JP5480388B2 - 圧電部材の欠陥の修復 - Google Patents
圧電部材の欠陥の修復 Download PDFInfo
- Publication number
- JP5480388B2 JP5480388B2 JP2012534146A JP2012534146A JP5480388B2 JP 5480388 B2 JP5480388 B2 JP 5480388B2 JP 2012534146 A JP2012534146 A JP 2012534146A JP 2012534146 A JP2012534146 A JP 2012534146A JP 5480388 B2 JP5480388 B2 JP 5480388B2
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- JP
- Japan
- Prior art keywords
- defect
- solution
- monomer
- piezoelectric member
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000007547 defect Effects 0.000 title claims description 70
- 239000000178 monomer Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 8
- 150000002148 esters Chemical class 0.000 claims description 8
- 239000010408 film Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 229920006254 polymer film Polymers 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 241000723353 Chrysanthemum Species 0.000 claims 2
- 235000007516 Chrysanthemum Nutrition 0.000 claims 2
- 210000001061 forehead Anatomy 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 15
- 238000006116 polymerization reaction Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 6
- 230000008439 repair process Effects 0.000 description 6
- 239000010936 titanium Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2203/00—Other substrates
- B05D2203/30—Other inorganic substrates, e.g. ceramics, silicon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2502/00—Acrylic polymers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0181—Memory or computer-assisted visual determination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
インクジェット技術は、プリントヘッドからの小さな液滴を所望の位置に付着するための経済的な方法として広く認められている。一般に、圧電式(ピエゾ式)インクジェットプリントヘッドは、外部電圧の印加中に変形するように設計された、1つ又は複数の流体チャンバを含む。一般に、この変形は、チャンバの体積(容積)を減少させ、それにより液滴が、チャンバの一端部のノズルを介して噴出される。
本教示は、圧電部材の欠陥を修復することに関する。本明細書で使用されるような欠陥は、空隙、細孔、及びクラックのような不完全状態を含むであろう。特に、欠陥は、圧電部材に切り込まれた溝内のナノクラックとすることができる。
Claims (9)
- 圧電部材(12)の欠陥を修復する方法であって、
溶媒とモノマーを含む溶液(10)を準備し、
前記圧電部材(12)において欠陥(18)の場所を検出し、
前記検出された場所の少なくとも一部に基づいて、前記溶液(10)でコーティングされるべき前記圧電部材(12)の表面(16)の領域を決定し、
前記溶液(10)が前記欠陥(18)内へ流れるように、前記表面(16)の領域を前記溶液(10)でコーティングし、
前記欠陥(18)内にモノマー薄膜(20)を形成するために前記溶媒の少なくとも一部を除去し、
前記欠陥(18)内の前記モノマー薄膜(20)を重合して前記欠陥(18)内にポリマー薄膜(22)を形成することを含む、方法。 - 前記モノマーが、アクリル酸、メタクリル酸、アクリル酸のエステル、メタクリル酸のエステル、及びアクリロニトリルから選択された少なくとも1つのアクリルモノマーを含む、請求項1に記載の方法。
- 前記溶媒が、メタノール、エタノール、イソプロピルアルコール、及び水から選択された少なくとも1つの溶媒を含む、請求項1又は2に記載の方法。
- 前記溶液(10)が、20センチポアズ未満の粘度を有する、請求項1〜3の何れかに記載の方法。
- 前記溶液(10)が、表面(16)上で90度未満の接触角を有する、請求項1〜4の何れかに記載の方法。
- 前記圧電部材(12)の前記表面(16)の領域をコーティングすることが、前記圧電部材(12)に形成された溝(14)の内面(16)をコーティングすることを含む、請求項1〜5の何れかに記載の方法。
- 前記欠陥(18)がクラックであり、前記溶液(10)が前記クラック内へ流れて前記クラックを実質的に充填する、請求項1〜6の何れかに記載の方法。
- 前記モノマーが、紫外線光により重合される、請求項1〜7の何れかに記載の方法。
- 前記モノマーが、加熱により重合される、請求項1〜7の何れかに記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2009/060358 WO2011046537A1 (en) | 2009-10-12 | 2009-10-12 | Repairing defects in a piezoelectric member |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013507787A JP2013507787A (ja) | 2013-03-04 |
JP5480388B2 true JP5480388B2 (ja) | 2014-04-23 |
Family
ID=43876377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012534146A Expired - Fee Related JP5480388B2 (ja) | 2009-10-12 | 2009-10-12 | 圧電部材の欠陥の修復 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120014820A1 (ja) |
EP (1) | EP2489083A4 (ja) |
JP (1) | JP5480388B2 (ja) |
CN (1) | CN102576801B (ja) |
WO (1) | WO2011046537A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9575008B2 (en) * | 2014-02-12 | 2017-02-21 | ASA Corporation | Apparatus and method for photographing glass in multiple layers |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3097707B2 (ja) * | 1991-09-26 | 2000-10-10 | セイコーエプソン株式会社 | インクジェットヘッドおよびその製造方法 |
US5907333A (en) * | 1997-03-28 | 1999-05-25 | Lexmark International, Inc. | Ink jet print head containing a radiation curable resin layer |
JP3340659B2 (ja) * | 1997-10-31 | 2002-11-05 | 日本碍子株式会社 | 電子部品の外観検査装置及び電子部品の外観検査方法 |
JP3159187B2 (ja) * | 1998-11-04 | 2001-04-23 | 日本電気株式会社 | 薄膜成膜方法 |
JP2000210615A (ja) * | 1999-01-26 | 2000-08-02 | Murata Mfg Co Ltd | コ―ティング装置、コ―ティング方法、および電子部品、ならびに電子部品の製造方法 |
JP2002318195A (ja) * | 2001-04-19 | 2002-10-31 | Murata Mfg Co Ltd | 外観検査方法および外観検査装置 |
US20020155227A1 (en) * | 2001-04-23 | 2002-10-24 | Sulzer Markets And Technolgy Ag | Method for the manufacture of a functional ceramic layer |
JP2003062999A (ja) * | 2001-08-27 | 2003-03-05 | Hitachi Koki Co Ltd | インクジェットヘッドおよびその製造方法 |
JP2003294640A (ja) * | 2002-04-04 | 2003-10-15 | Seiko Epson Corp | 外観検査方法およびその装置 |
KR100846462B1 (ko) * | 2002-05-23 | 2008-07-17 | 삼성전자주식회사 | 백 라이트용 형광램프 |
EP1493843A1 (en) * | 2003-07-03 | 2005-01-05 | ALSTOM Technology Ltd | Coated metallic component |
US20050105791A1 (en) * | 2003-10-29 | 2005-05-19 | Lee Ken K. | Surface inspection method |
JP2007076049A (ja) * | 2005-09-12 | 2007-03-29 | Fujifilm Corp | インクジェット記録ヘッド及びそれを用いたインクジェット記録装置 |
JP2008251598A (ja) * | 2007-03-29 | 2008-10-16 | Seiko Epson Corp | 圧電素子およびその製造方法 |
JP2009119688A (ja) * | 2007-11-14 | 2009-06-04 | Konica Minolta Holdings Inc | 圧電素子の検査方法及びインクジェットヘッドの製造方法 |
JP2009177751A (ja) * | 2008-01-28 | 2009-08-06 | Taiyo Yuden Co Ltd | 圧電素子、圧電振動板および圧電型電気音響変換器 |
US20100327699A1 (en) * | 2008-02-05 | 2010-12-30 | Muhammed Hassanali | Encapsulation coating to reduce particle shedding |
JP5639738B2 (ja) * | 2008-02-14 | 2014-12-10 | 日本碍子株式会社 | 圧電/電歪素子の製造方法 |
-
2009
- 2009-10-12 US US13/259,409 patent/US20120014820A1/en not_active Abandoned
- 2009-10-12 JP JP2012534146A patent/JP5480388B2/ja not_active Expired - Fee Related
- 2009-10-12 CN CN200980161912.4A patent/CN102576801B/zh not_active Expired - Fee Related
- 2009-10-12 WO PCT/US2009/060358 patent/WO2011046537A1/en active Application Filing
- 2009-10-12 EP EP09850455A patent/EP2489083A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP2489083A4 (en) | 2013-04-03 |
CN102576801A (zh) | 2012-07-11 |
EP2489083A1 (en) | 2012-08-22 |
US20120014820A1 (en) | 2012-01-19 |
WO2011046537A1 (en) | 2011-04-21 |
CN102576801B (zh) | 2015-04-08 |
JP2013507787A (ja) | 2013-03-04 |
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