CN111406316A - 电子部件 - Google Patents

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Publication number
CN111406316A
CN111406316A CN201780096191.8A CN201780096191A CN111406316A CN 111406316 A CN111406316 A CN 111406316A CN 201780096191 A CN201780096191 A CN 201780096191A CN 111406316 A CN111406316 A CN 111406316A
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Prior art keywords
electronic component
heat dissipation
insulating
connecting body
dissipation block
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Granted
Application number
CN201780096191.8A
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English (en)
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CN111406316B (zh
Inventor
高津纪男
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Shindengen Electric Manufacturing Co Ltd
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Shindengen Electric Manufacturing Co Ltd
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Publication of CN111406316A publication Critical patent/CN111406316A/zh
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Publication of CN111406316B publication Critical patent/CN111406316B/zh
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Abstract

电子部件具有：基座10；电子元件20，被设置于所述基座10的一侧；连接体30，被设置于电子元件20的一侧；散热块40，被设置于所述连接体30的一侧；绝缘部50，被设置于所述连接体30与所述散热块40之间；以及封装部90，封装：所述电子元件20、所述连接体30以及所述绝缘部50。其中，所述基座10的另一侧的面的至少一部分从所述封装部90露出。所述散热块40的一侧的面的至少一部分从所述封装部90露出。

Description

电子部件
技术领域
本发明涉及一种具有设置在封装部内的基座以及电子元件的电子部件。
背景技术
以往，在电子装置、电子模块等电子部件中，为了提升散热效率会使金属基板等的背面露出，并将其经由绝缘片等绝缘部来载置于散热器等上。从两面来进行散热的电子部件也已被普遍知晓，例如在特开2016－100479号公报中，设置有：半导体芯片、封装半导体芯片的封装树脂体、被配置于半导体芯片的第一主面侧，并且与第一主电极电连接的第一导体板(第一散热器)、以及被配置于半导体芯片的第二主面侧，并且与第二主电极电连接的第二导体板(第二散热器)。并且，第一基板以及第二基板均是经由绝缘板来抵接于冷却器。
在以往使用的方式中，由于被包含在电子部件的封装部内的半导体元件等电子元件与导体板被相互电连接，因此在诸如散热器的冷却体与电子部件之间就必须设置绝缘板、绝缘片等绝缘部。然而，就这样设置绝缘部会降低制造效率。
鉴于上述问题，本发明的目的在于提供一种电子部件，该电子部件的特征为：即使是发挥散热功能的面，也无需将绝缘片等绝缘部设置在其与诸如散热器等的冷却体之间。
发明内容
概念1
本发明的概念1中的电子部件，其特征在于，包括：
基座；
电子元件，被设置于所述基座的一侧；
连接体，被设置于电子元件的一侧；
散热块，被设置于所述连接体的一侧；
绝缘部，被设置于所述连接体与所述散热块之间；以及
封装部，封装：所述电子元件、所述连接体以及所述绝缘部，
其中，所述基座的另一侧的面的至少一部分从所述封装部露出，
所述散热块的一侧的面的至少一部分从所述封装部露出。
概念2
在本发明的概念1的电子部件中，
所述连接体的前端部被经由弯曲部向另一侧弯曲，
在所述前端部的一侧设置有所述绝缘部。
概念3
在本发明的概念1或概念2的电子部件中，
所述连接体的前端部具有凹部，
在所述凹部内设置有所述绝缘部。
概念4
在本发明的概念1至概念3的任意一项概念的电子部件中，
所述散热块具有：散热块主体部、以及从所述散热块主体部向另一侧延伸的延伸部，
所述延伸部被设置于所述连接体的前端部的一侧，
所述散热块主体部的一侧的面从所述封装部露出。
概念5
在本发明的概念4的电子部件中，
所述连接体的前端部具有凹部，
在所述凹部内设置有所述绝缘部以及所述延伸部。
概念6
在本发明的概念1至概念5的任意一项概念的电子部件中，
所述绝缘部为散热绝缘片或散热绝缘材料。
概念7
在本发明的概念1至概念6的任意一项概念的电子部件中，
所述绝缘部是具有散热绝缘性的弹性构件。
概念8
在本发明的概念7的电子部件中，
所述绝缘部的厚度为所述连接体的前端部的厚度的1/5～1/1。
概念9
在本发明的概念1至概念8的任意一项概念的电子部件中，
所述连接体的基端部通过导电性粘合剂来抵接于从所述封装部向外方露出的端子的一侧的面。
概念10
在本发明的概念1至概念9的任意一项概念的电子部件中，
仅有所述散热块从所述封装部的一侧露出。
概念11
在本发明的概念1至概念10的任意一项概念的电子部件中，
所述基座、所述散热块以及所述连接体是由相同材料组成。
概念12
在本发明的概念1至概念11的任意一项概念的电子部件中，
所述散热块的另一侧的面具有粗糙面。
发明效果
根据本发明，在被设置于电子元件的一侧的连接体与散热块之间设置有绝缘部，并且散热块与电子元件被绝缘。因此，就能够将发挥散热功能的散热块侧的面直接载置于诸如散热器的冷却体上。
附图说明
图1是在本发明的第一实施方式中使用的电子部件的侧视截面图。
图2是在本发明的第一实施方式的变形例1中使用的电子部件的侧视截面图。
图3是在本发明的第一实施方式的变形例2中使用的电子部件的侧视截面图。
图4是在本发明的第一实施方式的变形例3中使用的电子部件的侧视截面图。
图5是展示在本发明的第一实施方式中使用的电子部件以及冷却体的侧视截面图。
图6是在本发明的第一实施方式的变形例4中使用的电子部件的侧视截面图。
图7是在本发明的第一实施方式中使用的电子部件中采用厚度较厚的绝缘部时的侧视截面图。
图8是从图1的右侧方向观看在本发明的第一实施方式中使用的电子部件的前视截面图。
图9是在本发明的第二实施方式中使用的电子部件的侧视截面图。
图10是从图9的右侧方向观看在本发明的第二实施方式中使用的电子部件的前视截面图。
图11是在本发明的第三实施方式中使用的电子部件的斜视图。
图12是在本发明的第三实施方式的变形例中使用的电子部件的斜视图。
图13是展示在本发明的第三实施方式中使用的电子部件的一例前视截面图。
图14是展示在本发明的第三实施方式中使用的电子部件的另一例前视截面图。
图15是在本发明的第四实施方式中使用的电子部件的前视截面图。
图16是在本发明的第四实施方式的变形例中使用的电子部件的前视截面图。
具体实施方式
第一实施方式
《构成》
以下，对本实施方式中的电子部件进行说明。本实施方式中的电子部件是例如电子装置或电子模块。例如，作为电子装置能够例举出半导体装置，而作为电子模块则能够例举出半导体模块。此外，本实施方式中的电子元件典型地是半导体元件，其既可以是例如由MOS FET或IGBT等半导体组成的开关元件，也可以是电容器等。本实施方式中的一侧是指图1的上方侧，另一侧是指图1的下方侧。将图1的上下方向(即，包含一侧的方向以及另一侧的方向的方向)作为法线方向的面，在本实施方式中其被称为“面方向”。
如图1所示，电子部件具有：基座10；被设置于基座10的一侧的电子元件20；被设置于电子元件20的一侧的连接体30；被设置于连接体30的一侧的散热块40；被设置于连接体30与散热块40之间的绝缘部50；以及封装：电子元件20、连接体30以及绝缘部50的封装部90。基座10的另一侧的面的至少一部分从封装部90露出。散热块40的一侧的面的至少一部分从封装部90露出。
在基座10的一侧的面与电子元件20的另一侧的面之间，可以设置有焊锡等导电性粘合剂80。在电子元件20的一侧的面与连接体30的前端部32的另一侧的面之间，也可以设置有焊锡等导电性粘合剂80。
虽然论述了基座10的另一侧的面的至少一部分从封装部90露出，但是不仅仅是基座10的另一侧的面的一部分，也可以是基座10的另一侧的面的整体从封装部90露出。此外，虽然也论述了散热块40的一侧的面的至少一部分从封装部90露出，但是不仅仅是散热块40的一侧的面的一部分，也可以是散热块40的一侧的面的整体从封装部90露出。
在仅是基座10的另一侧的面的一部分是露出的情况下，如图2所示，基座10具有：基座主体部12；以及从基座主体部12向另一侧突出的基座突出部11，并且该基座突出部11的另一侧的面从封装部90露出。
在仅是散热块40的一侧的面的一部分是露出的情况下，如图3所示，散热块40具有：散热块主体部42；以及从散热块主体部42向一侧突出的散热块突出部41，并且该散热块突出部41的一侧的面从封装部90露出。
连接体30的前端部32经由弯曲部31向另一侧弯曲。在前端部32上设置有绝缘部50以及散热块40。
散热块40可以由圆柱形或大致呈长方体的形态构成。在本实施方式中，大致呈长方体是指由六面体构成的，且相向的两面是被配置为平行的形态，其也包含例如角部是带有圆角的形态。大致呈立方体是指由六面体构成的，相向的两面是被配置为平行且各面的大小为相同大小的形态，其与大致呈长方体的形态相同，也包含例如角部是带有圆角的形态。
绝缘部50是散热绝缘片或散热绝缘材料。作为散热绝缘片的其中一例，能够例举出在硅中填充了氧化铝、氮化铝、氮化硼等填料的高导热片。而作为散热绝缘材料的其中一例，则能够例举出含有氧化铝，氮化铝、氮化硼等填料的环氧树脂、硅树脂、聚氨酯树脂等。
绝缘部50也可以是具有散热绝缘性的弹性构件。作为其中一例，能够例举出含有氧化铝、氮化铝、氮化硼等填料的硅橡胶等。
绝缘部50的厚度可以为连接体30的前端部32的厚度的1/5～1/1，若进一步限定，其也可以具有1/3～1/2的厚度。通过加厚绝缘部50的厚度，就能够提升绝缘耐量。
如图1至图3所示，连接体30的基端部33被连接于从封装部90向外方露出的一个或多个端子35。此外，连接体30的基端部33也可以通过焊锡等导电性粘合剂80抵接于从封装部90向外方露出的端子35的基端部36的一侧的面。只是，连接体30与端子35并非彼此分离，而是如图4所示般，连接体30的基端部33是与端子35构成为一体。连接体30的基端部33也可以被构成为：在面方向上延伸后，从封装部90的侧面突出。
连接体30的基端部33与多个端子35在被相互连接的情况下，多个端子35在面方向的图1的纸面内外方向上被并排配置，并且该等多个端子35的一侧的面与连接体30的基端部33可以通过焊锡等导电性粘合剂80来互相抵接(参照图11以及图12)。此外，连接体30的基端部33与多个端子35也可以被构成为一体，在这种情况下，多个端子35也可以在面方向的图1的纸面内外方向上被并排配置。
在本实施方式的电子部件中，仅仅是散热块40从封装部90的一侧露出。
基座10、散热块40以及连接体30是由相同材料构成。作为其中一例，基座10、散热块40以及连接体30均可以由铜或含有铜的金属构成。
《作用·效果》
接着，对由上述构成所组成的本实施方式的作用·效果的其中一例进行说明。在上述构成中能够采用《作用·效果》中说明的所有方式。
在本发明中，当采用：在电子元件20的一侧上设置的连接体30与散热块40之间设置有绝缘部50，并且散热块40与电子元件20是被绝缘的方式时，如图5所示，能够将发挥散热功能的散热块40侧的面直接载置于诸如散热器的冷却体110上。因此，就无需在电子部件与诸如散热器的冷却体110之间另外设置散热绝缘片或散热绝缘材料等，这对于能够提高设计自由度这点上是有帮助的。此外，即使是在使用诸如本实施方式中的电子部件的情况下，也可以在诸如散热器的冷却体之间设置散热绝缘片或散热绝缘材料等。
如图1等所示，当采用：连接体30的前端部32经由弯曲部31向另一侧弯曲，并且在前端部32设置有绝缘部50以及散热块40的方式时，对于能够利用弯曲部31将绝缘部50在面方向上进行定位这点上是有帮助的。从该观点来看，如图3所示，对于绝缘部50的弯曲部31侧的侧面(图3的左侧面)抵接于弯曲部31，从而进行绝缘部50在面方向上的定位是有帮助的。
当采用：散热块40是由大致呈长方体或大致呈立方体的形态所构成的方式时，对于在制造工序中能够将散热块40容易地载置于向另一侧弯曲的前端部32这点上是有帮助的。
如图8所示，散热块40在面方向上的大小更大于连接体30的前端部32在面方向上的大小，并且散热块40是从连接体30的前端部32在面方向上突出的大小。
当绝缘部50是由散热绝缘片所构成时，对于能够维持绝缘性的同时实现高散热性这点上是有帮助的。此外，即使在绝缘部50是由散热绝缘材料所构成的情况下，对于能够维持绝缘性的同时实现高散热性这点上也是有帮助的。
在绝缘部50即使是由具有散热绝缘性的弹性构件所构成的情况下，对于能够维持绝缘性的同时实现高散热性这点上也是有帮助的。除了该效果以外，当采用本方式时，对于在制造工序中能够通过散热块40来按压绝缘部50的同时将绝缘部50以及散热块40载置于连接体30的前端部32这点上是有帮助的。即，在绝缘部50是由弹性构件所构成的情况下，即使散热块40相比于用于流入构成封装部90的封装树脂的模具是多多少少地向一侧突出，也能够通过模具来对散热块40进行按压的同时将封装树脂流入模具内。因此，对于即使因个体差等制造误差导致散热块40多多少少地从模具的厚度方向上突出，也能够在没有特别障碍的情况下制造电子部件这点上是有帮助的。此外，通过这样按压绝缘部50能够使绝缘部50内所包含的填料彼此靠近，并且还能够更为提升导热性。
当使用具有散热绝缘性的弹性构件来作为绝缘部50时，如图6所示，散热块40也可以设计为：在厚度方向上多多少少地从流入封装树脂的模具(封装部90)处突出。通过这样使散热块40多多少少地突出，就能够按压绝缘部50，并且能够使绝缘部50内所包含的填料彼此靠近，还能够更为提升导热性。其中，多多少少地突出是指：例如以小于等于绝缘部50厚度的1/10的高度突出。
特别是在绝缘部50是由具有散热绝缘性的弹性构件所构成的情况下，如图7所示，通过加厚绝缘部50的厚度，也能够如所述般利用该弹性力。因此，在该方式中的绝缘部50具有连接体30的前端部32厚度的1/3～1/2的厚度是有帮助的。
当采用：连接体30的基端部33是通过焊锡等导电性粘合剂80来抵接于从封装部90向外方露出的端子35的一侧的面的方式时，即便通过利用封装树脂进行封装时所使用的模具按压连接体30的前端部32侧，从而导致基端部33侧上浮，端子35本身也不会因此上浮。
在电子部件中，当采用：仅仅是散热块40从封装部90的一侧露出的方式时，能够将来自于电子元件20的发热仅通过经由绝缘部50以及散热块40的热路径来进行散热。特别是在采用例如散热绝缘片、散热绝缘材料或具有散热绝缘性的弹性构件等来作为绝缘部50的情况下，对于能够更高效地进行来自于电子元件20的发热这点上是有帮助的。
当基座10、散热块40以及连接体30是由相同材料所构成的情况下，能够以该等基座10、散热块40以及连接体30来调节在制造工序中施加的热量所引起的热膨胀或热收缩的比例。因此，例如通过调节基座10与连接体30之间的热膨胀或热收缩的比例，对于能够防止在基座10与连接体30之间的导电性粘合剂80中产生裂纹这点上是有帮助的。此外，通过调节连接体30与散热块40之间的热膨胀或热收缩的比例，对于能够防止在连接体30与散热块40之间产生偏移这点上是有帮助的。
第二实施方式
接着，对本发明的第二实施方式进行说明。
在本实施方式中，如图9所示，散热块40具有：散热块主体部42、以及从散热块主体部42向另一侧延伸的延伸部43。延伸部43被设置于连接体30的前端部32。散热块主体部42的一侧的面从封装部90露出。除此以外，则与第一实施方式相同，即使是第二实施方式也能够采用在第一实施方式中所采用的所有构成。对于在第一实施方式中说明过的构件则添加相同符号来进行说明。
通过设置如本实施方式般的延伸部43，就能够在将延伸部43载置于连接体30的前端部32的同时，增大散热块主体部42中的从封装部90的露出面。因此，对于能够实现高散热性这点上是有帮助的。
此外，从将延伸部43载置于连接体30的前端部32的观点来说，如图9以及图10所示，延伸部43在面方向上的面积更小于连接体30的前端部32。通过这样将延伸部43在面方向上的面积设为更小于连接体30的前端部32，对于能够防止延伸部43与连接体30相互接触这点上是有帮助的。此外，虽然也可以不限于这种方式而使延伸部43在面方向上的面积更大于连接体30的前端部32，但是在这时，延伸部43的一部分会在与弯曲部31的相反侧(图9的右侧)从前端部32在面方向上突出(参照图9中的以虚线展示的符号43)。
第三实施方式
接着，对本发明的第三实施方式进行说明。
在本实施方式中，如图11以及图12所示，连接体30的前端部32具有凹部130。如图13所示，在凹部130内也可以设置有绝缘部50。此外，如图14所示，在凹部130内不仅可以设置有绝缘部50，还可以设置有散热块40的延伸部43。其中，在图14所示的方式中，在延伸部43与连接体30的前端部32之间设置有间隙，并且互不接触。即使是第三实施方式也能够采用在上述各实施方式中所采用的所有构成。对于在上述各实施方式中说明过的构件则添加相同符号来进行说明。
通过如本实施方式般设置凹部130，能够将绝缘部50相对于连接体30的前端部32进行准确地定位。因此，就能够使电子部件的制造工序变得容易。
可以通过敲击前端部32来形成凹部130。在采用这种制造工序的情况下，通过形成凹部130就能够在前端部32的另一侧的面上形成如图11所示般的凸部131。此外，如图12所示，也能够采用设置凹部130，但不设置凸部131的方式。
第四实施方式
接着，对本发明的第四实施方式进行说明。
在本实施方式中，如图15所示，散热块40的另一侧的面具有粗糙面。即使是第四实施方式也能够采用在上述各实施方式中所采用的所有构成。对于在上述各实施方式中说明过的构件则添加相同符号来进行说明。
被设置于散热块40的另一侧的面上的粗糙面可以是具有细小的凹凸形状140的形态。这种细小的凹凸形状140可以通过进行喷砂来形成。当如本实施方式般散热块40的另一侧的面是粗糙面的情况下，通过散热块40能够防止由散热绝缘片或由具有散热绝缘性的弹性材料等组成的绝缘部50在面方向上移位。
此外，在散热块40是具有延伸部43的形态中，如图16所示，散热块40的延伸部43的另一侧的面具有细小的凹凸形状140，散热块主体部42的另一侧的面可以不具有凹凸形状。此外，不限于该形态，散热块主体部42的另一侧的面也可以具有凹凸形状。
上述各实施方式中的记载以及附图的公开只不过是用于说明在权利要求中记载的发明的一个示例，在权利要求中记载的发明不受上述各实施方式中的记载以及附图的公开所限定。此外，最初申请的权利要求的记载只是一个示例，基于说明书、附图等记载能够对权利要求的记载进行适当变更。
符号说明
10 基座
20 电子元件
30 连接体
31 弯曲部
32 前端部
35 端子
40 散热块
42 散热块主体部
43 延伸部
50 绝缘部
80 导电性粘合剂
90 封装部
130 凹部

Claims (12)

1.一种电子部件，其特征在于，包括：
基座；
电子元件，被设置于所述基座的一侧；
连接体，被设置于电子元件的一侧；
散热块，被设置于所述连接体的一侧；
绝缘部，被设置于所述连接体与所述散热块之间；以及
封装部，封装：所述电子元件、所述连接体以及所述绝缘部，
其中，所述基座的另一侧的面的至少一部分从所述封装部露出，
所述散热块的一侧的面的至少一部分从所述封装部露出。
2.根据权利要求1所述的电子部件，其特征在于：
其中，所述连接体的前端部被经由弯曲部向另一侧弯曲，
在所述前端部的一侧设置有所述绝缘部。
3.根据权利要求1所述的电子部件，其特征在于：
其中，所述连接体的前端部具有凹部，
在所述凹部内设置有所述绝缘部。
4.根据权利要求1所述的电子部件，其特征在于：
其中，所述散热块具有：散热块主体部、以及从所述散热块主体部向另一侧延伸的延伸部，
所述延伸部被设置于所述连接体的前端部的一侧，
所述散热块主体部的一侧的面从所述封装部露出。
5.根据权利要求4所述的电子部件，其特征在于：
其中，所述连接体的前端部具有凹部，
在所述凹部内设置有所述绝缘部以及所述延伸部。
6.根据权利要求1所述的电子部件，其特征在于：
其中，所述绝缘部为散热绝缘片或散热绝缘材料。
7.根据权利要求1所述的电子部件，其特征在于：
其中，所述绝缘部是具有散热绝缘性的弹性构件。
8.根据权利要求7所述的电子部件，其特征在于：
其中，所述绝缘部的厚度为所述连接体的前端部的厚度的1/5～1/1。
9.根据权利要求1所述的电子部件，其特征在于：
其中，所述连接体的基端部通过导电性粘合剂来抵接于从所述封装部向外方露出的端子的一侧的面。
10.根据权利要求1所述的电子部件，其特征在于：
其中，仅有所述散热块从所述封装部的一侧露出。
11.根据权利要求1所述的电子部件，其特征在于：
其中，所述基座、所述散热块以及所述连接体是由相同材料组成。
12.根据权利要求1所述的电子部件，其特征在于：
其中，所述散热块的另一侧的面具有粗糙面。
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