CN111312616A - 切削装置和使用了切削装置的晶片的加工方法 - Google Patents
切削装置和使用了切削装置的晶片的加工方法 Download PDFInfo
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Abstract
提供切削装置和使用了切削装置的晶片的加工方法,实现提高形成于晶片的整个外周缘的环状槽的检查效率。该切削装置包含:切削单元,其对晶片的外周缘进行切削而形成环状槽;边缘夹具,其将晶片保持为能够旋转;线扫描相机,该线扫描相机中的呈一列排列的拍摄元件与边缘夹具所保持的晶片的环状槽面对,并沿着环状槽的宽度方向配置;检查部,其根据一边使边缘夹具旋转一边对环状槽进行拍摄的线扫描相机所输出的信号而获取晶片的整个外周缘的环状槽的图像,并根据图像检测环状槽的宽度和缺陷;以及警告部,在检查部的检查结果偏离了预先登记的允许范围的情况下,该警告部发送警告信息。
Description
技术领域
本发明涉及切削装置和使用了切削装置的晶片的加工方法。
背景技术
近年来,随着电子设备的轻薄短小化的要求,形成有半导体器件的半导体晶片(以下称为晶片)的薄化不断发展。这种晶片的外周缘从正面至背面被倒角成R形状,因此当对晶片的背面进行磨削而薄化时,存在如下的问题:外周缘成为所谓的刀刃状态,容易在磨削中的晶片的外周缘产生缺陷。为了解决该问题,开发了边缘修剪技术,预先在晶片的器件面侧形成沿着外周缘的环状槽(例如参照专利文献1)。
另一方面,在这种边缘修剪中,当未按照规定的宽度将晶片的外周缘去除时,担心会残留R形状,因此研究了具有对外周缘的环状槽的宽度进行检测的功能的切削装置(例如参照专利文献2)。
专利文献1:日本特开2007-152906号公报
专利文献2:日本特开2013-149822号公报
但是,以往的技术使用拍摄单元按照规定的角度间隔对晶片的外周缘的环状槽进行拍摄,根据该拍摄图像来检查环状槽的宽度的优劣,因此需要每次将晶片的外周缘的规定点定位于拍摄单元的下方,检查所需的时间增长。另外,按照每个规定的角度间隔进行拍摄,因此无法沿着整个圆周对环状槽进行检查,期望提高检查效率。
发明内容
由此,本发明的目的在于提供切削装置和使用了切削装置的晶片的加工方法,实现提高形成于晶片的整个外周缘的环状槽的检查效率。
根据本发明的一个方式,提供切削装置,其中,该切削装置具有:切削单元,其具有安装切削刀具的主轴,该切削单元对晶片的外周缘进行切削而形成环状槽;边缘夹具,其将晶片保持为能够旋转;线扫描相机,该线扫描相机中的呈一列排列的受光元件与该边缘夹具所保持的该晶片的该环状槽面对,并沿着该环状槽的宽度方向配置;检查部,其根据一边使该边缘夹具旋转一边对该环状槽进行拍摄的该线扫描相机所输出的信号而构成该晶片的整个外周缘的该环状槽的图像,并根据该图像来检测该环状槽的宽度和缺陷;以及警告部,在该检查部的检查结果偏离了预先登记的允许范围的情况下,该警告部发送警告信息。
根据本发明的另一方式,提供使用了切削装置的晶片的加工方法,使用如下的切削装置对在外周缘形成有从正面至背面的倒角部的晶片的外周缘进行切削,该切削装置具有:切削单元,其具有安装切削刀具的主轴,该切削单元对晶片的外周缘进行切削而形成环状槽;边缘夹具,其将晶片保持为能够旋转;线扫描相机,该线扫描相机中的呈一列排列的受光元件与该边缘夹具所保持的该晶片的该环状槽面对,并沿着该环状槽的宽度方向配置;检查部,其根据一边使该边缘夹具旋转一边对该环状槽进行拍摄的该线扫描相机所输出的信号而构成该晶片的整个外周缘的该环状槽的图像,并根据该图像来检测该环状槽的宽度和缺陷;以及警告部,在该检查部的检查结果偏离了预先登记的允许范围的情况下,该警告部发送警告信息,其中,该晶片的加工方法具有如下的步骤:圆形切削步骤,利用保持面将该晶片保持,一边使该切削刀具切入该晶片的外周缘一边使该边缘夹具旋转,在该外周缘形成该环状槽;拍摄步骤,在实施了该圆形切削步骤之后,将该线扫描相机定位于与将晶片保持为能够旋转的边缘夹具所保持的该晶片的该环状槽面对的位置,一边对该晶片进行拍摄一边使该边缘夹具旋转,对该晶片整个外周缘进行拍摄而获取拍摄图像;以及检查步骤,利用该检查部对通过该拍摄步骤而拍摄的该拍摄图像进行检查,在得到该检查部的检查结果偏离了预先登记的允许范围这一结果的情况下发送警告信息。
根据本发明,通过使用线扫描相机对环状槽进行拍摄,能够一边使保持部旋转一边在短时间内对晶片的整个外周缘的环状槽进行拍摄,从而能够在整个圆周上有效地检查环状槽。
附图说明
图1是示出本发明实施方式的切削装置的一例的立体图。
图2是示出保持着晶片的卡盘工作台的剖视图。
图3是示意性示出对晶片的外周缘进行保持的边缘夹具以及对外周缘进行拍摄的线扫描相机的俯视图。
图4是示出本实施方式的晶片的加工方法的步骤的流程图。
图5是示出圆形切削步骤的侧剖视图。
图6是示出清洗步骤的侧剖视图。
图7是示出拍摄步骤的侧剖视图。
图8是示出拍摄步骤中的拍摄区域的一例的图。
图9是示出根据所拍摄的多个图像信息而形成的晶片的整个外周缘的图像的一例的图。
标号说明
1:切削装置;10:卡盘工作台(保持部);17a、17b:切削单元;18:切削刀具;30:清洗单元;40:边缘夹具(保持部);50:线扫描相机;50A:壳体;50B:拍摄元件(受光元件);60:控制单元;63:检查部;64:警告部;80:拍摄区域;90:图像;100:晶片;101:上表面(正面);104:外周缘;105:下表面(背面);107:环状槽;108:缺陷;200:检查区域。
具体实施方式
以下,参照附图对本发明的实施方式进行详细说明。本发明并不被以下实施方式所记载的内容限定。另外,在以下所记载的构成要素中包含本领域技术人员能够容易想到的内容、实质上相同的内容。另外,以下所记载的结构可以适当组合。另外,可以在不脱离本发明的主旨的范围内进行结构的各种省略、置换或变更。
根据附图,对本实施方式的切削装置进行说明。图1是示出本实施方式的切削装置的一例的立体图。图2是示出保持着晶片的卡盘工作台的剖视图。图3是示意性示出对晶片的外周缘进行保持的边缘夹具以及对外周缘进行拍摄的线扫描相机的俯视图。另外,在图3中,省略了形成于晶片的正面上的器件等。
晶片100例如是以硅、蓝宝石、SiC(碳化硅)或砷化镓等作为母材的圆板形状的半导体器件晶片或光器件晶片。如图1和图2所示,晶片100在上表面(正面)101具有呈格子状形成的分割预定线102,在由该分割预定线划分的各区域内形成有IC、LSI等器件103。另外,如图2所示,晶片100的外周缘104从上表面101至下表面(背面)105被倒角成圆弧状(R形状)。在晶片100的外周缘104的一部分形成有作为晶体取向的识别标记的凹口106。
本实施方式的切削装置1是具有如下功能的装置:在晶片100的倒角的外周缘104的上表面101侧形成沿着外周缘104的环状槽(边缘修剪加工),并且检查所形成的环状槽的宽度是否处于规定的基准范围内。如图1所示,切削装置1具有装置主体2,在该装置主体2的上表面2a上具有盒载置台3。盒载置台3能够升降,在该盒载置台3上能够载置收纳有多个晶片100的盒4。
在装置主体2的X轴方向前部设置有相对于盒4进行晶片100的搬出和搬入的搬送机器人6。搬送机器人6具有:对晶片100进行保持的机械手6a;以及使机械手6a移动至期望的位置的臂部6b。搬送机器人6能够通过未图示的搬送机构在Y轴方向上移动。
在装置主体2的上表面2a的X轴方向后部设置有能够在X轴方向上移动的移动基台7,按照跨越该移动基台7的路径的方式竖立设置有门型框架5。在移动基台7上设置有:修整板保持单元8,其对后述的用于将切削刀具18的前端形状修整为平坦的修整板进行保持;能够自转的卡盘工作台(保持部)10,其对晶片100进行保持;以及加工进给机构13,其将卡盘工作台10在X轴方向上进行加工进给。
卡盘工作台10具有在周缘部对晶片100的下表面105的外周缘104侧进行保持的环状的保持面11,如图2所示,保持面11的内侧的区域成为不与晶片100的下表面105接触的凹状的空间12。在卡盘工作台10中形成有在保持面11上开口的吸引口14,该吸引口14经由阀15而与吸引源16连接。虽省略了图示,但加工进给机构13构成为具有:周知的滚珠丝杠,其设置成绕轴心旋转自如;周知的电动机,其使该滚珠丝杠绕轴心旋转;以及周知的导轨,其将卡盘工作台10支承为在X轴方向上移动自如。
另外,如图1所示,切削装置1具有一对切削单元17a、17b,一对切削单元17a、17b分别对卡盘工作台10所保持的晶片100的外周缘104进行切削。这些切削单元17a、17b夹着卡盘工作台10而对置配置。一方的切削单元17a至少具有:切削刀具18,其沿着外周缘104对晶片100的上表面101进行切削,在外周缘104形成后述的环状槽107;以及主轴19,其具有Y轴方向的轴心,使切削刀具18旋转。另一方的切削单元17b也与切削单元17a同样地构成。另外,在对晶片100进行切削时,可以不使两个切削单元17a、17b同时运转,但也可以同时运转。
在门型框架的X轴方向前方设置有:切入进给机构20a,其将切削单元17a在Z轴方向上进行切入进给;分度进给机构25a,其将切削单元17a在Y轴方向上进行分度进给;切入进给机构20b,其将切削单元17b在Z轴方向上进行切入进给;以及分度进给机构25b,其将切削单元17b在Y轴方向上进行分度进给。切入进给机构20a具有:滚珠丝杠21,其沿Z轴方向延伸;电动机22,其与滚珠丝杠21的一端连接;一对导轨23,它们与滚珠丝杠21平行地延伸;以及升降板24,其与切削单元17a连结。在升降板24的一个面上滑动连接有一对导轨23,滚珠丝杠21与形成于升降板24的中央部的未图示的螺母螺合。并且,电动机22使滚珠丝杠21转动,从而能够使切削单元17a与升降板24一起按照规定的进给速度在Z轴方向上升降。另外,切入进给机构20b也与切入进给机构20a同样地构成,因此对构成切入进给机构20b的各部位标记与切入进给机构20a相同的标号,并省略了其说明。
分度进给机构25a和分度进给机构25b分别具有:滚珠丝杠26,其沿Y轴方向延伸;电动机27,其与各个滚珠丝杠26连接;导轨28,其与滚珠丝杠26平行地延伸;以及移动板29,其在一个面上连结有切入进给机构20a和切入进给机构20b,并且使切削单元17a和切削单元17b分别在Y轴方向上移动。在移动板29的另一个面上滑动连接有一对导轨28,滚珠丝杠26与形成于移动板29的中央部的未图示的螺母螺合。当通过电动机27进行驱动而使滚珠丝杠26转动时,能够将切削单元17a和切削单元17b与移动板29一起在Y轴方向上进行分度进给。
切削装置1配设有:清洗单元30,其对加工后的晶片100进行清洗;以及搬送垫9,其将加工后的晶片100从卡盘工作台10搬送至清洗单元30。清洗单元30至少具有:旋转台31,其对晶片100进行保持,能够自转并且能够升降;以及清洗水喷嘴32,其将清洗水提供至旋转台31所保持的晶片。
在装置主体2的上表面2a的中央部,在盒载置台3与清洗单元30之间设置有对形成于晶片100的外周缘的环状槽的宽度(槽宽度)进行检查的检查区域200。在该检查区域200中,切削装置1具有:多个(至少三个)边缘夹具(保持部)40,它们对晶片100的外周缘104进行夹持(保持);以及线扫描相机50,其对形成于边缘夹具40所保持的加工后的晶片100的外周缘104的环状槽107进行拍摄。
如图3所示,多个边缘夹具40的全部或任何一个设置成在晶片100的外周缘104附近沿半径方向移动自如。另外,边缘夹具40形成为大致圆柱状,其高度方向的中央部在周向上凹陷成横向V字状。另外,边缘夹具40被支承为在装置主体2的上表面2a上分别在水平面内旋转驱动自如,构成为能够与晶片100的厚度无关地以点接触状态对外周缘104进行夹持。因此,边缘夹具40能够在对晶片100的外周缘104进行了夹持的状态下将晶片100保持为旋转自如。
如图3所示,线扫描相机50具有在晶片100的上方与外周缘104的环状槽107面对而配置的细长的壳体50A,该壳体50A的长度方向沿着边缘夹具40所保持的晶片100的半径方向延伸。在该壳体50A的长度方向上,呈一列并排地内置有多个CCD图像传感器或CMOS图像传感器等拍摄元件(受光元件)。因此,线扫描相机50的多个拍摄元件沿着晶片100的环状槽107的宽度方向进行配置,线扫描相机50一边使边缘夹具40所保持的晶片100旋转,一边逐行对晶片100的环状槽107进行拍摄。线扫描相机50使用至少比环状槽107的宽度长的线扫描相机50。另外,线扫描相机50构成为在上述的半径方向上进退自如,优选在拍摄时线扫描相机50向晶片100的环状槽107的上方延伸,在相对于边缘夹具40装卸晶片100时,线扫描相机50从晶片100的上方退避。另外,线扫描相机50具有在拍摄时照射环状槽107的光源51。线扫描相机50所拍摄的多个图像信息(信号)输出至切削装置1所具有的控制单元60。
如图1所示,控制单元60具有:运算处理部61、存储部62、检查部63以及警告部64。运算处理部61构成为具有CPU(central processing unit,中央处理器)那样的微处理器,执行计算机程序而生成用于控制切削装置1的动作以及用于控制环状槽107的检查动作的各种控制信号。所生成的控制信号经由输入输出接口(未图示)而输出至切削装置1的各构成要素。存储部62存储有各种信息、特别是从线扫描相机50输出的图像信息。线扫描相机50沿着旋转的晶片100的整个外周缘104对环状槽107进行拍摄并将这些图像信息依次输出,因此存储部62至少存储有整个外周缘104的图像信息。
检查部63在运算处理部61的控制下根据存储于存储部62的图像信息而形成晶片100的整个外周缘104的图像,根据该图像来检查环状槽107的宽度及环状槽107的区域的缺陷(崩边)的有无和大小。警告部64将检查部63所检查的环状槽107的宽度及缺陷的大小与预先登记的允许范围进行比较。并且,若环状槽107的宽度或缺陷的大小处于允许范围内,则警告部64判定为正常进行加工。另外,警告部64在运算处理部61的控制下,在环状槽107的宽度或缺陷的大小偏离允许范围的情况下,判定为未正常进行加工并发送警告信息。作为警告信息,例如点亮警告灯或发出警告音。另外,也可以在切削装置1所具有的操作面板上显示加工异常的信息。
接着,对使用上述切削装置1对晶片100进行加工的加工方法进行说明。图4是示出本实施方式的晶片的加工方法的步骤的流程图。本实施方式的晶片的加工方法在晶片100的外周缘104形成环状槽107,对该环状槽107进行检查。如图4所示,晶片的加工方法具有:圆形切削步骤ST1、清洗步骤ST2、拍摄步骤ST3以及检查步骤ST4。
(圆形切削步骤)
图5是示出圆形切削步骤的侧剖视图。圆形切削步骤ST1是一边使切削刀具切入至卡盘工作台10所保持的晶片100的外周缘104一边使卡盘工作台10旋转而在外周缘104形成环状槽107的步骤。在本实施方式中,对仅利用一方的切削单元17a来形成环状槽107的情况进行说明。
首先,将晶片100保持在卡盘工作台10上。在该情况下,使用图1所示的搬送机器人6,将加工前的晶片100从盒4中取出,将该晶片100的下表面105载置在卡盘工作台10的保持面11上。接着,将图2所示的阀15打开,并且使吸引源16的吸引力作用于保持面11,利用保持面11对晶片100进行吸引保持。此时,面向空间12的晶片100的下表面105处于非接触的状态,因此不会在该下表面105上附着灰尘等。
当将晶片100保持在卡盘工作台10上时,使用移动基台7(图1)使卡盘工作台10移动至切削单元17a的下方,如图5所示,在晶片100的外周缘104形成环状槽107。具体而言,使移动至切削单元17a的下方的卡盘工作台10例如在箭头A方向上旋转。切削单元17a使主轴19旋转,从而一边使切削刀具18例如在箭头E方向上按照规定的旋转速度进行旋转,一边使用切入进给机构20a(图1)使切削单元17a在Z轴方向上下降,使旋转的切削刀具18切入卡盘工作台10所保持的晶片100的外周缘104。这样通过切削刀具18将呈圆弧状形成于晶片100的外周缘104的倒角的一部分去除而形成具有期望的宽度和深度的环状槽107。另外,除了使切削单元17a在Z轴方向上下降而使切削刀具18切入晶片100的外周缘104以外,还可以是,在预先将切削单元17a定位于规定的切入高度之后,使卡盘工作台10在X轴方向上移动而使切削刀具18切入晶片100的外周缘104。
(清洗步骤)
图6是示出清洗步骤的侧剖视图。清洗步骤ST2是对已切削加工有环状槽107的晶片100进行清洗的步骤。在实施了圆形切削步骤ST1之后,搬送垫9将加工后的晶片100从卡盘工作台10搬送至清洗单元30的旋转台31上。如图6所示,若将晶片100载置于旋转台31上,则将阀15a打开,通过吸引源16a的吸引力将晶片100吸引保持于旋转台31的保持面31a上。然后,一边使旋转台31按照规定的旋转速度例如在箭头B方向上旋转,一边从清洗水喷嘴32朝向旋转台31所保持的晶片100提供清洗水33,进行晶片100的清洗。在清洗结束之后,使旋转台31按照比清洗时高的速度进行旋转,喷出高压空气等而使晶片100干燥。另外,在清洗步骤ST2中,也可以使清洗水喷嘴32在晶片100的上表面(正面)101上移动而对整个该上表面101提供清洗水。
(拍摄步骤)
图7是示出拍摄步骤的侧剖视图。图8是示出拍摄步骤中的拍摄区域的一例的图。拍摄步骤ST3是使用线扫描相机50一边使晶片100旋转一边对该晶片100的整个外周缘104的环状槽107的图像进行拍摄的步骤。
在实施了清洗步骤ST2之后,为了检查环状槽107是否成为期望的槽宽度,使用搬送机器人6将清洗后的晶片100从旋转台31搬出,将该晶片100搬送至检查区域200。当将晶片100搬送至检查区域200时,如图3所示,各边缘夹具40按照沿半径方向靠近的方式移动,对晶片100的外周缘104进行夹持而固定。另外,边缘夹具40分别进行旋转,使晶片100例如在图中箭头方向上旋转。
接着,如图3和图7所示,线扫描相机50在晶片100的半径方向上移动而定位于与环状槽107面对的位置。使各边缘夹具40旋转驱动而使晶片100旋转,并且线扫描相机50例如从凹口106(图3)起对整个外周缘104的环状槽107进行拍摄直至再次到达凹口106为止。线扫描相机50在壳体50A内具有呈一列排列的多个拍摄元件50B,这些拍摄元件50B在晶片100的半径方向上排列。因此,如图8所示,线扫描相机50根据晶片100的旋转而在各个相当于拍摄元件50B的一行的拍摄区域80中依次对环状槽107进行拍摄。该拍摄区域80沿环状槽107的半径方向延伸,至少包含环状槽107的槽内周边缘107A与晶片100的外周缘104之间的槽底107B。与各拍摄区域80对应的图像信息输出至存储部62,存储部62存储整个外周缘104的图像信息。
(检查步骤)
检查步骤ST4是根据存储于存储部62的图像信息而形成晶片100的整个外周缘104的图像,并根据该图像来检查环状槽107的宽度及环状槽107的区域的缺陷的有无和大小的步骤。图9是示出根据所拍摄的多个图像信息而形成的晶片的整个外周缘的图像的一例的图。如图9所示,晶片100的整个外周缘104的图像90是将与拍摄区域80对应的图像信息连接而形成的。根据该图像90,检查部63检查环状槽107的宽度L及环状槽107的区域的缺陷108的有无和缺陷108的大小。环状槽107的宽度L是指环状槽107的槽内周边缘107A与晶片100的外周缘104之间的半径方向的长度。另外,环状槽107的区域的缺陷108例如是在环状槽107的槽内周边缘107A所产生的缺陷部位,缺陷108的大小D是指缺陷108的半径方向的长度。
检查部63对环状槽107的宽度L是否处于预先登记的允许范围内进行判断。具体而言,检查部63从整个圆周的值中读出晶片100的环状槽107的宽度L的最大值和最小值,对该最大值和最小值是否处于允许范围内进行判断。另外,当在环状槽107的区域中产生了缺陷108的情况下,检查部63对缺陷108的大小D是否处于预先登记的允许范围内进行判断。该缺陷108的大小D也可以不仅包含晶片100(环状槽107)的径向的长度,也包含周向的长度(大小)。
在这些判断中,在环状槽107的宽度L或缺陷108的大小D偏离允许范围的情况下,判定为环状槽107未正常进行加工,警告部64发送警告信息。作为警告信息,例如点亮警告灯、或发出警告音。另外,也可以在切削装置1所具有的操作面板上显示加工异常的信息。在环状槽107的宽度L或缺陷108的大小D偏离允许范围的情况下,有可能在切削刀具18的前端形状产生偏磨损,因此可以使旋转的切削刀具18切入图1所示的修整板保持单元8所保持的修整板来进行修整从而进行磨锐,或通过平坦化修整而修整切削刀具18的前端的形状。另外,也可以根据切削刀具18的偏磨损的程度更换成新的切削刀具18。
在实施了检查步骤ST4之后,通过搬送机器人6将晶片100从检查区域200搬出,将该晶片100收纳于盒4中。另外,在切削装置1的存储部62中预先存储要将实施检查步骤ST4而判断为环状槽107的宽度L或缺陷108的大小D未落入允许范围内的晶片100作为不良的晶片收纳于盒4的第几层。同时,也可以存储以凹口106为基准的哪个位置的宽度L或缺陷108的大小D未落入允许范围内。另外,也可以将环状槽107的宽度L或缺陷108的大小D未落入允许范围内的晶片100收纳于与原本进行收纳的盒4不同的盒中。
如以上所说明的那样,本实施方式的切削装置1具有:切削单元17a、17b,它们具有安装切削刀具18的主轴19,该切削单元17a、17b对晶片100的外周缘104进行切削而形成环状槽107;边缘夹具40,其将晶片100保持为能够旋转;线扫描相机50,该线扫描相机50中,呈一列排列的拍摄元件50B与边缘夹具40所保持的晶片100的环状槽107面对,并沿着环状槽107的宽度方向配置;检查部63,其根据一边使边缘夹具40旋转一边对环状槽107进行拍摄的线扫描相机50所输出的信号,构成晶片100的整个外周缘104的环状槽107的图像90,根据该图像90而检测环状槽107的宽度L和缺陷108的有无及大小D;以及警告部64,其在检查部63的检查结果偏离预先登记的允许范围的情况下发送警告信息。根据该结构,使用线扫描相机50对环状槽107进行拍摄,从而能够一边使边缘夹具40旋转一边在短时间内对晶片100的整个外周缘104的环状槽107进行拍摄,能够沿着整个圆周有效地检查环状槽107。
根据发明人的实验,在使用以往的区域相机按照规定的角度间隔对环状槽107的多个部位(例如36处)进行拍摄的情况下,需要每次将规定的拍摄点定位于区域相机的下方,因此拍摄36处需要150秒。另外,在该结构中,按照每个规定的角度间隔进行拍摄,因此无法对整个外周缘104的环状槽107进行检查。与此相对,根据使用线扫描相机50的本实施方式的结构,在使用边缘夹具40使晶片100按照规定的速度(5mm/s)进行旋转的情况下,能够在12.6秒这样的以往的1/10以下的时间内对整个外周缘104的环状槽107进行拍摄。
由此,按照每个晶片100对环状槽107的宽度L及缺陷108的大小D是否处于允许范围内进行判断,从而能够简单且迅速地检测晶片100的优劣,因此进一步提高产品的生产率。
另外,本发明并不限于上述实施方式。即,可以在不脱离本发明的主旨的范围内进行各种变形并实施。例如在上述实施方式中,在利用边缘夹具40使晶片100旋转的状态下,通过线扫描相机50对整个外周缘104进行了拍摄,但也可以构成为在将晶片100保持于卡盘工作台(保持部)10的状态下,线扫描相机50按照与晶片100的环状槽107面对的方式进行移动。
即也可以是,在使用切削单元17a、17b在晶片100的外周缘104形成环状槽107的圆形切削步骤ST1之后,在不使晶片100移动而是使卡盘工作台10(晶片100)旋转的状态下,使线扫描相机50按照与晶片100的环状槽107面对的方式移动,从而对整个外周缘104进行拍摄。根据该结构,无需使晶片100移动便能够在切削后直接在卡盘工作台10上进行检查,因此检查的时间效率较好。
Claims (2)
1.一种切削装置,其中,
该切削装置具有:
切削单元,其具有安装切削刀具的主轴,该切削单元对晶片的外周缘进行切削而形成环状槽;
边缘夹具,其将晶片保持为能够旋转;
线扫描相机,该线扫描相机中的呈一列排列的受光元件与该边缘夹具所保持的该晶片的该环状槽面对,并沿着该环状槽的宽度方向配置;
检查部,其根据一边使该边缘夹具旋转一边对该环状槽进行拍摄的该线扫描相机所输出的信号而构成该晶片的整个外周缘的该环状槽的图像,并根据该图像来检测该环状槽的宽度和缺陷;以及
警告部,在该检查部的检查结果偏离了预先登记的允许范围的情况下,该警告部发送警告信息。
2.一种使用了切削装置的晶片的加工方法,使用如下的切削装置对在外周缘形成有从正面至背面的倒角部的晶片的外周缘进行切削,
该切削装置具有:
切削单元,其具有安装切削刀具的主轴,该切削单元对晶片的外周缘进行切削而形成环状槽;
边缘夹具,其将晶片保持为能够旋转;
线扫描相机,该线扫描相机中的呈一列排列的受光元件与该边缘夹具所保持的该晶片的该环状槽面对,并沿着该环状槽的宽度方向配置;
检查部,其根据一边使该边缘夹具旋转一边对该环状槽进行拍摄的该线扫描相机所输出的信号而构成该晶片的整个外周缘的该环状槽的图像,并根据该图像来检测该环状槽的宽度和缺陷;以及
警告部,在该检查部的检查结果偏离了预先登记的允许范围的情况下,该警告部发送警告信息,
其中,该晶片的加工方法具有如下的步骤:
圆形切削步骤,利用保持面来保持该晶片,一边使该切削刀具切入该晶片的外周缘一边使该边缘夹具旋转,在该外周缘形成该环状槽;
拍摄步骤,在实施了该圆形切削步骤之后,将该线扫描相机定位于与将晶片保持为能够旋转的边缘夹具所保持的该晶片的该环状槽面对的位置,一边对该晶片进行拍摄一边使该边缘夹具旋转,对该晶片整个外周缘进行拍摄而获取拍摄图像;以及
检查步骤,利用该检查部对通过该拍摄步骤而拍摄的该拍摄图像进行检查,在得到该检查部的检查结果偏离了预先登记的允许范围这一结果的情况下,发送警告信息。
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