CN110662805A - 硅氧烷树脂组合物、使用其的粘合剂、显示装置、半导体装置及照明装置 - Google Patents
硅氧烷树脂组合物、使用其的粘合剂、显示装置、半导体装置及照明装置 Download PDFInfo
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- CN110662805A CN110662805A CN201880034950.2A CN201880034950A CN110662805A CN 110662805 A CN110662805 A CN 110662805A CN 201880034950 A CN201880034950 A CN 201880034950A CN 110662805 A CN110662805 A CN 110662805A
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- silicone resin
- resin composition
- valent organic
- general formula
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- 229920002050 silicone resin Polymers 0.000 title claims abstract description 130
- 239000011342 resin composition Substances 0.000 title claims abstract description 80
- 239000000853 adhesive Substances 0.000 title claims description 37
- 230000001070 adhesive effect Effects 0.000 title claims description 37
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000002904 solvent Substances 0.000 claims abstract description 35
- 150000001875 compounds Chemical class 0.000 claims abstract description 32
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 29
- 125000000962 organic group Chemical group 0.000 claims abstract description 27
- 239000003999 initiator Substances 0.000 claims abstract description 18
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 12
- 125000000304 alkynyl group Chemical group 0.000 claims abstract description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 6
- CSJDCSCTVDEHRN-UHFFFAOYSA-N methane;molecular oxygen Chemical compound C.O=O CSJDCSCTVDEHRN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 6
- 239000001257 hydrogen Substances 0.000 claims abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 5
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 31
- 239000000126 substance Substances 0.000 claims description 23
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 210000004027 cell Anatomy 0.000 claims description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 210000002858 crystal cell Anatomy 0.000 claims description 4
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- 238000005286 illumination Methods 0.000 claims description 3
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- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000007787 solid Substances 0.000 description 16
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
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- 239000007864 aqueous solution Substances 0.000 description 6
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 6
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 6
- 238000005481 NMR spectroscopy Methods 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
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- 238000012360 testing method Methods 0.000 description 5
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000007859 condensation product Substances 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 4
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- 238000003756 stirring Methods 0.000 description 4
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
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- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000003377 acid catalyst Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 3
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- 229940116333 ethyl lactate Drugs 0.000 description 3
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- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 3
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- GUKYSRVOOIKHHB-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CO[Si](OC)(OC)CCCCOCC1CO1 GUKYSRVOOIKHHB-UHFFFAOYSA-N 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
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- AXTADRUCVAUCRS-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrole-2,5-dione Chemical compound OCCN1C(=O)C=CC1=O AXTADRUCVAUCRS-UHFFFAOYSA-N 0.000 description 2
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- 150000002334 glycols Chemical class 0.000 description 2
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- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- UUVZTKMMRCCGHN-OUKQBFOZSA-N triethoxy-[(e)-2-phenylethenyl]silane Chemical compound CCO[Si](OCC)(OCC)\C=C\C1=CC=CC=C1 UUVZTKMMRCCGHN-OUKQBFOZSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ADQDBBLXGLRLPS-UHFFFAOYSA-N trimethoxy(pent-1-enyl)silane Chemical compound CCCC=C[Si](OC)(OC)OC ADQDBBLXGLRLPS-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- JRSJRHKJPOJTMS-MDZDMXLPSA-N trimethoxy-[(e)-2-phenylethenyl]silane Chemical compound CO[Si](OC)(OC)\C=C\C1=CC=CC=C1 JRSJRHKJPOJTMS-MDZDMXLPSA-N 0.000 description 1
- QRZSHHRCRZKAJB-UHFFFAOYSA-N trimethoxy-[10-(oxiran-2-ylmethoxy)decyl]silane Chemical compound C(C1CO1)OCCCCCCCCCC[Si](OC)(OC)OC QRZSHHRCRZKAJB-UHFFFAOYSA-N 0.000 description 1
- FKCHACQAIXAALH-UHFFFAOYSA-N trimethoxy-[5-(oxiran-2-ylmethoxy)pentyl]silane Chemical compound CO[Si](OC)(OC)CCCCCOCC1CO1 FKCHACQAIXAALH-UHFFFAOYSA-N 0.000 description 1
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- ITQVMIOKEJEYEZ-UHFFFAOYSA-N trimethoxy-[7-(oxiran-2-ylmethoxy)heptyl]silane Chemical compound CO[Si](OC)(OC)CCCCCCCOCC1CO1 ITQVMIOKEJEYEZ-UHFFFAOYSA-N 0.000 description 1
- QCZAFNUWDOGILF-UHFFFAOYSA-N trimethoxy-[9-(oxiran-2-ylmethoxy)nonyl]silane Chemical compound C(C1CO1)OCCCCCCCCC[Si](OC)(OC)OC QCZAFNUWDOGILF-UHFFFAOYSA-N 0.000 description 1
- OLTVTFUBQOLTND-UHFFFAOYSA-N tris(2-methoxyethoxy)-methylsilane Chemical compound COCCO[Si](C)(OCCOC)OCCOC OLTVTFUBQOLTND-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
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Abstract
提供粘合性和微细图案加工性优异的硅氧烷树脂组合物。硅氧烷树脂组合物含有包含下述通式(1)所示结构、下述通式(2)所示结构和下述通式(3)所示结构的硅氧烷树脂(A)、具有不饱和双键的化合物(B)、光聚合引发剂(C)和溶剂(D)。(通式(1)~(3)中,R1、R2及R3各自独立地表示氢、羟基、具有硅氧烷键的基团或碳原子数为1~30的1价有机基团。X表示链烯基、炔基、具有氮原子和碳‑氧不饱和键的1价有机基团或者具有环状醚键的1价有机基团。Y表示具有光自由基聚合性基团(不包括链烯基和炔基)的1价有机基团。Z表示具有碱溶性基团的1价有机基团。a、b及c各自独立地表示1以上的整数。a~c为2以上时,多个R1、R2、R3、X、Y及Z各自可以相同也可以不同。)
Description
技术领域
本发明涉及硅氧烷树脂组合物、使用其的粘合剂、和具有其的显示装置、半导体装置及照明装置。
背景技术
粘合剂被用于以显示器型显示装置、光学设备半导体装置、LED照明装置为代表的多种电子设备的组装中。在显示器型显示装置的构成部件即盖透镜、触摸面板传感器、显示器组件等的粘合中,通常使用液体型、膜型的光学粘合剂,粘合力强的以丙烯酸树脂为主成分的光学粘合剂被广泛使用。随着近年来电子设备的小型化,要求这些光学粘合剂具有高粘合性和微细图案加工性。
作为具有优异粘合性的光学粘合剂,例如,已提出了由下述组合物形成的光学粘合剂等:光学膜用粘合剂组合物(例如,参见专利文献1),其由含有(甲基)丙烯酸类聚合物和聚醚化合物的组合物形成,所述(甲基)丙烯酸类聚合物含有(甲基)丙烯酸烷基酯及含羟基的单体作为单体单元,所述聚醚化合物具有聚醚骨架且在至少1个末端具有反应性甲硅烷基;有机硅类固化性组合物(例如,参见专利文献2),其含有一分子中具有2个链烯基的有机硅氧烷、一分子中具有2个氢甲硅烷基的有机硅氧烷、一分子中将链烯基和氢甲硅烷基合计具有3个以上的交联剂、和氢甲硅烷化催化剂。
现有技术文献
专利文献
专利文献1:日本特开2012-255172号公报
专利文献2:日本特开2012-62424号公报
发明内容
发明要解决的课题
然而,专利文献1~2中记载的技术虽然粘合性优异,但存在微细图案加工性不充分,特别是微米尺寸的微细加工困难的问题。因此,本发明的目的在于提供一种粘合性和微细图案加工性优异的硅氧烷树脂组合物。
用于解决课题的手段
本申请的发明人经过深入研究,结果发现,通过使用具有特定化学结构的硅氧烷树脂,粘合性及微细图案加工性大幅提高,完成了本发明。
即,为了达到上述目的,本发明主要采用以下构成。
硅氧烷树脂组合物,其含有:硅氧烷树脂(A)、具有不饱和双键的化合物(B)、光聚合引发剂(C)及溶剂(D),其中,所述硅氧烷树脂(A)包含下述通式(1)所示的结构、下述通式(2)所示的结构以及下述通式(3)所示的结构。
[化学式1]
通式(1)~(3)中,R1、R2及R3各自独立地表示氢、羟基、具有硅氧烷键的基团或者碳原子数为1~30的1价有机基团。X表示链烯基、炔基、具有氮原子和碳-氧不饱和键的1价有机基团或者具有环状醚键的1价有机基团。Y表示具有光自由基聚合性基团(其中,不包括链烯基和炔基)的1价有机基团。Z表示具有碱溶性基团的1价有机基团。a、b及c各自独立地表示1以上的整数。a~c为2以上时,多个R1、R2、R3、X、Y及Z各自可以相同也可以不同。
发明效果
本发明的硅氧烷树脂组合物的粘合性和微细图案加工性优异。通过本发明的硅氧烷树脂组合物,能够形成粘合性优异的具有微细图案的固化物。
具体实施方式
本发明的硅氧烷树脂组合物含有硅氧烷树脂(A)、具有不饱和双键的化合物(B)、光聚合引发剂(C)和溶剂(D),所述硅氧烷树脂(A)包含上述通式(1)所示的结构、上述通式(2)所示的结构以及上述通式(3)所示的结构。通过在硅氧烷树脂(A)中包含上述通式(1)所示的结构,能够表现出粘合性、粘合多个被粘物。此外,通过在硅氧烷树脂(A)中包含上述通式(2)所示的结构,能够表现出光固化性,提高基于光刻法的微细图案加工性。进一步地,通过在硅氧烷树脂(A)中包含上述通式(3)所示的结构,能够赋予在碱性显影液中的溶解性,提高基于光刻法的微细图案加工性。具有不饱和双键的化合物(B)表现出光固化性,具有提高基于光刻法的微细图案加工性的作用。光聚合引发剂(C)赋予光固化性,具有使基于光刻法的微细图案形成成为可能的作用。溶剂(D)具有溶解硅氧烷树脂组合物而赋予流动性、提高涂布性的作用。
本发明的硅氧烷树脂组合物中,所谓硅氧烷树脂(A),是指主链骨架上具有硅氧烷键的聚合物。主链骨架上具有硅氧烷键的硅氧烷树脂(A)在将硅氧烷树脂组合物作为粘合剂使用时的再加工性(粘合后,将其先剥离再贴合时的操作性)和耐候耐热性方面优异。本发明中的硅氧烷树脂(A)的特征在于:包含下述通式(1)所示的结构、下述通式(2)所示的结构和下述通式(3)所示的结构。
[化学式2]
通式(1)~(3)中,R1、R2及R3各自独立地表示氢、羟基、具有硅氧烷键的基团或者碳原子数为1~30的1价有机基团。作为碳原子数为1~30的1价有机基团,例如可举出碳原子数为1~30的烷基、碳原子数为1~30的烷氧基、苯基等碳原子数为6~30的亚芳基、苯氧基等碳原子数为6~30的芳氧基等。这些基团中,至少一部分氢可被取代。这些基团中,优选碳原子数为1~30的烷基、碳原子数为1~30的烷氧基。
从使硅氧烷树脂的聚合反应性变得稳定的观点考虑,作为“碳原子数为1~30的烷基”,优选碳原子数为1~12的烷基,更优选甲基、乙基、丙基、异丙基、丁基、异丁基、仲丁基、叔丁基、戊基、己基、庚基、辛基、2-乙基己基、壬基、癸基。此外,从使硅氧烷树脂的聚合反应快速进行的观点考虑,作为“碳原子数为1~30的烷氧基”,优选碳原子数为1~12的烷氧基,更优选甲氧基、乙氧基、丙氧基、异丙氧基、丁氧基、异丁氧基、仲丁氧基、叔丁氧基。
通式(1)~(3)中,a、b及c各自独立地表示1以上的整数。a~c为2以上时,多个R1、R2、R3、X、Y及Z各自可以相同也可以不同。从进一步提高粘合性及微细图案加工性的观点考虑,a~c各自优选为2以上,更优选为5以上。另一方面,从提高硅氧烷树脂(A)在碱性显影液中的溶解性、进一步提高微细图案加工性的观点考虑,a~c优选为300以下,更优选200以下。
通式(1)中,X表示链烯基、炔基、具有氮原子和碳-氧不饱和键的1价有机基团或者具有环状醚键的1价有机基团。
作为“链烯基”,例如可举出乙烯基、烯丙基等。作为“炔基”,例如可举出乙炔基等。
作为“具有氮原子和碳-氧不饱和键的1价有机基团”,例如可举出尿素基(ureagroup)、脲基(ureido group)、异氰酸酯基、异氰脲酸酯基等。
作为“具有环状醚键的1价有机基团”,例如可举出缩水甘油基、氧杂环丁烷基等。
通式(1)中,从进一步提高粘合性的观点考虑,X优选为乙烯基、具有环状醚键的1价有机基团。此外,通式(1)中的X的碳原子数优选为8以上。若X的碳原子数为8以上,则即使将硅氧烷树脂组合物的固化物弯曲其也不易断裂,能够提高固化物的柔软性。此外,通过增加硅氧烷骨架的柔软性,能够进一步提高抗裂性。
通式(2)中,Y表示具有光自由基聚合性基团(其中,不包括链烯基和炔基)的1价有机基团。作为“光自由基聚合性基团”,例如可举出(甲基)丙烯酰基、马来酰亚胺基等。这些中,从进一步提高微细图案加工性的观点考虑,优选(甲基)丙烯酰基。
通式(3)中,Z表示具有碱溶性基团的1价有机基团。作为“碱溶性基团”,例如可举出羧基、巯基、酚羟基、磺酸基等。这些中,从进一步提高在碱性显影剂中的溶解性的观点考虑,优选羧基。
需要说明的是,当硅氧烷树脂(A)具有的结构为具有从X、Y及Z组成的组中选出的至少2种基团的情况下,该结构属于通式(1)~(3)的任一者所示的结构中所符合的所有结构。
硅氧烷树脂(A)优选为具有通过(1)所示的结构、通式(2)所示的结构及通式(3)所示的结构的有机硅烷化合物的水解·缩合物。进一步地,也可以是与其他有机硅烷化合物的水解·缩合物。硅氧烷树脂(A)不局限于这些有机硅烷化合物的嵌段共聚物,也可以是无规共聚物。
作为具有通式(1)所示的结构的有机硅烷化合物,例如可举出:乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三(甲氧基乙氧基)硅烷、乙烯基三丙氧基硅烷、乙烯基苯基三甲氧基硅烷、乙烯基苯基三乙氧基硅烷、乙烯基甲基二甲氧基硅烷、乙烯基甲基二乙氧基硅烷、乙烯基苯基二甲氧基硅烷、乙烯基苯基二乙氧基硅烷、乙烯基甲基二(甲氧基乙氧基)硅烷、乙烯基二甲基甲氧基硅烷、乙烯基二甲基乙氧基硅烷、乙烯基三甲氧基乙氧基硅烷、二乙烯基甲基甲氧基硅烷、二乙烯基甲基乙氧基硅烷、丁烯基三甲氧基硅烷、戊烯基三甲氧基硅烷、己烯基三甲氧基硅烷、庚烯基三甲氧基硅烷、辛烯基三甲氧基硅烷等含乙烯基的有机硅烷化合物类,烯丙基三甲氧基硅烷、烯丙基三乙氧基硅烷、烯丙基三(甲氧基乙氧基)硅烷、烯丙基甲基二甲氧基硅烷、烯丙基甲基二乙氧基硅烷、烯丙基甲基二(甲氧基乙氧基)硅烷、烯丙基二甲基甲氧基硅烷、烯丙基二甲基乙氧基硅烷、苯乙烯基三甲氧基硅烷、苯乙烯基三乙氧基硅烷、苯乙烯基三(甲氧基乙氧基)硅烷、苯乙烯基甲基二甲氧基硅烷、苯乙烯基甲基二乙氧基硅烷、苯乙烯基甲基二(甲氧基乙氧基)硅烷等含烯丙基的有机硅烷化合物类等含链烯基的有机硅烷化合物类;[双环[2.2.1]庚-5-烯-2-基]三乙氧基硅烷、(丁-3-炔-1-基氧基)(叔丁基)二甲基硅烷、叔丁基二甲基(2-丙炔氧基)硅烷、[3-(三乙氧基甲硅烷基)丙基]氨基甲酸炔丙酯等含炔基的有机硅烷化合物类;脲丙基三甲氧基硅烷、脲丙基三乙氧基硅烷、异氰酸酯基丙基三甲氧基硅烷、异氰酸酯基丙基三乙氧基硅烷、三-(三甲氧基甲硅烷基丙基)异氰脲酸酯等含有氮原子和碳-氧不饱和键的有机硅烷化合物类;缩水甘油基氧基丙基三甲氧基硅烷、缩水甘油基氧基丙基甲基二甲氧基硅烷、缩水甘油基氧基丙基三甲氧基硅烷、缩水甘油基氧基丙基三乙氧基硅烷、缩水甘油基氧基丁基三甲氧基硅烷、缩水甘油基氧基戊基三甲氧基硅烷、缩水甘油基氧基己基三甲氧基硅烷、缩水甘油基氧基庚基三甲氧基硅烷、缩水甘油基氧基辛基三甲氧基硅烷、缩水甘油基氧基壬基三甲氧基硅烷、缩水甘油基氧基癸基三甲氧基硅烷、缩水甘油基氧基丙基甲基二甲氧基硅烷、缩水甘油基氧基丙基甲基二乙氧基硅烷、2-(3,4-缩水甘油基氧基环己基)乙基三甲氧基硅烷、3-(N,N-二缩水甘油基)氨基丙基三甲氧基硅烷、氧杂环丁烷基三甲氧基硅烷、氧杂环丁烷基三乙氧基硅烷等含环状醚键的有机硅烷化合物类,等等。这些化合物也可以使用2种以上。
作为本发明中具有通式(1)所示结构的有机硅烷化合物,举例而言,若在乙烯基三甲氧基硅烷的情况下对通式(1)进行具体说明,则a为1,X为乙烯基(-CH=CH2),R1为甲氧基(-OCH3),纸面右侧的键为甲基(-CH3),纸面左侧的键为甲氧基(-OCH3)。以下具有通式(2)所示结构的有机硅烷化合物、具有通式(3)所示结构的有机硅烷化合物也一样。
作为具有通式(2)所示结构的有机硅烷化合物,例如可举出(甲基)丙烯酰基三甲氧基硅烷、(甲基)丙烯酰基三乙氧基硅烷、(甲基)丙烯酰基三丙氧基硅烷、(甲基)丙烯酰基乙基三甲氧基硅烷、(甲基)丙烯酰基乙基三乙氧基硅烷、(甲基)丙烯酰基乙基三丙氧基硅烷、(甲基)丙烯酰基丙基三甲氧基硅烷、(甲基)丙烯酰基丙基三乙氧基硅烷、(甲基)丙烯酰基丙基三丙氧基硅烷、(甲基)丙烯酰基丙基三(甲氧基乙氧基)硅烷、(甲基)丙烯酰基丙基甲基二甲氧基硅烷、(甲基)丙烯酰基丙基甲基二乙氧基硅烷、(甲基)丙烯酰基丙基二甲基甲氧基硅烷、(甲基)丙烯酰基丙基二苯基甲氧基硅烷、二(甲基)丙烯酰基丙基二甲氧基硅烷、三(甲基)丙烯酰基丙基甲氧基硅烷等含(甲基)丙烯酰基的有机硅烷化合物类;三甲氧基甲硅烷基马来酰亚胺、三乙氧基甲硅烷基马来酰亚胺等含马来酰亚胺基的有机硅烷化合物类等。这些化合物可以使用2种以上。
作为具有通式(3)所示结构的有机硅烷化合物,例如可举出三甲氧基甲硅烷基丙基琥珀酸酐、三乙氧基甲硅烷基丙基琥珀酸酐、三苯氧基甲硅烷基丙基琥珀酸酐、三甲氧基甲硅烷基丙基邻苯二甲酸酐、三甲氧基甲硅烷基丙基环己基二羧酸酐等含羧基的有机硅烷化合物类;巯丙基三甲氧基硅烷、巯丙基三乙氧基硅烷、巯丙基甲基二甲氧基硅烷等含巯基的有机硅烷化合物类,等等。这些化合物可以使用2种以上。
作为其他有机硅烷化合物,可列举甲基三甲氧基硅烷、甲基三乙氧基硅烷、甲基三(甲氧基乙氧基)硅烷、甲基三丙氧基硅烷、甲基三异丙氧基硅烷、甲基三丁氧基硅烷、乙基三甲氧基硅烷、乙基三乙氧基硅烷、己基三甲氧基硅烷、十八烷基三甲氧基硅烷、十八烷基三乙氧基硅烷、3-氨基丙基三乙氧基硅烷、N-(2-氨基乙基)-3-氨基丙基三甲氧基硅烷、乙基三丁氧基硅烷、甲基苯基二甲氧基硅烷、环己基甲基二甲氧基硅烷、十八烷基甲基二甲氧基硅烷、四甲氧基硅烷、四乙氧基硅烷、硅烷醇改性硅氧烷、氢化硅烷改性硅氧烷等。这些化合物可以使用2种以上。
硅氧烷树脂(A)中,相对于R1、R2及R3的总摩尔数而言的碳原子数为1~30的烃基的比例优选为1~80摩尔%。相对于R1、R2及R3的总摩尔数而言的碳原子数为1~30的烃基的比例为1摩尔%以上时,即使将硅氧烷树脂组合物的固化物弯曲其也不易断裂,能够提高固化物的柔软性。此外,由于硅氧烷骨架的柔软性提高,因此能够进一步提高抗裂性。相对于R1、R2及R3的总摩尔数而言的碳原子数为1~30的烃基的比例更优选为10摩尔%以上。另一方面,相对于R1、R2及R3的总摩尔数而言的碳原子数为1~30的烃基的比例为80摩尔%以下时,能够提高硅氧烷树脂组合物的光固化性和热固化性,进一步提高粘合性和微细图案加工性。相对于R1、R2及R3的总摩尔数而言的碳原子数为1~30的烃基的比例更优选为70摩尔%以下。
硅氧烷树脂(A)中相对于R1、R2及R3的总摩尔数而言的碳原子数为1~30的烃基的比例可以通过以下方法获得:例如,对于硅氧烷树脂(A),使用核磁共振设备(例如,BrukerAnalytic公司制造的“AVANCE III HD”)测定硅氧烷树脂的29Si-核磁共振谱,算出碳原子数为1~30的烃基所键合的Si的峰面积与其他Si的峰面积之比。此外,通过对于硅氧烷树脂(A)使用13C-核磁共振装置测定硅氧烷树脂的13C-核磁共振谱,对于硅氧烷树脂(A)的氘代氯仿溶液使用1H-核磁共振装置测定硅氧烷树脂的1H-核磁共振谱,从而能够求出烃基的碳原子数。
硅氧烷树脂(A)中,相对于a、b及c的总和而言的a的比例优选为3~65%。相对于a、b及c的总和而言的a的比例为3%以上时,能够进一步提高粘合性。相对于a、b及c的总和而言的a的比例更优选为10%以上。另一方面,相对于a、b及c的总和而言的a的比例为65%以下时,能够进一步提高基于光刻法的微细图案加工性。相对于a、b及c的总和而言的a的比例更优选为60%以下。
硅氧烷树脂(A)中,相对于a、b及c的总和而言的b的比例优选为20~60%。相对于a、b及c的总和而言的b的比例为20%以上时,能够充分进行基于自由基聚合的交联反应,能够进一步提高基于光刻法的微细图案加工性。b的比例更优选为35%以上。另一方面,相对于a、b及c的总和而言的b的比例为60%以下时,能够得到更为高精细的图案。
硅氧烷树脂(A)中,相对于a、b及c的总和而言的c的比例优选为5~35%。相对于a、b及c的总和而言的c的比例为5%以上时,能够进一步提高基于光刻法的微细图案加工性。另一方面,相对于a、b及c的总和而言的c的比例为35%以下时,能够降低显影后的膜减薄率。
硅氧烷树脂(A)中,相对于a、b及c的总和而言的a、b、c各自的比例可以通过例如以下方法算出。首先,通过上述方法测定硅氧烷树脂的29Si-核磁共振谱,算出X、Y或Z所键合的Si的峰面积与其他Si的峰面积之比。另一方面,对于硅氧烷树脂(A)的氘代氯仿溶液,使用核磁共振装置测定硅氧烷树脂(A)的1H-核磁共振谱,根据源自X、Y或Z的峰面积与其他峰面积(不包括硅烷醇基团)之比,算出硅氧烷树脂(A)中X、Y或Z的含有比例。根据结合上述29Si-核磁共振谱的结果求出的X的含量求出a的比例,根据结合上述29Si-核磁共振谱的结果求出的Y的含量求出b的比例,根据结合上述29Si-核磁共振谱的结果求出的Z的含量求出c的比例,从而能够算出相对于其总和而言的a、b、c各自的比例。
硅氧烷树脂(A)为具有通式(1)所示的结构、通式(2)所示的结构和通式(3)所示的结构的机硅烷化合物与其他有机硅烷化合物的水解·缩合物的情况下,其他有机硅烷化合物的量能够在不损害所期望的特性的范围内进行适当设定。相对于a、b及c的总和(100%)而言合计20%以下是适宜的。
硅氧烷树脂(A)的重均分子量没有特别限定,优选为10,000以上且70,000以下。此处,硅氧烷树脂(A)的重均分子量是指通过凝胶渗透色谱法(GPC)测定的聚苯乙烯换算值。
硅氧烷树脂(A)可通过将具有通式(1)所示结构、通式(2)所示结构及通式(3)所示结构的有机硅烷化合物与根据需要的其他有机硅烷化合物进行水解·缩合而得到。例如,可通过将有机硅烷化合物水解后,将得到的硅烷醇化合物在溶剂存在下或无溶剂的条件下进行缩合反应而得到。
水解反应的各种条件可考虑反应规模,反应容器的大小、形状等适当设定。例如,优选的是,在溶剂中经1~180分钟向有机硅烷化合物中添加酸催化剂或碱催化剂、及水,于室温~150℃使其反应1~300分钟。通过在这样的条件下进行水解反应,能够抑制剧烈反应。
优选在酸催化剂的存在下进行水解反应。作为酸催化剂,优选为含有甲酸、乙酸或磷酸的酸性水溶液。
优选在利用有机硅烷化合物的水解反应得到硅烷醇化合物后,将反应液直接于50℃以上且溶剂的沸点以下的温度加热1~100小时,进行缩合反应。此外,为了提高硅氧烷树脂(A)的聚合度,也可以进行再加热或添加碱催化剂。
作为有机硅烷化合物的水解反应及硅烷醇化合物的缩合反应中所使用的溶剂,例如可举出甲醇、乙醇、丙醇、异丙醇、二丙酮醇等醇类;乙二醇、丙二醇等二醇类;乙二醇单甲醚、乙二醇单乙醚、丙二醇单甲醚、丙二醇单乙醚、丙二醇单丙醚、丙二醇单丁醚、乙二醇单叔丁基醚等醚类;甲基乙基酮、乙酰丙酮、甲基丙基酮、甲基丁基酮、甲基异丁基酮、二异丁基酮、环戊酮等酮类;二甲基甲酰胺、二甲基乙酰胺等酰胺类;乙酸乙酯、乙酸丙酯、乙酸丁酯、乙酸异丁酯、乙二醇单乙醚乙酸酯、丙二醇单甲醚乙酸酯、3-甲氧基丁基乙酸酯、3-甲基-3-甲氧基丁基乙酸酯、乳酸甲酯、乳酸乙酯、乳酸丁酯等乙酸酯类;甲苯、二甲苯、己烷、环己烷等芳香族烃或脂肪族烃,γ-丁内酯,N-甲基-2-吡咯烷酮,二甲基亚砜等。这些溶剂可以使用2种以上。从提高硅氧烷树脂组合物的涂布性的观点考虑,这些溶剂中优选使用二丙酮醇、乙二醇单叔丁基醚、丙二醇单甲醚、丙二醇单甲醚乙酸酯、丙二醇单乙醚等。
在通过水解反应生成溶剂的情况下,也可以在无溶剂的条件下进行水解。优选在反应结束后通过进一步添加溶剂来调节至作为树脂组合物而言适当的浓度。此外,根据目的,可以在水解后,在加热和/或减压下蒸馏并除去适量的所生成的醇等,然后添加适当的溶剂。
此外,水解反应中所使用的水优选为离子交换水。
本发明的硅氧烷树脂组合物中,硅氧烷树脂(A)的含量优选为总固体成分(不包括溶剂(D))中的20质量%以上,更优选为25质量%以上,进一步优选为50质量%以上。硅氧烷树脂(A)的含量为20质量%以上时,能够进一步提高粘合性、再加工性、耐候耐热性。另一方面,硅氧烷树脂(A)的含量优选为总固体成分(不包括溶剂(D))中的98质量%以下,更优选为95质量%以下。硅氧烷树脂(A)的含量为98质量%以下时,能够进一步提高微细图案加工性。
本发明的硅氧烷树脂组合物中,所谓具有不饱和双键的化合物(B)是指具有1个以上碳-碳双键的单体或低聚物。具有不饱和双键的化合物(B)的重均分子量没有特别限定,优选为10,000以下。
作为具有不饱和双键的化合物(B),例如可举出丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸异丙酯、丙烯酸正丁酯、丙烯酸仲丁酯、丙烯酸异丁酯、丙烯酸叔丁酯、丙烯酸正戊酯、丙烯酸烯丙酯、丙烯酸苄酯、丙烯酸丁氧基乙酯、丙烯酸丁氧基三乙二醇酯、丙烯酸环己酯、丙烯酸二环戊酯、丙烯酸二环戊烯酯、丙烯酸2-乙基己酯、丙烯酸甘油酯、丙烯酸缩水甘油酯、丙烯酸十七氟癸酯、丙烯酸2-羟乙酯、丙烯酸异冰片酯、丙烯酸2-羟丙酯、丙烯酸异癸酯、丙烯酸异辛酯、丙烯酸月桂酯、丙烯酸2-甲氧基乙酯、甲氧基乙二醇丙烯酸酯、甲氧基二乙二醇丙烯酸酯、丙烯酸八氟戊酯、丙烯酸苯氧基乙酯、丙烯酸硬脂酯、丙烯酸三氟乙酯、烯丙基化二丙烯酸环己酯、1,4-丁二醇二丙烯酸酯、1,3-丁二醇二丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、二季戊四醇六丙烯酸酯、二季戊四醇单羟基五丙烯酸酯、二三羟甲基丙烷四丙烯酸酯、甘油二丙烯酸酯、甲氧基化二丙烯酸环己酯、新戊二醇二丙烯酸酯、丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、二丙烯酸三甘油酯、三羟甲基丙烷三丙烯酸酯、丙烯酰胺、丙烯酸氨基乙酯、丙烯酸苯酯、丙烯酸苯氧基乙酯、丙烯酸苄酯、丙烯酸1-萘酯、丙烯酸2-萘酯、双酚A二丙烯酸酯、双酚A-环氧乙烷加成物的二丙烯酸酯、双酚A-环氧丙烷加成物的二丙烯酸酯、1-乙烯基-2-吡咯烷酮、N-乙烯基-ε-己内酰胺、丙烯酸缩水甘油酯、氨基甲酸酯丙烯酸酯等丙烯酸酯,丙烯酸苯硫酚酯、苄硫醇丙烯酸酯或者这些单体的芳香环中的1-5个氢原子被氯或溴原子取代而得的单体,这些丙烯酸酯被替换为甲基丙烯酸酯而得的化合物,苯乙烯、对甲基苯乙烯、邻甲基苯乙烯、间甲基苯乙烯、氯化苯乙烯、溴化苯乙烯、α-甲基苯乙烯、氯化α-甲基苯乙烯、溴化α-甲基苯乙烯、氯甲基苯乙烯、羟甲基苯乙烯、羧甲基苯乙烯、乙烯基萘、乙烯基蒽、乙烯基咔唑、2-(1,3,4,5,6,7-六氢-1,3-二氧基-2H-异吲哚-2-基)乙基-2-丙酸酯、N-环己基马来酰亚胺、N-苯基马来酰亚胺、3,4,5,6-四氢邻苯二甲酰亚胺、N-丙烯酰氧基乙基六氢邻苯二甲酰亚胺、N-(2-羟乙基)马来酰亚胺、N-乙烯基邻苯二甲酰亚胺、N-烯丙基邻苯二甲酰亚胺、1H-吡咯-2,5-二酮,1-(3-丁烯基)-3,4-二甲基、1H-吡咯-2,5-二酮,3,4-二甲基-1-(3-甲基-3-丁烯基)、甲基丙烯酸2-[2-(2-(2,5-二氢-3,4-二甲基-2,5-二氧杂-1H-吡咯-1-基)乙氧基]乙酯、甲基丙烯酸6-(2,3-二甲基马来酰亚胺)己酯、三烯丙基异氰脲酸酯、二烯丙基丙基异氰脲酸酯、三甲基丙烯酸异氰脲酸酯、三乙烯基异氰脲酸酯、二烯丙基乙基马来酰亚胺异氰脲酸酯、二烯丙基-N-烯丙基乙酰酰胺异氰脲酸酯、二缩水甘油基烯丙基异氰脲酸酯、三缩水甘油异氰脲酸酯、二烯丙基丙基邻苯二甲酰亚胺异氰脲酸酯、三(2-丙烯酰氧基乙基)异氰脲酸酯、三(2-甲基丙烯酰氧基乙基)异氰脲酸酯、三烯丙基丙酸酯异氰脲酸酯、三缩水甘油基戊基异氰脲酸酯、三缩水甘油基辛基异氰脲酸酯等。这些化合物也可以含有2种以上。这些化合物中也可以混合有丙烯酸基、甲基丙烯酸基、乙烯基、马来酰亚胺基、烯丙基。
本发明的硅氧烷树脂组合物中的具有不饱和双键的化合物(B)的含量优选为总固体成分(不包括溶剂(D))中的1质量%以上,更优选为5质量%以上。具有不饱和双键的化合物(B)的含量为1质量%以上时,能够进一步提高灵敏度,并且进一步提高基于光刻法的微细图案加工性。另一方面,具有不饱和双键的化合物(B)的含量优选为总固体成分(不包括溶剂(D))中的60质量%以下,更优选为50质量%以下。具有不饱和双键的化合物(B)的含量为60质量%以下时,能够进一步提高微细图案加工性。
在本发明的硅氧烷树脂组合物中,作为光聚合引发剂(C),例如可举出光自由基聚合引发剂、光敏剂等。这些光聚合引发剂可以含有2种以上。
作为光聚合引发剂(C),例如可举出肟酯化合物、酰基氧化膦化合物、酮类化合物、安息香化合物、酰基肟化合物、茂金属化合物、噻吨酮化合物、胺化合物、酮类化合物、香豆素化合物、蒽化合物、偶氮化合物、四溴化碳、三溴苯砜等光自由基聚合引发剂;鎓盐、三嗪化合物、硼化合物等光阳离子聚合引发剂;曙红或亚甲基蓝等光还原染料与抗坏血酸或三乙醇胺等还原剂的组合,等等。
本发明的硅氧烷树脂组合物中的光聚合引发剂(C)的含量优选为总固体成分(不包括溶剂(D))中的0.1质量%以上,更优选为0.2质量%以上。当光聚合引发剂(C)的含量为0.1质量%以上时,能够提高硅氧烷树脂组合物的曝光部分的固化密度,并且能够提高显影后的残膜率。另一方面,光聚合引发剂(C)的含量优选为总固体成分(不包括溶剂(D))中的20质量%以下,更优选为10质量%以下。光聚合引发剂(C)的含量为20质量%以下时,能够容易地调节灵敏度,并且能够进一步提高微细图案加工性。
在本发明的硅氧烷树脂组合物中,作为溶剂(D),优选为能够溶解上述硅氧烷树脂(A)、具有不饱和双键的化合物(B)和光聚合引发剂(C)的有机溶剂。例如可举出乙醇、丙醇、异丙醇、二丙酮醇等醇类;乙二醇、丙二醇等二醇类;乙二醇单甲醚、乙二醇单乙醚、丙二醇单甲醚、丙二醇单乙醚、丙二醇单丙醚、丙二醇单丁醚等醚类;甲基乙基酮、乙酰丙酮、甲基丙基酮、甲基丁基酮、甲基异丁基酮、二异丁基酮、环戊酮等酮类;二甲基甲酰胺、二甲基乙酰胺等酰胺类;乙酸乙酯、乙酸丙酯、乙酸丁酯、乙酸异丁酯、乙二醇单乙醚乙酸酯、丙二醇单甲醚乙酸酯、乙酸3-甲氧基丁酯、乙酸3-甲基-3-甲氧基丁酯、乳酸甲酯、乳酸乙酯、乳酸丁酯等乙酸酯类;甲苯、二甲苯、己烷、环己烷等芳香族或脂肪族烃,γ-丁内酯、N-甲基-2-吡咯烷酮、二甲基亚砜等。这些溶剂也可以含有2种以上。
本发明的硅氧烷树脂组合物中的溶剂(D)的含量优选为10~80质量%。
本发明的硅氧烷树脂组合物优选含有光产酸剂。所谓光产酸剂是指在曝光时引起键断裂而产生酸的化合物,优选通过曝光波长365nm(i线)、405nm(h线)、436nm(g线)或它们的混合光线下进行照射而产生酸的化合物。酸作为促进硅烷醇脱水缩合的催化剂而起作用。此外,硅氧烷树脂组合物包含具有环状醚基的化合物时,酸作为环状醚基的聚合催化剂而起作用。通过在曝光后存在酸,促进了未反应的硅烷醇基的缩合和/或环状醚基的聚合,具有降低显影后的膜减薄率的效果。作为所产生的酸,优选为全氟烷基磺酸、对甲苯磺酸等强酸。
作为光产酸剂,例如可举出SI-100、SI-101、SI-105、SI-106、SI-109、PI-105、PI-106、PI-109、NAI-100、NAI-1002、NAI-1003、NAI-1004、NAI-101、NAI-105、NAI-106、NAI-109、NDI-101、NDI-105、NDI-106、NDI-109、PAI-01、PAI-101、PAI-106、PAI-1001(均为商品名,由Midori Kagaku(株)制造),SP-077、SP-082(均为商品名,由(株)ADEKA制造),TPS-PFBS(商品名,由东洋合成工业(株)制造),CGI-MDT、CGI-NIT(均为商品名,由Ciba Japan(株)制造),WPAG-281、WPAG-336、WPAG-339、WPAG-342、WPAG-344、WPAG-350、WPAG-370、WPAG-372、WPAG-449、WPAG-469、WPAG-505、WPAG-506(均为商品名,由和光纯药工业(株)制造)。这些光产酸剂可以含有2种以上。这些中,优选CGI-MDT。
从膜减薄率的降低和显影性的观点考虑,硅氧烷树脂组合物中的光产酸剂的含量优选为固体成分中的0.5质量%以上,优选为2.0质量%以下。
本发明的硅氧烷树脂组合物在不损害所期望的特性的范围内(通常,总固体成分中合计在5质量%以下),还可以含有上述(A)~(D)成分以外的添加剂。作为添加剂,例如可举出分子内不具有不饱和双键的化合物、增塑剂、流平剂、热产酸剂、固化剂、表面活性剂、硅烷偶联剂、消泡剂、颜料等。
本发明的硅氧烷树脂组合物在25℃时的粘度优选为1~1000mPa·s。25℃时的粘度为1mPa·s以上时,涂膜厚度的均一性优异。另一方面,25℃时的粘度为1000mPa·s以下时,涂布性优异(能够采用排出型涂布装置进行涂布,能够短时间内进行大面积涂布,等等)。25℃时的粘度更优选为100mPa·s以下。此处,本发明的硅氧烷树脂组合物的粘度是通过使用E型粘度计(例如,东机产业(株)制造的“TV25型粘度计”)、测定在温度25℃、转速20rpm的条件下保持1分钟后的粘度而求出的。作为将本发明的硅氧烷树脂组合物在25℃时的粘度设置在上述范围的方法,例如可举出将硅氧烷树脂组合物的溶剂(D)的含量、硅氧烷树脂(A)的重均分子量调节为上述优选范围的方法等。
本发明的硅氧烷树脂组合物能够通过将上述(A)~(D)成分与根据需要的其他成分混合而得到。这些各成分优选使用搅拌器进行混合溶解。作为搅拌器,例如可举出振动机、混合机等搅拌震荡器等。
接下来,对本发明的粘合剂进行说明。本发明的粘合剂包含上述硅氧烷树脂组合物,通过该粘合剂能够将多个被粘物贴合、固定。此处,本发明中所谓的“粘合”是指以粘合剂为媒介,通过化学键合、物理粘接和/或机械接合使多个被粘物的表面粘合的状态。利用本发明的粘合剂,即使在不使用特殊加工装置的情况下也能够对固化物的膜厚、图案线宽和图案间隔在微米尺寸上进行微细加工,并且能够有利于小型电子设备的组装过程中的生产节拍的缩短和微细化。
通过使本发明的硅氧烷树脂组合物固化,能够得到固化物。本发明的硅氧烷树脂组合物由于包含具有柔软骨架的硅氧烷树脂,因此能够形成固化物的膜厚为10μm~200μm的厚膜。这样的固化物适宜用作粘合剂。关于对硅氧烷树脂组合物进行微细加工而得到固化物(粘合剂)的方法,举以下例子进行说明。
优选通过将本发明的硅氧烷树脂组合物涂布在基板上,进行干燥、曝光、显影来形成具有粘合性的微细图案。此处,基板是被粘物之一。
作为基板,例如可举出玻璃基板、硅晶片、氧化铝基板、氮化铝基板、碳化硅基板、形成有装饰层的基板、形成有绝缘层的基板、聚对苯二甲酸乙二醇酯(以下称为PET)膜等聚酯膜、聚酰亚胺膜、芳族聚酰胺膜、环氧树脂基板、聚醚酰亚胺树脂基板、聚醚酮树脂基板、聚砜类树脂基板,等等。
作为将硅氧烷树脂组合物涂布在基板上的涂布方法,例如可举出凹版印刷、旋涂、狭缝涂布、棒涂、喷涂、丝网印刷等。
优选通过干燥所获得的涂膜来将溶剂挥发除去。作为干燥方法,可举出加热干燥、真空干燥、红外线干燥等。作为加热干燥装置,例如可举出烘箱、加热板、红外线照射装置等。加热温度优选为60~120℃。干燥温度为60℃以上时,能够将溶剂充分地挥发除去。另一方面,干燥温度为120℃以下时,能够抑制硅氧烷树脂组合物的热交联,减少未曝光部的残渣。加热时间优选为1分钟~60分钟。
优选对通过干燥工序获得的干燥膜进行曝光和显影。作为曝光方法,通常使用隔着光掩模进行曝光的方法,但也可以使用不用光掩模而用激光等直接进行描绘的方法。作为曝光装置,例如可举出步进曝光机、对准曝光机等。作为曝光中使用的活性光线,例如可举出近紫外线、紫外线、电子束、X射线、激光等,优选紫外线。作为紫外线的光源,例如可举出低压汞灯、高压汞灯、超高压汞灯、卤素灯、杀菌灯等,优选超高压汞灯。
通过使用显影液对曝光后的膜进行显影,将未曝光部溶解除去从而形成所期望的微细图案。作为显影液,例如可举出碱性显影液、有机显影液。作为碱性显影液,例如可举出氢氧化四甲基铵、二乙醇胺、二乙基氨基乙醇、氢氧化钠、氢氧化钾、碳酸钠、碳酸钾、三乙胺、二乙胺、甲胺、二甲胺、乙酸二甲基氨基乙酯、二甲基氨基乙醇、甲基丙烯酸二甲基氨基乙酯、环己胺、乙二胺、六亚甲基二胺的水溶液。也可以向其中添加表面活性剂。作为有机显影液,例如可举出N-甲基-2-吡咯烷酮、N-乙酰基-2-吡咯烷酮、N,N-二甲基乙酰胺、N,N-二甲基甲酰胺、二甲基亚砜、六甲基磷三酰胺等极性溶剂。也可以向这些极性溶剂中添加甲醇、乙醇、异丙醇、二甲苯、水、甲基卡必醇、乙基卡必醇等。
作为显影方法,例如可举出如下方法:在使层叠有曝光后的膜的基板静置、或使其旋转的同时,在涂膜表面上喷雾显影液的方法;将层叠有曝光后的膜的基板浸渍在显影液中的方法;将层叠有曝光后的膜的基板浸渍在显影液中的同时照射超声波的方法;等等。
对于通过显影所获得的图案,也可以实施用淋洗液进行的淋洗处理。作为淋洗液,例如可举出水、醇类的水溶液、酯类的水溶液等。作为醇类,例如可举出乙醇、异丙醇等。作为酯类,例如可举出乳酸乙酯、丙二醇单甲基醚乙酸酯等。
由上述方法在基板上形成具有粘合性的微细图案之后,重叠另一方被粘物并加热,从而将一方被粘物即基板与另一方被粘物粘合固定。作为加热条件,优选为例如50℃~200℃、1分钟~60分钟。
使本发明的硅氧烷树脂组合物固化而得的固化物适合用于显示装置、半导体装置、照明装置的组装。例如,在显示装置的组装中,可以使用使本发明的硅氧烷树脂组合物固化而得的固化物作为将选自由液晶单元、有机EL、迷你LED单元以及微型LED单元组成的组中的至少一种与基板粘合的粘合剂。所谓迷你LED单元,是指排列有许多纵横的长度为100μm~10mm左右的LED而成的单元。所谓微型LED单元,是指排列有许多纵横的长度为小于100μm的LED而成的单元。另外,在用于图像传感器的半导体装置的组装中,可以使用使本发明的硅氧烷树脂组合物固化而得的固化物作为将陶瓷封装件与带光学镀膜的玻璃盖贴合的粘合剂。进一步地,在LED照明装置的组装中,能够合适地使用使本发明的硅氧烷树脂组合物固化而得的固化物作为将LED元件与引线框架基板贴合的粘合剂。
作为一个例子,下面就使用了包含本发明的硅氧烷树脂组合物的粘合剂而成的显示器型显示装置的制造方法的一个例子进行说明。
首先,通过将液晶单元等显示面板和背光照明等构成部件介由包含本发明的硅氧烷树脂组合物的粘合剂进行粘合、组装后,组入驱动电路。显示器型显示装置中可以根据需要在适当的位置设置1层或2层以上各种部件(例如扩散板、导光板、防眩层、折射率匹配层、防反射层、保护绝缘层、透镜阵列片、背光照明、触摸传感器模块,等等)。
实施例
下面,举例实施例和比较例对本发明进行更详细地说明,但本发明并不局限于此。各实施例和比较例中使用的材料和评价方法如下。
<硅氧烷树脂(A)的原料>
有机硅烷化合物(a-X1):乙烯基三甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(a-X2):辛烯基三甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(a-X3):氧杂环丁烷基三甲氧基硅烷(东亚合成(株)制造)
有机硅烷化合物(a-X4):3-缩水甘油基氧基丙基三甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(a-X5):缩水甘油基氧基辛基三甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(a-X6):3-异氰酸酯基丙基三乙氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(a-X7):3-缩水甘油基氧基丙基甲基二甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(b-Y1):3-丙烯酰氧基丙基三甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(b-Y2):3-甲基丙烯酰氧基丙基三甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(b-Y3):3-丙烯酰氧基丙基甲基二甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(b-Y4):3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷(东京化成工业(株)制造)
有机硅烷化合物(c-Z1):3-三甲氧基甲硅烷基丙基琥珀酸酐(东京化成工业(株)制造)
有机硅烷化合物(c-Z2):3-巯基丙基三甲氧基硅烷(东京化成(株)制造)
有机硅烷化合物(d-1):甲基三甲氧基硅烷(东京化成(株)制造)
有机硅烷化合物(d-2):己基三甲氧基硅烷(信越化学工业(株)制造)
有机硅烷化合物(d-3):甲基苯基二甲氧基硅烷(信越化学工业(株)制造)
有机硅烷化合物(d-4):硅烷醇改性的硅氧烷低聚物X-21-5841(商品名,信越化学工业(株)制造)
有机硅烷化合物(d-5):氢硅烷改性的硅氧烷低聚物TSL9586(商品名,MomentivePerformance Materials Japan(同)制造)
阻聚剂:2,6-二叔丁基对甲酚(东京化成工业(株)制造)
聚合催化剂:磷酸(东京化成工业(株)制造)
溶剂:丙二醇单甲醚乙酸酯(以下称为PGMEA)(东京化成工业(株)制造)。
<硅氧烷树脂组合物的原料>
具有不饱和双键的化合物(B):丙烯酸异丁酯(东京化成工业(株)制造)
光聚合引发剂(C):二苯甲酮(东京化成工业(株)制造)
溶剂(D):PGMEA(东京化成工业(株)制造)
流平剂:“BYK”(注册商标)-333(Big Chemie Japan(株)制造)
各实施例和比较例的评价方法如下所示。
(1)粘度
对于通过各实施例和比较例得到的硅氧烷树脂组合物,使用E型粘度计测定在温度25℃、转速20rpm的条件下保持1分钟后的粘度。
(2)涂布性
基于各实施例和比较例中得到的硅氧烷树脂组合物在涂布工序中有无涂布不良,根据以下基准评价涂布性。其中,涂布不良是指发生喷嘴堵塞、膜厚不均、涂布缺陷中的至少任一种的状态。
无涂布不良:A
有涂布不良:B。
(3)微细图案加工性
针对通过实施例和比较例得到的具有图案宽度/图案间隔(以下称为“L/S”)不同的2种粘合图案的膜、使用光学显微镜在倍率50倍下进行放大观察,观察是否存在图案形成不良,根据以下基准评价图案加工性。其中,图案形成不良是指产生图案从PET膜剥离、产生图案之间的残渣中的至少任一种的状态。
基材表面内无图案形成不良:A
基板表面内有图案形成不良:B。
(4)粘合性
在各实施例和比较例得到的具有粘合图案的膜上重叠、贴合玻璃基板(OA-10G,日本电气硝子(株)制造),然后,使用加热板于120℃加热30分钟,制造具有玻璃基板的膜。将该具有玻璃基板的膜切成宽度25mm、长度100mm,使用拉伸试验机(EZ-SX,(株)岛津制作所制造),在剥离角度90度、剥离速度300mm/min的条件下测定剥离时的粘合力(N/25mm)。
(5)固化物的柔软性
在各实施例和比较例中所得的具有粘合剂的膜上重叠、贴合PET膜后,使用加热板于120℃加热30分钟,制造具有固化物的膜。将该具有固化物的膜切成宽度10mm、长度100mm,以固化物表面彼此相对的方式放置在耐久性试验仪(DLDMLH-FU,Yuasa System机器(株)制造)中,在弯曲R半径为5mm的条件下进行面状物U字折叠试验。将该试验重复100次、500次、1000次和5000次后,使用光学显微镜将固化物在倍率50倍下放大观察,观察有无破损,根据以下基准评价固化物的柔软性。其中,固化物的破损是指发生裂纹、断裂、基材与被粘物剥离中的至少任一种的状态。
固化物无破损:A
固化物有破损:B。
(6)抗裂性
以使固化后的膜厚分别为10μm、30μm的方式,将各实施例和比较例中得到的硅氧烷树脂组合物涂布在10cm2见方的无碱玻璃基板上、使用加热板(SCW-636)在100℃的温度下预烘烤3分钟,形成预烘烤膜。然后,使用平行光掩模对准器(佳能(株)制造的“PLA-501F(商品名)”)、将超高压汞灯作为光源,在不隔着掩模的情况下以300mJ/cm2的曝光量对预烘烤膜进行曝光。然后,使用自动显影装置(泷泽产业(株)制造的“AD-2000(商品名)”)、用浓度为0.045重量%的氢氧化钾水溶液进行60秒的喷淋显影,接着用水淋洗30秒。进而,使用烘箱(商品名:IHPS-222,由Espec(株)制造)在空气中于200℃的温度固化30分钟,制备固化物。目视观察所制备的固化物,根据以下基准评价是否产生裂纹。其中,即使只确认到1个裂纹,也判断为该膜厚时没有抗裂性。
固化物中没有产生裂纹:A
固化物中产生了裂纹:B。
(7)显影膜减薄率
将各实施例和比较例中得到的硅氧烷树脂组合物涂布在硅晶片基板上,与上述(6)抗裂性的评价方法相同地进行预烘烤、曝光、显影。在预烘烤后和显影后测定膜厚,通过下式评价显影膜减薄。
显影膜减薄率(%)=((预烘烤后的膜厚)-(显影后的膜厚))×100/(预烘烤后的膜厚)。
合成例1
以使总量成为1摩尔的方式取与表1记载的摩尔%相当质量的、表1中记载的有机硅烷化合物(a-X1)、有机硅烷化合物(b-Y1)、有机硅烷化合物(c-Z1)放入玻璃烧瓶中,加入阻聚剂0.21g、溶剂205.47g,于40℃搅拌30分钟。然后,经10分钟添加相对于有机硅烷化合物的总重量100质量%而言为1质量%的磷酸的水溶液,添加后搅拌30分钟,然后于70℃搅拌30分钟。在蒸馏出副产物甲醇、水的同时,于120℃搅拌3小时,获得属于硅氧烷树脂(A)的硅氧烷树脂A1的PGMEA溶液。
测定所得的硅氧烷树脂A1的29Si-核磁共振谱和1H-核磁共振谱,分别求出相对于R1、R2和R3的总摩尔数而言的碳原子数为1~30的烃基的比例,和相对于a、b和c的总和而言的a、b、c的比例。对于所获得的硅氧烷树脂A1,使用四氢呋喃作为展开溶剂通过GPC在展开速度0.4ml/分钟的条件下测定重均分子量,结果以聚苯乙烯换算值计为20,000。这些结果示于表1中。
合成例2~27
将构成硅氧烷树脂的有机硅烷化合物的种类和质量、聚合时间如表1~2所示进行变更,除此以外,通过与合成例1相同的方法,分别合成属于硅氧烷树脂(A)的硅氧烷树脂A2~A24,和不属于硅氧烷树脂(A)的硅氧烷树脂A′25~27。以与合成例1相同的方式,测试相对于R1、R2和R3的总摩尔数而言的碳原子数为1~30的烃基的比例,相对于a、b和c的总和而言的a、b、c各自的比例,重均分子量,其结果示于表1~2中。
[表1]
[表2-1]
[表2-2]
[表2-2]
实施例1
以固体成分浓度换算计,取80质量%合成例1中得到的硅氧烷树脂A1、19质量%具有不饱和双键的化合物(B)、0.9质量%光聚合引发剂(C)、0.1质量%流平剂加入小瓶中后,添加溶剂(D)以使总固体成分浓度成为40质量%,在室温下搅拌30分钟,制造硅氧烷树脂组合物S1。通过上述方法评价该硅氧烷树脂组合物的粘度,结果为10mPa·s。
使用狭缝模头涂布机(多单元涂布机(Multi-unit Coater),Toray Engineering(株)制造),通过狭缝涂布法将硅氧烷树脂组合物S1涂布在PET膜(“Lumirror”(注册商标)S-10;东丽(株)制造)上,得到涂膜。关于涂布性,通过上述方法评价,结果为A。
将得到的涂膜在100℃的加热板上干燥3分钟,得到干燥后的膜厚为10μm的具有干燥膜的膜P1。重复相同的操作准备多张具有干燥膜的膜P1。在具有干燥膜的膜P1上,隔着描绘了L/S为100/100μm、20μm/20μm的2种图案的曝光掩模、均通过输出功率为21mW/cm2的超高压汞灯在照射量为300mJ/cm2的条件下进行曝光(换算为波长365nm),得到图案曝光膜P1。另外,不隔着曝光掩模而进行曝光、得到整面曝光膜P1。然后,使用0.045质量%的氢氧化钾水溶液作为显影液,对图案曝光膜P1进行喷淋显影至达到未曝光部全部溶解的时间,得到具有粘合图案的膜P1。以相同的显影时间对整面曝光膜P1进行显影,得到具有粘合剂的膜P1。关于具有粘合图案的膜P1的微细图案加工性,通过上述方法进行评价,结果L/S=100/100μm,L/S=20μm/20μm均为A。关于具有粘合图案的膜P1的粘合性,通过上述方法进行评价,结果为2N/25mm。关于具有粘合剂的膜P1的固化物的柔软性,通过上述方法进行评价,结果弯曲试验为100次时为A,弯曲试验为500次时为B。
实施例2~24和比较例1~3
除将硅氧烷树脂如表3~4所示进行变更以外,以与实施例1相同的方法,分别制造硅氧烷树脂组合物S2~S24和S28~30。除将硅氧烷树脂组合物S1变更为表3~4中记载的硅氧烷树脂组合物S2~S24和S28~30以外,以与实施例1相同的方法得到具有粘合图案的膜P2~24和P28~30,和具有粘合剂的膜P2~24和P28~30。通过上述方法进行评价,结果示于表3~4中。
实施例25
以固体成分浓度换算计,取78.5质量%合成例24中得到的硅氧烷树脂A24、19质量%具有不饱和双键的化合物(B)、0.9质量%光聚合引发剂(C)、1.5质量%光产酸剂(E)、0.1质量%流平剂加入小瓶中后,添加溶剂(D)以使总固体成分浓度成为40质量%,于室温搅拌30分钟,制造硅氧烷树脂组合物S25。通过上述方法评价该硅氧烷树脂组合物的粘度,结果为10mPa·s。除将硅氧烷树脂组合物S1变更为S25以外,以与实施例1相同的方法得到具有粘合图案的膜P25和具有粘合剂的膜P25。通过上述方法进行评价,结果示于表4中。
实施例26
以固体成分浓度换算计,取79.7质量%合成例24中得到的硅氧烷树脂A24、19质量%具有不饱和双键的化合物(B)、0.9质量%光聚合引发剂(C)、0.3质量%光产酸剂(E)、0.1质量%流平剂加入小瓶中后,添加溶剂(D)以使总固体成分浓度成为40质量%,于室温搅拌30分钟,制造硅氧烷树脂组合物S26。通过上述方法评价该硅氧烷树脂组合物的粘度,结果为10mPa·s。除将硅氧烷树脂组合物S1变更为S26以外,以与实施例1相同的方法得到具有粘合图案的膜P26和具有粘合剂的膜P26。通过上述方法进行评价,结果示于表3~4中。
实施例27
以固体成分浓度换算计,取77.5质量%合成例24中得到的硅氧烷树脂A24、19质量%具有不饱和双键的化合物(B)、0.9质量%光聚合引发剂(C)、2.5质量%光产酸剂(E)、0.1质量%流平剂加入小瓶中后,添加溶剂(D)以使总固体成分浓度成为40质量%,于室温搅拌30分钟,制造硅氧烷树脂组合物S27。通过上述方法评价该硅氧烷树脂组合物的粘度,结果为10mPa·s。除将硅氧烷树脂组合物S1变更为S27以外,以与实施例1相同的方法得到具有粘合图案的膜P27和具有粘合剂的膜P27。通过上述方法进行评价,结果示于表3~4中。
[表3]
[表4-1]
[表4-2]
实施例28显示器型显示装置的制作
以使干燥后的膜厚成为10μm的方式,通过狭缝涂布法在经有机硅处理的PET膜(“Lumirror”(注册商标)S-10;东丽(株)制造)上涂布硅氧烷树脂组合物S18,得到具有涂膜的膜。将具有涂膜的膜在100℃的加热板上干燥3分钟,得到具有干燥膜的膜。隔着以100μm的间隔描绘着图案为136mm×72mm的多个开口部的曝光掩模、通过输出功率为21mW/cm2的超高压汞灯进行照射量为300mJ/cm2的曝光(换算为波长365nm),得到图案曝光膜。然后,使用0.045质量%的氢氧化钾水溶液作为显影液,对图案曝光膜进行喷淋显影直至达到未曝光部全部溶解的时间,得到具有粘合图案的膜。用分切机将所得具有粘合图案的膜切成单片,得到具有粘合图案的膜单片。将具有粘合图案的膜单片分别转印到偏光板(SEG;日东电工(株)制造)、相位差膜(SN2;日东电工(株)制造)后,使用真空层压机在80℃、0.2MPa的条件下将其分别贴合到液晶单元(Model6.1”;EU Optronics制造)的两面上,制造显示器型显示装置。使用环境试验机(ESPEC(株)制造的“PR-1J”)在85℃、85%RH条件下对该显示器型显示装置进行恒温高湿处理500小时,然后目视观察粘合图案的发泡、浮起、剥离等粘合不良和外观不良,结果没有任何不良。
产业上的可利用性
本发明的硅氧烷树脂组合物、粘合剂适合用作显示装置、半导体装置或照明装置等各种电子设备的组装工序中的粘合剂。
Claims (11)
1.硅氧烷树脂组合物,其含有:硅氧烷树脂(A)、具有不饱和双键的化合物(B)、光聚合引发剂(C)及溶剂(D),其中,所述硅氧烷树脂(A)包含下述通式(1)所示的结构、下述通式(2)所示的结构以及下述通式(3)所示的结构,
[化学式1]
通式(1)~(3)中,R1、R2及R3各自独立地表示氢、羟基、具有硅氧烷键的基团或者碳原子数为1~30的1价有机基团;X表示链烯基、炔基、具有氮原子和碳-氧不饱和键的1价有机基团或者具有环状醚键的1价有机基团;Y表示具有光自由基聚合性基团(其中,不包括链烯基和炔基)的1价有机基团;Z表示具有碱溶性基团的1价有机基团;a、b及c各自独立地表示1以上的整数;a~c为2以上时,多个R1、R2、R3、X、Y及Z各自可以相同也可以不同。
2.根据权利要求1所述的硅氧烷树脂组合物,其还包含光产酸剂(E)。
3.根据权利要求1或2所述的硅氧烷树脂组合物,其中,所述硅氧烷树脂(A)中,相对于R1、R2及R3的总摩尔数而言的碳原子数为1~30的烃基的比例为10~80摩尔%。
4.根据权利要求1~3中任一项所述的硅氧烷树脂组合物,其中,所述硅氧烷树脂(A)中,相对于a、b及c的总和而言的a的比例为10~60%、b的比例为20~60%、c的比例为5~35%。
5.根据权利要求1~4中任一项所述的硅氧烷树脂组合物,其中,所述通式(1)~(3)中,X为乙烯基和/或具有环状醚键的1价有机基团,Y为具有(甲基)丙烯酰基的1价有机基团,Z为具有羧基的1价有机基团。
6.根据权利要求5所述的硅氧烷树脂组合物,其中,所述通式(1)中,X的碳原子数为8以上。
7.粘合剂,其包含权利要求1~6中任一项所述的硅氧烷树脂组合物。
8.固化物,其是通过使权利要求1~6中任一项所述的硅氧烷树脂组合物固化而得的,所述固化物的膜厚为10~200μm。
9.显示装置,其具有:选自由液晶单元、有机EL单元、迷你LED单元和微型LED单元组成的组中的至少一种、以及基板、权利要求8所述的固化物。
10.半导体装置,其具有权利要求8所述固化物。
11.照明装置,其具有权利要求8所述的固化物。
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101595193A (zh) * | 2007-01-22 | 2009-12-02 | 信越化学工业株式会社 | 粘合剂组合物以及带粘合剂的光学膜 |
JP2010039056A (ja) * | 2008-08-01 | 2010-02-18 | Sekisui Chem Co Ltd | 感光性組成物及びパターン膜の製造方法 |
WO2011024836A1 (ja) * | 2009-08-26 | 2011-03-03 | 新日鐵化学株式会社 | シリコーン樹脂を含んだアルカリ可溶性樹脂及び感光性樹脂組成物、並びに感光性樹脂組成物を用いた硬化物 |
CN102194764A (zh) * | 2010-02-08 | 2011-09-21 | 富士胶片株式会社 | 半导体装置、半导体元件用基板以及它们的制造方法 |
CN103765313A (zh) * | 2011-08-31 | 2014-04-30 | 旭化成电子材料株式会社 | 感光性碱可溶有机硅树脂组合物 |
CN104969126A (zh) * | 2013-02-14 | 2015-10-07 | 东丽株式会社 | 负型感光性着色组合物、固化膜、触摸面板用遮光图案和触摸面板的制造方法 |
CN105122137A (zh) * | 2013-03-28 | 2015-12-02 | 东丽株式会社 | 感光性树脂组合物、保护膜或绝缘膜、触摸面板及其制造方法 |
CN105378615A (zh) * | 2013-07-25 | 2016-03-02 | 东丽株式会社 | 触控面板用负型感光性白色组合物、触控面板及触控面板的制造方法 |
CN109071742A (zh) * | 2016-04-25 | 2018-12-21 | 东丽株式会社 | 树脂组合物、其固化膜及其制造方法以及固体摄像器件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5187973B2 (ja) | 2009-04-30 | 2013-04-24 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置 |
JP5646932B2 (ja) | 2010-09-17 | 2014-12-24 | 株式会社カネカ | 光学接着剤及びこれを含む表示デバイス |
JP6318634B2 (ja) * | 2013-02-14 | 2018-05-09 | 東レ株式会社 | 感光性シロキサン組成物、硬化膜及び素子 |
JP6363930B2 (ja) * | 2014-10-10 | 2018-07-25 | 日東電工株式会社 | 粘着剤付き光学フィルムおよびその製造方法、ならびに画像表示装置の製造方法 |
TW201624137A (zh) * | 2014-12-22 | 2016-07-01 | 奇美實業股份有限公司 | 感光性聚矽氧烷組成物、保護膜以及具有保護膜的元件 |
-
2018
- 2018-06-21 JP JP2018533701A patent/JP7077947B2/ja active Active
- 2018-06-21 CN CN201880034950.2A patent/CN110662805B/zh active Active
- 2018-06-21 WO PCT/JP2018/023623 patent/WO2019026458A1/ja active Application Filing
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- 2018-06-21 KR KR1020197037942A patent/KR102487737B1/ko active IP Right Grant
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Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101595193A (zh) * | 2007-01-22 | 2009-12-02 | 信越化学工业株式会社 | 粘合剂组合物以及带粘合剂的光学膜 |
JP2010039056A (ja) * | 2008-08-01 | 2010-02-18 | Sekisui Chem Co Ltd | 感光性組成物及びパターン膜の製造方法 |
WO2011024836A1 (ja) * | 2009-08-26 | 2011-03-03 | 新日鐵化学株式会社 | シリコーン樹脂を含んだアルカリ可溶性樹脂及び感光性樹脂組成物、並びに感光性樹脂組成物を用いた硬化物 |
CN102194764A (zh) * | 2010-02-08 | 2011-09-21 | 富士胶片株式会社 | 半导体装置、半导体元件用基板以及它们的制造方法 |
CN103765313A (zh) * | 2011-08-31 | 2014-04-30 | 旭化成电子材料株式会社 | 感光性碱可溶有机硅树脂组合物 |
CN104969126A (zh) * | 2013-02-14 | 2015-10-07 | 东丽株式会社 | 负型感光性着色组合物、固化膜、触摸面板用遮光图案和触摸面板的制造方法 |
CN105122137A (zh) * | 2013-03-28 | 2015-12-02 | 东丽株式会社 | 感光性树脂组合物、保护膜或绝缘膜、触摸面板及其制造方法 |
CN105378615A (zh) * | 2013-07-25 | 2016-03-02 | 东丽株式会社 | 触控面板用负型感光性白色组合物、触控面板及触控面板的制造方法 |
CN109071742A (zh) * | 2016-04-25 | 2018-12-21 | 东丽株式会社 | 树脂组合物、其固化膜及其制造方法以及固体摄像器件 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111875955A (zh) * | 2020-02-17 | 2020-11-03 | 杭州师范大学 | 一种uv固化光学透明柔性材料及其制备方法与应用 |
CN111875955B (zh) * | 2020-02-17 | 2022-04-19 | 杭州师范大学 | 一种uv固化光学透明柔性材料及其制备方法与应用 |
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US20210095124A1 (en) | 2021-04-01 |
KR102487737B1 (ko) | 2023-01-12 |
TW201910368A (zh) | 2019-03-16 |
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