CN110494965B - 检查系统、晶圆图显示器、晶圆图显示方法以及存储介质 - Google Patents

检查系统、晶圆图显示器、晶圆图显示方法以及存储介质 Download PDF

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Publication number
CN110494965B
CN110494965B CN201880023358.2A CN201880023358A CN110494965B CN 110494965 B CN110494965 B CN 110494965B CN 201880023358 A CN201880023358 A CN 201880023358A CN 110494965 B CN110494965 B CN 110494965B
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wafer map
under test
display
wafer
tester
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Chinese (zh)
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CN110494965A (zh
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内田伸
加贺美徹也
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31907—Modular tester, e.g. controlling and coordinating instruments in a bus based architecture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN201880023358.2A 2017-03-30 2018-02-08 检查系统、晶圆图显示器、晶圆图显示方法以及存储介质 Active CN110494965B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017067047A JP6815251B2 (ja) 2017-03-30 2017-03-30 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム
JP2017-067047 2017-03-30
PCT/JP2018/004408 WO2018179890A1 (ja) 2017-03-30 2018-02-08 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム

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Publication Number Publication Date
CN110494965A CN110494965A (zh) 2019-11-22
CN110494965B true CN110494965B (zh) 2022-12-23

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US (1) US11009544B2 (enExample)
JP (1) JP6815251B2 (enExample)
KR (1) KR102305872B1 (enExample)
CN (1) CN110494965B (enExample)
TW (1) TWI744511B (enExample)
WO (1) WO2018179890A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018147959A (ja) * 2017-03-02 2018-09-20 東京エレクトロン株式会社 検査システム、ならびに検査システムの故障解析・予知方法
US10802068B2 (en) * 2018-12-07 2020-10-13 Powertech Technology Inc. Method of detecting abnormal test signal channel of automatic test equipment
JP7295703B2 (ja) * 2019-05-29 2023-06-21 株式会社アドバンテスト 試験装置
CN114245933B (zh) * 2019-09-06 2025-11-18 株式会社日立高新技术 制程信息提示系统、制程错误推定系统
JP7454385B2 (ja) * 2020-01-23 2024-03-22 浜松ホトニクス株式会社 ウェハ搬送ユニット及びウェハ搬送方法
KR102695180B1 (ko) * 2022-08-29 2024-08-16 주식회사 에이티이솔루션 반도체 웨이퍼의 전압-전류 특성시험 시스템 및 그 전압-전류 특성 시험방법
TWI883818B (zh) * 2024-02-06 2025-05-11 萬潤科技股份有限公司 電子元件測試資訊顯示方法及電子元件測試裝置

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JP4437508B1 (ja) * 2009-02-27 2010-03-24 株式会社アドバンテスト 試験装置
JP4487016B1 (ja) * 2009-09-10 2010-06-23 株式会社アドバンテスト 通電部材、接続部材、試験装置および接続部材を修繕する方法
JP2010225661A (ja) * 2009-03-19 2010-10-07 Tokyo Electron Ltd 針跡の判定方法及び針跡判定用プログラム
CN101996912A (zh) * 2009-08-11 2011-03-30 台湾积体电路制造股份有限公司 集成电路晶圆级测试方法、半导体装置测试系统及其方法
JP2011097799A (ja) * 2009-11-02 2011-05-12 Yokogawa Electric Corp 電源装置および半導体試験装置
CN102280394A (zh) * 2010-06-10 2011-12-14 (株)昌盛Ace产业 Led及晶圆检查装置、以及利用上述装置的检查方法
KR20130071082A (ko) * 2011-12-20 2013-06-28 세메스 주식회사 웨이퍼 검사 설정 방법
KR20130090631A (ko) * 2012-02-06 2013-08-14 삼성전자주식회사 프로브 카드의 니들들을 자동으로 포커싱하고 클리닝하는 방법
CN106531657A (zh) * 2017-01-13 2017-03-22 京隆科技(苏州)有限公司 无墨点晶圆外观检查方法及其检查系统

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JP4976112B2 (ja) * 2006-11-24 2012-07-18 株式会社日立ハイテクノロジーズ 欠陥レビュー方法および装置
JP4482707B1 (ja) * 2009-07-13 2010-06-16 株式会社アドバンテスト 試験装置
JP2011210775A (ja) 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
JP5825502B2 (ja) * 2013-02-27 2015-12-02 株式会社東京精密 プローブ装置
WO2014132856A1 (ja) * 2013-02-27 2014-09-04 株式会社東京精密 プローブ装置のアライメント支援装置及びアライメント支援方法
JP2015061021A (ja) * 2013-09-20 2015-03-30 東京エレクトロン株式会社 ウエハ検査ユニット、テストヘッド及びウエハ検査装置
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US10620236B2 (en) * 2017-06-12 2020-04-14 Marvell Asia Pte, Ltd. Multi-test type probe card and corresponding testing system for parallel testing of dies via multiple test sites

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Publication number Priority date Publication date Assignee Title
JP4437508B1 (ja) * 2009-02-27 2010-03-24 株式会社アドバンテスト 試験装置
JP2010225661A (ja) * 2009-03-19 2010-10-07 Tokyo Electron Ltd 針跡の判定方法及び針跡判定用プログラム
CN101996912A (zh) * 2009-08-11 2011-03-30 台湾积体电路制造股份有限公司 集成电路晶圆级测试方法、半导体装置测试系统及其方法
JP4487016B1 (ja) * 2009-09-10 2010-06-23 株式会社アドバンテスト 通電部材、接続部材、試験装置および接続部材を修繕する方法
JP2011097799A (ja) * 2009-11-02 2011-05-12 Yokogawa Electric Corp 電源装置および半導体試験装置
CN102280394A (zh) * 2010-06-10 2011-12-14 (株)昌盛Ace产业 Led及晶圆检查装置、以及利用上述装置的检查方法
KR20130071082A (ko) * 2011-12-20 2013-06-28 세메스 주식회사 웨이퍼 검사 설정 방법
KR20130090631A (ko) * 2012-02-06 2013-08-14 삼성전자주식회사 프로브 카드의 니들들을 자동으로 포커싱하고 클리닝하는 방법
CN106531657A (zh) * 2017-01-13 2017-03-22 京隆科技(苏州)有限公司 无墨点晶圆外观检查方法及其检查系统

Also Published As

Publication number Publication date
TW201903422A (zh) 2019-01-16
KR102305872B1 (ko) 2021-09-27
CN110494965A (zh) 2019-11-22
US11009544B2 (en) 2021-05-18
US20200064398A1 (en) 2020-02-27
JP6815251B2 (ja) 2021-01-20
JP2018170418A (ja) 2018-11-01
KR20190137113A (ko) 2019-12-10
WO2018179890A1 (ja) 2018-10-04
TWI744511B (zh) 2021-11-01

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