CN110323146B - 电子零件封装装置 - Google Patents

电子零件封装装置 Download PDF

Info

Publication number
CN110323146B
CN110323146B CN201910237691.XA CN201910237691A CN110323146B CN 110323146 B CN110323146 B CN 110323146B CN 201910237691 A CN201910237691 A CN 201910237691A CN 110323146 B CN110323146 B CN 110323146B
Authority
CN
China
Prior art keywords
electronic component
holding head
film
tray
shaped electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910237691.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN110323146A (zh
Inventor
広濑圭刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN110323146A publication Critical patent/CN110323146A/zh
Application granted granted Critical
Publication of CN110323146B publication Critical patent/CN110323146B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07163—Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
CN201910237691.XA 2018-03-28 2019-03-27 电子零件封装装置 Active CN110323146B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-063188 2018-03-28
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Publications (2)

Publication Number Publication Date
CN110323146A CN110323146A (zh) 2019-10-11
CN110323146B true CN110323146B (zh) 2022-11-08

Family

ID=68113034

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910237691.XA Active CN110323146B (zh) 2018-03-28 2019-03-27 电子零件封装装置

Country Status (4)

Country Link
JP (1) JP7023154B2 (https=)
KR (1) KR102253289B1 (https=)
CN (1) CN110323146B (https=)
TW (1) TWI723362B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497843B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497841B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497842B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497837B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497839B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497838B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7507396B2 (ja) * 2020-12-25 2024-06-28 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
JP7837178B2 (ja) * 2021-03-31 2026-03-30 芝浦メカトロニクス株式会社 電子部品実装装置
CN115148617A (zh) * 2021-03-31 2022-10-04 芝浦机械电子装置株式会社 电子零件安装装置
JP7812679B2 (ja) * 2021-03-31 2026-02-10 芝浦メカトロニクス株式会社 電子部品実装装置
CN115148616B (zh) * 2021-03-31 2025-09-23 芝浦机械电子装置株式会社 电子零件安装装置
JP7154449B1 (ja) * 2021-10-28 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
TW202438692A (zh) * 2021-11-19 2024-10-01 日商芝浦機械電子裝置股份有限公司 供給裝置及成膜裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243681A (ja) * 1991-12-20 1993-09-21 Thomson Hybrides レーザ列の配線方法及び該方法によって配線されたレーザ列
CN1720612A (zh) * 2002-12-02 2006-01-11 松下电器产业株式会社 零件供给头装置、零件供给装置、零件安装装置、以及安装头部的移动方法
CN101256965A (zh) * 2007-03-01 2008-09-03 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109905B2 (ja) * 2002-05-31 2008-07-02 松下電器産業株式会社 部品実装基板生産装置
JP4627643B2 (ja) 2004-08-20 2011-02-09 芝浦メカトロニクス株式会社 実装用電子部品の供給装置
JP4323410B2 (ja) * 2004-10-22 2009-09-02 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4518257B2 (ja) 2005-01-19 2010-08-04 株式会社日立ハイテクノロジーズ 半導体装置実装装置
JP4802003B2 (ja) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
US8328498B2 (en) * 2007-01-25 2012-12-11 Panasonic Corporation Component feeding unit and method, and component mounting apparatus and method
KR101166058B1 (ko) * 2007-02-22 2012-07-19 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법
WO2009122711A1 (ja) * 2008-04-01 2009-10-08 パナソニック株式会社 部品実装装置および方法
JP4658235B2 (ja) * 2009-01-08 2011-03-23 パナソニック株式会社 部品実装装置及びその方法
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
KR101399973B1 (ko) 2012-12-21 2014-06-19 세광테크 주식회사 인라인 자동 ｏｌｂ 본딩장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243681A (ja) * 1991-12-20 1993-09-21 Thomson Hybrides レーザ列の配線方法及び該方法によって配線されたレーザ列
CN1720612A (zh) * 2002-12-02 2006-01-11 松下电器产业株式会社 零件供给头装置、零件供给装置、零件安装装置、以及安装头部的移动方法
CN101256965A (zh) * 2007-03-01 2008-09-03 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法

Also Published As

Publication number Publication date
JP2019176028A (ja) 2019-10-10
JP7023154B2 (ja) 2022-02-21
CN110323146A (zh) 2019-10-11
KR102253289B1 (ko) 2021-05-20
TW201943005A (zh) 2019-11-01
TWI723362B (zh) 2021-04-01
KR20190113604A (ko) 2019-10-08

Similar Documents

Publication Publication Date Title
CN110323146B (zh) 电子零件封装装置
KR100278137B1 (ko) 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
KR20190037103A (ko) 전자 부품의 실장 장치와 표시용 부재의 제조 방법
CN101587826A (zh) 固晶装置
JP7060431B2 (ja) フィルム状電子部品供給台、打抜供給装置及び電子部品実装装置
JPH11150133A (ja) 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法
JP7340774B2 (ja) 部品圧着装置および部品圧着方法
KR102720412B1 (ko) 전자 부품 실장 장치
KR20250132433A (ko) 전자 부품 실장 장치
CN111954455B (zh) 部件安装装置以及部件安装方法
JP3592924B2 (ja) Ｉｃチップの供給方法、供給装置、及びそれに使用する短冊テープ状支持体
KR102744026B1 (ko) 전자 부품 실장 장치
JP5159259B2 (ja) 圧着装置及びフラットパネルディスプレイの製造装置
JP2022158935A (ja) 電子部品実装装置
JP7262008B2 (ja) Ａｃｆ貼付装置及びａｃｆ貼付方法
JP6324860B2 (ja) 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法
JP6987922B2 (ja) 電子部品の実装装置と表示用部材の製造方法
JP7285303B2 (ja) 電子部品の実装装置と表示用部材の製造方法
JP7812679B2 (ja) 電子部品実装装置
JP2021005685A (ja) 部品装着装置及び部品装着方法
JP2011097095A (ja) 圧着装置及びフラットパネルディスプレイの製造装置
JP4660178B2 (ja) 電子部品の実装装置
JP2010161195A (ja) 部品供給装置及びその方法
KR101382261B1 (ko) 씨오지 가압착 장치
JP2023038666A (ja) 部品圧着装置および部品圧着装置のメンテナンス方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant