삼성전자주식회사 | 광경화성 수지 조성물 및 그의 패터닝 방법 |
US7204574B2 (en) * | 2004-06-30 | 2007-04-17 | Lexmark International, Inc. | Polyimide thickfilm flow feature photoresist and method of applying same |
US20070085881A1 (en) * | 2004-08-19 | 2007-04-19 | Cornell Robert W | Methods for improved micro-fluid ejection devices |
JP4646610B2 (ja) * | 2004-12-01 | 2011-03-09 | キヤノン株式会社 | インクジェット記録ヘッド |
KR100670004B1 (ko) | 2005-02-25 | 2007-01-19 | 삼성전자주식회사 | 잉크젯 프린트헤드 |
US20060221115A1 (en) * | 2005-04-01 | 2006-10-05 | Lexmark International, Inc. | Methods for bonding radiation curable compositions to a substrate |
KR100657334B1 (ko) * | 2005-09-13 | 2006-12-14 | 삼성전자주식회사 | 잉크젯 프린터 헤드의 제조 방법 및 상기 방법에 의하여제조된 잉크젯 프린터 헤드 |
US7571979B2 (en) * | 2005-09-30 | 2009-08-11 | Lexmark International, Inc. | Thick film layers and methods relating thereto |
JP4850637B2 (ja) * | 2006-09-04 | 2012-01-11 | キヤノン株式会社 | 液体吐出ヘッドの製造方法および液体吐出ヘッド |
US7784917B2 (en) | 2007-10-03 | 2010-08-31 | Lexmark International, Inc. | Process for making a micro-fluid ejection head structure |
US20090186293A1 (en) * | 2008-01-23 | 2009-07-23 | Bryan Thomas Fannin | Dry film protoresist for a micro-fluid ejection head and method therefor |
US8454149B2 (en) * | 2009-06-29 | 2013-06-04 | Videojet Technologies Inc | Thermal inkjet print head with solvent resistance |
JP5480388B2 (ja) * | 2009-10-12 | 2014-04-23 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | 圧電部材の欠陥の修復 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4090936A (en) * | 1976-10-28 | 1978-05-23 | Minnesota Mining And Manufacturing Company | Photohardenable compositions |
US4173476A (en) * | 1978-02-08 | 1979-11-06 | Minnesota Mining And Manufacturing Company | Complex salt photoinitiator |
US4297401A (en) * | 1978-12-26 | 1981-10-27 | Minnesota Mining & Manufacturing Company | Liquid crystal display and photopolymerizable sealant therefor |
US4401537A (en) * | 1978-12-26 | 1983-08-30 | Minnesota Mining And Manufacturing Company | Liquid crystal display and photopolymerizable sealant therefor |
NL183380C (nl) * | 1979-12-27 | 1988-10-03 | Asahi Chemical Ind | Van een patroon voorziene en een dikke laag omvattende geleiderconstructie en werkwijze voor het vervaardigen daarvan. |
JPS58220756A (ja) * | 1982-06-18 | 1983-12-22 | Canon Inc | インクジエツト記録ヘツドの製造方法 |
US4609427A (en) * | 1982-06-25 | 1986-09-02 | Canon Kabushiki Kaisha | Method for producing ink jet recording head |
US4426431A (en) * | 1982-09-22 | 1984-01-17 | Eastman Kodak Company | Radiation-curable compositions for restorative and/or protective treatment of photographic elements |
JPH0645242B2 (ja) * | 1984-12-28 | 1994-06-15 | キヤノン株式会社 | 液体噴射記録ヘツドの製造方法 |
US4623676A (en) * | 1985-01-18 | 1986-11-18 | Minnesota Mining And Manufacturing Company | Protective coating for phototools |
US4688056A (en) * | 1985-07-13 | 1987-08-18 | Canon Kabushiki Kaisha | Liquid jet recording head having a layer of a resin composition curable with an active energy ray |
US4688053A (en) * | 1985-07-13 | 1987-08-18 | Canon Kabushiki Kaisha | Liquid jet recording head having a layer of a resin composition curable with an active energy ray |
JPH02113022A (ja) * | 1988-10-20 | 1990-04-25 | Yokohama Rubber Co Ltd:The | 紫外線硬化型エポキシ樹脂組成物 |
US5578417A (en) * | 1989-01-10 | 1996-11-26 | Canon Kabushiki Kaisha | Liquid jet recording head and recording apparatus having same |
KR910010027B1 (ko) * | 1989-03-03 | 1991-12-10 | 동양나이론 주식회사 | 열가소성 수지 조성물 |
US4948645A (en) * | 1989-08-01 | 1990-08-14 | Rogers Corporation | Tape automated bonding and method of making the same |
JP2897272B2 (ja) * | 1989-08-25 | 1999-05-31 | 東洋紡績株式会社 | 電子部品封止用硬化型樹脂組成物 |
JP2697937B2 (ja) * | 1989-12-15 | 1998-01-19 | キヤノン株式会社 | 活性エネルギー線硬化性樹脂組成物 |
DE69123932T2 (de) * | 1990-10-18 | 1997-05-22 | Canon Kk | Herstellungsverfahren eines Tintenstrahldruckkopfes |
US5290667A (en) * | 1991-12-03 | 1994-03-01 | Canon Kabushiki Kaisha | Method for producing ink jet recording head |
US5297331A (en) * | 1992-04-03 | 1994-03-29 | Hewlett-Packard Company | Method for aligning a substrate with respect to orifices in an inkjet printhead |
US5275695A (en) * | 1992-12-18 | 1994-01-04 | International Business Machines Corporation | Process for generating beveled edges |
JP3143307B2 (ja) * | 1993-02-03 | 2001-03-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JPH091804A (ja) * | 1995-06-21 | 1997-01-07 | Canon Inc | インクジェット記録ヘッドの製造方法および同方法により製造されたインクジェット記録ヘッド |
JPH0924614A (ja) * | 1995-07-11 | 1997-01-28 | Canon Inc | 液体噴射記録ヘッド用保護膜材料および該保護膜材料を用いた液体噴射記録ヘッドおよび液体噴射記録ヘッドキット |
-
1997
- 1997-03-28 US US08/827,564 patent/US5907333A/en not_active Expired - Lifetime
-
1998
- 1998-03-27 CN CN98108878A patent/CN1119245C/zh not_active Expired - Lifetime
- 1998-03-27 AT AT98302358T patent/ATE242299T1/de not_active IP Right Cessation
- 1998-03-27 EP EP98302358A patent/EP0867488B1/en not_active Expired - Lifetime
- 1998-03-27 DE DE69815189T patent/DE69815189T2/de not_active Expired - Lifetime
- 1998-03-28 KR KR1019980010855A patent/KR100527608B1/ko not_active IP Right Cessation
- 1998-03-30 JP JP12383498A patent/JP4051467B2/ja not_active Expired - Fee Related
- 1998-06-23 TW TW087104671A patent/TW412633B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69815189D1 (de) | 2003-07-10 |
KR19980080815A (ko) | 1998-11-25 |
CN1197817A (zh) | 1998-11-04 |
KR100527608B1 (ko) | 2006-02-28 |
JP4051467B2 (ja) | 2008-02-27 |
EP0867488A1 (en) | 1998-09-30 |
EP0867488B1 (en) | 2003-06-04 |
TW412633B (en) | 2000-11-21 |
ATE242299T1 (de) | 2003-06-15 |
JPH10338798A (ja) | 1998-12-22 |
DE69815189T2 (de) | 2004-06-03 |
US5907333A (en) | 1999-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1119245C (zh) | 包含辐射固化树脂层的喷墨打印头 | |
CN102272227B (zh) | 可辐射固化树脂组合物以及使用这种组合物的快速三维成像方法 | |
CN1082449C (zh) | 喷液记录头及制造它的方法 | |
CN1968816B (zh) | 喷墨头制造方法和通过该制造方法制造的喷墨头 | |
CN1104585A (zh) | 喷墨记录头的制造方法 | |
JPH07214783A (ja) | インクジェット記録ヘッドの製造方法 | |
CN1432601A (zh) | 环氧树脂组合物、表面处理方法、液体喷射记录头和液体喷射记录装置 | |
JP4578469B2 (ja) | 光導波路形成用硬化性樹脂組成物、光導波路形成用硬化性ドライフィルム、樹脂硬化物及び光導波路 | |
CN1432600A (zh) | 环氧树脂组合物、表面处理方法、液体喷射记录头和液体喷射记录装置 | |
KR20140045429A (ko) | 경화성 수지 조성물에 의해 제조된 층을 포함하는 잉크젯 프린트 헤드 | |
JP2017147331A (ja) | 硬化性樹脂組成物 | |
US8394575B2 (en) | Formulations for environmentally friendly photoresist film layers | |
JP2001083710A (ja) | 電子部品用材料およびそれを硬化してなる電子部品 | |
CN1934498A (zh) | 永久抗蚀剂组合物、其固化产物及其用途 | |
CN1849560A (zh) | 感光性树脂组合物及使用该组合物的图案形成方法 | |
JP2925816B2 (ja) | 液体噴射記録ヘッド、その製造方法、及び同ヘッドを具備した記録装置 | |
JP2008180879A (ja) | 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法 | |
JP2003277712A (ja) | 光硬化性封止接着剤 | |
CN1966270A (zh) | 喷墨打印头的制造方法及使用该方法制得的喷墨打印头 | |
JP4034588B2 (ja) | 感光性を有する着色性組成物およびその硬化物 | |
JP6672069B2 (ja) | 硬化性樹脂組成物 | |
JP2018041808A (ja) | ファンアウト型のウエハレベルパッケージ用反り矯正材 | |
CN1196748C (zh) | 活化能线硬化性树脂组合物 | |
JPH01126638A (ja) | 画像形成用樹脂組成物 | |
JPH01126362A (ja) | 画像形成用エポキシ樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUNAI ELECTRIC CO., LTD. Free format text: FORMER OWNER: LEXMARK INTERNATIONAL, INC. Effective date: 20140103 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140103 Address after: Osaka Japan Patentee after: Funai Electric Co., Ltd. Address before: American Kentucky Patentee before: Lexmark International, Inc. |
|
CX01 | Expiry of patent term |
Granted publication date: 20030827 |
|
CX01 | Expiry of patent term |